JP6824908B2 - 加熱要素を有する装置、コンピューティング・システム及び方法 - Google Patents
加熱要素を有する装置、コンピューティング・システム及び方法 Download PDFInfo
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- H—ELECTRICITY
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- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
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Description
本願は2015年6月26日付の米国出願第14/752,695号に対する35U.S.C.365(b)に基づく優先権を主張する。米国出願14/752,695号は全体的に本願のリファレンスに組み込まれる。
本開示は一般にエレクトロニクスの分野に関連する。特に、実施形態は機械的に組み込まれる加熱素子の配置及び/又は利用に関連する。
モバイル・コンピューティング・デバイスは、例えば改善された処理能力だけでなくバッテリ寿命の長期化にも起因して、急速に普及している。タブレット(又はスマート・フォン)の設計における現在の傾向の1つは、ディスプレイ・アセンブリを接着剤でシャーシに永続的に結合することである。これは、締め具、孔及び/又はネジの使用を最小化し、システム全体の審美性を向上させるかもしれない。しかしながら、そのような設計ソリューションは、モバイル・コンピューティング・デバイスのアップブレード及び/又は保守性(serviceability)を制限する可能性がある。
Claims (24)
- コンピューティング・デバイスの第1部分及び前記コンピューティング・デバイスの第2部分を結合する接着剤に熱的に結合される加熱要素を有する装置であって、
前記加熱要素は電力の印加に応じて加熱されることが可能であり、加熱された前記加熱要素は、前記コンピューティング・デバイスの第1部分と前記コンピューティング・デバイスの第2部分との物理的な分離を可能にするように、前記接着剤による結合の解消を引き起こし、前記加熱要素は通信ケーブルのポートである開口を通じてアクセス可能である、装置。 - 前記電力の印加は、電圧の印加、電流の印加又は電磁エネルギの印加のうちの1つ以上を通じて提供される、請求項1に記載の装置。
- 前記加熱要素は、更にラッチを通じてアクセス可能である、請求項1に記載の装置。
- 前記開口は、前記コンピューティング・デバイスに存在するポートである、請求項3に記載の装置。
- 前記存在するポートは、ユニバーサル・シリアル・バス(USB)ポート、オーディオ・ポート、加入者識別モジュール(SIM)ポート、又は高解像度マルチメディア・インターフェース(HDMI(登録商標))ポートを含む群から選択される、請求項4に記載の装置。
- 前記加熱要素は、ニッケル・クロム合金、銅ニッケル合金、鉄クロム・アルミ合金及び/又はそれらの組み合わせのうちの1つ以上を含む群から選択される材料により構成される、請求項1に記載の装置。
- 前記加熱要素は、シングル・ストランド・ケーブル又はマルチ・ストランド・ケーブルを有する、請求項1に記載の装置。
- 前記マルチ・ストランド・ケーブルは、複数のケーブル材料で構成される、請求項7に記載の装置。
- 前記加熱要素は、前記接着剤による結合を解消するために十分な熱量又は温度を十分な期間にわたって持続することが可能である、請求項1に記載の装置。
- 前記コンピューティング・デバイスの第1部分は、ディスプレイ・デバイス又はディスプレイ・デバイス・カバー・ガラスを含む、請求項1に記載の装置。
- 前記ディスプレイ・デバイスは、フラット・パネル・ディスプレイを含む、請求項10に記載の装置。
- 前記コンピューティング・デバイスの第2部分は、前記コンピューティング・デバイスのデバイス・シャーシ又は前記コンピューティング・デバイスの外側カバーを含む、請求項1に記載の装置。
- 前記コンピューティング・デバイスは、モバイル・コンピューティング・デバイスを構成する、請求項1に記載の装置。
- 前記モバイル・コンピューティング・デバイスは、システム・オン・チップ(SOC)デバイス、1つ以上のプロセッサ・コアを有するプロセッサ、フラット・パネル・ディスプレイ・デバイス及びメモリのうちの1つ以上を含む、請求項13に記載の装置。
- 前記モバイル・コンピューティング・デバイスは、スマート・フォン、タブレット、ウルトラ・モバイル・パーソナル・コンピュータ(UMPC)、ラップトップ・コンピュータ、ウルトラブック・コンピューティング・デバイス及びウェアラブル・デバイスのうちの何れかを構成する、請求項14に記載の装置。
- 前記ウェアラブル・デバイスは、スマート・ウォッチ、スマート眼鏡又はスマート・ブレスレットのうちの何れかを構成する、請求項15に記載の装置。
- コンピューティング・システムであって:
1つ上のプロセッサ・コアを有するプロセッサ;
前記プロセッサに結合されるフラット・パネル・ディスプレイ・デバイス;
接着剤に熱的に結合される加熱要素;
を有し、前記接着剤は、前記フラット・パネル・ディスプレイ・デバイスのカバー・ガラスを外側カバーに結合し、
前記加熱要素は電力の印加に応じて加熱されることが可能であり、加熱された前記加熱要素は、前記カバー・ガラスと前記外側カバーとの物理的な分離を可能にするように、前記接着剤による結合の解消を引き起こし、前記加熱要素は通信ケーブルのポートである開口を通じてアクセス可能である、コンピューティング・システム。 - 前記電力の印加は、電圧の印加、電流の印加又は電磁エネルギの印加のうちの1つ以上を通じて提供される、請求項17に記載のコンピューティング・システム。
- 前記加熱要素は、更にラッチを通じてアクセス可能である、請求項17に記載のコンピューティング・システム。
- コンピューティング・デバイスの第1部分及び前記コンピューティング・デバイスの第2部分を結合する接着剤に熱的に結合される加熱要素に、電力を印加することを有する方法であって、
加熱された前記加熱要素は、前記コンピューティング・デバイスの第1部分と前記コンピューティング・デバイスの第2部分との物理的な分離を可能にするように、前記接着剤による結合の解消を引き起こし、前記加熱要素は通信ケーブルのポートである開口を通じてアクセス可能である、方法。 - 前記電力の印加は、電圧の印加、電流の印加又は電磁エネルギの印加のうちの1つ以上を通じて実行される、請求項20に記載の方法。
- 前記加熱要素は、更にラッチを通じてアクセス可能である、請求項20に記載の方法。
- 前記開口は、前記コンピューティング・デバイスに存在するポートである、請求項22に記載の方法。
- 請求項20ないし23のうち何れか一項に記載の方法を実行する手段を有する装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/752,695 | 2015-06-26 | ||
US14/752,695 US9618973B2 (en) | 2015-06-26 | 2015-06-26 | Mechanically embedded heating element |
PCT/US2016/035088 WO2016209566A1 (en) | 2015-06-26 | 2016-05-31 | Mechanically embedded heating element |
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Publication Number | Publication Date |
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JP2018520424A JP2018520424A (ja) | 2018-07-26 |
JP6824908B2 true JP6824908B2 (ja) | 2021-02-03 |
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JP2017561316A Active JP6824908B2 (ja) | 2015-06-26 | 2016-05-31 | 加熱要素を有する装置、コンピューティング・システム及び方法 |
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US (1) | US9618973B2 (ja) |
EP (1) | EP3314353B1 (ja) |
JP (1) | JP6824908B2 (ja) |
KR (1) | KR102457428B1 (ja) |
CN (1) | CN107735742B (ja) |
TW (1) | TWI718145B (ja) |
WO (1) | WO2016209566A1 (ja) |
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US9862115B2 (en) | 2015-03-27 | 2018-01-09 | Intel Corporation | Hidden feature for accessing or repairing mobile devices |
US10565839B1 (en) * | 2016-10-24 | 2020-02-18 | Marc W. Tobias | Security medallion |
US10832111B1 (en) * | 2016-10-24 | 2020-11-10 | Marc Tobias | Security medallion |
KR102591568B1 (ko) * | 2017-01-19 | 2023-10-23 | 삼성전자주식회사 | 디스플레이를 포함하는 전자 장치 |
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CN107735742A (zh) | 2018-02-23 |
KR20180014191A (ko) | 2018-02-07 |
WO2016209566A1 (en) | 2016-12-29 |
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JP2018520424A (ja) | 2018-07-26 |
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CN107735742B (zh) | 2021-09-14 |
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