JP6823819B1 - レジスト剥離液 - Google Patents

レジスト剥離液 Download PDF

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Publication number
JP6823819B1
JP6823819B1 JP2019209696A JP2019209696A JP6823819B1 JP 6823819 B1 JP6823819 B1 JP 6823819B1 JP 2019209696 A JP2019209696 A JP 2019209696A JP 2019209696 A JP2019209696 A JP 2019209696A JP 6823819 B1 JP6823819 B1 JP 6823819B1
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JP
Japan
Prior art keywords
cyclic amine
copper
stripping solution
mass
molybdenum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019209696A
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English (en)
Japanese (ja)
Other versions
JP2021081616A (ja
Inventor
真一郎 淵上
真一郎 淵上
靖紀 鈴木
靖紀 鈴木
佑典 鬼頭
佑典 鬼頭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
Original Assignee
Panasonic Intellectual Property Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Intellectual Property Management Co Ltd filed Critical Panasonic Intellectual Property Management Co Ltd
Priority to JP2019209696A priority Critical patent/JP6823819B1/ja
Priority to PCT/JP2020/029456 priority patent/WO2021100254A1/ja
Priority to CN202080005335.6A priority patent/CN112805629B/zh
Priority to TW109135481A priority patent/TWI730911B/zh
Application granted granted Critical
Publication of JP6823819B1 publication Critical patent/JP6823819B1/ja
Publication of JP2021081616A publication Critical patent/JP2021081616A/ja
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Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2019209696A 2019-11-20 2019-11-20 レジスト剥離液 Active JP6823819B1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019209696A JP6823819B1 (ja) 2019-11-20 2019-11-20 レジスト剥離液
PCT/JP2020/029456 WO2021100254A1 (ja) 2019-11-20 2020-07-31 レジスト剥離液
CN202080005335.6A CN112805629B (zh) 2019-11-20 2020-07-31 抗蚀剂剥离液
TW109135481A TWI730911B (zh) 2019-11-20 2020-10-14 阻劑剝離液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019209696A JP6823819B1 (ja) 2019-11-20 2019-11-20 レジスト剥離液

Publications (2)

Publication Number Publication Date
JP6823819B1 true JP6823819B1 (ja) 2021-02-03
JP2021081616A JP2021081616A (ja) 2021-05-27

Family

ID=74228035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019209696A Active JP6823819B1 (ja) 2019-11-20 2019-11-20 レジスト剥離液

Country Status (3)

Country Link
JP (1) JP6823819B1 (zh)
TW (1) TWI730911B (zh)
WO (1) WO2021100254A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115167083A (zh) * 2022-07-19 2022-10-11 深圳深骏微电子材料有限公司 一种水性剥离液及其用途

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007044446A1 (en) * 2005-10-05 2007-04-19 Advanced Technology Materials, Inc. Oxidizing aqueous cleaner for the removal of post-etch residues
KR101488265B1 (ko) * 2007-09-28 2015-02-02 삼성디스플레이 주식회사 박리 조성물 및 박리 방법
CN102227687A (zh) * 2008-12-25 2011-10-26 长瀬化成株式会社 光致抗蚀剂剥离剂组合物、层积金属布线基板的光致抗蚀剂剥离方法和制造方法
WO2010104816A1 (en) * 2009-03-11 2010-09-16 Fujifilm Electronic Materials U.S.A., Inc. Cleaning formulation for removing residues on surfaces
JP2012060050A (ja) * 2010-09-13 2012-03-22 Fujifilm Corp 洗浄組成物、これを用いた洗浄方法及び半導体素子の製造方法
JP6112446B2 (ja) * 2012-10-31 2017-04-12 パナソニックＩｐマネジメント株式会社 フォトレジスト剥離液組成物
JP2016095413A (ja) * 2014-11-14 2016-05-26 パナソニックＩｐマネジメント株式会社 レジスト剥離液
JP5885046B1 (ja) * 2015-03-24 2016-03-15 パナソニックＩｐマネジメント株式会社 レジスト剥離液
JP6922957B2 (ja) * 2015-09-30 2021-08-18 ブラザー工業株式会社 液体吐出装置
JP6646073B2 (ja) * 2016-01-22 2020-02-14 富士フイルム株式会社 処理液
JP2019209698A (ja) * 2018-05-31 2019-12-12 シロキ工業株式会社 シートスライド装置

Also Published As

Publication number Publication date
WO2021100254A1 (ja) 2021-05-27
TW202121072A (zh) 2021-06-01
TWI730911B (zh) 2021-06-11
JP2021081616A (ja) 2021-05-27

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