JP6813551B2 - シラ環状化合物及びそれを用いたケイ素含有膜の堆積方法 - Google Patents
シラ環状化合物及びそれを用いたケイ素含有膜の堆積方法 Download PDFInfo
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- JP6813551B2 JP6813551B2 JP2018201797A JP2018201797A JP6813551B2 JP 6813551 B2 JP6813551 B2 JP 6813551B2 JP 2018201797 A JP2018201797 A JP 2018201797A JP 2018201797 A JP2018201797 A JP 2018201797A JP 6813551 B2 JP6813551 B2 JP 6813551B2
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- GQZFNVJKSLVETO-UHFFFAOYSA-N (1-ethylsiletan-1-yl) propanoate Chemical compound C(C)[Si]1(CCC1)OC(CC)=O GQZFNVJKSLVETO-UHFFFAOYSA-N 0.000 claims description 2
- OTJOKGQUIUNUKB-UHFFFAOYSA-N (1-ethylsilinan-1-yl) propanoate Chemical compound CCC(=O)O[Si]1(CC)CCCCC1 OTJOKGQUIUNUKB-UHFFFAOYSA-N 0.000 claims description 2
- VEQWGKYOYRNYIN-UHFFFAOYSA-N (1-ethylsilolan-1-yl) acetate Chemical compound C(C)[Si]1(CCCC1)OC(C)=O VEQWGKYOYRNYIN-UHFFFAOYSA-N 0.000 claims description 2
- GVMJXYVLBFXUNI-UHFFFAOYSA-N (1-ethylsilolan-1-yl) propanoate Chemical compound CCC(=O)O[Si]1(CC)CCCC1 GVMJXYVLBFXUNI-UHFFFAOYSA-N 0.000 claims description 2
- SVZMYHTZNZQLLK-UHFFFAOYSA-N (1-methylsiletan-1-yl) acetate Chemical compound CC(=O)O[Si]1(C)CCC1 SVZMYHTZNZQLLK-UHFFFAOYSA-N 0.000 claims description 2
- PALQQKNNOFGSGO-UHFFFAOYSA-N (1-methylsilinan-1-yl) acetate Chemical compound C[Si]1(CCCCC1)OC(C)=O PALQQKNNOFGSGO-UHFFFAOYSA-N 0.000 claims description 2
- KNPSYLZHMRCEAU-UHFFFAOYSA-N (1-methylsilinan-1-yl) propanoate Chemical compound CCC(=O)O[Si]1(C)CCCCC1 KNPSYLZHMRCEAU-UHFFFAOYSA-N 0.000 claims description 2
- ZADXWRVUWIECFC-UHFFFAOYSA-N (1-methylsilolan-1-yl) propanoate Chemical compound CCC(=O)O[Si]1(C)CCCC1 ZADXWRVUWIECFC-UHFFFAOYSA-N 0.000 claims description 2
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- XDWZHWDXZWJZDI-UHFFFAOYSA-N (1-ethylsilinan-1-yl) acetate Chemical compound C(C)[Si]1(CCCCC1)OC(C)=O XDWZHWDXZWJZDI-UHFFFAOYSA-N 0.000 claims 1
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Classifications
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- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
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- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
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- B05D3/067—Curing or cross-linking the coating
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02203—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being porous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
- H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02345—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light
- H01L21/02348—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to radiation, e.g. visible light treatment by exposure to UV light
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
本出願は2017年10月27日に出願された米国仮出願番号第62/578,072号の優先権及び利益を主張し、その全体を参照することにより本明細書中に取り込む。
例としては、シクロヘキサン、1,2,4−トリメチルシクロヘキサン、1−メチル−4−(1−メチルエチル)シクロヘキサン、シクロオクタン、メチルシクロオクタン、メチルシクロヘキサンなどが挙げられる。
例としては、エチレン、プロピレン、アセチレン、ネオヘキサン、1,3−ブタジエン、2−メチル−1,3−ブタジエン、2,3−ジメチル−2,3−ブタジエン、置換ジエンなどが挙げられる。
例としては、パラ−シメン、シクロオクテン、1,5−シクロオクタジエン、ジメチルシクロオクタジエン、シクロヘキセン、ビニルシクロヘキサン、ジメチルシクロヘキセン、α−テルピネン、ピネン、リモネン、ビニルシクロヘキセンなどが挙げられる。
例としては、ノルボルナン、スピロ−ノナン、デカヒドロナフタレンなどが挙げられる。
例としては、カンフェン、ノルボルネン、ノルボルナジエン、5−エチリデン−2−ノルボルネンなどが挙げられる。
例としては、アダマンタンが挙げられる。
オルガノシリケート層が、1−アセトキシ−1−メチル−1−シラシクロペンタンをケイ素前駆体として用いて堆積された。この複合膜を、200mmウエハ上に堆積するための堆積条件は以下のとおりである。前駆体は、反応チャンバ中に直接の液体注入(DLI)によって、1−メチル−1−アセトキシ−1−シラシクロペンタンの1000ミリグラム/分(mg/分)の流量、200標準立方センチメートル毎分(sccm)のヘリウムキャリアガス流、200sccmのO2,350ミリインチ(0.89cm)のシャワーヘッド/ウエハ間隔、400℃のウエハチャック温度、7トル(930Pa)のチャンバ圧力、で供給され。650Wプラズマが80秒間反応チャンバに加えられた。堆積された膜としての結果は、499nm厚であり、そして1.486の屈折率(RI)を有していた。堆積されたままのこの膜は、2.96の誘電率、13.5GPaの弾性率および2.4GPaの硬度を有していた。堆積の後に、この膜はUVアニーリング工程に4分間、400℃で曝露された。UVアニーリングの後に、この膜は、7.6%収縮して461nmの厚さとなり、1.488の屈折率を有していた。UV硬化の後に、この膜は3.00の誘電率、16.8GPaの弾性率および3.2GPaの硬度を有していた。UVアニーリング後のこの膜のXPSで測定された元素組成は、27.1原子%の炭素、42.6原子%の酸素および30.3原子%のケイ素であった。XPS分析は、このような膜中の水素組成を測定することはできないが、水素はC−H結合およびおそらくはSi−H結合の形態で存在しており、そして膜の10〜50原子%の範囲を構成することが推測される。
本開示は以下も包含する。
[1]
式Si v O w C x H y Fz(式中、v+w+x+y+z=100%であり、vは10〜35原子%であり、wは10〜65原子%であり、xは5〜40原子%であり、yは10〜50原子%であり、そしてzは0〜15原子%である)により表される誘電体膜の製造方法であって、該方法は、
反応チャンバ内に基材を提供すること、
該反応チャンバ中に、シラ環状化合物を含む少なくとも1種の構造形成性前駆体を含む気体試薬を導入すること、該シラ環状化合物は、不純物を約100ppm未満しか含まない、および、
該反応チャンバ中の該気体試薬にエネルギーを加え、該気体試薬の反応を誘導して、そしてそれによって該基材上に膜を堆積させること、
を含んでいる。
[2]
前記気体試薬が、テトラエトキシシランおよびテトラメトキシシランから選択された硬化剤を含む構造形成性試薬を更に含む、上記態様1記載の方法。
[3]
前記シラ環状化合物が、下記の式I、
を有する化合物を含み、該シラ環状化合物が、不純物を約100ppm未満しか含まない、上記態様1記載の方法。
[4]
前記シラ環状化合物が、1−メチル−1−アセトキシ−1−シラシクロペンタン、1−メチル−1−プロピオノキシ−1−シラシクロペンタン、1−メチル−1−アセトキシ−1−シラシクロブタン、1−メチル−1−プロピオノキシ−1−シラシクロブタン、1−メチル−1−アセトキシ−1−シラシクロヘキサン、1−メチル−1−プロピオノキシ−1−シラシクロヘキサン、1−エチル−1−アセトキシ−1−シラシクロペンタン、1−エチル−1−プロピオノキシ−1−シラシクロペンタン、1−エチル−1−アセトキシ−1−シラシクロブタン、1−エチル−1−プロピオノキシ−1−シラシクロブタン、1−エチル−1−アセトキシ−1−シラシクロヘキサン、1−エチル−1−プロピオノキシ−1−シラシクロヘキサンおよびそれらの組み合わせ、からなる群から選択された少なくとも1種の化合物を含む、上記態様3記載の方法。
[5]
前記シラ環状化合物が、1−メチル−1−アセトキシ−1−シラシクロペンタンを含む、上記態様4記載の方法。
[6]
前記方法が、プラズマ強化化学気相堆積である、上記態様1記載の方法。
[7]
前記気体試薬が、O 2 、N 2 O、NO、NO 2 、CO 2 、水、H 2 O 2 、オゾンおよびそれらの混合物からなる群から選択された少なくとも1種の酸化剤を更に含み、該気体試薬が酸化剤を含まない、上記態様1記載の方法。
[8]
前記加える工程において前記反応チャンバが、He、Ar、N 2 、Kr、Xe、NH 3 、H 2 、CO 2 、またはCOから選択される少なくとも1種の気体を更に含む、上記態様1記載の方法。
[9]
付加的な堆積後処理工程を更に含み、これが熱処理、UVアニール、e−ビーム処理、およびガンマ線処理の少なくとも1種を含む、上記態様1記載の方法。
[10]
前記堆積後処理工程が、UVアニールおよび熱処理の両方を含む、上記態様9記載の方法。
[11]
堆積されたままの前記膜が、30原子%以上の炭素を含み、13GPa以上の弾性率を有し、そして2.0GPa以上の膜硬度を有する、上記態様1記載の方法。
[12]
堆積されたままの前記膜が、続いてUV硬化され、そして該硬化された膜が25原子%以上の炭素を含み、15GPa以上の弾性率を有し、そして3.0GPa以上の硬度を有する、上記態様1記載の方法。
[13]
上記態様1記載の方法であって、
前記気体試薬が、ポロゲンを更に含み、
堆積されたままの前記膜が、該ポロゲンを含む予備膜であり、そして該方法が、
該予備膜から該ポロゲンの少なくとも一部を除去して、細孔を含み、そして2.6以下の誘電率を有する多孔性誘電体膜を提供する工程、
を更に含む、方法。
[14]
前記ポロゲンが、
一般式C n H 2n の環式炭化水素(式中、n=4〜14であり、環式構造中の炭素数は4〜10であり、そして環式構造上に1つもしくは2つ以上の単純な又は枝分かれした炭化水素置換基が存在してよい)、
一般式C n H (2n+2)−2m の直鎖もしくは枝分かれの飽和、単一もしくは複数の不飽和の炭化水素(式中、n=2〜20であり、m=0〜nである)、
一般式C n H 2n−2p の単一もしくは複数の不飽和の環式炭化水素(式中、pは分子中の不飽和部位の数であり、n=4〜14であり、環式構造中の炭素数は4〜10であり、そして環式構造上に1つもしくは2つ以上の単純なもしくは枝分かれの炭化水素置換基が存在してよい)、
一般式C n H 2n−2 の二環式炭化水素(式中、n=4〜14であり、二環式構造中の炭素数は4〜12であり、そして環状構造上に1もしくは2以上の単純なもしくは枝分かれの炭化水素置換基が存在してよい)、
一般式C n H 2n−(2+2m) の複数不飽和の二環式炭化水素(式中、mは分子中の不飽和部位の数であり、n=4〜14であり、二環式構造中の炭素数は4〜12であり、そして環状構造上に1もしくは2以上の単純なもしくは枝分かれの炭化水素置換基が存在してよい)、ならびに、
一般式C n H 2n−4 の三環式炭化水素(式中、n=4〜14であり、三環構造中の炭素数は4〜12であり、そして環状構造上に1または2以上の単純なもしくは枝分かれの炭化水素置換基が存在してよい)、
からなる群から選択される少なくとも1種の化合物である、上記態様13記載の方法。
[15]
前記ポロゲンが、シクロヘキサン、1,2,4−トリメチルシクロヘキサン、1−メチル−4−(1−メチルエチル)シクロヘキサン、シクロオクタン、メチルシクロオクタン、エチレン、プロピレン、アセチレン、ネオヘキサン、1,3−ブタジエン、2−メチル−1,3−ブタジエン、2,3−ジメチル−2,3−ブタジエン、置換ジエン、パラ−シメン、シクロオクテン、1,5−シクロオクタジエン、シクロヘキセン、ビニルシクロヘキサン、ジメチルシクロヘキセン、α-テルピネン、ピネン、リモネン、ビニルシクロヘキセン、ノルボルナン、スピロ−ノナン、カンフェン、ノルボルネン、ノルボルナジエン、5−エチリデン−2−ノルボルネン、デカヒドロナフタレン、アダマンタンからなる群より選ばれる少なくとも1種の化合物を含む、上記態様14記載の方法。
[16]
前記膜構造が、−CH 2 −メチレン橋掛けおよび−CH 2 CH 2 −エチレン橋掛けの少なくとも1種を含む、上記態様1記載の方法。
Claims (15)
- 式SivOwCxHyFz(式中、v+w+x+y+z=100%であり、vは10〜35原子%であり、wは10〜65原子%であり、xは5〜40原子%であり、yは10〜50原子%であり、そしてzは0〜15原子%である)により表される誘電体膜の製造方法であって、該方法は、
反応チャンバ内に基材を提供すること、
該反応チャンバ中に、シラ環状化合物を含む少なくとも1種の構造形成性前駆体を含む気体試薬を導入すること、該シラ環状化合物は、不純物を約100ppm未満しか含まない、および、
該反応チャンバ中の該気体試薬にエネルギーを加え、該気体試薬の反応を誘導して、そしてそれによって該基材上に膜を堆積させること、
を含み、
前記シラ環状化合物が、下記の式I、
を有する化合物を含み、該シラ環状化合物が、不純物を約100ppm未満しか含まない、方法。 - 前記気体試薬が、テトラエトキシシランおよびテトラメトキシシランから選択された硬化剤を含む構造形成性試薬を更に含む、請求項1記載の方法。
- 前記シラ環状化合物が、1−メチル−1−アセトキシ−1−シラシクロペンタン、1−メチル−1−プロピオノキシ−1−シラシクロペンタン、1−メチル−1−アセトキシ−1−シラシクロブタン、1−メチル−1−プロピオノキシ−1−シラシクロブタン、1−メチル−1−アセトキシ−1−シラシクロヘキサン、1−メチル−1−プロピオノキシ−1−シラシクロヘキサン、1−エチル−1−アセトキシ−1−シラシクロペンタン、1−エチル−1−プロピオノキシ−1−シラシクロペンタン、1−エチル−1−アセトキシ−1−シラシクロブタン、1−エチル−1−プロピオノキシ−1−シラシクロブタン、1−エチル−1−アセトキシ−1−シラシクロヘキサン、1−エチル−1−プロピオノキシ−1−シラシクロヘキサンおよびそれらの組み合わせ、からなる群から選択された少なくとも1種の化合物を含む、請求項1記載の方法。
- 前記シラ環状化合物が、1−メチル−1−アセトキシ−1−シラシクロペンタンを含む、請求項3記載の方法。
- 前記方法が、プラズマ強化化学気相堆積である、請求項1記載の方法。
- 前記気体試薬が、O2、N2O、NO、NO2、CO2、水、H2O2、オゾンおよびそれらの混合物からなる群から選択された少なくとも1種の酸化剤を更に含み、該気体試薬が酸化剤を含まない、請求項1記載の方法。
- 前記加える工程において前記反応チャンバが、He、Ar、N2、Kr、Xe、NH3、H2、CO2、またはCOから選択される少なくとも1種の気体を更に含む、請求項1記載の方法。
- 付加的な堆積後処理工程を更に含み、これが熱処理、UVアニール、e−ビーム処理、およびガンマ線処理の少なくとも1種を含む、請求項1記載の方法。
- 前記堆積後処理工程が、UVアニールおよび熱処理の両方を含む、請求項8記載の方法。
- 堆積されたままの前記膜が、30原子%以上の炭素を含み、13GPa以上の弾性率を有し、そして2.0GPa以上の膜硬度を有する、請求項1記載の方法。
- 堆積されたままの前記膜が、続いてUV硬化され、そして該硬化された膜が25原子%以上の炭素を含み、15GPa以上の弾性率を有し、そして3.0GPa以上の硬度を有する、請求項1記載の方法。
- 請求項1記載の方法であって、
前記気体試薬が、ポロゲンを更に含み、
堆積されたままの前記膜が、該ポロゲンを含む予備膜であり、そして該方法が、
該予備膜から該ポロゲンの少なくとも一部を除去して、細孔を含み、そして2.6以下の誘電率を有する多孔性誘電体膜を提供する工程、
を更に含む、方法。 - 前記ポロゲンが、
一般式CnH2nの環式炭化水素(式中、n=4〜14であり、環式構造中の炭素数は4〜10であり、そして環式構造上に1つもしくは2つ以上の単純な又は枝分かれした炭化水素置換基が存在してよい)、
一般式CnH(2n+2)−2mの直鎖もしくは枝分かれの飽和、単一もしくは複数の不飽和の炭化水素(式中、n=2〜20であり、m=0〜nである)、
一般式CnH2n−2pの単一もしくは複数の不飽和の環式炭化水素(式中、pは分子中の不飽和部位の数であり、n=4〜14であり、環式構造中の炭素数は4〜10であり、そして環式構造上に1つもしくは2つ以上の単純なもしくは枝分かれの炭化水素置換基が存在してよい)、
一般式CnH2n−2の二環式炭化水素(式中、n=4〜14であり、二環式構造中の炭素数は4〜12であり、そして環状構造上に1もしくは2以上の単純なもしくは枝分かれの炭化水素置換基が存在してよい)、
一般式CnH2n−(2+2m)の複数不飽和の二環式炭化水素(式中、mは分子中の不飽和部位の数であり、n=4〜14であり、二環式構造中の炭素数は4〜12であり、そして環状構造上に1もしくは2以上の単純なもしくは枝分かれの炭化水素置換基が存在してよい)、ならびに、
一般式CnH2n−4の三環式炭化水素(式中、n=4〜14であり、三環構造中の炭素数は4〜12であり、そして環状構造上に1または2以上の単純なもしくは枝分かれの炭化水素置換基が存在してよい)、
からなる群から選択される少なくとも1種の化合物である、請求項12記載の方法。 - 前記ポロゲンが、シクロヘキサン、1,2,4−トリメチルシクロヘキサン、1−メチル−4−(1−メチルエチル)シクロヘキサン、シクロオクタン、メチルシクロオクタン、エチレン、プロピレン、アセチレン、ネオヘキサン、1,3−ブタジエン、2−メチル−1,3−ブタジエン、2,3−ジメチル−2,3−ブタジエン、置換ジエン、パラ−シメン、シクロオクテン、1,5−シクロオクタジエン、シクロヘキセン、ビニルシクロヘキサン、ジメチルシクロヘキセン、α-テルピネン、ピネン、リモネン、ビニルシクロヘキセン、ノルボルナン、スピロ−ノナン、カンフェン、ノルボルネン、ノルボルナジエン、5−エチリデン−2−ノルボルネン、デカヒドロナフタレン、及びアダマンタンからなる群より選ばれる少なくとも1種の化合物を含む、請求項13記載の方法。
- 前記膜構造が、−CH2−メチレン橋掛けおよび−CH2CH2−エチレン橋掛けの少なくとも1種を含む、請求項1記載の方法。
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-
2018
- 2018-10-25 US US16/170,152 patent/US20190134663A1/en not_active Abandoned
- 2018-10-26 SG SG10201809520SA patent/SG10201809520SA/en unknown
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EP3476971A3 (en) | 2019-07-24 |
KR102232769B1 (ko) | 2021-03-25 |
TWI690614B (zh) | 2020-04-11 |
SG10201809520SA (en) | 2019-05-30 |
EP3476971B1 (en) | 2020-06-17 |
TW201923135A (zh) | 2019-06-16 |
JP2019081951A (ja) | 2019-05-30 |
KR20190047646A (ko) | 2019-05-08 |
CN109722648A (zh) | 2019-05-07 |
CN109722648B (zh) | 2021-06-25 |
EP3476971A2 (en) | 2019-05-01 |
US20190134663A1 (en) | 2019-05-09 |
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