JP6803296B2 - 露光装置および基板処理装置 - Google Patents

露光装置および基板処理装置 Download PDF

Info

Publication number
JP6803296B2
JP6803296B2 JP2017105673A JP2017105673A JP6803296B2 JP 6803296 B2 JP6803296 B2 JP 6803296B2 JP 2017105673 A JP2017105673 A JP 2017105673A JP 2017105673 A JP2017105673 A JP 2017105673A JP 6803296 B2 JP6803296 B2 JP 6803296B2
Authority
JP
Japan
Prior art keywords
substrate
unit
support
processing chamber
elevating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017105673A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018200420A (ja
Inventor
靖博 福本
靖博 福本
孝文 大木
孝文 大木
友宏 松尾
友宏 松尾
正也 浅井
正也 浅井
将彦 春本
将彦 春本
田中 裕二
裕二 田中
知佐世 中山
知佐世 中山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2017105673A priority Critical patent/JP6803296B2/ja
Priority to PCT/JP2018/017408 priority patent/WO2018221115A1/ja
Priority to TW107115851A priority patent/TWI666525B/zh
Publication of JP2018200420A publication Critical patent/JP2018200420A/ja
Application granted granted Critical
Publication of JP6803296B2 publication Critical patent/JP6803296B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2017105673A 2017-05-29 2017-05-29 露光装置および基板処理装置 Active JP6803296B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017105673A JP6803296B2 (ja) 2017-05-29 2017-05-29 露光装置および基板処理装置
PCT/JP2018/017408 WO2018221115A1 (ja) 2017-05-29 2018-05-01 露光装置および基板処理装置
TW107115851A TWI666525B (zh) 2017-05-29 2018-05-10 曝光裝置及基板處理裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017105673A JP6803296B2 (ja) 2017-05-29 2017-05-29 露光装置および基板処理装置

Publications (2)

Publication Number Publication Date
JP2018200420A JP2018200420A (ja) 2018-12-20
JP6803296B2 true JP6803296B2 (ja) 2020-12-23

Family

ID=64454569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017105673A Active JP6803296B2 (ja) 2017-05-29 2017-05-29 露光装置および基板処理装置

Country Status (3)

Country Link
JP (1) JP6803296B2 (zh)
TW (1) TWI666525B (zh)
WO (1) WO2018221115A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI747490B (zh) 2019-09-19 2021-11-21 日商斯庫林集團股份有限公司 曝光裝置
JP7295755B2 (ja) * 2019-09-19 2023-06-21 株式会社Screenホールディングス 基板処理装置
KR102359376B1 (ko) * 2020-06-03 2022-02-08 한국고요써모시스템(주) 기판의 열처리 오븐

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3356354B2 (ja) * 1994-05-30 2002-12-16 東京エレクトロン株式会社 処理装置
JP3028462B2 (ja) * 1995-05-12 2000-04-04 東京エレクトロン株式会社 熱処理装置
JP3823027B2 (ja) * 2001-01-31 2006-09-20 東京エレクトロン株式会社 基板処理装置
JP3892327B2 (ja) * 2002-03-28 2007-03-14 大日本スクリーン製造株式会社 基板処理装置
JP5484373B2 (ja) * 2011-02-14 2014-05-07 東京エレクトロン株式会社 パターン形成方法
US9669984B2 (en) * 2011-07-22 2017-06-06 Asml Holding N.V. Lithographic apparatus and device manufacturing method
JP5890255B2 (ja) * 2012-04-02 2016-03-22 株式会社Screenセミコンダクターソリューションズ 露光装置、基板処理装置、基板の露光方法および基板処理方法
CN108336011B (zh) * 2012-11-30 2022-08-02 株式会社尼康 搬入方法、搬送系统及曝光装置、和器件制造方法
CN106255924B (zh) * 2014-05-06 2019-12-10 Asml荷兰有限公司 衬底支座、用于在衬底支撑位置上加载衬底的方法、光刻设备和器件制造方法
NL2017433A (en) * 2015-10-09 2017-04-11 Asml Netherlands Bv Substrate table and lithographic apparatus

Also Published As

Publication number Publication date
WO2018221115A1 (ja) 2018-12-06
TW201901307A (zh) 2019-01-01
JP2018200420A (ja) 2018-12-20
TWI666525B (zh) 2019-07-21

Similar Documents

Publication Publication Date Title
KR101922260B1 (ko) 노광 장치, 기판 처리 장치, 기판의 노광 방법 및 기판 처리 방법
KR101764534B1 (ko) 노광 장치, 기판 처리 장치, 기판의 노광 방법 및 기판 처리 방법
JP6803296B2 (ja) 露光装置および基板処理装置
TWI706226B (zh) 曝光裝置、基板處理裝置、基板之曝光方法及基板處理方法
KR20160115775A (ko) 노광 장치 및 기판 처리 장치
TWI659275B (zh) 曝光裝置、基板處理裝置、曝光方法、及基板處理方法
JP6845058B2 (ja) 露光装置、基板処理装置、基板の露光方法および基板処理方法
WO2018190273A1 (ja) 露光装置、基板処理装置、基板の露光方法および基板処理方法
JP6768561B2 (ja) 露光装置、基板処理装置、基板の露光方法および基板処理方法
JP6872385B2 (ja) 露光装置、基板処理装置、基板の露光方法および基板処理方法
JP6924661B2 (ja) 露光装置、基板処理装置、露光方法および基板処理方法
JP2019057641A (ja) 露光装置、基板処理装置、露光方法および基板処理方法
JP7295754B2 (ja) 露光装置
JP2007311469A (ja) 基板の処理方法、プログラム及び基板処理システム
JP2012220896A (ja) 周辺露光方法及び周辺露光装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20191223

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200630

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200814

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20201104

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20201130

R150 Certificate of patent or registration of utility model

Ref document number: 6803296

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250