JP6795165B1 - 走査ミラーおよび走査ミラーの製造方法 - Google Patents
走査ミラーおよび走査ミラーの製造方法 Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/403—Oxides of aluminium, magnesium or beryllium
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00777—Preserve existing structures from alteration, e.g. temporary protection during manufacturing
- B81C1/00785—Avoid chemical alteration, e.g. contamination, oxidation or unwanted etching
- B81C1/00793—Avoid contamination, e.g. absorption of impurities or oxidation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/32—Carbides
- C23C16/325—Silicon carbide
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
- C23C16/345—Silicon nitride
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45555—Atomic layer deposition [ALD] applied in non-semiconductor technology
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/04—Optical MEMS
- B81B2201/042—Micromirrors, not used as optical switches
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0145—Flexible holders
- B81B2203/0154—Torsion bars
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- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Mechanical Optical Scanning Systems (AREA)
Abstract
Description
図1乃至図6は、本発明の実施の形態の走査ミラーおよび走査ミラーの製造方法を示している。
本発明の実施の形態の走査ミラーは、Si製のバンドル層とデバイス層との間に、SiO2製のBOX層を有するSOI(Silicon on Insulator)ウエハを用いて製造されている。SOIウエハは、バンドル層とデバイス層とが、BOX層により絶縁されている。
12 バンドル層
13 BOX層
21 支持電極
21a 内縁
22 梁部
22a ミラー用孔
23 コネクティングバー
24 ミラー部
25 トーションバー
26 印加電極
26a 駆動用孔
27 ALD層
31 レジストリポリマー
Claims (8)
- ミラー部と、
前記ミラー部を支持するよう設けられ、表面がALD層で覆われたトーションバーとを有し、
前記トーションバーに捩れ力を与えることにより、前記トーションバーに沿った軸を中心として前記ミラー部を回動可能に構成されていることを
特徴とする走査ミラー。 - 表面が前記ALD層で覆われた1対の電極を有し、各電極の間に電圧を印加することにより、前記トーションバーに捩れ力を与えるよう変形可能に設けられた静電アクチュエータを有することを特徴とする請求項1記載の走査ミラー。
- 前記ALD層は、絶縁体から成ることを特徴とする請求項1または2記載の走査ミラー。
- 前記ALD層は、酸化アルミニウム(Al2O3)、窒化アルミニウム(AlN)、窒化ケイ素(Si3N4)、炭化ケイ素(SiC)および窒化ガリウム(GaN)のうちのいずれか1種類、または複数種類から成ることを特徴とする請求項1乃至3のいずれか1項に記載の走査ミラー。
- 前記ミラー部と前記トーションバーとは、シリコン(Si)製であることを特徴とする請求項1乃至4のいずれか1項に記載の走査ミラー。
- 前記ALD層は、0.5nm乃至200nmの厚みを有していることを特徴とする請求項1乃至5のいずれか1項に記載の走査ミラー。
- ミラー部を支持するよう設けられたトーションバーに捩れ力を与えることにより、前記トーションバーに沿った軸を中心として前記ミラー部を回動可能に構成された走査ミラーの製造方法であって、
前記ミラー部と前記トーションバーとを形成した後、少なくとも前記トーションバーの表面に、原子層堆積法により前記ALD層を形成することを
特徴とする走査ミラーの製造方法。 - 前記走査ミラーは、1対の電極の間に電圧を印加することにより、前記トーションバーに捩れ力を与えるよう変形可能に設けられた静電アクチュエータを有し、
前記ミラー部と前記トーションバーと前記静電アクチュエータとを形成した後、少なくとも前記トーションバーの表面と前記静電アクチュエータの各電極の表面とに、原子層堆積法により前記ALD層を形成することを
特徴とする請求項7記載の走査ミラーの製造方法。
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JP2019098158 | 2019-05-25 | ||
JP2019098158 | 2019-05-25 | ||
PCT/JP2020/018008 WO2020241153A1 (ja) | 2019-05-25 | 2020-04-27 | 走査ミラーおよび走査ミラーの製造方法 |
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JP6795165B1 true JP6795165B1 (ja) | 2020-12-02 |
JPWO2020241153A1 JPWO2020241153A1 (ja) | 2021-09-13 |
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EP (1) | EP3978987A4 (ja) |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002040353A (ja) * | 2000-07-25 | 2002-02-06 | Miyota Kk | ガルバノ装置の製造方法及びガルバノ装置 |
US20070211257A1 (en) * | 2006-03-09 | 2007-09-13 | Kearl Daniel A | Fabry-Perot Interferometer Composite and Method |
WO2017006425A1 (ja) * | 2015-07-07 | 2017-01-12 | 富士通株式会社 | 光デバイス |
JP2017171664A (ja) * | 2011-05-24 | 2017-09-28 | バーサム マテリアルズ ユーエス,リミティド ライアビリティ カンパニー | 有機アミノシラン前駆体、並びにその製造方法及び使用方法 |
US20180186625A1 (en) * | 2016-12-30 | 2018-07-05 | Texas Instruments Incorporated | Dielectric cladding of microelectromechanical systems (mems) elements for improved reliability |
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US7553686B2 (en) * | 2002-12-17 | 2009-06-30 | The Regents Of The University Of Colorado, A Body Corporate | Al2O3 atomic layer deposition to enhance the deposition of hydrophobic or hydrophilic coatings on micro-electromechanical devices |
JP2008168438A (ja) * | 2007-01-09 | 2008-07-24 | Seiko Epson Corp | 静電アクチュエータ、液滴吐出ヘッド及びそれらの製造方法並びに液滴吐出装置 |
JP6459392B2 (ja) * | 2014-10-28 | 2019-01-30 | ミツミ電機株式会社 | 光走査装置 |
JP2017102232A (ja) * | 2015-12-01 | 2017-06-08 | セイコーエプソン株式会社 | 光学デバイス、画像表示装置、およびヘッドマウントディスプレイ |
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- 2020-04-27 US US17/417,981 patent/US20220066198A1/en active Pending
- 2020-04-27 JP JP2020545752A patent/JP6795165B1/ja active Active
- 2020-04-27 EP EP20814367.7A patent/EP3978987A4/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002040353A (ja) * | 2000-07-25 | 2002-02-06 | Miyota Kk | ガルバノ装置の製造方法及びガルバノ装置 |
US20070211257A1 (en) * | 2006-03-09 | 2007-09-13 | Kearl Daniel A | Fabry-Perot Interferometer Composite and Method |
JP2017171664A (ja) * | 2011-05-24 | 2017-09-28 | バーサム マテリアルズ ユーエス,リミティド ライアビリティ カンパニー | 有機アミノシラン前駆体、並びにその製造方法及び使用方法 |
WO2017006425A1 (ja) * | 2015-07-07 | 2017-01-12 | 富士通株式会社 | 光デバイス |
US20180186625A1 (en) * | 2016-12-30 | 2018-07-05 | Texas Instruments Incorporated | Dielectric cladding of microelectromechanical systems (mems) elements for improved reliability |
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EP3978987A4 (en) | 2022-07-27 |
JPWO2020241153A1 (ja) | 2021-09-13 |
US20220066198A1 (en) | 2022-03-03 |
EP3978987A1 (en) | 2022-04-06 |
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