JP6783791B2 - 導電性透明層の調製のためのアルコール/水混合物中の銀ナノワイヤ、及び分散したスチレン/(メタ)アクリル共重合体を含む組成物 - Google Patents
導電性透明層の調製のためのアルコール/水混合物中の銀ナノワイヤ、及び分散したスチレン/(メタ)アクリル共重合体を含む組成物 Download PDFInfo
- Publication number
- JP6783791B2 JP6783791B2 JP2017553100A JP2017553100A JP6783791B2 JP 6783791 B2 JP6783791 B2 JP 6783791B2 JP 2017553100 A JP2017553100 A JP 2017553100A JP 2017553100 A JP2017553100 A JP 2017553100A JP 6783791 B2 JP6783791 B2 JP 6783791B2
- Authority
- JP
- Japan
- Prior art keywords
- composition
- range
- butanol
- group
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000203 mixture Substances 0.000 title claims description 137
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 title claims description 55
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims description 32
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 title claims description 30
- 239000002042 Silver nanowire Substances 0.000 title claims description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims description 21
- 229920006243 acrylic copolymer Polymers 0.000 title claims description 13
- 238000002360 preparation method Methods 0.000 title description 10
- 229920001577 copolymer Polymers 0.000 claims description 53
- 239000000758 substrate Substances 0.000 claims description 48
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 40
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 34
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 claims description 34
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 28
- -1 polyethylene terephthalate Polymers 0.000 claims description 23
- 150000001298 alcohols Chemical class 0.000 claims description 22
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 21
- 238000002834 transmittance Methods 0.000 claims description 20
- 239000007787 solid Substances 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 16
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 claims description 13
- 239000002070 nanowire Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 9
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 239000002071 nanotube Substances 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 229920000620 organic polymer Polymers 0.000 claims description 4
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 238000007646 gravure printing Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 2
- 238000007650 screen-printing Methods 0.000 claims description 2
- 238000007764 slot die coating Methods 0.000 claims description 2
- 238000004528 spin coating Methods 0.000 claims description 2
- 239000000178 monomer Substances 0.000 description 45
- 239000000976 ink Substances 0.000 description 43
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 33
- 239000000523 sample Substances 0.000 description 19
- 125000000217 alkyl group Chemical group 0.000 description 16
- 230000003287 optical effect Effects 0.000 description 13
- 239000004094 surface-active agent Substances 0.000 description 13
- 125000003118 aryl group Chemical group 0.000 description 12
- 229910052739 hydrogen Inorganic materials 0.000 description 12
- 239000001257 hydrogen Substances 0.000 description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 12
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 9
- 239000011159 matrix material Substances 0.000 description 9
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 7
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 7
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 7
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 7
- 239000000080 wetting agent Substances 0.000 description 7
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 6
- 125000003342 alkenyl group Chemical group 0.000 description 6
- 125000000304 alkynyl group Chemical group 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 6
- 229910052736 halogen Inorganic materials 0.000 description 6
- 150000002367 halogens Chemical class 0.000 description 6
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 5
- 125000004093 cyano group Chemical group *C#N 0.000 description 5
- 150000002431 hydrogen Chemical class 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 4
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 4
- 150000001408 amides Chemical class 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- 239000000460 chlorine Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 230000002209 hydrophobic effect Effects 0.000 description 4
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical class CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 125000000129 anionic group Chemical group 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 3
- 239000000693 micelle Substances 0.000 description 3
- 239000002121 nanofiber Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- BEWCNXNIQCLWHP-UHFFFAOYSA-N 2-(tert-butylamino)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCNC(C)(C)C BEWCNXNIQCLWHP-UHFFFAOYSA-N 0.000 description 2
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical class NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 229920005729 JONCRYL® 60 Polymers 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- 125000004663 dialkyl amino group Chemical group 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 238000000265 homogenisation Methods 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 2
- 125000000160 oxazolidinyl group Chemical group 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920000307 polymer substrate Polymers 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 238000000518 rheometry Methods 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 2
- 125000001412 tetrahydropyranyl group Chemical group 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- CXOOGGOQFGCERQ-UHFFFAOYSA-N (2-methyl-2-nitropropyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)[N+]([O-])=O CXOOGGOQFGCERQ-UHFFFAOYSA-N 0.000 description 1
- POTYORUTRLSAGZ-UHFFFAOYSA-N (3-chloro-2-hydroxypropyl) prop-2-enoate Chemical compound ClCC(O)COC(=O)C=C POTYORUTRLSAGZ-UHFFFAOYSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- FMQPBWHSNCRVQJ-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropan-2-yl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C(F)(F)F)C(F)(F)F FMQPBWHSNCRVQJ-UHFFFAOYSA-N 0.000 description 1
- QTKPMCIBUROOGY-UHFFFAOYSA-N 2,2,2-trifluoroethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(F)(F)F QTKPMCIBUROOGY-UHFFFAOYSA-N 0.000 description 1
- QRIMLDXJAPZHJE-UHFFFAOYSA-N 2,3-dihydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(O)CO QRIMLDXJAPZHJE-UHFFFAOYSA-N 0.000 description 1
- PQDKOKTULASSPO-UHFFFAOYSA-N 2-(1,3-oxazolidin-2-yl)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC1NCCO1 PQDKOKTULASSPO-UHFFFAOYSA-N 0.000 description 1
- PRAMZQXXPOLCIY-UHFFFAOYSA-N 2-(2-methylprop-2-enoyloxy)ethanesulfonic acid Chemical compound CC(=C)C(=O)OCCS(O)(=O)=O PRAMZQXXPOLCIY-UHFFFAOYSA-N 0.000 description 1
- SJIXRGNQPBQWMK-UHFFFAOYSA-N 2-(diethylamino)ethyl 2-methylprop-2-enoate Chemical compound CCN(CC)CCOC(=O)C(C)=C SJIXRGNQPBQWMK-UHFFFAOYSA-N 0.000 description 1
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- GPOGMJLHWQHEGF-UHFFFAOYSA-N 2-chloroethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCl GPOGMJLHWQHEGF-UHFFFAOYSA-N 0.000 description 1
- ISRGONDNXBCDBM-UHFFFAOYSA-N 2-chlorostyrene Chemical compound ClC1=CC=CC=C1C=C ISRGONDNXBCDBM-UHFFFAOYSA-N 0.000 description 1
- CHNGPLVDGWOPMD-UHFFFAOYSA-N 2-ethylbutyl 2-methylprop-2-enoate Chemical compound CCC(CC)COC(=O)C(C)=C CHNGPLVDGWOPMD-UHFFFAOYSA-N 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- NJRHMGPRPPEGQL-UHFFFAOYSA-N 2-hydroxybutyl prop-2-enoate Chemical compound CCC(O)COC(=O)C=C NJRHMGPRPPEGQL-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- VWJAVBOLCVPIAK-UHFFFAOYSA-N 2-methoxybutyl 2-methylprop-2-enoate Chemical compound CCC(OC)COC(=O)C(C)=C VWJAVBOLCVPIAK-UHFFFAOYSA-N 0.000 description 1
- IJSVVICYGLOZHA-UHFFFAOYSA-N 2-methyl-n-phenylprop-2-enamide Chemical compound CC(=C)C(=O)NC1=CC=CC=C1 IJSVVICYGLOZHA-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- CEXQWAAGPPNOQF-UHFFFAOYSA-N 2-phenoxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOC1=CC=CC=C1 CEXQWAAGPPNOQF-UHFFFAOYSA-N 0.000 description 1
- ILZXXGLGJZQLTR-UHFFFAOYSA-N 2-phenylethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC1=CC=CC=C1 ILZXXGLGJZQLTR-UHFFFAOYSA-N 0.000 description 1
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 description 1
- DXIJHCSGLOHNES-UHFFFAOYSA-N 3,3-dimethylbut-1-enylbenzene Chemical compound CC(C)(C)C=CC1=CC=CC=C1 DXIJHCSGLOHNES-UHFFFAOYSA-N 0.000 description 1
- NWKKCUWIMOZYOO-UHFFFAOYSA-N 3-methoxybutyl 2-methylprop-2-enoate Chemical compound COC(C)CCOC(=O)C(C)=C NWKKCUWIMOZYOO-UHFFFAOYSA-N 0.000 description 1
- ULYIFEQRRINMJQ-UHFFFAOYSA-N 3-methylbutyl 2-methylprop-2-enoate Chemical compound CC(C)CCOC(=O)C(C)=C ULYIFEQRRINMJQ-UHFFFAOYSA-N 0.000 description 1
- YGQURMQHUGDYAO-UHFFFAOYSA-N 4-[2-[2-(4-nitrophenyl)imidazo[2,1-b][1,3]benzothiazol-6-yl]oxyethyl]morpholine Chemical compound C1=CC([N+](=O)[O-])=CC=C1C1=CN2C3=CC=C(OCCN4CCOCC4)C=C3SC2=N1 YGQURMQHUGDYAO-UHFFFAOYSA-N 0.000 description 1
- VLKMIPHLVWYOTQ-UHFFFAOYSA-N 5,6-dihydroxyhexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCC(O)CO VLKMIPHLVWYOTQ-UHFFFAOYSA-N 0.000 description 1
- NUXLDNTZFXDNBA-UHFFFAOYSA-N 6-bromo-2-methyl-4h-1,4-benzoxazin-3-one Chemical compound C1=C(Br)C=C2NC(=O)C(C)OC2=C1 NUXLDNTZFXDNBA-UHFFFAOYSA-N 0.000 description 1
- OCIFJWVZZUDMRL-UHFFFAOYSA-N 6-hydroxyhexyl prop-2-enoate Chemical compound OCCCCCCOC(=O)C=C OCIFJWVZZUDMRL-UHFFFAOYSA-N 0.000 description 1
- RUZXDTHZHJTTRO-UHFFFAOYSA-N 7-amino-4h-1,4-benzoxazin-3-one Chemical compound N1C(=O)COC2=CC(N)=CC=C21 RUZXDTHZHJTTRO-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- STNJBCKSHOAVAJ-UHFFFAOYSA-N Methacrolein Chemical compound CC(=C)C=O STNJBCKSHOAVAJ-UHFFFAOYSA-N 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- ULUAUXLGCMPNKK-UHFFFAOYSA-N Sulfobutanedioic acid Chemical compound OC(=O)CC(C(O)=O)S(O)(=O)=O ULUAUXLGCMPNKK-UHFFFAOYSA-N 0.000 description 1
- LCXXNKZQVOXMEH-UHFFFAOYSA-N Tetrahydrofurfuryl methacrylate Chemical compound CC(=C)C(=O)OCC1CCCO1 LCXXNKZQVOXMEH-UHFFFAOYSA-N 0.000 description 1
- OXOPJTLVRHRSDJ-SNAWJCMRSA-N [(e)-but-2-enyl] 2-methylprop-2-enoate Chemical compound C\C=C\COC(=O)C(C)=C OXOPJTLVRHRSDJ-SNAWJCMRSA-N 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000006184 cosolvent Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- WRAABIJFUKKEJQ-UHFFFAOYSA-N cyclopentyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCC1 WRAABIJFUKKEJQ-UHFFFAOYSA-N 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- FKIRSCKRJJUCNI-UHFFFAOYSA-N ethyl 7-bromo-1h-indole-2-carboxylate Chemical compound C1=CC(Br)=C2NC(C(=O)OCC)=CC2=C1 FKIRSCKRJJUCNI-UHFFFAOYSA-N 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- LNCPIMCVTKXXOY-UHFFFAOYSA-N hexyl 2-methylprop-2-enoate Chemical compound CCCCCCOC(=O)C(C)=C LNCPIMCVTKXXOY-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- MCVVUJPXSBQTRZ-ONEGZZNKSA-N methyl (e)-but-2-enoate Chemical compound COC(=O)\C=C\C MCVVUJPXSBQTRZ-ONEGZZNKSA-N 0.000 description 1
- AWJZTPWDQYFQPQ-UHFFFAOYSA-N methyl 2-chloroprop-2-enoate Chemical compound COC(=O)C(Cl)=C AWJZTPWDQYFQPQ-UHFFFAOYSA-N 0.000 description 1
- WFKDPJRCBCBQNT-UHFFFAOYSA-N n,2-dimethylprop-2-enamide Chemical compound CNC(=O)C(C)=C WFKDPJRCBCBQNT-UHFFFAOYSA-N 0.000 description 1
- QRWZCJXEAOZAAW-UHFFFAOYSA-N n,n,2-trimethylprop-2-enamide Chemical compound CN(C)C(=O)C(C)=C QRWZCJXEAOZAAW-UHFFFAOYSA-N 0.000 description 1
- JMCVCHBBHPFWBF-UHFFFAOYSA-N n,n-diethyl-2-methylprop-2-enamide Chemical compound CCN(CC)C(=O)C(C)=C JMCVCHBBHPFWBF-UHFFFAOYSA-N 0.000 description 1
- OVHHHVAVHBHXAK-UHFFFAOYSA-N n,n-diethylprop-2-enamide Chemical compound CCN(CC)C(=O)C=C OVHHHVAVHBHXAK-UHFFFAOYSA-N 0.000 description 1
- ZIWDVJPPVMGJGR-UHFFFAOYSA-N n-ethyl-2-methylprop-2-enamide Chemical compound CCNC(=O)C(C)=C ZIWDVJPPVMGJGR-UHFFFAOYSA-N 0.000 description 1
- SWPMNMYLORDLJE-UHFFFAOYSA-N n-ethylprop-2-enamide Chemical compound CCNC(=O)C=C SWPMNMYLORDLJE-UHFFFAOYSA-N 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- NZIDBRBFGPQCRY-UHFFFAOYSA-N octyl 2-methylprop-2-enoate Chemical compound CCCCCCCCOC(=O)C(C)=C NZIDBRBFGPQCRY-UHFFFAOYSA-N 0.000 description 1
- QHGUPRQTQITEPO-UHFFFAOYSA-N oxan-2-yl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCO1 QHGUPRQTQITEPO-UHFFFAOYSA-N 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical class C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- GYDSPAVLTMAXHT-UHFFFAOYSA-N pentyl 2-methylprop-2-enoate Chemical compound CCCCCOC(=O)C(C)=C GYDSPAVLTMAXHT-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- PZAWASVJOPLHCJ-UHFFFAOYSA-N prop-2-ynyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC#C PZAWASVJOPLHCJ-UHFFFAOYSA-N 0.000 description 1
- BOQSSGDQNWEFSX-UHFFFAOYSA-N propan-2-yl 2-methylprop-2-enoate Chemical compound CC(C)OC(=O)C(C)=C BOQSSGDQNWEFSX-UHFFFAOYSA-N 0.000 description 1
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 150000003333 secondary alcohols Chemical class 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
- GOCYQQKRJUGVRU-SQQVDAMQSA-M sodium;(e)-but-2-enoate Chemical compound [Na+].C\C=C\C([O-])=O GOCYQQKRJUGVRU-SQQVDAMQSA-M 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
- B05D1/005—Spin coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
- C03C17/10—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals by deposition from the liquid phase
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/08—Heat treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/108—Hydrocarbon resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0831—Gold
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/004—Additives being defined by their length
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/046—Carbon nanorods, nanowires, nanoplatelets or nanofibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Geochemistry & Mineralogy (AREA)
- Thermal Sciences (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Paints Or Removers (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Electric Cables (AREA)
- Non-Insulated Conductors (AREA)
Description
適切な液体中に溶解又は分散された、十分な量の
(i)1種以上のマトリックス形成結合剤、
(ii)導電性ナノ物体、及び
(iii)任意に、補助成分
を含む組成物を塗布し、前記基板の前記表面上に、25℃、且つ101.325kPaで固体である、塗布された組成物の成分(以下、固体成分と称する)を含む導電性透明層が形成されるまで、それらの25℃、且つ101.325kPaで液体である成分(以下、液体成分と称する)を、前記基板の前記表面に塗布された前記組成物から除去することにより調製される。そのような導電性透明層の調製のための組成物は、一般に、インクと称される。
(a)導電性粒子、好ましくは銀粒子、さらに好ましくは銀フレーク
(b)スチレン/(メタ)アクリル共重合体
(c)アニオン性湿潤剤
(d)消泡剤、及び
(e)水
並びに、任意に、アルコール、アミン、グリコール、アセテート、エーテル、ケトン、アルデヒド及びアミドからなる群から選択される少なくとも1種の溶媒を含む組成物を開示する。US2008/0182090A1によれば、前記アニオン性湿潤剤は、好ましくはアルカリ性スルホコハク酸塩(alkali sulfosuccinate)、及びアニオン性ポリアクリレート共重合体からなる群から選択される。
(A)(A−1)水
(A−2)メタノール、エタノール、n−プロパノール、i−プロパノール、n−ブタノール、i−ブタノール、及びt−ブタノールからなる群から選択される1種以上のアルコール、
を含む混合物、
(B)導電性ナノ物体(electroconductive nanoobject)であり、
前記導電性ナノ物体(B)は、1nm〜100nmの範囲の2つの外形寸法(external dimension)、及び1μm〜100μmの範囲のそれらの第3の外形寸法を有し、
前記導電性ナノ物体(B)の総質量画分は、前記組成物の総質量に基づいて、0.01質量%〜1質量%の範囲である前記導電性ナノ物体(B)、
(C)混合物(A)中に溶解された、1種以上のスチレン/(メタ)アクリル共重合体であり、
前記溶解された共重合体(C)は、それぞれ500g/mol〜22000g/molの範囲の数平均分子量を有し、
前記溶解された共重合体(C)の総質量画分は、前記組成物の総質量に基づいて、0.02質量%〜5質量%の範囲である前記溶解された共重合体(C)、
を含む前記組成物によって達成される。
(A−1)水
(A−2)メタノール、エタノール、n−プロパノール、i−プロパノール、n−ブタノール、i−ブタノール、及びt−ブタノールからなる群から選択される1種以上のアルコール、
を含む混合物(A)であり、
25℃、且つ101.325kPaで固体である主成分は、上記で定義した導電性ナノ物体(B)、及び上記で定義した1種以上の共重合体(C)である。本発明に従う(上記で定義した)組成物において、25℃、且つ101.325kPaで固体である成分(固体成分)の総濃度は、いずれの場合にも前記組成物の総質量に基づいて、10質量%以下、好ましくは8質量%以下、さらに好ましくは5質量%以下である。
(A−1)水
(A−2)メタノール、エタノール、n−プロパノール、i−プロパノール、n−ブタノール、i−ブタノール、及びt−ブタノールからなる群から選択される1種以上のアルコール、
を含む混合物である。
(A−1)水、及び
(A−2)メタノール、エタノール、n−プロパノール、i−プロパノール、n−ブタノール、i−ブタノール、及びt−ブタノールからなる群から選択される1種以上のアルコール、
からなる。
いずれの場合にも前記混合物(A)の総体積に基づいて、
(A−1)70%〜<100%の水、
(A−2)>0%〜30%の、メタノール、エタノール、n−プロパノール、i−プロパノール、n−ブタノール、i−ブタノール、及びt−ブタノールからなる群から選択される1種以上のアルコール、
からなる。
いずれの場合にも前記混合物(A)の総体積に基づいて、
(A−1)70%〜98%の水
(A−2)2%〜30%の、メタノール、エタノール、n−プロパノール、i−プロパノール、n−ブタノール、i−ブタノール、及びt−ブタノールからなる群から選択される1種以上のアルコール、
からなる。
いずれの場合にも前記混合物(A)の総体積に基づいて、
(A−1)75%〜85%の水
(A−2)15%〜25%の、メタノール、エタノール、n−プロパノール、i−プロパノール、n−ブタノール、i−ブタノール、及びt−ブタノールからなる群から選択される1種以上のアルコール、
からなる。
共重合形態で、
・モノアルケニル芳香族モノマーMC1に由来する単位C1
及び、
・(メタ)アクリルモノマーMC2に由来する単位C2
を含むか、又はそれらからなり、
前記単位C1(モノアルケニル芳香族モノマーに由来する単位)が、化学構造
R2は、互いに単位C1のR2から独立して、ハロゲン(好ましくは塩素)、及びアルキル(好ましくはメチル)からなる群から選択され、且つR2は、オルト、メタ、及びパラからなる群から選択される位置にある]
を有し、
前記単位C2((メタ)アクリルモノマーに由来する単位)が、化学構造
R4は、互いに単位C2のR4から独立して、
−COOH、
−COOX(式中、Xは、アルカリ金属カチオン、アンモニウムカチオン、及び置換アンモニウムカチオンから選択される)、
−CN、
−COOR5(式中、R5は、分岐、及び非分岐のアルキル基、分岐、及び非分岐のアルケニル基、分岐、及び非分岐のアルキニル基、シクロアルキル基、アラルキル基、アラルケニル基、フルフリル、テトラヒドロフルフリル、イソプロピリデングリセリル、グリシジル、並びにテトラヒドロピラニルからなる群から選択され、前記分岐、及び非分岐のアルキル基、アルケニル基、並びにアルキニル基は、ヒドロキシ、アルコキシ、フェノキシ、ハロゲン、スルホ、ニトロ、オキサゾリジニル、モノアルキルアミノ、及びジアルキルアミノ基からなる群から選択される1個以上の基で置換された、分岐、及び非分岐のアルキル基、アルケニル基、並びにアルキニル基を含む)、
−CHO、
−NR6R7(式中、R6、及びR7は、独立して、水素、アルキル、及びフェニルからなる群から選択される)
からなる群から選択される。]
を有する。
R2は、互いにモノマーMC1のR2から独立して、ハロゲン(好ましくは塩素)、及びアルキル(好ましくはメチル)からなる群から選択され、且つR2は、オルト、メタ、及びパラからなる群から選択される位置にある]
を有する1種以上のものアルケニル芳香族モノマーMC1と、式
R4は、互いにモノマーMC2のR4から独立して、
−COOH、
−COOX(式中、Xは、アルカリ金属カチオン、アンモニウムカチオン、及び置換アンモニウムカチオンから選択される)、
−CN、
−COOR5(式中、R5は、分岐、及び非分岐のアルキル基、分岐、及び非分岐のアルケニル基、分岐、及び非分岐のアルキニル基、シクロアルキル基、アラルキル基、アラルケニル基、フルフリル、テトラヒドロフルフリル、イソプロピリデングリセリル、グリシジル、並びにテトラヒドロピラニルからなる群から選択され、前記分岐、及び非分岐のアルキル基、アルケニル基、並びにアルキニル基は、ヒドロキシ、アルコキシ、フェノキシ、ハロゲン、スルホ、ニトロ、オキサゾリジニル、モノアルキルアミノ、及びジアルキルアミノ基からなる群から選択される1個以上の基で置換された、分岐、及び非分岐のアルキル基、アルケニル基、並びにアルキニル基を含む)、
−CHO、
−NR6R7(式中、R6、及びR7は、独立して、水素、アルキル、及びフェニルからなる群から選択される)
からなる群から選択される。]
を有する1種以上の(メタ)アクリルモノマーMC2との共重合によって得られる。
(A)混合物であり、
いずれの場合にも、前記混合物(A)の総体積に基づいて、
(A−1)70%〜98%の水
(A−2)2%〜30%の、メタノール、エタノール、n−プロパノール、i−プロパノール、n−ブタノール、i−ブタノール、及びt−ブタノールからなる群から選択される1種以上のアルコール、
からなる混合物、
(B)銀ナノワイヤであり、
10μm〜50μmの範囲の長さ、及び3nm〜30nmの範囲の直径を有し、
前記銀ナノワイヤ(B)の総質量画分は、前記組成物の総質量に基づいて、0.5質量%以下である前記銀ナノワイヤ(B)、
(C)混合物(A)中に溶解された、スチレン/(メタ)アクリル共重合体であり、
1700g/mol〜15500g/molの範囲の数平均分子量を有し、
前記溶解された共重合体(C)の質量画分は、前記組成物の総質量に基づいて、2質量%未満、好ましくは1.5質量%以下である前記溶解された共重合体(C)、
を含むか、又はそれらからなり、
前記銀ナノワイヤ(B)の総質量と、
前記溶解された共重合体(C)の質量との比が、
1:5〜5:1の範囲である、
前記組成物が、特に好ましい。
上記で定義した本発明に従う組成物を調製、又は供給する工程、
基板の表面に前記組成物を塗布する工程、
前記基板の前記表面上に、層が形成されるまで、25℃、且つ101.325kPaで液体である成分を、前記基板の前記表面に塗布された前記組成物から除去する工程、
を含む。
である。したがって、シート抵抗Rshは、
・2013年11月に発行されたASTM D1003(手順A)に従って測定して、1%以下のヘイズ、
・4探針プローブで測定して、100オーム/スクエア以下のシート抵抗、
・2013年11月に発行されたASTM D1003(手順A)に従って測定して、90%以上の光透過率、
の1種以上を示す。
・2013年11月に発行されたASTM D1003(手順A)に従って測定して、1%以下のヘイズ、及び
・4探針プローブで測定して、100オーム/スクエア以下のシート抵抗、及び
・2013年11月に発行されたASTM D1003(手順A)に従って測定して、90%以上の光透過率、
を示す。
銀ナノワイヤ(上記で定義したナノ物体(B))の水分散液、及び上記で定義したスチレン/アクリル共重合体(C)の水溶液(Joncryl60、BASFから市販されている)を、選択された脂肪族アルコール(A−2)(後述の表1参照)と、30分間の分散時間で混合し、3.6mg/mlの銀ナノワイヤの濃度、及び表1に示した銀ナノワイヤ(B)の、共重合体(C)に対する質量比を有するインクを得る。選択された脂肪族アルコール(A−2)の、水(A−1)に対する体積比は、1/9に設定する。
銀ナノワイヤ(上記で定義したナノ物体(B))の水分散液、及び上記で定義したスチレン/アクリル共重合体(C)の水溶液(Joncryl60、BASFから市販されている)を、(A−2)イソプロパノールと、30分間の分散時間で混合し、5mg/mlの銀ナノワイヤ(B)の濃度、及び後述の表2に示した銀ナノワイヤ(B)の、共重合体(C)に対する質量比を有するインクを得る。イソプロパノール(A−2)の、水(A−1)に対する体積比は、3/7に設定する。
Claims (12)
- 組成物であって、成分
(A)(A−1)70〜98%の水、及び
(A−2)2〜30%のメタノール、エタノール、n−プロパノール、i−プロパノール、n−ブタノール、i−ブタノール、及びt−ブタノールからなる群から選択される1種以上のアルコール、
を含む混合物であって、成分(A−1)、(A−2)の百分率は、前記混合物の総体積に基づく混合物、
(B)導電性ナノ物体であり、
前記導電性ナノ物体(B)は、1nm〜100nmの範囲の2つの外形寸法、及び1μm〜100μmの範囲の第3の外形寸法を有し、
前記導電性ナノ物体(B)の総質量画分は、前記組成物の総質量に基づいて、0.01質量%〜1質量%の範囲である前記導電性ナノ物体(B)、及び
(C)混合物(A)中に溶解された、1種以上のスチレン/(メタ)アクリル共重合体であり、
前記溶解された共重合体(C)は、それぞれ500〜22000の範囲の数平均分子量を有し、
前記溶解された共重合体(C)の総質量画分は、前記組成物の総質量に基づいて、0.02質量%〜5質量%の範囲である前記溶解された共重合体(C)、
を含み、
25℃、且つ101.325kPaで固体である成分の含有量が、前記組成物の総質量に基づいて、5質量%以下であり、及び
カーボンナノチューブを含まない、組成物。 - 前記導電性ナノ物体(B)が、1μm〜100μmの範囲の長さ、及び
1nm〜100nmの範囲の直径を有し、
前記導電性ナノ物体(B)が、銀、銅、及び金からなる群から選択される1種以上の材料を含む請求項1に記載の組成物。 - 前記導電性ナノ物体(B)が、ナノワイヤ、及びナノチューブからなる群から選択される請求項1に記載の組成物。
- 前記導電性ナノ物体(B)の総質量と、
前記溶解された共重合体(C)の総質量との比が、
1:20〜20:1の範囲である請求項1に記載の組成物。 - 前記1種以上のアルコール(A−2)が、i−プロパノール、n−ブタノール、及びt−ブタノールからなる群から選択される請求項1に記載の組成物。
- (A)前記混合物
(B)前記導電性ナノ物体としての銀ナノワイヤであり、
前記銀ナノワイヤ(B)は、10μm〜50μmの範囲の長さ、及び3nm〜30nmの範囲の直径を有し、
前記銀ナノワイヤ(B)の総質量画分は、前記組成物の総質量に基づいて、0.5質量%以下である前記銀ナノワイヤ(B)、
(C)混合物(A)中に溶解された、スチレン/(メタ)アクリル共重合体であり、
前記溶解された共重合体(C)は、1700〜15500の範囲の数平均分子量を有し、
前記溶解された共重合体(C)の質量画分は、前記組成物の総質量に基づいて、2質量%未満である前記溶解された共重合体(C)、
を含み、
前記銀ナノワイヤ(B)の総質量と、前記溶解された共重合体(C)の質量との比が、
1:5〜5:1の範囲である請求項1に記載の組成物。 - 2013年11月に発行されたASTM D1003(手順A)に従って測定して、80%以上の光透過率を有する導電性層を、基材上に調製する方法であって、
請求項1に記載の組成物を調製、又は供給する工程、
基材の表面に前記組成物を塗布する工程、
前記基材の前記表面上に、層が形成されるまで、25℃、且つ101.325kPaで液体である成分を、前記基材の前記表面に塗布された前記組成物から除去する工程、
を含む方法。 - 前記基材の前記表面に前記組成物を塗布する工程が、スピンコーティング、ドローダウンコーティング、ロールツーロールコーティング、グラビア印刷、マイクログラビア印刷、スクリーン印刷、フレキソ印刷、及びスロットダイコーティングからなる群から選択される技術によって実施される請求項7に記載の方法。
- 前記基材が、ガラス、及び有機ポリマーからなる群から選択される材料を含む請求項7に記載の方法。
- 前記基材が、ポリエチレンテレフタレートを含む請求項7に記載の方法。
- 25℃、且つ101.325kPaで液体である前記成分の、前記基材の前記表面に塗布された前記組成物からの除去工程を、前記基材の前記表面に塗布された前記組成物を、100℃〜150℃の範囲の温度に、15分以下の時間さらすことによって達成する請求項7に記載の方法。
- 前記混合物が、
(A−1)75〜85%の水、
(A−2)15〜25%のメタノール、エタノール、n−プロパノール、i−プロパノール、n−ブタノール、i−ブタノール、及びt−ブタノールからなる群から選択される1種以上のアルコール、
から成る請求項1に記載の組成物。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562144961P | 2015-04-09 | 2015-04-09 | |
US62/144,961 | 2015-04-09 | ||
PCT/EP2016/056109 WO2016162192A1 (en) | 2015-04-09 | 2016-03-21 | Composition comprising silver nanowires in an alcohol/water mixture and dispersed styrene/(meth)acrylic copolymers for the preparation of electroconductive transparent layers |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018515879A JP2018515879A (ja) | 2018-06-14 |
JP6783791B2 true JP6783791B2 (ja) | 2020-11-11 |
Family
ID=55699607
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017553100A Expired - Fee Related JP6783791B2 (ja) | 2015-04-09 | 2016-03-21 | 導電性透明層の調製のためのアルコール/水混合物中の銀ナノワイヤ、及び分散したスチレン/(メタ)アクリル共重合体を含む組成物 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10526501B2 (ja) |
JP (1) | JP6783791B2 (ja) |
KR (1) | KR20170135909A (ja) |
CN (1) | CN107429095A (ja) |
TW (1) | TWI700345B (ja) |
WO (1) | WO2016162192A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6710685B2 (ja) * | 2014-08-15 | 2020-06-17 | ビーエーエスエフ ソシエタス・ヨーロピアBasf Se | 導電性透明層の製造のための銀ナノワイヤーおよびスチレン/(メタ)アクリル酸コポリマーを含む組成物 |
KR102486523B1 (ko) * | 2017-06-07 | 2023-01-11 | 삼성디스플레이 주식회사 | 캐패시터 구조체, 캐패시터 구조체를 구비한 표시 장치 및 캐패시터 구조체 제조 방법 |
CN114341279B (zh) * | 2019-09-26 | 2023-09-12 | Dic油墨株式会社 | 水性液体印刷油墨、印刷物及层叠体 |
CN114334274B (zh) * | 2021-12-17 | 2024-03-08 | 深圳市善柔科技有限公司 | 银纳米线薄膜及其制备方法 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4414370A (en) | 1981-01-09 | 1983-11-08 | S. C. Johnson & Son, Inc. | Process for continuous bulk copolymerization of vinyl monomers |
US4529787A (en) | 1982-06-15 | 1985-07-16 | S. C. Johnson & Son, Inc. | Bulk polymerization process for preparing high solids and uniform copolymers |
US4546160A (en) | 1984-02-29 | 1985-10-08 | S. C. Johnson & Son, Inc. | Bulk polymerization process for preparing high solids and uniform copolymers |
US5508366A (en) | 1994-10-18 | 1996-04-16 | S. C. Johnson & Son, Inc. | Continuous production of reduced gel content hydroxylated addition polymers |
KR100341140B1 (ko) * | 2000-02-28 | 2002-06-20 | 이종학 | 수성 잉크용 수지 보강 에멀젼 수지 및 이의 제조방법 |
EP1962348B1 (en) | 2005-08-12 | 2013-03-06 | Cambrios Technologies Corporation | Nanowires-based transparent conductors |
US20110097277A1 (en) * | 2005-08-25 | 2011-04-28 | University Of Washington | Particles coated with zwitterionic polymers |
US8709288B2 (en) | 2006-09-08 | 2014-04-29 | Sun Chemical Corporation | High conductive water-based silver ink |
US20090035707A1 (en) * | 2007-08-01 | 2009-02-05 | Yubing Wang | Rheology-controlled conductive materials, methods of production and uses thereof |
CN101754584B (zh) * | 2008-12-12 | 2012-01-25 | 清华大学 | 制备导电线路的方法 |
ES2607961T3 (es) * | 2010-07-12 | 2017-04-04 | Hanwha Chemical Corporation | Composición de revestimiento conductor y método para fabricar una capa conductora usando la misma |
JP2013544917A (ja) | 2010-10-22 | 2013-12-19 | カンブリオス テクノロジーズ コーポレイション | ナノワイヤーインク組成物およびその印刷 |
KR101795419B1 (ko) * | 2011-01-26 | 2017-11-13 | 주식회사 잉크테크 | 투명 도전막의 제조방법 및 이에 의해 제조된 투명 도전막 |
DE102011119821A1 (de) * | 2011-12-01 | 2013-06-06 | Bundesdruckerei Gmbh | Elektrooptisches Sicherheitselement |
JP2013196918A (ja) * | 2012-03-21 | 2013-09-30 | Jnc Corp | 透明導電膜の形成に用いられる塗膜形成用組成物 |
GB201209221D0 (en) * | 2012-05-25 | 2012-07-04 | Isis Innovation | Solid material and method and composition for forming solid material |
US9920207B2 (en) * | 2012-06-22 | 2018-03-20 | C3Nano Inc. | Metal nanostructured networks and transparent conductive material |
US20140255707A1 (en) * | 2013-03-06 | 2014-09-11 | Carestream Health, Inc. | Stabilization agents for silver nanowire based transparent conductive films |
US20150014025A1 (en) * | 2013-04-05 | 2015-01-15 | Nuovo Film, Inc. | Transparent conductive electrodes comprising merged metal nanowires, their structure design, and method of making such structures |
JP2015034279A (ja) * | 2013-04-10 | 2015-02-19 | デクセリアルズ株式会社 | 透明導電膜形成用インク組成物、透明導電膜、透明電極の製造方法、及び画像表示装置 |
JP6710685B2 (ja) | 2014-08-15 | 2020-06-17 | ビーエーエスエフ ソシエタス・ヨーロピアBasf Se | 導電性透明層の製造のための銀ナノワイヤーおよびスチレン/(メタ)アクリル酸コポリマーを含む組成物 |
WO2016023889A1 (en) * | 2014-08-15 | 2016-02-18 | Basf Se | Composition comprising silver nanowires and dispersed polymer beads for the preparation of electroconductive transparent layers |
JP2017535930A (ja) * | 2014-09-22 | 2017-11-30 | ビーエーエスエフ ソシエタス・ヨーロピアBasf Se | 透明導電層、その層を備えたフィルム、及びその製造方法 |
-
2016
- 2016-03-21 WO PCT/EP2016/056109 patent/WO2016162192A1/en active Application Filing
- 2016-03-21 KR KR1020177032036A patent/KR20170135909A/ko not_active Application Discontinuation
- 2016-03-21 CN CN201680018303.3A patent/CN107429095A/zh active Pending
- 2016-03-21 US US15/564,779 patent/US10526501B2/en not_active Expired - Fee Related
- 2016-03-21 JP JP2017553100A patent/JP6783791B2/ja not_active Expired - Fee Related
- 2016-04-07 TW TW105110898A patent/TWI700345B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US20180105713A1 (en) | 2018-04-19 |
WO2016162192A1 (en) | 2016-10-13 |
TWI700345B (zh) | 2020-08-01 |
US10526501B2 (en) | 2020-01-07 |
CN107429095A (zh) | 2017-12-01 |
JP2018515879A (ja) | 2018-06-14 |
TW201700640A (zh) | 2017-01-01 |
KR20170135909A (ko) | 2017-12-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI684185B (zh) | 用於製備導電透明層的含有銀奈米線及苯乙烯/(甲基)丙烯酸共聚物之組成物 | |
EP3180402B1 (en) | Composition comprising silver nanowires and fibers of crystalline cellulose for the preparation of electroconductive transparent layers | |
JP6783791B2 (ja) | 導電性透明層の調製のためのアルコール/水混合物中の銀ナノワイヤ、及び分散したスチレン/(メタ)アクリル共重合体を含む組成物 | |
JP2021167425A (ja) | 融着ネットワークを有する透明導電性フィルムの形成のための金属ナノワイヤーインク | |
JP6639500B2 (ja) | 導電性透明層の製造のための銀ナノワイヤーおよび分散されたポリマービーズを含む組成物 | |
WO2018134411A1 (en) | Stretchable conductive ink | |
JP6084397B2 (ja) | 焼結用無機粒子含有ペーストおよび塗布形成物 | |
JP6084396B2 (ja) | 焼結用無機粒子含有ペーストおよび塗布形成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190320 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20191118 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191210 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20200302 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200420 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200929 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20201022 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6783791 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |