JP6775791B1 - Parts delivery device - Google Patents

Parts delivery device Download PDF

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JP6775791B1
JP6775791B1 JP2020092482A JP2020092482A JP6775791B1 JP 6775791 B1 JP6775791 B1 JP 6775791B1 JP 2020092482 A JP2020092482 A JP 2020092482A JP 2020092482 A JP2020092482 A JP 2020092482A JP 6775791 B1 JP6775791 B1 JP 6775791B1
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image
delivery device
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light
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JP2021190506A (en
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正一 永里
正一 永里
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Ueno Seiki Co Ltd
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Ueno Seiki Co Ltd
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Priority to JP2020092482A priority Critical patent/JP6775791B1/en
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Priority to CN202110516912.4A priority patent/CN113233189A/en
Priority to MYPI2021002819A priority patent/MY188856A/en
Priority to TW110119159A priority patent/TWI774395B/en
Publication of JP2021190506A publication Critical patent/JP2021190506A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90Devices for picking-up and depositing articles or materials
    • B65G47/91Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/917Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers control arrangements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G43/00Control devices, e.g. for safety, warning or fault-correcting
    • B65G43/08Control devices operated by article or material being fed, conveyed or discharged

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Studio Devices (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Seal Device For Vehicle (AREA)
  • Window Of Vehicle (AREA)
  • Fluid-Damping Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

【課題】電子部品の受け渡しの際に接近させる部材を所定の位置に正確に配置させることが可能な部品受渡し装置を提供する。【解決手段】対向して配置される部材A1、B1の少なくとも一方を仮想直線L1に平行に移動させて、部材A1、B1を接近させ、部材A1、B1間にある電子部品Wを部材B1に渡す部品受渡し装置10において、部材A1、B1が非対向に配置された状態で、仮想直線L1に平行な方向に部材A1又は部材B1を対向位置から撮像した第1の画像、及び、対向配置されている部材A1、B1の双方を仮想直線L1に直交する方向に撮像した第2の画像を得る撮像手段19と、第1、第2の画像の各被撮像物から撮像手段19に至る光路上に設けられ、光の反射及び屈折のいずれか一方又は双方により、撮像手段19に第1、第2の画像をとらえさせる光路調整手段20とを備える。【選択図】図1PROBLEM TO BE SOLVED: To provide a component delivery device capable of accurately arranging a member to be approached at a predetermined position when delivering an electronic component. SOLUTION: At least one of members A1 and B1 arranged to face each other is moved in parallel with a virtual straight line L1, the members A1 and B1 are brought close to each other, and an electronic component W between the members A1 and B1 is attached to the member B1. In the parts delivery device 10 to be handed over, in a state where the members A1 and B1 are arranged non-opposing, the first image obtained by capturing the member A1 or the member B1 from the opposite position in the direction parallel to the virtual straight line L1 and the members are arranged facing each other. An imaging means 19 for obtaining a second image obtained by capturing both of the members A1 and B1 in a direction orthogonal to the virtual straight line L1 and an optical path from each object to be imaged to the imaging means 19 of the first and second images. The image pickup means 19 is provided with an optical path adjusting means 20 for capturing the first and second images by one or both of light reflection and reflection. [Selection diagram] Fig. 1

Description

本発明は、電子部品を所定の部材に移動させる部品受渡し装置に関する。 The present invention relates to a component delivery device that moves an electronic component to a predetermined member.

電子部品を吸着している一のユニットの吸着ノズルから他のユニットの吸着ノズルに電子部品を移動させる装置や、表面に電子部品が貼り付けられたウエハシートの裏面側を針状部材で押して電子部品を表面側に移動させ、ウエハシートの表面側に配されたコレットに渡す装置(特許文献1参照)等、一の部材(以下、「部材A」と言う)と他の部材(以下、「部材B」と言う)を接近させて、部材A、B間にある電子部品を部材Bに受け渡す様々な装置が存在する。 A device that moves electronic components from the suction nozzle of one unit that sucks electronic components to the suction nozzles of another unit, or the back side of a wafer sheet with electronic components attached to the front surface is pushed by a needle-shaped member to generate electrons. One member (hereinafter referred to as "member A") and another member (hereinafter referred to as "member A") such as a device (see Patent Document 1) for moving a component to the surface side and passing it to a collet arranged on the surface side of the wafer sheet. There are various devices that bring (referred to as "member B") closer to each other and deliver electronic components between members A and B to member B.

このような装置においては、部材A及び部材Bをそれぞれ所定の位置に配した状態から部材Aと部材Bを接近させることが、電子部品の安定的な受け渡しのために重要であり、各部材の組み立て時の調整等によって、部材A及び部材Bがそれぞれ所定の位置に配されるようにしてきた。 In such a device, it is important to bring the member A and the member B close to each other from the state where the member A and the member B are arranged at predetermined positions for stable delivery of the electronic parts, and it is important for each member to be delivered. The members A and B have been arranged at predetermined positions by adjustment at the time of assembly or the like.

特開平11−186298号公報JP-A-11-186298

しかしながら、電子部品の微小化が進むにつれ、部材A及び部材Bをそれぞれ所定の位置に配する精度をより高める必要があった。なお、ここで言う電子部品とは、例えば、ダイオード、トランジスタ、コンデンサ、インダクタ、IC(Integrated Circuit)である。
本発明は、かかる事情に鑑みてなされたもので、電子部品の受け渡しの際に接近させる部材を所定の位置に正確に配置させることが可能な部品受渡し装置を提供することを目的とする。
However, as the miniaturization of electronic components progresses, it is necessary to improve the accuracy of arranging the members A and B at predetermined positions. The electronic components referred to here are, for example, diodes, transistors, capacitors, inductors, and ICs (Integrated Circuits).
The present invention has been made in view of such circumstances, and an object of the present invention is to provide a parts delivery device capable of accurately arranging members to be approached at a predetermined position when delivering electronic parts.

前記目的に沿う第1の発明に係る部品受渡し装置は、対向して配置される部材A、Bの少なくとも一方を仮想直線Lに平行に移動させて、該部材A、Bを接近させ、該部材A、B間にある電子部品を該部材Bに渡す部品受渡し装置において、前記部材A、Bが非対向に配置された状態で、前記仮想直線Lに平行な方向に該部材A又は該部材Bを対向位置から撮像した第1の画像を得る第1の撮像手段と、対向配置されている前記部材A、Bの双方を前記仮想直線Lに直交する方向に撮像した第2の画像を得る第2の撮像手段と、前記部材A、Bのいずれか一方と共に回転して、該部材A、Bが非対向に配置された状態及び該部材A、Bが対向配置された状態の一方から他方に切り替える回転体とを備える。 In the component delivery device according to the first invention according to the above object, at least one of the members A and B arranged to face each other is moved in parallel with the virtual straight line L to bring the members A and B close to each other, and the members are brought close to each other. In a component delivery device that passes an electronic component between A and B to the member B, the member A or the member B is arranged in a non-opposing state and is arranged in a direction parallel to the virtual straight line L. A first imaging means for obtaining a first image captured from a facing position, and a second image obtained by capturing both of the members A and B arranged opposite to each other in a direction orthogonal to the virtual straight line L. Rotating together with the image pickup means of 2 and one of the members A and B, one of the states in which the members A and B are arranged non-opposite and the state in which the members A and B are arranged facing each other become the other. It has a rotating body to switch .

前記目的に沿う第2の発明に係る部品受渡し装置は、対向して配置される部材A、Bの少なくとも一方を仮想直線Lに平行に移動させて、該部材A、Bを接近させ、該部材A、B間にある電子部品を該部材Bに渡す部品受渡し装置において、前記部材A、Bが非対向に配置された状態で、前記仮想直線Lに平行な方向に該部材A又は該部材Bを対向位置から撮像した第1の画像、及び、対向配置されている前記部材A、Bの双方を前記仮想直線Lに直交する方向に撮像した第2の画像を得る撮像手段と、前記第1、第2の画像の各被撮像物から前記撮像手段に至る光路上に設けられ、光の反射及び屈折のいずれか一方又は双方により、前記撮像手段に前記第1、第2の画像をとらえさせる光路調整手段と、前記部材A、Bのいずれか一方と共に回転して、該部材A、Bが非対向に配置された状態及び該部材A、Bが対向配置された状態の一方から他方に切り替える回転体とを備える。 In the component delivery device according to the second invention according to the above object, at least one of the members A and B arranged to face each other is moved in parallel with the virtual straight line L to bring the members A and B close to each other, and the members are brought close to each other. In a component delivery device that passes an electronic component between A and B to the member B, the member A or the member B is arranged in a direction parallel to the virtual straight line L with the members A and B arranged in a non-opposing manner. An imaging means for obtaining a first image obtained by capturing images from opposite positions and a second image obtained by capturing both of the members A and B arranged to face each other in a direction orthogonal to the virtual straight line L, and the first image. , Which is provided on the optical path from each object to be imaged in the second image to the imaging means, and causes the imaging means to capture the first and second images by one or both of light reflection and refraction. Rotating together with the optical path adjusting means and one of the members A and B, the members A and B are switched from one of the non-opposed states and the members A and B to the other. It is equipped with a rotating body .

第1、第2の発明に係る部品受渡し装置は、部材A、Bが非対向に配置された状態で、仮想直線Lに平行な方向に部材A又は部材Bを対向位置から撮像した第1の画像、及び、対向配置されている部材A、Bの双方を仮想直線Lに直交する方向に撮像した第2の画像を得るので、第1の画像から部材A又は部材Bの位置を検出して部材A又は部材Bの位置調整をし、第2の画像から部材A、B間の距離を検出して、部材A、B間の間隔を調整することができ、電子部品の受け渡しの際に接近させる部材A、Bを所定の位置に正確に配置させることが可能である。 In the parts delivery device according to the first and second inventions, the first member A or member B is imaged from the opposite position in a direction parallel to the virtual straight line L in a state where the members A and B are arranged non-opposing. Since the image and the second image obtained by capturing both the images and the members A and B arranged opposite to each other in the direction orthogonal to the virtual straight line L are obtained, the position of the member A or the member B is detected from the first image. The position of the member A or the member B can be adjusted, the distance between the members A and B can be detected from the second image, and the distance between the members A and B can be adjusted, and the electronic parts can be approached when the electronic parts are delivered. It is possible to accurately arrange the members A and B to be made to be in a predetermined position.

本発明の第1の実施の形態に係る部品受渡し装置の説明図である。It is explanatory drawing of the parts delivery apparatus which concerns on 1st Embodiment of this invention. 同部品受渡し装置における第1の画像の説明図である。It is explanatory drawing of the 1st image in the component delivery apparatus. 同部品受渡し装置における第2の画像の説明図である。It is explanatory drawing of the 2nd image in the component delivery apparatus. 本発明の第2の実施の形態に係る部品受渡し装置の説明図である。It is explanatory drawing of the parts delivery apparatus which concerns on 2nd Embodiment of this invention. 本発明の第3の実施の形態に係る部品受渡し装置の説明図である。It is explanatory drawing of the parts delivery apparatus which concerns on 3rd Embodiment of this invention. 本発明の第4の実施の形態に係る部品受渡し装置の説明図である。It is explanatory drawing of the parts delivery apparatus which concerns on 4th Embodiment of this invention.

続いて、添付した図面を参照しつつ、本発明を具体化した実施の形態につき説明し、本発明の理解に供する。
図1に示すように、本発明の第1の実施の形態に係る部品受渡し装置10は、対向して配置される部材A1(部材Aの一例)及び部材B1(部材Bの一例)の少なくとも一方を仮想直線L1(仮想直線Lの一例)に平行に移動させて、部材A1、B1を接近させ、部材A1、B1間にある電子部品Wを部材B1に渡す装置である。以下、詳細に説明する。
Subsequently, an embodiment embodying the present invention will be described with reference to the attached drawings, and the present invention will be understood.
As shown in FIG. 1, the component delivery device 10 according to the first embodiment of the present invention has at least one of a member A1 (an example of a member A) and a member B1 (an example of a member B) arranged to face each other. Is a device that moves the members A1 and B1 in parallel with the virtual straight line L1 (an example of the virtual straight line L) to bring the members A1 and B1 close to each other, and passes the electronic component W between the members A1 and B1 to the member B1. The details will be described below.

部品受渡し装置10は、図1に示すように、水平配置された円盤状の回転体11と、回転体11に昇降自在に取り付けられた複数の可動ロッド12と、回転体11を回転させるモータ13を備えている。可動ロッド12は、回転体11の外周部に等間隔で配され、それぞれ鉛直に回転体11を貫通している。各可動ロッド12は、回転体11から上側に突出した部分にコイルバネ14が装着され、回転体11から下側に突出した部分にアーム15の一端部が固定されている。アーム15は回転体11の径方向に長く、他端部が回転体11から離れた位置に配されている。 As shown in FIG. 1, the component delivery device 10 includes a horizontally arranged disk-shaped rotating body 11, a plurality of movable rods 12 movably attached to the rotating body 11, and a motor 13 for rotating the rotating body 11. It has. The movable rods 12 are arranged at equal intervals on the outer peripheral portion of the rotating body 11, and each vertically penetrates the rotating body 11. A coil spring 14 is attached to a portion of each movable rod 12 projecting upward from the rotating body 11, and one end of an arm 15 is fixed to a portion projecting downward from the rotating body 11. The arm 15 is long in the radial direction of the rotating body 11, and the other end thereof is arranged at a position away from the rotating body 11.

部材A1は、鉛直方向に長い吸着ノズルであり、アーム15の他端部を貫通している。部材A1は、下端部中心で真空圧によって電子部品Wを吸着し、吸着している電子部品Wを真空破壊又は大気開放によって解放する。モータ13は間欠的に作動し、可動ロッド12、アーム15及び部材A1はモータ13の間欠的な作動によって移動(回転体11の中心を基準とした回転移動)及び一時停止を繰り返す。モータ13の一度の作動により、各可動ロッド12は可動ロッド12の配置ピッチ分移動する。 The member A1 is a suction nozzle that is long in the vertical direction and penetrates the other end of the arm 15. The member A1 attracts the electronic component W by vacuum pressure at the center of the lower end portion, and releases the attracted electronic component W by vacuum breaking or opening to the atmosphere. The motor 13 operates intermittently, and the movable rod 12, the arm 15, and the member A1 are repeatedly moved (rotationally moved with reference to the center of the rotating body 11) and paused by the intermittent operation of the motor 13. By operating the motor 13 once, each movable rod 12 moves by the arrangement pitch of the movable rod 12.

可動ロッド12が一時停止する位置のいくつかには、直上に、可動ロッド12を押し下げて可動ロッド12、アーム15及び部材A1を下降させる押下げ手段16が設けられている。押下げ手段16が可動ロッド12、アーム15及び部材A1を下降させる距離は調整可能である。可動ロッド12、アーム15及び部材A1は、可動ロッド12が押下げ手段16から下向きの力を付与されていない状態で、可動ロッド12に作用しているコイルバネ14の復元力によって押し上げられる。以下、部材A1が下降していない高さ位置を「上昇位置」といい、部材A1が下降した高さ位置を「下降位置」と言う。 At some of the positions where the movable rod 12 is temporarily stopped, pressing means 16 for pushing down the movable rod 12 to lower the movable rod 12, the arm 15, and the member A1 is provided directly above. The distance at which the pressing means 16 lowers the movable rod 12, the arm 15, and the member A1 can be adjusted. The movable rod 12, the arm 15, and the member A1 are pushed up by the restoring force of the coil spring 14 acting on the movable rod 12 in a state where the movable rod 12 is not applied a downward force by the pushing means 16. Hereinafter, the height position where the member A1 is not lowered is referred to as an "elevation position", and the height position where the member A1 is lowered is referred to as a "descending position".

押下げ手段16が可動ロッド12の真上に配された状態で、当該可動ロッド12に対応する部材A1の直下には、電子部品Wの位置を調整する校正ユニット17が設置されている。校正ユニット17は、電子部品Wを上端部中心で真空圧により吸着し、吸着している電子部品Wを真空破壊又は大気開放によって解放する部材B1(本実施の形態では、吸着コレット)と、部材B1の水平移動及び部材B1の仮想の鉛直軸を中心とした旋回が可能な位置調整機構18とを備えている。 With the pressing means 16 arranged directly above the movable rod 12, a calibration unit 17 for adjusting the position of the electronic component W is installed directly below the member A1 corresponding to the movable rod 12. The calibration unit 17 includes a member B1 (in this embodiment, a suction collet) that sucks the electronic component W at the center of the upper end portion by vacuum pressure and releases the sucked electronic component W by vacuum breaking or opening to the atmosphere. It is provided with a position adjusting mechanism 18 capable of horizontally moving B1 and turning around a virtual vertical axis of member B1.

部材B1の上方で上昇位置に配されている部材A1に吸着された電子部品Wは、部材A1、B1間で、部材B1まで距離を有する位置に配される。以下、特に記載がない限り、部材A1は、校正ユニット17の上方に配されているものとする。本実施の形態において、仮想直線L1は鉛直に配され、電子部品Wは、部材A1が上昇位置から仮想直線L1に平行に移動(下降)するのに伴って部材B1に接近し、部材A1が下降位置に配されて部材B1に接触する。 The electronic component W adsorbed on the member A1 arranged in the ascending position above the member B1 is arranged at a position having a distance to the member B1 between the members A1 and B1. Hereinafter, unless otherwise specified, the member A1 is assumed to be arranged above the calibration unit 17. In the present embodiment, the virtual straight line L1 is arranged vertically, and the electronic component W approaches the member B1 as the member A1 moves (descends) in parallel with the virtual straight line L1 from the ascending position, and the member A1 moves. It is arranged in the descending position and comes into contact with the member B1.

部材A1は、部材B1に接近する際、等速で移動(下降)してもよいし、部材B1に接近するに従って事前に設定された位置から減速するようにしてもよい。また、部材A1が移動して電子部品Wが部材B1に接触した時点で、押下げ手段16のモータに流れる電流値等を基に押下げ手段16に生じている負荷を計測し、計測された負荷が設定値以上の負荷とならないように荷重制御を行うことができる。 The member A1 may move (descend) at a constant speed when approaching the member B1, or may decelerate from a preset position as it approaches the member B1. Further, when the member A1 moves and the electronic component W comes into contact with the member B1, the load generated in the pressing means 16 is measured and measured based on the current value flowing through the motor of the pressing means 16 and the like. Load control can be performed so that the load does not exceed the set value.

部材B1が電子部品Wを吸着した後、部材A1は、電子部品Wを解放して部材B1に電子部品Wを渡し、上昇する。
次に、部材B1が部材A1から取得した電子部品Wを、その位置を校正して部材A1に戻す。具体的には、位置調整機構18が、電子部品Wが部材A1に吸着されていた際に検出された電子部品Wの部材A1に対する相対位置を基に、適宜、部材B1の水平移動や旋回を行って電子部品Wが部材A1に対し所定の位置に配されるように位置を調整する。部材B1は位置調整が完了した電子部品Wを、下降して下降位置に配された部材A1に戻し、電子部品Wを吸着した部材A1は上昇位置まで上昇する。部材A1は、電子部品Wを吸着して上昇する際、等速で上昇してもよいし、予め設定した速度制御パターンに従って加減速を行ってもよい。
After the member B1 attracts the electronic component W, the member A1 releases the electronic component W, passes the electronic component W to the member B1, and ascends.
Next, the position of the electronic component W obtained by the member B1 from the member A1 is calibrated and returned to the member A1. Specifically, the position adjusting mechanism 18 appropriately moves or turns the member B1 based on the relative position of the electronic component W with respect to the member A1 detected when the electronic component W is attracted to the member A1. The position is adjusted so that the electronic component W is arranged at a predetermined position with respect to the member A1. The member B1 lowers the electronic component W whose position adjustment has been completed and returns it to the member A1 arranged in the descending position, and the member A1 adsorbing the electronic component W rises to the ascending position. When the electronic component W is adsorbed and ascended, the member A1 may ascend at a constant speed, or may accelerate or decelerate according to a preset speed control pattern.

ここで、部材A1、B1間の電子部品Wの受け渡しを安定的に行うには、上昇位置にある部材A1の下端部中心(電子部品Wを吸着する部分)及び部材B1の上端部中心(電子部品Wを吸着する部分)が仮想直線L1に平行に配されること、並びに、部材A1が下降位置に配されて、部材A1の下端部中心から部材B1の上端部中心までの距離が電子部品Wの厚み分となることが重要である。 Here, in order to stably transfer the electronic component W between the members A1 and B1, the center of the lower end portion of the member A1 at the raised position (the portion that attracts the electronic component W) and the center of the upper end portion of the member B1 (electronics). The portion that attracts the component W) is arranged parallel to the virtual straight line L1, and the member A1 is arranged at the descending position, and the distance from the center of the lower end of the member A1 to the center of the upper end of the member B1 is an electronic component. It is important that it is the thickness of W.

そのため、部品受渡し装置10は、以下に説明する撮像手段19及び光路調整手段20を具備し、部材A1、B1間で電子部品Wの受け渡しを行う前の準備工程として、部材A1、B1の位置調整を行えるように設計されている。
撮像手段19は、撮像方向が鉛直(仮想直線L1に平行な方向)となるように設置されている。平面視して、可動ロッド12、部材A1(部材B1についても同じ)及び撮像手段19は、直線的に並べられている。光路調整手段20は、撮像手段19の直下に配されたビームスプリッタ21、ビームスプリッタ21の直下で部材A1、B1間の高さ位置に配されたミラー22、及び、ビームスプリッタ21と同一高さで、部材A1、B1の真上に配されたミラー23を具備している。ここで、ビームスプリッタ21に代えて、ハーフミラーのように入射光の角度に応じて光を反射又は透過するコーティング面が設けられた光学部品を用いてもよい。
Therefore, the component delivery device 10 includes the imaging means 19 and the optical path adjusting means 20 described below, and adjusts the positions of the members A1 and B1 as a preparatory step before the electronic component W is delivered between the members A1 and B1. It is designed to be able to do.
The imaging means 19 is installed so that the imaging direction is vertical (direction parallel to the virtual straight line L1). In a plan view, the movable rod 12, the member A1 (the same applies to the member B1), and the imaging means 19 are arranged linearly. The optical path adjusting means 20 has the same height as the beam splitter 21 arranged directly under the imaging means 19, the mirror 22 arranged at a height position between the members A1 and B1 directly under the beam splitter 21, and the beam splitter 21. The mirror 23 is provided directly above the members A1 and B1. Here, instead of the beam splitter 21, an optical component having a coating surface that reflects or transmits light according to the angle of incident light, such as a half mirror, may be used.

ミラー22は、部材A1、B1が対向配置される位置(以下、「部材A1、B1の対向位置」とも言う)からミラー22に向かって水平に進んでミラー22に入射した光をビームスプリッタ21に向かって真上に反射する。ビームスプリッタ21は、ミラー22から真上に進んでビームスプリッタ21に入射した光を透過させて撮像手段19に向かわせる。 The mirror 22 advances horizontally toward the mirror 22 from a position where the members A1 and B1 are arranged to face each other (hereinafter, also referred to as “opposite positions of the members A1 and B1”), and the light incident on the mirror 22 is transferred to the beam splitter 21. It reflects directly above. The beam splitter 21 travels directly upward from the mirror 22 to transmit the light incident on the beam splitter 21 and directs the light to the imaging means 19.

ミラー23は、部材A1、B1の対向位置からミラー23に向かって真上に進んでミラー23に入射した光をビームスプリッタ21に向かって水平に反射する。ビームスプリッタ21は、ミラー23から水平に進んでビームスプリッタ21に入射した光の略半分を真上に反射して撮像手段19に向かわせる。 The mirror 23 advances directly upward toward the mirror 23 from the opposite positions of the members A1 and B1 and horizontally reflects the light incident on the mirror 23 toward the beam splitter 21. The beam splitter 21 travels horizontally from the mirror 23 and reflects substantially half of the light incident on the beam splitter 21 directly upward to direct it to the imaging means 19.

準備工程における部材A1、B1の位置調整は以下のように行われる。
部材B1の真上に部材A1が配されていない状態(部材A1、B1が非対向に配置された状態)で、撮像手段19は、図2に示すように、仮想直線L1に平行な方向で部材B1を真上(部材B1の対向位置)から撮像した第1の画像Pを得る。第1の画像Pは、部材B1を真上から撮像した領域P1に加え、部材B1が水平に撮像された領域P2も有する。部材B1の真上に部材A1が配されないようにするには、例えば、押下げ手段16の真下に可動ロッド12が配された状態から、回転体11を可動ロッド12の配置ピッチの半分に当たる角度だけ回転させればよい。
The position adjustment of the members A1 and B1 in the preparatory step is performed as follows.
In a state where the member A1 is not arranged directly above the member B1 (a state in which the members A1 and B1 are arranged in a non-opposing manner), the imaging means 19 is in a direction parallel to the virtual straight line L1 as shown in FIG. A first image P obtained by imaging the member B1 from directly above (the position facing the member B1) is obtained. The first image P has a region P2 in which the member B1 is horizontally imaged in addition to the region P1 in which the member B1 is imaged from directly above. To prevent the member A1 from being arranged directly above the member B1, for example, the angle at which the rotating body 11 hits half of the arrangement pitch of the movable rod 12 from the state where the movable rod 12 is arranged directly under the pressing means 16. You only have to rotate it.

そして、第1の画像Pの領域P1から、第1の画像Pにおける所定の位置R(本実施の形態では、領域P1の中心)に対する部材B1の上端部中央の相対位置が検出される。本検出は、人が第1の画像Pを画面で見て行ってもよいし、撮像手段19に接続された図示しない情報処理端末が行ってもよい。本実施の形態では、人が第1の画像Pを見て、位置Rに対する部材B1の上端部中央の相対位置を容易に確認できるように、撮像手段19の光学部材(例えばレンズ)に、位置Rで直交する直線J、Kが付された図示しないガラス板が取り付けられている。 Then, from the region P1 of the first image P, the relative position of the center of the upper end portion of the member B1 with respect to the predetermined position R (in the present embodiment, the center of the region P1) in the first image P is detected. This detection may be performed by a person viewing the first image P on a screen, or may be performed by an information processing terminal (not shown) connected to the imaging means 19. In the present embodiment, the position is placed on the optical member (for example, a lens) of the imaging means 19 so that a person can easily confirm the relative position of the center of the upper end portion of the member B1 with respect to the position R by looking at the first image P. A glass plate (not shown) with straight lines J and K orthogonal to each other at R is attached.

ガラス板は、直線Jが領域P1内で位置Rを通りx軸方向に沿い、直線Kが位置Rを通り領域P1、P2に渡ってy軸方向に沿うように、撮像手段19のレンズに対して位置決めされている。当該ガラス板を用いる代わりに、撮像手段19が得た第1の画像P(後述する第2の画像Qについても同じ)に直線J、Kと同様の2本の直線をソフトウェアによって付すようにしてもよい。
第1の画像Pの領域P1において、部材B1の上端部中心が位置Rに配されるように、撮像手段19や部材B1の位置が調整される。これによって、位置調整後に撮像された第1の画像Pでは、領域P1において部材B1の上端部中心が位置R上に配され、領域P2において部材B1の上端部中心が直線K上に配されることとなる。
The glass plate is formed with respect to the lens of the imaging means 19 so that the straight line J passes through the position R in the region P1 and follows the x-axis direction, and the straight line K passes through the position R and follows the regions P1 and P2 along the y-axis direction. Is positioned. Instead of using the glass plate, software attaches two straight lines similar to the straight lines J and K to the first image P (the same applies to the second image Q described later) obtained by the imaging means 19. May be good.
In the region P1 of the first image P, the positions of the imaging means 19 and the member B1 are adjusted so that the center of the upper end portion of the member B1 is arranged at the position R. As a result, in the first image P captured after the position adjustment, the center of the upper end portion of the member B1 is arranged on the position R in the region P1, and the center of the upper end portion of the member B1 is arranged on the straight line K in the region P2. It will be.

次に、部材A1、B1が対向配置された状態で、撮像手段19は、図3に示すように、対向配置されている部材A1、B1の双方を水平(仮想直線L1に直交する方向)に撮像した第2の画像Qを得る。本実施の形態においては、第2の画像Qを撮像する際に、部材A1が電子部品Wを吸着しておらず上昇位置に配されているが、部材A1は、電子部品Wを吸着していてもよいし、下降位置や部材B1に接触する位置に配されていてもよい。
第2の画像Qは、部材A1、B1を水平に撮像した領域Q2に加えて部材A1、B1を真上から撮像した領域Q1も有する。領域Q1、Q2はそれぞれ領域P1、P2に対応し、第2の画像Qには、第1の画像Pと同様に直線J、Kがとらえられる。
Next, with the members A1 and B1 facing each other, the image pickup means 19 horizontally arranges both the members A1 and B1 facing each other (direction orthogonal to the virtual straight line L1) as shown in FIG. The captured second image Q is obtained. In the present embodiment, when the second image Q is imaged, the member A1 does not adsorb the electronic component W and is arranged in the ascending position, but the member A1 adsorbs the electronic component W. It may be arranged at a descending position or a position where it comes into contact with the member B1.
The second image Q has a region Q1 in which the members A1 and B1 are imaged from directly above in addition to the region Q2 in which the members A1 and B1 are imaged horizontally. The regions Q1 and Q2 correspond to the regions P1 and P2, respectively, and the straight lines J and K are captured in the second image Q as in the first image P.

従って、光路調整手段20は、第1の画像Pの領域P1の被撮像物である部材B1及び第2の画像Qの領域Q2の被撮像物である部材A1、B1から撮像手段19に至る光路上に設けられ、光の反射により、撮像手段19に第1の画像P及び第2の画像Qをとらえさせるものである。なお、光の屈折のみによって、あるいは、光の反射及び屈折によって、撮像手段19に第1の画像P及び第2の画像Qをとらえさせる光路調整手段を採用してもよい。 Therefore, the optical path adjusting means 20 is the light from the members B1 which are the objects to be imaged in the region P1 of the first image P and the members A1 and B1 which are the objects to be imaged in the region Q2 of the second image Q to the imaging means 19. It is provided on the road and causes the image pickup means 19 to capture the first image P and the second image Q by reflecting light. It should be noted that an optical path adjusting means for causing the imaging means 19 to capture the first image P and the second image Q by refraction of light alone or by reflection and refraction of light may be adopted.

第2の画像Qの領域Q2を基にして、部材A1の下端部と部材B1の上端部間の距離が検出される。部材A1、B1が接触している場合は、部材A1、B1間の距離は零として検出される。
ここで、第1の画像Pを利用して行った撮像手段19や部材B1の位置調整によって、第2の画像Qの領域Q2において、部材B1の上端部中心が直線K上に配されている。
The distance between the lower end of the member A1 and the upper end of the member B1 is detected based on the region Q2 of the second image Q. When the members A1 and B1 are in contact with each other, the distance between the members A1 and B1 is detected as zero.
Here, by adjusting the positions of the imaging means 19 and the member B1 performed using the first image P, the center of the upper end portion of the member B1 is arranged on the straight line K in the region Q2 of the second image Q. ..

即ち、撮像手段19は、第1の画像Pにおいて第1の画像Pの領域P1のx軸方向中心に位置する被撮像物の部位(ここでは部材B1の上端部中心)が、(第2の画像Qの)領域Q2のx軸方向中心に位置した第2の画像Qを得ている。そのため、第2の画像Qの領域Q2を基にして、部材A1の下端部中心が部材B1の上端部中心の真上(部材B1の上端部中心に対して仮想直線L1に平行)に配されていることから、部材A1の下端部中心が直線K上に配されていることを検出できる。 That is, in the image pickup means 19, the portion of the object to be imaged (here, the center of the upper end portion of the member B1) located at the center in the x-axis direction of the region P1 of the first image P in the first image P is (second). A second image Q located at the center of the region Q2 (of the image Q) in the x-axis direction is obtained. Therefore, based on the region Q2 of the second image Q, the center of the lower end portion of the member A1 is arranged directly above the center of the upper end portion of the member B1 (parallel to the center of the upper end portion of the member B1 and parallel to the virtual straight line L1). Therefore, it can be detected that the center of the lower end portion of the member A1 is arranged on the straight line K.

また、第2の画像Qの領域Q1には部材A1の上端部が撮像される。そのため、本実施の形態では、部材A1の上端部中心及び部材A1の下端部中心が仮想直線L1に平行に配されていることを前提として、第2の画像Qの領域Q1において部材A1の上端部中心が位置R(直線K、Jの直交位置)に一致していることから、部材A1の下端部中心が部材B1の上端部中心の真上に配されていることを検出するようにしている。
第2の画像Qを利用した各検出も、人が第2の画像Qを画面で見て行ってもよいし、情報処理端末がソフトウェアを用いて行ってもよい。
Further, the upper end portion of the member A1 is imaged in the region Q1 of the second image Q. Therefore, in the present embodiment, it is assumed that the center of the upper end portion of the member A1 and the center of the lower end portion of the member A1 are arranged parallel to the virtual straight line L1, and the upper end of the member A1 is arranged in the region Q1 of the second image Q. Since the center of the portion coincides with the position R (the position orthogonal to the straight lines K and J), it is detected that the center of the lower end of the member A1 is directly above the center of the upper end of the member B1. There is.
Each detection using the second image Q may also be performed by a person looking at the second image Q on the screen, or by the information processing terminal using software.

第2の画像Qにおいて、部材A1の下端部中心から部材B1の上端部中心までの距離が所定の値となり、かつ、部材A1の下端部中心が部材B1の上端部中心の真上に配されるように、部材A1の位置調整がなされる。部材A1を上昇位置に配して第2の画像Qを得た場合、部材A1の上昇位置を基準にして下降位置を決定でき、部材A1を下降位置に配して第2の画像Qを得た場合、部材A1の下降位置を基準にして上昇位置を決定でき、部材A1、B1を接触させて第2の画像Qを撮像した場合、部材A1が部材B1に接触する位置を基準にして、部材A1の上昇位置及び下降位置を決めることができる。
第2の画像Qを利用した各検出及びその検出結果を基にした部材A1の位置調整は、全ての部材A1について行われる。
In the second image Q, the distance from the center of the lower end of the member A1 to the center of the upper end of the member B1 is a predetermined value, and the center of the lower end of the member A1 is arranged directly above the center of the upper end of the member B1. As described above, the position of the member A1 is adjusted. When the member A1 is arranged in the ascending position to obtain the second image Q, the descending position can be determined with reference to the ascending position of the member A1, and the member A1 is arranged in the descending position to obtain the second image Q. In this case, the ascending position can be determined with reference to the descending position of the member A1, and when the members A1 and B1 are brought into contact with each other and the second image Q is imaged, the position where the member A1 contacts the member B1 is used as a reference. The ascending position and the descending position of the member A1 can be determined.
Each detection using the second image Q and the position adjustment of the member A1 based on the detection result are performed for all the members A1.

本実施の形態では、撮像手段19が単焦点式である。位置調整機構18は、撮像手段19が、第1の画像Pの被撮像物及び第2の画像Qの被撮像物を焦点が合った状態で撮像するように設計されていることから、第1の画像P及び第2の画像Qを基にした各検出を安定的になすことができる。
なお、焦点距離が可変の撮像手段を採用してもよく、その場合、第1の画像を撮像するタイミングと第2の画像を撮像するタイミングで、撮像手段の焦点距離を変えれば、第1の画像の被撮像物及び第2の画像の被撮像物を焦点が合った状態で撮像できることから、位置調整機構によって第1の画像を得るための光路長と第2の画像を得るための光路長を一致させる調整は不要である。
In the present embodiment, the imaging means 19 is a single focus type. The position adjusting mechanism 18 is first because the imaging means 19 is designed to image the imaged object of the first image P and the imaged object of the second image Q in a focused state. Each detection based on the image P and the second image Q of the above can be stably performed.
An imaging means having a variable focal length may be adopted. In that case, if the focal length of the imaging means is changed at the timing of capturing the first image and the timing of capturing the second image, the first image is taken. Since the imaged object of the image and the imaged object of the second image can be imaged in a focused state, the optical path length for obtaining the first image and the optical path length for obtaining the second image by the position adjustment mechanism. No adjustment is required to match.

部品受渡し装置10は、1つの撮像手段19で第1の画像P及び第2の画像Qを得るようにしているが、第1の画像を得る撮像手段とは別に第2の画像を得る撮像手段を設けるようにしてもよい。この場合、光路調整手段を設ける必要はなく、部品受渡し装置は、対向して配置される部材A、Bの少なくとも一方を仮想直線Lに平行に移動させて、部材A、Bを接近させ、部材A、B間にある電子部品を部材Bに渡す装置であって、部材A、Bが非対向に配置された状態で、仮想直線Lに平行な方向に部材A又は部材Bを対向位置から撮像した第1の画像を得る第1の撮像手段と、対向配置されている部材A、Bの双方を仮想直線Lに直交する方向に撮像した第2の画像を得る第2の撮像手段とを備えることとなる。 The component delivery device 10 obtains the first image P and the second image Q with one image pickup means 19, but the image pickup means for obtaining the second image separately from the image pickup means for obtaining the first image. May be provided. In this case, it is not necessary to provide the optical path adjusting means, and the component delivery device moves at least one of the members A and B arranged opposite to each other in parallel with the virtual straight line L to bring the members A and B closer to each other. A device that passes an electronic component between A and B to a member B, and images the member A or the member B from a facing position in a direction parallel to a virtual straight line L in a state where the members A and B are arranged non-opposing. The present invention includes a first imaging means for obtaining the first image, and a second imaging means for obtaining a second image in which both of the members A and B arranged opposite to each other are imaged in a direction orthogonal to the virtual straight line L. It will be.

また、第1の画像に部材B以外のものが写りこむこと、及び、第2の画像に部材A、B以外のものが写りこむことを抑制するため、特定範囲の波長の光を照射する照明と光学フィルタを設けてもよい。
以下、図4を参照して、部品受渡し装置10に対し、照明31、32及び光学フィルタ33、34が追加された本発明の第2の実施の形態に係る部品受渡し装置30について説明する。なお、部品受渡し装置30において、部品受渡し装置10と同様の構成については、同じ符号を付して、詳細な説明を省略する。
In addition, in order to prevent objects other than members B from being reflected in the first image and objects other than members A and B from being reflected in the second image, illumination that irradiates light having a wavelength in a specific range. And an optical filter may be provided.
Hereinafter, with reference to FIG. 4, the parts delivery device 30 according to the second embodiment of the present invention in which the illuminations 31, 32 and the optical filters 33, 34 are added to the parts delivery device 10 will be described. In the parts delivery device 30, the same components as those of the parts delivery device 10 are designated by the same reference numerals, and detailed description thereof will be omitted.

部品受渡し装置30は、図4に示すように、ミラー23と部材A1、B1の対向位置との間から部材A1、B1の対向位置に向かって青色の光を照射する照明31と、部材A1、B1の対向位置を基準にして、ミラー22の反対側から部材A1、B1の対向位置に向かって赤色の光を照射する照明32を備えている。照明31、32は共にリング状の同軸照明であり、撮像手段19は、照明31の内周を通して真上から部材A1、B1を撮像した画像を得る。 As shown in FIG. 4, the component delivery device 30 includes an illumination 31 that irradiates blue light from between the mirror 23 and the facing positions of the members A1 and B1 toward the facing positions of the members A1 and B1, and the member A1. An illumination 32 that irradiates red light from the opposite side of the mirror 22 toward the facing positions of the members A1 and B1 with reference to the facing position of B1 is provided. The illuminations 31 and 32 are both ring-shaped coaxial illuminations, and the imaging means 19 obtains an image obtained by imaging the members A1 and B1 from directly above through the inner circumference of the illumination 31.

部材A1、B1の対向位置からミラー23及びビームスプリッタ21を経由して撮像手段19に至る光路上(本実施の形態ではミラー23とビームスプリッタ21の間)には、光学フィルタ33が設けられている。部材A1、B1の対向位置からミラー22及びビームスプリッタ21を経由して撮像手段19に至る光路上(本実施の形態ではミラー22とビームスプリッタ21の間)には、光学フィルタ34が設けられている。 An optical filter 33 is provided on the optical path (between the mirror 23 and the beam splitter 21 in this embodiment) from the opposite positions of the members A1 and B1 to the imaging means 19 via the mirror 23 and the beam splitter 21. There is. An optical filter 34 is provided on the optical path (between the mirror 22 and the beam splitter 21 in the present embodiment) from the opposite positions of the members A1 and B1 to the imaging means 19 via the mirror 22 and the beam splitter 21. There is.

光学フィルタ33は照明31に対応し青色の光のみを透過させ、光学フィルタ34は照明32に対応し赤色の光のみを透過させる。
撮像手段19は、部材B1の真上に部材A1が配されていない状態、かつ、照明31が青色光を照射し、照明32が赤色光を照射していない状態で第1の画像を撮像する。これによって、第1の画像には、青色光を照射された部材B1が他のものより強調されて撮像される。
The optical filter 33 corresponds to the illumination 31 and transmits only blue light, and the optical filter 34 corresponds to the illumination 32 and transmits only red light.
The imaging means 19 captures the first image in a state where the member A1 is not arranged directly above the member B1 and the illumination 31 irradiates blue light and the illumination 32 does not irradiate red light. .. As a result, the member B1 irradiated with blue light is emphasized and captured in the first image more than the others.

そして、撮像手段19は、1)部材A1、B1が対向配置された状態、かつ、照明31が青色光を照射し、照明32が赤色光を照射していない状態と、2)部材A1、B1が対向配置された状態、かつ、照明31が青色光を照射しておらず、照明32が赤色光を照射している状態とで第2の画像を得る。上記1)の状態で得られた第2の画像の部材A1、B1を真上から(仮想直線L1に平行に)撮像した領域には、部材A1、B1が強調されてとらえられる。上記2)の状態で得られた第2の画像の部材A1、B1を水平に撮像した領域には、部材A1、B1が強調されてとらえられる。
なお、青色光及び赤色光の組み合わせは一例であり、他の組み合わせであってもよいのは言うまでもない。
Then, the imaging means 19 has 1) a state in which the members A1 and B1 are arranged to face each other, and a state in which the illumination 31 irradiates blue light and the illumination 32 does not irradiate red light, and 2) the members A1 and B1. A second image is obtained in a state where the lights 31 are arranged to face each other and the light 31 is not irradiating blue light and the light 32 is shining red light. The members A1 and B1 are emphasized and captured in the region where the members A1 and B1 of the second image obtained in the state of 1) above are imaged from directly above (parallel to the virtual straight line L1). The members A1 and B1 are emphasized and captured in the region where the members A1 and B1 of the second image obtained in the state of 2) above are horizontally imaged.
The combination of blue light and red light is an example, and it goes without saying that other combinations may be used.

ここまで説明した部品受渡し装置10、30は、部材Aが電子部品Wを部材Bに渡し、部材Bが部材Aから取得した電子部品Wの位置を校正して部材Aに戻す装置であったが、これに限定されない。
以下、図5、図6を参照して、部材A、Bの役割が、部品受渡し装置10、30とは異なる部品受渡し装置40、60について説明する。
The component delivery devices 10 and 30 described so far are devices in which the member A passes the electronic component W to the member B, and the member B calibrates the position of the electronic component W acquired from the member A and returns the electronic component W to the member A. , Not limited to this.
Hereinafter, the parts delivery devices 40 and 60 in which the roles of the members A and B are different from those of the parts delivery devices 10 and 30 will be described with reference to FIGS. 5 and 6.

本発明の第3の実施の形態に係る部品受渡し装置40は、図5に示すように、複数の部材A2(部材Aの一例)を有する回転ユニット41と、複数の部材B2(部材Bの一例)を有する回転ユニット42を備えている。長尺の吸着ノズルである各部材A2は、回転ユニット41の回転中心を基準にして放射状に配置され、部材A2の長手方向に進退可能である。回転ユニット41は、回転と一時停止を繰り返して、各部材A2が間欠的に移動する。 As shown in FIG. 5, the component delivery device 40 according to the third embodiment of the present invention includes a rotary unit 41 having a plurality of members A2 (an example of a member A) and a plurality of members B2 (an example of a member B). ) Is provided. Each member A2, which is a long suction nozzle, is arranged radially with reference to the rotation center of the rotation unit 41, and can move forward and backward in the longitudinal direction of the member A2. The rotation unit 41 repeatedly rotates and pauses, and each member A2 moves intermittently.

長尺の吸着ノズルである各部材B2は、回転ユニット42の回転中心を基準にして放射状に配置され、部材B2の長手方向に進退可能である。回転ユニット42は、回転と一時停止を繰り返して、各部材B2が間欠的に移動する。
回転ユニット41、42は同じタイミングで一時停止し、回転ユニット41、42が一時停止した際、一の部材A2と一の部材B2とが距離を有して対向配置される。対向配置された部材A2、B2は、部材A2、B2の少なくとも一方が水平に配された仮想直線L2(仮想直線Lの一例)に平行に移動して、部材A2、B2を接近させ、部材A2に吸着されている図示しない電子部品を部材B2に渡す。部材A2、B2が接近する際には、予め設定されたパターンに従って減速動作を行ってもよい。また、部材A2に吸着されている電子部品が部材B2に接触する際には、設定された以上の荷重が電子部品にかからないように荷重制御を行ってもよい。
Each member B2, which is a long suction nozzle, is arranged radially with reference to the rotation center of the rotation unit 42, and can move forward and backward in the longitudinal direction of the member B2. The rotation unit 42 repeatedly rotates and pauses, and each member B2 moves intermittently.
The rotating units 41 and 42 are temporarily stopped at the same timing, and when the rotating units 41 and 42 are temporarily stopped, one member A2 and one member B2 are arranged so as to face each other with a distance. The members A2 and B2 arranged to face each other move in parallel with the virtual straight line L2 (an example of the virtual straight line L) in which at least one of the members A2 and B2 is horizontally arranged to bring the members A2 and B2 closer to each other, and the members A2 An electronic component (not shown) adsorbed on the member B2 is passed to the member B2. When the members A2 and B2 approach each other, the deceleration operation may be performed according to a preset pattern. Further, when the electronic component adsorbed on the member A2 comes into contact with the member B2, the load may be controlled so that a load exceeding the set value is not applied to the electronic component.

部材A2から部材B2への電子部品の受け渡しを安定的に行うべく、部品受渡し装置40は、部材A2、B2が非対向に配置された状態で、仮想直線L2に平行な方向に部材B2を部材B2の対向位置(部材A2が一時停止する位置)から撮像した第1の画像、及び、対向配置されている部材A2、B2の双方を仮想直線L2に直交する方向(鉛直)に撮像した第2の画像を得る撮像手段43と、第1の画像の被撮像物である部材B2から撮像手段43に至る光路上及び第2の画像の被撮像物である部材A2、B2から撮像手段43に至る光路上に設けられ、光の反射及び屈折のいずれか一方又は双方により、撮像手段43に第1、第2の画像をとらえさせる光路調整手段44とを備えている。 In order to stably deliver the electronic component from the member A2 to the member B2, the component delivery device 40 sets the member B2 in a direction parallel to the virtual straight line L2 in a state where the members A2 and B2 are arranged non-opposing to each other. The first image taken from the opposite position of B2 (the position where the member A2 temporarily stops) and the second image of both the members A2 and B2 arranged facing each other in the direction orthogonal to the virtual straight line L2 (vertical). The imaging means 43 for obtaining the image of the above, and on the optical path from the member B2 which is the object to be imaged in the first image to the imaging means 43, and from the members A2 and B2 which are the objects to be imaged in the second image to the imaging means 43. It is provided on the optical path and includes an optical path adjusting means 44 that causes the imaging means 43 to capture the first and second images by one or both of light reflection and refraction.

光路調整手段44はミラー45、46及びビームスプリッタ47を有している。ミラー45、46及びビームスプリッタ47は、撮像手段43が、ビームスプリッタ47及びミラー46を介して部材B2を対向位置から撮像した第1の画像を得ること、及び、ビームスプリッタ47及びミラー45を介して対向配置された部材A2、B2を仮想直線L2に直交する方向に撮像した第2の画像を得ることができるように配置されている。
なお、部品受渡し装置40に対し、撮像手段43、ミラー45、46及びビームスプリッタ47の配置を変えることによって、部材B2ではなく部材A2を対向位置から撮像した第1の画像を得るようにすることができる。
The optical path adjusting means 44 includes mirrors 45 and 46 and a beam splitter 47. In the mirrors 45, 46 and the beam splitter 47, the imaging means 43 obtains a first image in which the member B2 is imaged from the opposite positions via the beam splitter 47 and the mirror 46, and the beam splitter 47 and the mirror 45 are used. The members A2 and B2 are arranged so as to be able to obtain a second image captured in a direction orthogonal to the virtual straight line L2.
By changing the arrangement of the image pickup means 43, the mirrors 45, 46, and the beam splitter 47 with respect to the component delivery device 40, it is possible to obtain a first image in which the member A2 is imaged from the opposite position instead of the member B2. Can be done.

また、本発明の第4の実施の形態に係る部品受渡し装置60は、図6に示すように、ペパーポットである部材A3(部材Aの一例)と、複数の部材B3(部材Bの一例)を有する回転ユニット61とを備えている。部材A3は突上げニードル62が収められた円柱状の収容体63を具備している。収容体63と共に水平に配置された突上げニードル62は、水平配置された仮想直線L3に平行(水平)に進退可能であり、前進して一端部が収容体63の一端部に形成された貫通孔から突出し、後退して全体が収容体63内に収まる。部材A3は、リングホルダ64に取り付けられ多数の電子部品が表面に貼付されたウエハシートSの裏面側に配されている。 Further, as shown in FIG. 6, the parts delivery device 60 according to the fourth embodiment of the present invention includes a member A3 (an example of a member A) which is a pepper pot and a plurality of members B3 (an example of a member B). It is provided with a rotating unit 61 having the above. The member A3 includes a columnar housing 63 in which the push-up needle 62 is housed. The push-up needle 62 horizontally arranged together with the accommodating body 63 can advance and retreat in parallel (horizontally) with the horizontally arranged virtual straight line L3, and moves forward so that one end is formed at one end of the accommodating body 63. It protrudes from the hole and recedes so that the entire body fits in the housing 63. The member A3 is arranged on the back surface side of the wafer sheet S attached to the ring holder 64 and having a large number of electronic components attached to the front surface.

長尺の吸着ノズルである各部材B3は、回転ユニット61の回転中心を基準にして放射状に配置され、部材B3の長手方向に進退可能である。回転ユニット61は回転と一時停止を繰り返して各部材B3が間欠的に移動する。
回転ユニット61が一時停止した際、裏面側に収容体63の一端部が近接されたウエハシートSの領域の表面に貼付された電子部品(ウエハシートS)に対し、一の部材B3が、距離を有して対向配置される。
Each member B3, which is a long suction nozzle, is arranged radially with reference to the rotation center of the rotation unit 61, and can move forward and backward in the longitudinal direction of the member B3. Each member B3 moves intermittently in the rotating unit 61 by repeating rotation and pausing.
When the rotating unit 61 is temporarily stopped, one member B3 is a distance from the electronic component (wafer sheet S) attached to the front surface of the area of the wafer sheet S in which one end of the housing 63 is close to the back surface side. Are placed facing each other.

この状態で、突上げニードル62が仮想直線L3に平行に前進してウエハシートSの裏面を表面側に押して、突上げニードル62(部材A3)と共に電子部品を部材B3に接近させ、部材B3が電子部品を吸着する。これによって、電子部品がウエハシートSから部材B3に渡される。突上げニードル62が前進する際、突上げニードル62は、予め設定された制御パターンに従って、電子部品が部材B3に接近するのに伴い減速したり、途中で一旦停止し再度前進する二段階の前進動作を行ったりすることができる。 In this state, the push-up needle 62 advances in parallel with the virtual straight line L3, pushes the back surface of the wafer sheet S toward the front surface side, brings the electronic component closer to the member B3 together with the push-up needle 62 (member A3), and the member B3 moves. Adsorb electronic components. As a result, the electronic component is passed from the wafer sheet S to the member B3. When the push-up needle 62 moves forward, the push-up needle 62 decelerates as the electronic component approaches the member B3 according to a preset control pattern, or stops in the middle and moves forward again in two stages. You can perform operations.

ウエハシートSから部材B3へ電子部品を安定的に渡すには、部材A3が所定の位置に配置され、電子部品を間に挟んで対向配置される部材A3、B3が所定の距離を有することが重要である。そこで、部品受渡し装置60は、部材A3に部材B3が非対向な状態で、仮想直線L3に平行な方向(水平)に部材A3を対向位置から撮像した第1の画像、及び、対向配置されている部材A3、B3の双方を仮想直線L3に直交する方向(鉛直)に撮像した第2の画像を得る撮像手段65と、第1の画像の被撮像物である部材A3から撮像手段65に至る光路上及び第2の画像の被撮像物である部材A3、B3から撮像手段65に至る光路上に設けられ、光の反射及び屈折のいずれか一方又は双方により、撮像手段65に第1、第2の画像をとらえさせる光路調整手段66とを備えている。本実施の形態では、部品受渡し装置60からウエハリング64を取り除いた状態で第1、第2の画像が撮像される。 In order to stably pass the electronic component from the wafer sheet S to the member B3, the member A3 must be arranged at a predetermined position, and the members A3 and B3 arranged to face each other with the electronic component in between have a predetermined distance. is important. Therefore, the component delivery device 60 is arranged in a first image in which the member A3 is imaged from a position facing the member A3 in a direction (horizontal) parallel to the virtual straight line L3 in a state where the member B3 is not opposed to the member A3. An imaging means 65 for obtaining a second image obtained by capturing both of the members A3 and B3 in a direction (vertical) orthogonal to the virtual straight line L3, and a member A3 to the imaging means 65 which is an imaged object of the first image. It is provided on the optical path and on the optical path from the members A3 and B3 which are the objects to be imaged of the second image to the imaging means 65, and the first and first images are provided to the imaging means 65 by either one or both of light reflection and refraction. It is provided with an optical path adjusting means 66 for capturing the image of 2. In the present embodiment, the first and second images are imaged with the wafer ring 64 removed from the component delivery device 60.

光路調整手段66は、ミラー67、68及びビームスプリッタ69を有する。ミラー67、68及びビームスプリッタ69は、撮像手段65が、ビームスプリッタ69及びミラー68を介して部材A3を対向位置から撮像した第1の画像を得ることができ、ビームスプリッタ69及びミラー67を介して対向配置された部材A3、B3を仮想直線L3に直交する方向に撮像した第2の画像を得られるように配置されている。 The optical path adjusting means 66 includes mirrors 67 and 68 and a beam splitter 69. The mirrors 67, 68 and the beam splitter 69 allow the imaging means 65 to obtain a first image in which the member A3 is imaged from opposite positions via the beam splitter 69 and the mirror 68, and the imaging means 65 passes through the beam splitter 69 and the mirror 67. The members A3 and B3 are arranged so as to obtain a second image captured in a direction orthogonal to the virtual straight line L3.

以上、本発明の実施の形態を説明したが、本発明は、上記した形態に限定されるものでなく、要旨を逸脱しない条件の変更等は全て本発明の適用範囲である。
例えば、第1、第2の画像に直線J、Kが存在する必要はない。
また、第1の画像において第1の画像のx軸方向中心に位置する被撮像物の部位が、第2の画像において第2の画像のx軸方向中心以外の位置にとらえられるようにしてもよい。
Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and all changes in conditions that do not deviate from the gist are within the scope of the present invention.
For example, the straight lines J and K need not be present in the first and second images.
Further, even if the portion of the object to be imaged located at the center of the first image in the x-axis direction in the first image is captured at a position other than the center in the x-axis direction of the second image in the second image. Good.

10:部品受渡し装置、11:回転体、12:可動ロッド、13:モータ、14:コイルバネ、15:アーム、16:押下げ手段、17:校正ユニット、18:位置調整機構、19:撮像手段、20:光路調整手段、21:ビームスプリッタ、22、23:ミラー、30:部品受渡し装置、31、32:照明、33、34:光学フィルタ、40:部品受渡し装置、41、42:回転ユニット、43:撮像手段、44:光路調整手段、45、46:ミラー、47:ビームスプリッタ、60:部品受渡し装置、61:回転ユニット、62:突上げニードル、63:収容体、64:リングホルダ、65:撮像手段、66:光路調整手段、67、68:ミラー、69:ビームスプリッタ、A1〜A3:部材A、B1〜B3:部材B、L1〜L3:仮想直線L、P:第1の画像、Q:第2の画像、S:ウエハシート、W:電子部品 10: Parts delivery device, 11: Rotating body, 12: Movable rod, 13: Motor, 14: Coil spring, 15: Arm, 16: Pushing means, 17: Calibration unit, 18: Position adjustment mechanism, 19: Imaging means, 20: Optical path adjusting means, 21: Beam splitter, 22, 23: Mirror, 30: Parts delivery device, 31, 32: Lighting, 33, 34: Optical filter, 40: Parts delivery device, 41, 42: Rotating unit, 43 : Imaging means, 44: Optical path adjusting means, 45, 46: Mirror, 47: Beam splitter, 60: Parts delivery device, 61: Rotating unit, 62: Push-up needle, 63: Accommodator, 64: Ring holder, 65: Imaging means, 66: Optical path adjusting means, 67, 68: Mirror, 69: Beam splitter, A1 to A3: Member A, B1 to B3: Member B, L1 to L3: Virtual straight line L, P: First image, Q : Second image, S: Wafer sheet, W: Electronic component

Claims (5)

対向して配置される部材A、Bの少なくとも一方を仮想直線Lに平行に移動させて、該部材A、Bを接近させ、該部材A、B間にある電子部品を該部材Bに渡す部品受渡し装置において、
前記部材A、Bが非対向に配置された状態で、前記仮想直線Lに平行な方向に該部材A又は該部材Bを対向位置から撮像した第1の画像を得る第1の撮像手段と、
対向配置されている前記部材A、Bの双方を前記仮想直線Lに直交する方向に撮像した第2の画像を得る第2の撮像手段と
前記部材A、Bのいずれか一方と共に回転して、該部材A、Bが非対向に配置された状態及び該部材A、Bが対向配置された状態の一方から他方に切り替える回転体とを備えることを特徴とする部品受渡し装置。
A component that moves at least one of the members A and B arranged to face each other in parallel with the virtual straight line L to bring the members A and B closer to each other and passes an electronic component between the members A and B to the member B. In the delivery device
A first imaging means for obtaining a first image obtained by imaging the member A or the member B from a facing position in a direction parallel to the virtual straight line L in a state where the members A and B are arranged non-opposing.
A second imaging means for obtaining a second image captured the member A, which is opposed, both B in a direction perpendicular to the virtual straight line L,
A rotating body that rotates together with any one of the members A and B to switch from one of the members A and B in a non-opposed state and a state in which the members A and B are arranged to face each other. A parts delivery device characterized by this.
対向して配置される部材A、Bの少なくとも一方を仮想直線Lに平行に移動させて、該部材A、Bを接近させ、該部材A、B間にある電子部品を該部材Bに渡す部品受渡し装置において、
前記部材A、Bが非対向に配置された状態で、前記仮想直線Lに平行な方向に該部材A又は該部材Bを対向位置から撮像した第1の画像、及び、対向配置されている前記部材A、Bの双方を前記仮想直線Lに直交する方向に撮像した第2の画像を得る撮像手段と、
前記第1、第2の画像の各被撮像物から前記撮像手段に至る光路上に設けられ、光の反射及び屈折のいずれか一方又は双方により、前記撮像手段に前記第1、第2の画像をとらえさせる光路調整手段と
前記部材A、Bのいずれか一方と共に回転して、該部材A、Bが非対向に配置された状態及び該部材A、Bが対向配置された状態の一方から他方に切り替える回転体とを備えることを特徴とする部品受渡し装置。
A component that moves at least one of the members A and B arranged to face each other in parallel with the virtual straight line L to bring the members A and B closer to each other and passes an electronic component between the members A and B to the member B. In the delivery device
A first image obtained by capturing the member A or the member B from a facing position in a direction parallel to the virtual straight line L in a state where the members A and B are arranged non-opposing, and the above-mentioned arranged facing each other. An imaging means for obtaining a second image in which both members A and B are imaged in a direction orthogonal to the virtual straight line L.
The first and second images are provided on the optical path from each object to be imaged of the first and second images to the image pickup means, and the first and second images are provided to the image pickup means by one or both of light reflection and refraction. an optical path adjusting means for creating caught,
A rotating body that rotates together with any one of the members A and B to switch from one of the members A and B in a non-opposed state and a state in which the members A and B are arranged to face each other. A parts delivery device characterized by this.
請求項2記載の部品受渡し装置において、前記撮像手段は、前記第1の画像において該第1の画像のx軸方向中心に位置する被撮像物の部位が、前記第2の画像のx軸方向中心に位置した該第2の画像を得ることを特徴とする部品受渡し装置。 In the component delivery device according to claim 2, in the image pickup means, the portion of the object to be imaged located at the center of the first image in the x-axis direction of the first image is in the x-axis direction of the second image. A parts delivery device characterized by obtaining the second image located at the center. 請求項2又は3記載の部品受渡し装置において、前記撮像手段は、前記第1の画像に撮像される前記部材A又は前記部材Bを焦点が合った状態で撮像し、前記第2の画像に撮像される前記部材A及び前記部材Bを焦点が合った状態で撮像することを特徴とする部品受渡し装置。 In the component delivery device according to claim 2 or 3, the image pickup means takes an image of the member A or the member B imaged in the first image in a focused state, and images the member A or the member B in the second image. A component delivery device, characterized in that the member A and the member B are imaged in a focused state. 請求項2〜4のいずれか一項に記載の部品受渡し装置において、前記部材A、Bの対向位置に向かって色Cの光を照射する照明Dと、前記光路上に設けられた、前記色Cの光のみを透過させる光学フィルタEと、前記色Cの光とは波長が異なる色Jの光を前記部材A、Bの対向位置に向かって照射する照明Kと、前記光路上に設けられた、前記色Jの光のみを透過させる光学フィルタLとを更に備え、In the component delivery device according to any one of claims 2 to 4, the illumination D that irradiates the light of the color C toward the opposite positions of the members A and B, and the color provided on the optical path. An optical filter E that transmits only the light of C, an illumination K that irradiates light of color J having a wavelength different from that of the light of color C toward the opposite positions of the members A and B, and an illumination K provided on the optical path. Further, an optical filter L that transmits only the light of the color J is provided.
前記撮像手段は、前記部材A、Bが非対向に配置された状態、かつ、前記照明Dが前記色Cの光を照射し、前記照明Kが前記色Jの光を照射していない状態と、前記部材A、Bが対向配置された状態、かつ、前記照明Dが前記色Cの光を照射しておらず、前記照明Kが前記色Jの光を照射している状態とでそれぞれ撮像することを特徴とする部品受渡し装置。The imaging means is a state in which the members A and B are arranged non-opposite, and the illumination D irradiates the light of the color C and the illumination K does not irradiate the light of the color J. , The members A and B are arranged to face each other, and the illumination D is not irradiating the light of the color C, and the illumination K is irradiating the light of the color J. A parts delivery device characterized by
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