JP6771647B2 - 複数の目標からのオーバレイ信号の同時取得 - Google Patents

複数の目標からのオーバレイ信号の同時取得 Download PDF

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Publication number
JP6771647B2
JP6771647B2 JP2019504839A JP2019504839A JP6771647B2 JP 6771647 B2 JP6771647 B2 JP 6771647B2 JP 2019504839 A JP2019504839 A JP 2019504839A JP 2019504839 A JP2019504839 A JP 2019504839A JP 6771647 B2 JP6771647 B2 JP 6771647B2
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JP
Japan
Prior art keywords
irradiation
path
pupil
measurement system
images
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Active
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JP2019504839A
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English (en)
Japanese (ja)
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JP2019526053A (ja
JP2019526053A5 (cg-RX-API-DMAC10.html
Inventor
アンドリュー ヒル
アンドリュー ヒル
アンノン マナッセン
アンノン マナッセン
ユリ パスコヴァー
ユリ パスコヴァー
ユバル ルバシェブスキー
ユバル ルバシェブスキー
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KLA Corp
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KLA Corp
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Publication date
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Publication of JP2019526053A publication Critical patent/JP2019526053A/ja
Publication of JP2019526053A5 publication Critical patent/JP2019526053A5/ja
Application granted granted Critical
Publication of JP6771647B2 publication Critical patent/JP6771647B2/ja
Active legal-status Critical Current
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J4/00—Measuring polarisation of light
    • G01J4/04—Polarimeters using electric detection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
    • G02B27/4233—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G01N2021/4792—Polarisation of scatter light

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Peptides Or Proteins (AREA)
  • Medicines That Contain Protein Lipid Enzymes And Other Medicines (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2019504839A 2016-07-28 2017-07-28 複数の目標からのオーバレイ信号の同時取得 Active JP6771647B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/222,503 2016-07-28
US15/222,503 US10048132B2 (en) 2016-07-28 2016-07-28 Simultaneous capturing of overlay signals from multiple targets
PCT/US2017/044528 WO2018023078A1 (en) 2016-07-28 2017-07-28 Simultaneous capturing of overlay signals from multiple targets

Publications (3)

Publication Number Publication Date
JP2019526053A JP2019526053A (ja) 2019-09-12
JP2019526053A5 JP2019526053A5 (cg-RX-API-DMAC10.html) 2020-09-10
JP6771647B2 true JP6771647B2 (ja) 2020-10-21

Family

ID=61009490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019504839A Active JP6771647B2 (ja) 2016-07-28 2017-07-28 複数の目標からのオーバレイ信号の同時取得

Country Status (7)

Country Link
US (2) US10048132B2 (cg-RX-API-DMAC10.html)
JP (1) JP6771647B2 (cg-RX-API-DMAC10.html)
KR (1) KR102180433B1 (cg-RX-API-DMAC10.html)
CN (2) CN112432926B (cg-RX-API-DMAC10.html)
SG (2) SG10201912512UA (cg-RX-API-DMAC10.html)
TW (1) TWI728157B (cg-RX-API-DMAC10.html)
WO (1) WO2018023078A1 (cg-RX-API-DMAC10.html)

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US11360399B2 (en) 2018-09-19 2022-06-14 Asml Netherlands B.V. Metrology sensor for position metrology
KR102873433B1 (ko) * 2018-11-21 2025-10-17 케이엘에이 코포레이션 단일 셀 그레이 산란계측 오버레이 타겟 및 다양한 조명 파라미터를 사용한 이들의 측정
US11073768B2 (en) 2019-06-26 2021-07-27 Kla Corporation Metrology target for scanning metrology
US11359916B2 (en) * 2019-09-09 2022-06-14 Kla Corporation Darkfield imaging of grating target structures for overlay measurement
US11933717B2 (en) 2019-09-27 2024-03-19 Kla Corporation Sensitive optical metrology in scanning and static modes
JP7365510B2 (ja) * 2020-01-29 2023-10-19 エーエスエムエル ネザーランズ ビー．ブイ． 基板上の周期構造を測定するための計測方法およびデバイス
US11604149B2 (en) * 2020-04-23 2023-03-14 Kla Corporation Metrology methods and optical schemes for measurement of misregistration by using hatched target designs
KR20230052878A (ko) 2020-08-17 2023-04-20 도쿄엘렉트론가부시키가이샤 가변 파장 투시 층 적층물
US11428642B2 (en) * 2021-01-04 2022-08-30 Kla Corporation Scanning scatterometry overlay measurement
US12663728B2 (en) 2021-05-04 2026-06-23 Kla Corporation Oblique illumination for overlay metrology
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JP2023116048A (ja) * 2022-02-09 2023-08-22 キオクシア株式会社 計測装置および計測方法
CN119317878A (zh) * 2022-07-19 2025-01-14 Asml荷兰有限公司 用于光刻系统的增强对准设备
WO2024033035A1 (en) * 2022-08-10 2024-02-15 Asml Netherlands B.V. Metrology method and associated metrology device
KR20240108945A (ko) 2023-01-03 2024-07-10 삼성전자주식회사 기판 검사 장치 및 기판 검사 방법
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Also Published As

Publication number Publication date
JP2019526053A (ja) 2019-09-12
SG11201900509YA (en) 2019-02-27
SG10201912512UA (en) 2020-02-27
US10401228B2 (en) 2019-09-03
KR20190026039A (ko) 2019-03-12
CN109564160B (zh) 2020-11-10
TWI728157B (zh) 2021-05-21
US20180335346A1 (en) 2018-11-22
US20180031424A1 (en) 2018-02-01
CN112432926B (zh) 2025-10-10
US10048132B2 (en) 2018-08-14
TW201805593A (zh) 2018-02-16
WO2018023078A1 (en) 2018-02-01
CN112432926A (zh) 2021-03-02
CN109564160A (zh) 2019-04-02
KR102180433B1 (ko) 2020-11-19

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