JP6761025B2 - 研磨用組成物セット、前研磨用組成物、及びシリコンウェーハの研磨方法 - Google Patents

研磨用組成物セット、前研磨用組成物、及びシリコンウェーハの研磨方法 Download PDF

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Publication number
JP6761025B2
JP6761025B2 JP2018508509A JP2018508509A JP6761025B2 JP 6761025 B2 JP6761025 B2 JP 6761025B2 JP 2018508509 A JP2018508509 A JP 2018508509A JP 2018508509 A JP2018508509 A JP 2018508509A JP 6761025 B2 JP6761025 B2 JP 6761025B2
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JP
Japan
Prior art keywords
polishing
silicon wafer
composition
polishing composition
test piece
Prior art date
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JP2018508509A
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English (en)
Japanese (ja)
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JPWO2017169154A1 (ja
Inventor
公亮 土屋
公亮 土屋
真希 浅田
真希 浅田
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Fujimi Inc
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Fujimi Inc
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Publication of JPWO2017169154A1 publication Critical patent/JPWO2017169154A1/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2018508509A 2016-03-30 2017-02-08 研磨用組成物セット、前研磨用組成物、及びシリコンウェーハの研磨方法 Active JP6761025B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016067868 2016-03-30
JP2016067868 2016-03-30
PCT/JP2017/004630 WO2017169154A1 (ja) 2016-03-30 2017-02-08 研磨用組成物セット、前研磨用組成物、及びシリコンウェーハの研磨方法

Publications (2)

Publication Number Publication Date
JPWO2017169154A1 JPWO2017169154A1 (ja) 2019-02-07
JP6761025B2 true JP6761025B2 (ja) 2020-09-23

Family

ID=59963830

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018508509A Active JP6761025B2 (ja) 2016-03-30 2017-02-08 研磨用組成物セット、前研磨用組成物、及びシリコンウェーハの研磨方法

Country Status (3)

Country Link
JP (1) JP6761025B2 (zh)
TW (1) TWI724117B (zh)
WO (1) WO2017169154A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021100085A (ja) * 2019-12-24 2021-07-01 ニッタ・デュポン株式会社 研磨用組成物
US20230143074A1 (en) * 2020-03-13 2023-05-11 Fujimi Incorporated Polishing composition and polishing method
EP4120322A4 (en) * 2020-03-13 2024-03-27 Fujimi Inc POLISHING COMPOSITION AND POLISHING METHOD

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6685757B2 (en) * 2002-02-21 2004-02-03 Rodel Holdings, Inc. Polishing composition
WO2012039390A1 (ja) * 2010-09-24 2012-03-29 株式会社 フジミインコーポレーテッド 研磨用組成物およびリンス用組成物
JP6259723B2 (ja) * 2014-06-18 2018-01-10 株式会社フジミインコーポレーテッド シリコンウェーハの研磨方法、研磨用組成物および研磨用組成物セット

Also Published As

Publication number Publication date
TW201742138A (zh) 2017-12-01
TWI724117B (zh) 2021-04-11
WO2017169154A1 (ja) 2017-10-05
JPWO2017169154A1 (ja) 2019-02-07

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