JP6759809B2 - Electronic component transfer device and electronic component inspection device - Google Patents

Description

The present invention relates to an electronic component transfer device and an electronic component inspection device.

The IC handler recognizes the positions of the transfer source and the transfer destination from the image taken by the camera by image processing, corrects the transfer position, and realizes high-precision transfer. In this image processing, a model image of the transport position registered in advance is used. Model images are registered for each transport position (tray, change kit). Therefore, when creating an inspection setting (recipe), it is necessary to register a large number of model images.

In this image work, "brightness adjustment" and "cutting out the model image" are performed by the operator's subjectivity, so that the registered model image differs depending on the operator. Even the same worker may be different each time they register. In addition, since it is necessary for the operator to register a large number of model images of the transport position, a lot of work is forced and burdensome.

For example, it is disclosed to register a model image for detecting the presence or absence of a component (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2001-67478

However, Patent Document 1 does not disclose an adjustment method for optimizing the brightness and position of an image.

The present invention has been made to solve at least a part of the above-mentioned problems, and can be realized as the following forms or application examples.

[Application Example 1] The electronic component transfer device according to this application example is based on an electronic component mounting unit on which electronic components can be mounted, an imaging unit capable of capturing an image of the electronic component mounting portion, and the image. It has a model image creating unit capable of creating a model image of the electronic component mounting unit, and the model image creating unit has at least one of the brightness of the model image and the cutout position of the model image with respect to the image. Is characterized by being adjustable.

According to this application example, the brightness of the model image and at least one of the cutout positions of the model image with respect to the image can be adjusted. Thereby, the optimum model image can be obtained. As a result, it is possible to provide an electronic component transfer device that corrects the transfer position and realizes high-precision transfer.

[Application Example 2] In the electronic component transfer device described in the application example, the model image creating unit automatically adjusts the brightness of the model image based on the brightness of the pixels in the image and the number of pixels. Is preferable.

According to this application example, the brightness can be automatically controlled.

[Application Example 3] The electronic component transfer device according to the above application example has an input unit for inputting a brightness adjustment parameter, and the model image creation unit uses the input brightness adjustment parameter to perform the model. It is preferable to adjust the brightness of the image.

According to this application example, it is possible to easily control the numerical value of the brightness to be adjusted.

[Application Example 4] In the electronic component transfer device described in the above application example, it is preferable to adjust the cutout position of the model image by differentiating the image data of the image captured by the imaging unit.

According to this application example, the enhancement process can be easily performed by creating the image by the differential process.

[Application Example 5] In the electronic component transfer device according to the above application example, the electronic component transport device has a display unit, and the model image creation unit has the brightness of pixels in the image and the brightness of the pixels based on the imaging signal of the imaging unit. It is preferable to display the number on the display unit.

According to this application example, the brightness of the image can be easily adjusted by comparing the brightness value of the entire image based on the brightness with a predetermined threshold value (luminance value), and the brightness can be adjusted. It is very convenient for brightness adjustment because it is easy to check the numerical value of.

[Application Example 6] In the electronic component transfer device described in the above application example, it is preferable that the model image creating unit quantifies the brightness of pixels and the number of pixels in the image.

According to this application example, the brightness can be easily and automatically controlled.

[Application Example 7] In the electronic component transfer device described in the above application example, the digitization involves the brightness of pixels in the image as the first axis and the number of pixels as the second axis orthogonal to the first axis. It is preferable to create a histogram.

According to this application example, since the digitization is generated by the model image creation unit by using a known histogram, the model image creation unit can be simply configured and an appropriate digitization can be generated. Become.

[Application Example 8] In the electronic component transfer device described in the above application example, it is preferable that the model image creating unit displays the histogram on the display unit.

According to this application example, the tendency of brightness can be easily grasped by displaying the histogram.

[Application Example 9] The electronic component transporting device according to this application example is based on an electronic component mounting unit on which electronic components can be mounted, an imaging unit capable of capturing an image of the electronic component mounting portion, and the image. It has a model image display setting unit having an instruction receiving unit capable of displaying setting information of a model image of the electronic component mounting unit and receiving an instruction for automatic registration of the model image, and the model image display setting. The unit has an electronic component mounting unit selection unit capable of selecting the electronic component mounting unit, and when instructed by the instruction receiving unit, the brightness of the model image and the cutout position of the model image with respect to the image. It is characterized in that at least one can be adjusted automatically.

According to this application example, the brightness of the model image and at least one of the cutout positions of the model image with respect to the image can be adjusted. Thereby, the optimum model image can be obtained. As a result, it is possible to provide an electronic component transfer device that corrects the transfer position and realizes high-precision transfer.

[Application Example 10] The electronic component inspection apparatus according to this application example is based on an electronic component mounting unit on which electronic components can be mounted, an imaging unit capable of capturing an image of the electronic component mounting portion, and the image. It has a model image creating unit capable of creating a model image of the electronic component mounting unit and an inspection unit for inspecting the electronic component, and the model image creating unit has the brightness of the model image and the image. It is characterized in that at least one of the cutout positions of the model image can be adjusted.

According to this application example, the brightness of the model image and at least one of the cutout positions of the model image with respect to the image can be adjusted. Thereby, the optimum model image can be obtained. As a result, it is possible to provide an electronic component inspection device that corrects the transport position and realizes high-precision transport.

The schematic perspective view which shows the inspection apparatus which concerns on 1st Embodiment. The schematic plan view of the inspection apparatus shown in FIG. FIG. 3 is a block diagram showing a control device, a setting display unit, and an image acquisition unit of a mounting unit included in the inspection device shown in FIG. The schematic side view of the mounting part image acquisition part shown in FIG. The flowchart which shows the process of automatic registration of the model image which concerns on this embodiment. The flowchart which shows the process of brightness adjustment which concerns on this Embodiment. The figure explaining the brightness adjustment algorithm which concerns on this embodiment. The flowchart which shows the process of the model image area determination which concerns on this embodiment. The flowchart which shows the flow of automatic registration of the model image which concerns on this embodiment. The figure which shows the setting screen of the automatic registration of the model image which concerns on 2nd Embodiment. The flowchart which shows the process of automatic registration of the model image which concerns on 2nd Embodiment. The figure which shows the model image registration processing state screen of automatic registration of the model image which concerns on 2nd Embodiment. The side view which shows the mounting part image acquisition part of the modification.

(First Embodiment)
Hereinafter, the electronic component transfer device and the electronic component inspection device of the present invention will be described in detail based on the embodiments shown in the accompanying drawings.

FIG. 1 is a schematic perspective view showing an inspection device according to the present embodiment. FIG. 2 is a schematic plan view of the inspection device shown in FIG. FIG. 3 is a block diagram showing a control device, a setting display unit, and an image acquisition unit of the mounting unit included in the inspection device shown in FIG. FIG. 4 is a schematic side view of the mounting portion image acquisition portion shown in FIG.

In addition, in FIG. 1, FIG. 2, FIG. 4 (described later), and FIG. 13 (described later), for convenience of explanation, three axes orthogonal to each other, the X axis, the Y axis, and the Z axis, are illustrated by arrows. , The tip side of the arrow is "+ (plus)" and the base end side is "-(minus)". In the following, the direction parallel to the X-axis (first direction) is the "X-axis direction", the direction parallel to the Y-axis (second direction) is the "Y-axis direction", and the direction parallel to the Z-axis is "Z". Axial direction ". In the following, for convenience of explanation, the upper side (+ Z-axis direction side) in FIG. 1 is referred to as "upper" and the lower side (-Z-axis direction side) is referred to as "lower".

Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical. Further, the upstream side in the transport direction of electronic components is also simply referred to as "upstream side", and the downstream side is also simply referred to as "downstream side". Further, the term "horizontal" as used herein is not limited to a perfect horizontal position, and includes a state of being slightly inclined (for example, less than 5 °) with respect to the horizontal direction as long as the transportation of electronic components is not hindered.

The inspection device (electronic component inspection device) 1 shown in FIGS. 1 and 2 includes, for example, an IC device such as a BGA (Ball grid array) package or an LGA (Land grid array) package, an LCD (Liquid Crystal Display), or a CIS (CMOS). It is a device for inspecting and testing (hereinafter simply referred to as "inspection") the electrical characteristics of electronic components such as (Image Sensor). In the following, for convenience of explanation, a case where an IC device is used as the electronic component to be inspected will be described as a representative, and this will be referred to as “IC device 90”.

As shown in FIGS. 1 and 2, the inspection device (electronic component inspection device) 1 includes a transfer device (electronic component transfer device) 10 for transporting an IC device (electronic component) 90, an inspection unit 16, and a display unit 41. A setting display unit 40 having an operation unit 42 and a control device 30 are provided. The transport device 10 includes an electronic component mounting unit 2 on which the IC device 90 can be mounted. The electronic component mounting section 2 includes, for example, a tray 200, an electronic component supply section 14, an electronic component recovery section 18, a temperature control section 12, a recovery tray 19, and a rotary stage (not shown) (hereinafter, these). (Also referred to as “electronic component mounting section 2” when the mounting sections of the above are not distinguished), the transport device 10 is an imaging device (imaging unit) 51 and a lighting device 52 capable of capturing an image of the electronic component mounting section 2. It has a mounting unit image acquisition unit 50 (see FIG. 3).

In this embodiment, the transport device 10 is configured by removing the inspection control unit 312 of the inspection unit 16 and the control device 30 described later from the inspection device 1 (see FIG. 3).

As shown in FIGS. 1 and 2, the inspection device 1 includes a tray supply area A1, a device supply area A2, an inspection area A3 provided with an inspection unit 16, a device recovery area A4, and a tray removal area A5. It is divided into.

Each of these areas is partitioned by a wall or a shutter (not shown). The device supply area A2 is the first chamber R1 defined by a wall portion, a shutter, or the like. Further, the inspection area A3 is a second chamber R2 defined by a wall portion, a shutter, or the like. Further, the device collection area A4 is a third chamber R3 defined by a wall portion, a shutter, or the like. Further, the first chamber R1 (device supply area A2), the second chamber R2 (inspection area A3), and the third chamber R3 (device recovery area A4) can ensure airtightness and heat insulation, respectively. It is configured in. As a result, the humidity and temperature of the first chamber R1, the second chamber R2, and the third chamber R3 can be maintained as much as possible. The inside of the first chamber R1 and the second chamber R2 are controlled to a predetermined humidity and a predetermined temperature, respectively, and are configured so that inspections can be performed in, for example, a normal temperature environment, a low temperature environment, and a high temperature environment. Has been done.

In the inspection device 1, the IC device 90 passes through each area from the tray supply area A1 to the tray removal area A5 in order, and an inspection (electrical inspection) is performed in the inspection area A3 in the middle. In the above-mentioned "inspection (electrical inspection)" of the present embodiment, for example, when it is confirmed whether or not the IC device 90 is conducted, or when a specific signal is input, the expected output is obtained. Check if it can be done. This makes it possible to determine whether or not the IC device 90 is broken or short-circuited. In addition, the inspection unit 16 may perform an inspection for confirming the operation of a circuit (not shown) included in the IC device 90.
Hereinafter, the inspection device 1 will be described for each of the areas A1 to A5.

(Tray supply area)
As shown in FIG. 2, the tray supply area A1 is an area to which the tray 200 (electronic component mounting unit 2) in which a plurality of uninspected IC devices 90 are arranged is supplied. A large number of trays 200 can be stacked in the tray supply area A1.

(Device supply area)
As shown in FIG. 2, the device supply area A2 is an area in which a plurality of IC devices 90 on the tray 200 from the tray supply area A1 are supplied to the inspection area A3, respectively. The tray transport mechanisms 11A and 11B for transporting the tray 200 are provided so as to straddle the tray supply area A1 and the device supply area A2.

The device supply area A2 is provided with a temperature adjusting unit 12 (electronic component mounting unit 2), a supply robot (device transfer head) 13, and a supply empty tray transfer mechanism 15.

The temperature adjusting unit 12 is a device for arranging the IC device 90, heating or cooling the arranged IC device 90, and adjusting (controlling) the temperature of the IC device 90 to a temperature suitable for inspection. In the configuration shown in FIG. 2, two temperature adjusting units 12 are arranged and fixed in the Y-axis direction. Then, the IC device 90 on the tray 200 carried in from the tray supply area A1 by the tray transport mechanism 11A is transported to one of the temperature adjusting units 12 and placed on the tray 200.

The supply robot 13 is a transfer unit that conveys the IC device 90, and is supported so as to be movable in the X-axis direction, the Y-axis direction, and the Z-axis direction within the device supply area A2. The supply robot 13 transports the IC device 90 between the tray 200 carried in from the tray supply area A1 and the temperature adjustment unit 12, and the temperature adjustment unit 12 and the electronic component supply unit 14 (electronic component mounting unit) described later. It is responsible for transporting the IC device 90 to and from 2). The supply robot 13 has a plurality of gripping portions (not shown) that grip the IC device 90. Each grip portion is provided with a suction nozzle, and can be gripped by sucking the IC device 90. Further, the supply robot 13 can heat or cool the IC device 90 to adjust the temperature of the IC device 90 to a temperature suitable for inspection, similarly to the temperature adjusting unit 12.

The supply empty tray transport mechanism 15 is a transport unit (convey mechanism) that transports an empty tray 200 in a state where all IC devices 90 have been removed in the X-axis direction. Then, after this transfer, the empty tray 200 is returned from the device supply area A2 to the tray supply area A1 by the tray transfer mechanism 11B.

(Inspection area)
As shown in FIG. 2, the inspection area A3 is an area in which the IC device 90 is inspected. The inspection area A3 is provided with an electronic component supply unit 14, an inspection unit 16, a measuring robot (device transfer head) 17, and an electronic component collection unit 18 (electronic component mounting unit 2). In the present embodiment, the electronic component supply unit 14 and the electronic component collection unit 18 are configured to be movable independently, but they are connected or integrated and configured to be movable in the same direction. You may be.

The electronic component supply unit 14 is a transport unit on which the temperature-controlled (temperature-controlled) IC device 90 is placed and transported to the vicinity of the inspection unit 16. The electronic component supply unit 14 can reciprocate between the device supply area A2 and the inspection area A3 along the X-axis direction. Further, in the configuration shown in FIG. 2, two electronic component supply units 14 are arranged in the Y-axis direction. The IC device 90 on the temperature adjusting unit 12 is conveyed to and placed on one of the electronic component supply units 14. This transfer is performed by the supply robot 13. Further, in the electronic component supply unit 14, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the temperature of the IC device 90 to a temperature suitable for inspection.

The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC device 90, and is a holding unit that holds the IC device 90 when inspecting the IC device 90. The inspection unit 16 is provided with a plurality of probe pins that are electrically connected to the terminals of the IC device 90 while holding the IC device 90. Then, the terminal of the IC device 90 and the probe pin are electrically connected (contacted), and the IC device 90 is inspected (electrically inspected) via the probe pin. Further, in the inspection unit 16, similarly to the temperature adjustment unit 12, the IC device 90 can be heated or cooled to adjust the temperature of the IC device 90 to a temperature suitable for inspection.

The measuring robot 17 is a transport unit that transports the IC device 90, and is movably supported within the inspection area A3. The measuring robot 17 can transport the IC device 90 on the electronic component supply unit 14 carried in from the device supply area A2 onto the inspection unit 16 and place it on the inspection unit 16. Further, when inspecting the IC device 90, the measuring robot 17 presses the IC device 90 toward the inspection unit 16, thereby bringing the IC device 90 into contact with the inspection unit 16. As a result, as described above, the terminal of the IC device 90 and the probe pin of the inspection unit 16 are electrically connected. The measuring robot 17 has a plurality of gripping portions (not shown) that grip the IC device 90. Each grip portion is provided with a suction nozzle, and can be gripped by sucking the IC device 90. Further, the measuring robot 17 can heat or cool the IC device 90 to adjust the temperature of the IC device 90 to a temperature suitable for inspection, similarly to the temperature adjusting unit 12. In the present embodiment, the number of measuring robots 17 is one as shown in the figure, but two or more may be provided.

The electronic component collection unit 18 is a transfer unit on which the IC device 90 that has been inspected by the inspection unit 16 is placed and conveyed to the device collection area A4. The electronic component collection unit 18 can reciprocate between the inspection area A3 and the device collection area A4 along the X-axis direction. Further, in the configuration shown in FIG. 2, two electronic component collection units 18 are arranged in the Y-axis direction, similarly to the electronic component supply unit 14. The IC device 90 on the inspection unit 16 is transported to and placed on one of the electronic component collection units 18. This transfer is performed by the measuring robot 17.

As shown in FIG. 4, the mounting portion 181 has a concave shape that opens upward, and its cross-sectional area gradually decreases toward the bottom surface. The mounting portion 181 having such a shape is composed of a bottom surface and four inclined side surfaces. Such a side surface of the mounting portion 181 functions as a guide surface for guiding the IC device 90 to the mounting portion 181 when the IC device 90 is mounted. As a result, the IC device 90 can be easily mounted on the mounting portion 181.

Further, the surfaces (side surfaces and bottom surface) constituting the mounting portion 181 are subjected to antireflection treatment to reduce the reflection on the surface. As a result, when the electronic component mounting unit 2 is imaged by the image pickup device 51 included in the mounting unit image acquisition unit 50, which will be described later, unnecessary light is incident on the image sensor (not shown) included in the image pickup device 51. Can be suppressed. Therefore, a clearer image can be obtained by the imaging device 51 described later.

The antireflection treatment is not particularly limited, and examples thereof include an antireflection film formation, a roughening treatment (a treatment for increasing light scattering), and a black treatment (a treatment for increasing light absorption).

(Device recovery area)
As shown in FIG. 2, the device collection area A4 is an area in which the IC device 90 for which the inspection has been completed is collected. The device collection area A4 is provided with a collection tray 19, a collection robot 20, and a collection empty tray transfer mechanism 21. In addition, three empty trays 200 are also prepared in the device collection area A4.

The collection tray 19 is an electronic component mounting unit 2 on which the IC device 90 is mounted. The collection trays 19 are fixed in the device collection area A4, and in the configuration shown in FIG. 2, three collection trays 19 are arranged side by side in the X-axis direction. Further, the empty tray 200 is also an electronic component mounting portion 2 on which the IC device 90 is mounted, and three of them are arranged side by side in the X-axis direction. Then, the IC device 90 on the electronic component collection unit 18 that has moved to the device collection area A4 is transported to and placed on one of the collection tray 19 and the empty tray 200. As a result, the IC device 90 is collected and sorted (classified) for each inspection result. The collection robot 20 separates the IC device 90 based on the inspection result. The recovery robot 20 separates the IC device 90 according to a command from the control device 30 described later.

The recovery robot 20 is a transport unit that transports the IC device 90, and is movably supported in the device recovery area A4 in the X-axis direction, the Y-axis direction, and the Z-axis direction. The recovery robot 20 can transport the IC device 90 from the electronic component recovery unit 18 to the recovery tray 19 or the empty tray 200. The recovery robot 20 has a plurality of gripping portions (not shown) that grip the IC device 90. Each grip portion is provided with a suction nozzle, and can be gripped by sucking the IC device 90.

The collection empty tray transport mechanism 21 is a transport unit (convey mechanism) that transports the empty tray 200 carried in from the tray removal area A5 in the X-axis direction. Then, after this transfer, the empty tray 200 will be arranged at a position where the IC device 90 is collected, that is, it may be one of the three empty trays 200.

(Tray removal area)
The tray removal area A5 is an area in which the tray 200 in which the plurality of IC devices 90 in the inspected state are arranged is collected and removed. A large number of trays 200 can be stacked in the tray removal area A5. The tray transport mechanisms 22A and 22B for transporting the trays 200 one by one are provided so as to straddle the device collection area A4 and the tray removal area A5. The tray transport mechanism 22A transports the tray 200 on which the inspected IC device 90 is placed from the device collection area A4 to the tray removal area A5. The tray transport mechanism 22B transports an empty tray 200 for collecting the IC device 90 from the tray removal area A5 to the device collection area A4.

Although not shown, the first chamber R1, the second chamber R2, and the third chamber R3 of the respective regions A1 to A5 as described above are temperature sensors (hygrometers) that detect the indoor temperature. A humidity sensor (hygrometer) that detects indoor humidity (relative humidity) and an oxygen concentration sensor (oxygen meter) that detects indoor oxygen concentration are provided. In the present embodiment, the temperature sensor, the humidity sensor, and the oxygen concentration sensor are provided in each of the first chamber R1, the second chamber R2, and the third chamber R3, but the temperature sensor, the humidity sensor, and the like. And the place where the oxygen concentration sensor is provided is arbitrary.

Although not shown, the inspection device 1 has a dry air supply mechanism. The dry air supply mechanism is configured to be able to supply low humidity air, a gas such as nitrogen (hereinafter, also referred to as dry air) to the first chamber R1, the second chamber R2, and the third chamber R3. Therefore, by supplying dry air as needed, it is possible to prevent dew condensation and icing (icing) of the IC device 90.

In the above-described embodiment, the inspection device 1 is configured to be capable of inspecting in a normal temperature environment, a low temperature environment, and a high temperature environment, but is not limited to this, and is not limited to the above three environments. The inspection may be performed under at least one of these environments. For example, a wall, a shutter, a hygrometer, an oxygen concentration meter, and a configuration for a low temperature environment such as dry air may not be included.

(Control device)
As shown in FIG. 3, the control device 30 has a function of controlling each unit of the inspection device 1, and includes a control unit 31 and a storage unit 32.

The control unit 31 includes, for example, a CPU (Central Processing Unit), and includes a drive control unit 311, an inspection control unit 312, an imaging control unit 313, and a model image creation unit 314. The storage unit 32 includes, for example, a ROM (read only memory) and a RAM (Random Access Memory).

The drive control unit 311 includes each unit (tray transfer mechanism 11A, 11B, temperature adjustment unit 12, supply robot 13, supply empty tray transfer mechanism 15, electronic component supply unit 14, inspection unit 16, measurement robot 17, electronic component collection unit 18). , The recovery robot 20, the recovery empty tray transfer mechanism 21, and the tray transfer mechanisms 22A and 22B) are controlled.

The inspection control unit 312 can also inspect the IC device 90 arranged in the inspection unit 16 based on the program (software) stored in the storage unit 32, for example.

The image pickup control unit 313 controls the driving of the mounting unit image acquisition unit 50 and the like. Further, the image pickup control unit 313 processes the signal from the image pickup device 51 and converts the image of the electronic component mounting unit 2 acquired by the mounting unit image acquisition unit 50 into data (generates image data).

The model image creation unit 314 creates a model image of the electronic component mounting unit 2 based on the image data. The model image creation unit 314 adjusts the brightness of the model image. The model image creation unit 314 adjusts the cutting position of the model image with respect to the image data. The model image creation unit 314 adjusts the brightness of the model image and at least one of the cutout positions of the model image with respect to the image data.

The model image creation unit 314 displays the brightness of the pixels in the image and the number of pixels on the display unit 41 based on the image pickup signal of the image pickup device 51. According to this, the brightness of the image can be easily adjusted by comparing the brightness value of the entire image based on the brightness with a predetermined threshold value (luminance value), and the numerical value of the brightness. It is very convenient for brightness adjustment because it is easy to check.

The model image creation unit 314 automatically adjusts the brightness of the model image based on the brightness of the pixels in the image and the number of pixels. According to this, the brightness can be automatically controlled.

The model image creation unit 314 digitizes the brightness of the pixels and the number of pixels in the image. According to this, the brightness can be easily and automatically controlled.

For digitization, a histogram is created in which the brightness of the pixels in the image is set to the horizontal axis as the first axis, and the number of pixels is set to the vertical axis as the second axis orthogonal to the first axis. According to this, since the digitization is generated by the model image creation unit 314 by using the known histogram, the model image creation unit 314 can be simply configured, and an appropriate digitization can be generated. Become.

The model image creation unit 314 displays the histogram on the display unit 41. According to this, the tendency of brightness can be easily grasped by displaying the histogram.

The model image creation unit 314 adjusts the brightness of the model image using the brightness adjustment parameters input from the operation unit (input unit) 42. According to this, it is possible to easily control the numerical value of the brightness to be adjusted.

The cutout position of the model image is adjusted by differentiating the image data of the image captured by the image pickup apparatus 51. According to this, the enhancement process can be easily performed by creating the image by the differential process.

Further, the control unit 31 has a function of displaying the drive of each unit, inspection results, image data and the like on the display unit 41, a function of performing processing according to an input from the operation unit 42, and the like.
The storage unit 32 stores programs, data, and the like for the control unit 31 to perform various processes.

(Setting display)
As shown in FIGS. 1 and 3, the setting display unit 40 has a display unit 41 and an operation unit 42.

The display unit 41 has a monitor 411 that displays the drive of each unit, inspection results, and the like. The monitor 411 can be composed of, for example, a liquid crystal display panel, a display panel such as an organic EL, or the like. The operator can set and confirm various processes and conditions of the inspection device 1 through the monitor 411.

The operation unit 42 is an input device such as a mouse 421, and outputs an operation signal corresponding to the operation by the operator to the control unit 31. Therefore, the operator can instruct the control unit 31 of various processes and the like by using the mouse 421.
In the present embodiment, the mouse 421 is used as the operation unit 42, but the operation unit 42 is not limited to this, and may be, for example, an input device such as a keyboard, a trackball, or a touch panel.

(Placement part image acquisition part)
The mounting unit image acquisition unit 50 has a function of acquiring an image of the electronic component mounting unit 2. As shown in FIG. 2, the mounting unit image acquisition unit 50 is provided in the tray supply area A2 and the device collection area A4 in the supply robot 13 and the collection robot 20. That is, the mounting unit image acquisition unit 50 is provided at a position where an image of the electronic component mounting unit 2 can be acquired.

The mounting unit image acquisition unit 50 includes a first mounting unit image acquisition unit 50a and a second mounting unit image acquisition unit 50b. The first mounting unit image acquisition unit 50a and the second mounting unit image acquisition unit 50b are provided above the electronic component mounting unit 2.

In the present embodiment, when each of the first mounting unit image acquisition unit 50a and the second mounting unit image acquisition unit 50b is regarded as one mounting unit image acquisition unit 50, the mounting unit image acquisition unit The number of 50 is two, but the number of the mounting unit image acquisition unit 50 is not limited to this and is arbitrary.

The mounting unit image acquisition unit 50 is supported by the supply robot 13 and the recovery robot 20 so as to be arranged above the electronic component mounting unit 2. As a result, the mounting unit image acquisition unit 50 can acquire an image of the state of the upper surface 911 of the electronic component mounting unit 2 from vertically above the electronic component mounting unit 2.

The first mounting unit image acquisition unit 50a and the second mounting unit image acquisition unit 50b have an image pickup device 51 and a lighting device 52, respectively. The lighting device 52 may be not only continuous lighting but also intermittently strong light (flash) as long as the exposure time can be controlled.

The image pickup device 51 has an image pickup device that receives light from the electronic component mounting unit 2 and converts it into an electric signal. The image pickup device 51 is not particularly limited, but for example, a camera (CCD camera) using a CCD (Charge Coupled Device) image sensor as the image pickup element, and a camera using a CMOS (Complementary Metal Oxide Semiconductor) image sensor as the image pickup element. Examples of the image sensor include an electronic camera (digital camera) such as a camera using a MOS image sensor. Further, by analyzing the image data by using, for example, a differential interference method, a Fourier transform method, or the like, it is possible to emphasize fine shapes and hard-to-see shapes and improve the shape detection sensitivity. In addition, it is possible to emphasize fine scratches and hard-to-see scratches and improve the scratch detection sensitivity.

The imaging device 51 is configured such that the imaging region is substantially equal to or larger than the size of the upper surface 911 of the electronic component mounting portion 2.

Further, although not shown, the image pickup apparatus 51 preferably includes an optical system such as an optical lens and an autofocus mechanism. Thereby, for example, a clear image can be obtained even when the height (height in the Z-axis direction) of the electronic component mounting portion 2 with respect to the image pickup apparatus 51 is different.

The lighting device 52 is a light source device that is driven when the electronic component mounting unit 2 is imaged by the imaging device 51 and irradiates the electronic component mounting unit 2 with light. With this lighting device 52, it is possible to suppress darkening of the image due to insufficient light amount and obtain a clearer image.

In the present embodiment, the lighting device 52 forms an annular shape and is arranged around the image pickup device 51. As a result, the electronic component mounting portion 2 can be uniformly irradiated with light. The shape and arrangement of the lighting device 52 are not limited to the above-mentioned configuration.

The mounting unit image acquisition unit 50 having such a configuration irradiates the electronic component mounting unit 2 with light by the lighting device 52, and images the electronic component mounting unit 2 by the imaging device 51. The signal from the image pickup apparatus 51 is taken into the image pickup control unit 313 described above. The image pickup control unit 313 processes the signal from the image pickup device 51 and generates an image of the electronic component mounting unit 2 as two-dimensional image data.

Further, three-dimensional image data may be generated by using the image of the electronic component mounting unit 2 acquired by the mounting unit image acquisition unit 50. In that case, for example, although not shown, two or more (for example, three) mounting unit image acquisition units 50 may be provided for one arrangement row.

(Example)
Hereinafter, acquisition of an image of the electronic component mounting unit 2 will be described while explaining a series of operations of the inspection device 1 having the above configuration.
FIG. 5 is a flowchart showing a process of automatically registering a model image according to the present embodiment.
An example of the flow at the time of automatic registration of the model image in the model image creation unit 314 will be described below.

The model image creation unit 314 according to the present embodiment automatically creates a model image. The model image creation unit 314 automatically performs the operations of "brightness adjustment" and "cutting out the model image".

First, in step S10, the image pickup control unit 313 moves the mounting unit image acquisition unit 50 above the electronic component mounting unit 2.

Next, in step S20, the model image creation unit 314 adjusts the brightness of the image of the electronic component mounting unit 2.

Next, in step S30, the model image creation unit 314 determines the model image area of the image of the electronic component mounting unit 2.

Next, in step S40, the model image creation unit 314 cuts out and registers the model image of the electronic component mounting unit 2. Then, the automatic registration of the model image is completed.

FIG. 6 is a flowchart showing the brightness adjustment process according to the present embodiment.
An example of the process of "brightness adjustment" in step S20 will be described below.

The model image creation unit 314 digitizes the brightness of the pixels and the number of pixels in the image. According to this, the brightness can be easily and automatically controlled. The model image creation unit 314 determines an appropriate set value from the brightness distribution in the captured image in the automation of "brightness adjustment". At this time, the settings to be adjusted include exposure time, shutter speed, illumination intensity, aperture, and illumination lighting time. The lighting lighting time may be adjusted when the flash is used.

First, in step S210, the mounting unit image acquisition unit 50 images the electronic component mounting unit 2.

Next, in step S220, the model image creation unit 314 creates the brightness distribution of the image of the electronic component mounting unit 2.

The model image creation unit 314 displays the brightness of the pixels in the image and the number of pixels on the display unit 41 based on the image pickup signal of the image pickup device 51. According to this, the brightness of the image can be easily adjusted by comparing the brightness value of the entire image based on the brightness with a predetermined threshold value (luminance value), and the numerical value of the brightness. It is very convenient for brightness adjustment because it is easy to check.

For digitization, a histogram is created in which the brightness of pixels in the image is on the horizontal axis (first axis) and the number of pixels is on the vertical axis (second axis). According to this, since the digitization is generated by the model image creation unit 314 by using the known histogram, the model image creation unit 314 can be simply configured, and an appropriate digitization can be generated. Become.

Next, in step S230, the model image creation unit 314 determines whether the brightness is appropriate. Evaluate the distribution of the histogram to determine the brightness.

FIG. 7 is a diagram illustrating a brightness adjustment algorithm according to the present embodiment.
As shown in the lower figure of FIG. 7, when the right end of the distribution of the histogram 70 is on the right side of the reference value, it is judged that the image is bright. If it is bright, the process proceeds to step S240.
As shown in the upper figure of FIG. 7, when the right end of the distribution of the histogram 74 is on the left side of the reference value, it is determined that the image is dark. If it is dark, the process proceeds to step S250.

Next, in step S240, the model image creation unit 314 darkens the pixels in the image (shortens the exposure time). Make sure that the distribution is within the predetermined standard value. Specifically, the distribution of the histogram 70 is narrowed so that it fits within the reference value like the distribution of the histogram 72.

Next, in step S250, the model image creation unit 314 brightens the pixels in the image (extends the exposure time). Make sure that the distribution is within the predetermined standard value. Specifically, the distribution of the histogram 74 is expanded so that it fits within the reference value like the distribution of the histogram 72.
And back.

FIG. 8 is a flowchart showing the process of determining the model image area according to the present embodiment.
An example of the process of "determining the model image area" in step S30 will be described below.

The cutout position of the model image is adjusted by differentiating the image data of the image captured by the image pickup apparatus 51. According to this, the enhancement process can be easily performed by creating the image by the differential process. In the automation of "cutting out the model image", the model image area in the captured image is determined based on the dimensions of the IC device 90 and the electronic component mounting portion 2, and the image is cut out. Features (symmetry) in the image are also used to determine the model image area. The adjustment of the cutout position of the model image is determined by checking the edges in the image.
For example, check the edge by the following method.

First, in step S310, the model image creation unit 314 determines a temporary model image area of the image of the electronic component mounting unit 2. At the center of the image, make it larger than the size of the electronic component mounting unit 2. Create a derivative image of the image and extract the edges. The cutting frame is determined based on the size of the electronic component mounting portion 2 (electronic component mounting portion size + α).

Next, in step S320, the model image creation unit 314 evaluates the symmetry of the model image area while changing the temporary model image area vertically and horizontally.
For example, the model image creation unit 314 calculates the rotational symmetry of the model image. The model image creation unit 314 cuts out a model image. The model image creation unit 314 extracts the area of the edge portion of the model image. The model image creation unit 314 expands the cutout frame, and repeats cutting out the model image and extracting the area of the edge portion (up to the maximum specified in advance).

Next, in step S330, the model image creation unit 314 sets the position with the highest symmetry as the model image area. The model image creation unit 314 regards a position having high symmetry as the center of the model image. The model image creation unit 314 determines the optimum edge position from the distribution of the cutout frame and the edge area, and determines the cutout position of the model image. The optimum edge position is determined by using, for example, the size at which the edge area is saturated, or the edge area above a certain threshold value. And back.

FIG. 9 is a flowchart showing the flow of automatic registration of the model image according to the present embodiment.
An example of a flow of processing a plurality of times when the model image is automatically registered in the model image creation unit 314 will be described below.
By performing the model image registration process of FIG. 5 a plurality of times, a more appropriate model image can be obtained. In order to obtain a more optimal model image, "brightness adjustment" and "cutting out the model image" are repeated a plurality of times.

First, in step S10, the image pickup control unit 313 moves the mounting unit image acquisition unit 50 above the electronic component mounting unit 2.

Next, in step S20, the model image creation unit 314 adjusts the brightness of the image of the electronic component mounting unit 2.

Next, in step S30, the model image creation unit 314 determines the model image area of the electronic component mounting unit 2.

Next, in step S32, the image pickup control unit 313 moves the mounting unit image acquisition unit 50 to a position where the model image area of the electronic component mounting unit 2 can be imaged at the center.

Next, in step S34, the model image creation unit 314 adjusts the brightness in the model image area of the electronic component mounting unit 2 to make it more optimum.

Next, in step S36, the model image creation unit 314 determines the model image area of the electronic component mounting unit 2. As a result, the model image of the electronic component mounting unit 2 captured at the center of the mounting unit image acquisition unit 50 can be used.

Next, in step S40, the model image creation unit 314 cuts out and registers the model image of the electronic component mounting unit 2. Then, the automatic registration of the model image is completed.

As described above, in the inspection device 1, the image acquisition unit 50 of the mounting unit acquires the image of the electronic component mounting unit 2.

According to this embodiment, the brightness of the model image and at least one of the cutout positions of the model image with respect to the image can be adjusted. Thereby, the optimum model image can be obtained. As a result, it is possible to provide the transfer device 10 and the inspection device 1 that correct the transfer position and realize high-precision transfer.

In addition, optimal model registration that does not depend on the operator can be performed. The burden on registered workers is reduced.

(Second Embodiment)
FIG. 10 is a diagram showing a setting screen for automatic registration of model images according to the present embodiment.
Hereinafter, the present embodiment will be described, but the differences from the first embodiment described above will be mainly described, and the same matters will be omitted.

The transport device 10 according to the present embodiment can display the setting information of the model image of the electronic component mounting unit 2 based on the image, and can receive the instruction for automatic registration of the model image. The model automatic registration button (instruction receiving unit). ) 82 is provided with a supply transport correction setup screen (model image display setting unit) 80.

The supply / transport correction setup screen 80 includes a detection pocket selection button (electronic component mounting section selection section) 84 capable of selecting the electronic component mounting section 2. The operator (operator) selects the electronic component mounting unit 2 with the detection pocket selection button 84. The automatic registration of the model image is executed when the operator (operator) selects the model automatic registration button 82. When the model automatic registration button 82 is selected, the model image creation unit 314 automatically adjusts the brightness of the model image and at least one of the cutout positions of the model image with respect to the image.

For the operation of the operation unit 42 of the operator (operator), for example, the mouse 421 is operated, the cursor is moved to the position of each operation button (icon) displayed on the display unit 41, and the cursor is selected (clicked). It is done by.
A part or all of the operation buttons displayed on the display unit 41 may be provided as mechanical operation buttons such as push buttons.

FIG. 11 is a flowchart showing a process of automatically registering a model image according to the present embodiment.
An example of the flow at the time of automatic registration of the model image in the model image creation unit 314 will be described below.

First, in step S50, the model image creation unit 314 registers the model image of the tray 200 (electronic component mounting unit 2) (see FIGS. 5 and 9).

Next, in step S60, the model image creation unit 314 registers the model image of the electronic component supply unit 14 (electronic component mounting unit 2) (see FIGS. 5 and 9).

Next, in step S70, the model image creating unit 314 registers the model image of the temperature adjusting unit 12 (electronic component mounting unit 2) (see FIGS. 5 and 9).

Next, in step S80, the model image creation unit 314 registers a model image of the rotation stage (not shown) (electronic component mounting unit 2) (see FIGS. 5 and 9). Then, the automatic registration of the model image is completed.

FIG. 12 is a diagram showing a model image registration processing state screen for automatic registration of model images according to the present embodiment.
During automatic registration, the model registration processing status screen 86 indicating that the model (model screen) of the supply shuttle (electronic component supply unit 14) is being registered is displayed.

(Modification example)
The mounting unit image acquisition unit 50 may be supported by the support unit 60 so as to be arranged above the electronic component mounting unit 2. As a result, the mounting unit image acquisition unit 50 can acquire information on the state of the upper surface 911 of the electronic component mounting unit 2 from vertically above the electronic component mounting unit 2. The support unit 60 is attached to, for example, a support leg (not shown) that supports the inspection unit 16 or the measurement robot 17.

FIG. 13 is a schematic side view showing the mounting portion image acquisition portion 50 of the modified example.
Further, as shown in FIG. 13, the mounting unit image acquisition unit 50 may be supported by the measuring robot 17 so as to be arranged above the electronic component mounting unit 2. As a result, the mounting unit image acquisition unit 50 can acquire an image of the inspection unit 16 from vertically above the inspection unit 16.

Further, in the above description, the mounting unit image acquisition unit 50 has imaged one electronic component mounting unit 2 in one imaging, but has captured a plurality of electronic component mounting units 2 in one imaging. You may take an image. Further, the mounting unit image acquisition unit 50 may divide one electronic component mounting unit 2 into a plurality of images. In that case, the number of divisions is not particularly limited and is appropriately set according to various conditions such as the performance of the image pickup apparatus 51, but the larger the number, the more preferable. As a result, the image can be acquired with high accuracy as compared with the case where the image of the electronic component mounting unit 2 is acquired all at once.

Although the electronic component transfer device and the electronic component inspection device of the present invention have been described above based on the illustrated embodiment, the present invention is not limited to this, and the configuration of each part is arbitrary having the same function. It can be replaced with the one of the configuration. Further, any other constituents may be added to the present invention.

For example, in the above-described embodiment, the configuration including the imaging device 51 and the lighting device 52 is mentioned as the mounting unit image acquisition unit 50, but the configuration of the mounting unit image acquisition unit 50 is not limited to this. For example, the mounting unit image acquisition unit 50 may be a device that irradiates the surface of an electronic component with a laser beam, scans the laser beam, and receives the laser beam reflected on the surface.

Further, in the above-described embodiment, the mounting unit image acquisition unit 50 is configured to image the upper surface of the electronic component mounting unit 2 in the vertical direction, but the present invention is not limited to this, and for example, the mounting unit image acquisition unit is used. The unit 50 may be configured so that the back surface, side surface, and the like of the electronic component can be imaged.

1 ... Inspection device (electronic component inspection device) 2 ... Electronic component mounting unit 10 ... Transport device (electronic component transport device) 11A, 11B ... Tray transport mechanism 12 ... Temperature control unit (electronic component mounting section) 13 ... Supply robot (Device transfer head) 14 ... Electronic component supply section (Electronic component mounting section) 15 ... Supply empty tray transfer mechanism 16 ... Inspection section 17 ... Measuring robot (Device transfer head) 18 ... Electronic component collection section (Electronic component mounting section) 19 ... Collection tray (electronic component mounting unit) 20 ... Recovery robot 21 ... Recovery empty tray transfer mechanism 22A, 22B ... Tray transfer mechanism 30 ... Control device 31 ... Control unit 32 ... Storage unit 40 ... Setting display unit 41 ... Display unit 42 ... Operation unit (input unit) 50 ... Mounting unit Image acquisition unit 50a ... First mounting unit image acquisition unit 50b ... Second mounting unit Image acquisition unit 51 ... Imaging device (imaging unit) 52 ... Lighting device 60 ... Support unit 70, 72, 74 ... histogram 80 ... Supply and transport correction setup screen (model image display setting unit) 82 ... Model automatic registration button (instruction reception unit) 84 ... Detection pocket selection button (electronic component mounting unit selection unit) ) 86 ... Model registration processing status screen 90 ... IC device (electronic component) 181 ... Mounting unit 200 ... Tray (electronic component mounting unit) 311 ... Drive control unit 312 ... Inspection control unit 313 ... Imaging control unit 314 ... Model image Creation unit 411 ... Monitor 421 ... Mouse 911 ... Top surface A1 ... Tray supply area A2 ... Device supply area A3 ... Inspection area A4 ... Device collection area A5 ... Tray removal area R1 ... Room 1 R2 ... Room 2 R3 ... Room 3 ..

Claims (4)

An electronic component mounting unit on which electronic components can be mounted,
An imaging unit capable of capturing an image of the electronic component mounting unit, and an imaging unit
A model image creation unit capable of creating a model image of the electronic component mounting unit based on the image ,
Has a display and
The model image creation unit can adjust the brightness of the model image .
The model image creating unit displays the brightness of the pixels and the number of pixels in the image on the display unit based on the imaging signal of the imaging unit.
The model image creation unit digitizes the brightness of the pixels and the number of pixels in the image.
The digitization creates a histogram in which the brightness of the pixels in the image is set to the first axis and the number of pixels is set to the second axis orthogonal to the first axis.
The model image creation unit is an electronic component transfer device that displays the histogram on the display unit . The electronic component transfer device according to claim 1, wherein the model image creating unit automatically adjusts the brightness of the model image based on the brightness of the pixels in the image and the number of pixels. It has an input section for inputting brightness adjustment parameters.
The electronic component transfer device according to claim 1, wherein the model image creating unit adjusts the brightness of the model image by using the input brightness adjustment parameter. An electronic component mounting unit on which electronic components can be mounted,
An imaging unit capable of capturing an image of the electronic component mounting unit, and an imaging unit
A model image creation unit capable of creating a model image of the electronic component mounting unit based on the image,
An inspection unit for inspecting the electronic component,
Has a display and
The model image creation unit can adjust the brightness of the model image .
The model image creating unit displays the brightness of the pixels and the number of pixels in the image on the display unit based on the imaging signal of the imaging unit.
The model image creation unit digitizes the brightness of the pixels and the number of pixels in the image.
The digitization creates a histogram in which the brightness of the pixels in the image is set to the first axis and the number of pixels is set to the second axis orthogonal to the first axis.
The model image creation unit is an electronic component inspection device that displays the histogram on the display unit .