CN107661867B

CN107661867B - Electronic component conveying device and electronic component inspection device

Info

Publication number: CN107661867B
Application number: CN201710626908.7A
Authority: CN
Inventors: 山崎孝
Original assignee: Seiko Epson Corp
Current assignee: Seiko Epson Corp
Priority date: 2016-07-28
Filing date: 2017-07-27
Publication date: 2020-04-14
Anticipated expiration: 2037-07-27
Also published as: JP6759809B2; CN107661867A; TW201803787A; JP2018018304A

Abstract

The invention provides an electronic component conveying device and an electronic component inspection device which realize high-precision conveying by correcting conveying positions. The electronic component conveying device comprises: an electronic component mounting part on which an electronic component can be mounted; an imaging unit (51) that can image an image of the electronic component mounting unit; and a sample image creation unit (314) that can create a sample image of the electronic component placement unit on the basis of the image, wherein the sample image creation unit (314) can adjust at least one of the brightness of the sample image and the position of the sample image captured with respect to the image.

Description

Electronic component conveying device and electronic component inspection device

Technical Field

The invention relates to an electronic component conveying device and an electronic component inspection device.

Background

In an IC sorter, the positions of a transfer start point and a transfer destination are recognized from an image captured by a camera by image processing, and a transfer position is corrected to realize high-precision transfer. In this image processing, a sample (model) image of a conveyance position registered in advance is used. The sample image is registered at each transport position (tray, replacement tool). Therefore, when the inspection setting (method) is created, an operation of registering a set of a plurality of sample images is required.

In this image manipulation, "brightness adjustment" and "clipping of a sample image" are performed based on the subjectivity of the operator, and therefore, the registered sample image differs depending on the operator. Even the same operator may have different situations at each registration. Further, since the operator needs to register sample images at a plurality of transport positions, the operator is forced to perform many operations, which causes a burden.

For example, it is disclosed to register a sample image for detecting the presence or absence of a component (for example, see patent document 1).

[ Prior art documents ]

[ patent document ]

Patent document 1: japanese patent laid-open No. 2001-67478

However, patent document 1 does not disclose an adjustment method for optimizing the brightness and position of an image.

Disclosure of Invention

The present invention has been made to solve at least some of the above problems, and can be implemented as the following modes or application examples.

First application example an electronic component transfer apparatus according to the first application example includes: an electronic component mounting part on which an electronic component can be mounted; an imaging unit capable of imaging an image of the electronic component mounting unit; and a sample image creation unit capable of creating a sample image of the electronic component mounting unit based on the image, the sample image creation unit being capable of adjusting at least one of a brightness of the sample image and an interception position of the sample image with respect to the image.

According to the present application example, at least one of the brightness of the sample image and the cut-off position of the sample image with respect to the image can be adjusted. This makes it possible to obtain an optimal sample image. As a result, an electronic component conveying apparatus that can correct the conveying position to realize high-precision conveying can be provided.

In the electronic component transfer device according to the second application example, it is preferable that the sample image creating unit automatically adjusts the brightness of the sample image based on the brightness of the pixels in the image and the number of pixels.

According to the present application example, the luminance can be automatically controlled.

In the electronic component conveying apparatus according to the above-described application example, it is preferable that the electronic component conveying apparatus includes an input unit that inputs a brightness adjustment parameter, and the sample image creating unit adjusts the brightness of the sample image using the input brightness adjustment parameter.

According to the present application example, the numerical value of the adjusted luminance can be easily controlled.

In the electronic component conveying apparatus according to the application example, it is preferable that the adjustment of the cut-out position of the sample image is performed by performing a differentiation process on image data of the image captured by the imaging unit.

According to the present application example, the enhancement processing can be easily performed by performing the differentiation processing on the image and creating the image.

In the electronic component transfer device according to the application example, it is preferable that the electronic component transfer device includes a display unit, and the sample image creating unit displays the brightness of the pixels and the number of pixels in the image on the display unit based on the image pickup signal of the image pickup unit.

According to the present application example, the luminance of the image can be easily adjusted by comparing the luminance value of the entire image based on the luminance with a predetermined threshold value (luminance value), and the luminance value can be easily confirmed, which is very convenient for the luminance adjustment.

In the electronic component transfer device according to the above-described application example, it is preferable that the sample image creating unit digitizes the brightness of the pixels and the number of pixels in the image.

According to the present application example, the luminance can be easily automatically controlled.

In the electronic component conveying apparatus according to the above-described application example, it is preferable that the digitizing is a histogram in which the luminance of pixels in the image is a first axis and the number of pixels is a second axis orthogonal to the first axis.

According to the present application example, by using a known histogram and generating a numerical value by the sample image generating unit, the sample image generating unit can be easily configured and appropriate numerical value generation can be performed.

In the electronic component conveying apparatus according to the above-described application example, it is preferable that the sample image creating unit displays the histogram on the display unit.

According to the present application example, the tendency of luminance can be easily grasped by displaying the histogram.

Application example nine an electronic component transfer apparatus according to the application example includes: an electronic component mounting part on which an electronic component can be mounted; an imaging unit capable of imaging an image of the electronic component mounting unit; and a sample image display setting unit that can display setting information of a sample image of the electronic component mounting unit based on the image and has an instruction receiving unit that receives an instruction to automatically register the sample image, wherein the sample image display setting unit has an electronic component mounting unit selection unit that can select the electronic component mounting unit, and when instructed by the instruction receiving unit, at least one of a brightness of the sample image and a position where the sample image is captured with respect to the image can be automatically adjusted.

[ application example ] an electronic component inspection apparatus according to the present application example includes: an electronic component mounting part on which an electronic component can be mounted; an imaging unit capable of imaging an image of the electronic component mounting unit; a sample image creating unit capable of creating a sample image of the electronic component mounting unit based on the image; and an inspection unit configured to inspect the electronic component, wherein the sample image creation unit is configured to adjust at least one of a brightness of the sample image and an interception position of the sample image with respect to the image.

Drawings

Fig. 1 is a schematic perspective view showing an inspection apparatus according to a first embodiment.

Fig. 2 is a schematic plan view of the inspection apparatus shown in fig. 1.

Fig. 3 is a block diagram showing a control device, a setting display unit, and a placement unit image acquisition unit included in the inspection device shown in fig. 1.

Fig. 4 is a schematic side view of the mounting unit image acquiring unit shown in fig. 2.

Fig. 5 is a flowchart showing the process of automatically registering a sample image according to the present embodiment.

Fig. 6 is a flowchart showing the process of luminance adjustment according to the present embodiment.

Fig. 7 is a diagram for explaining an algorithm of luminance adjustment according to the present embodiment.

Fig. 8 is a flowchart showing a process of determining a sample image area according to the present embodiment.

Fig. 9 is a flowchart showing a flow of automatic registration of a sample image according to the present embodiment.

Fig. 10 is a diagram illustrating a setting screen for automatic registration of a sample image according to the second embodiment.

Fig. 11 is a flowchart showing a process of automatic registration of a sample image according to the second embodiment.

Fig. 12 is a diagram illustrating a sample image registration processing status screen for automatic registration of a sample image according to the second embodiment.

Fig. 13 is a side view showing a mount unit image acquiring unit according to a modification.

Description of the symbols

1 an inspection apparatus (electronic component inspection apparatus); 2 an electronic component mounting part; 10 a conveying device (electronic component conveying device); 11A, 11B tray conveying mechanism; 12 a temperature adjustment unit (electronic component mounting unit); 13 a supply robot (device transfer head); 14 an electronic component supply section (electronic component mounting section); 15 supplying an empty tray carrying mechanism; 16 an inspection unit; 17 a measurement robot (device transfer head); 18 an electronic component collecting section (electronic component mounting section); 19 a tray for collection (electronic component mounting part); 20 a recovery robot; 21 a mechanism for recovering empty trays; 22A, 22B tray conveying mechanism; 30 a control device; 31 a control unit; 32 a storage part; 40 setting display part; 41 a display unit; 42 an operation unit (input unit); 50a loading unit image acquisition unit; 50a first placing section image acquiring section; 50b a second placing section image obtaining section; 51 an imaging device (imaging unit); 52 an illumination device; 60 a support part; 70. 72, 74 histograms; 80 supplying a conveyance correction setting screen (sample image display setting section); 82 sample automatic registration button (instruction accepting unit); 84 a detection recess selection button (electronic component mounting portion selection portion); 86 sample registration process status screen; 90IC devices (electronic components); 181 a placing part; 200 trays (electronic component mounting parts); 311 a drive control section; 312 inspection control unit; 313 an imaging control unit; 314 a sample image creating unit; a 411 monitor; 421 mouse; 911 above; a1 pallet supply area; a2 device supply area; a3 examination area; a4 device recovery area; a5 tray removal area; r1 first chamber; r2 second chamber; r3 third chamber.

Detailed Description

(first embodiment)

Hereinafter, an electronic component conveying apparatus and an electronic component inspection apparatus according to the present invention will be described in detail based on embodiments shown in the drawings.

Fig. 1 is a schematic perspective view showing an inspection apparatus according to a first embodiment. Fig. 2 is a schematic plan view of the inspection apparatus shown in fig. 1. Fig. 3 is a block diagram showing a control device, a setting display unit, and a placement unit image acquisition unit included in the inspection device shown in fig. 1. Fig. 4 is a schematic side view of the mounting unit image acquiring unit shown in fig. 2.

In fig. 1, 2, 4 (described later), and 13 (described later), for convenience of explanation, three axes orthogonal to each other, i.e., an X axis, a Y axis, and a Z axis, are shown by arrows, and the tip side of the arrows is "+ (positive)" and the base side thereof is "- (negative)". Hereinafter, a direction parallel to the X axis (first direction) is referred to as "X axis direction", a direction parallel to the Y axis (second direction) is referred to as "Y axis direction", and a direction parallel to the Z axis is referred to as "Z axis direction". For convenience of explanation, the upper side (+ Z-axis direction side) in fig. 1 is referred to as "upper" and the lower side (-Z-axis direction side) is referred to as "lower" in the following description.

Also, the XY plane containing the X and Y axes is horizontal and the Z axis is vertical. The upstream side in the transport direction of the electronic component is simply referred to as "upstream side", and the downstream side is simply referred to as "downstream side". The term "horizontal" as used herein is not limited to a complete horizontal state, and includes a state slightly inclined from the horizontal (for example, less than about 5 °) as long as it does not hinder the transfer of electronic components.

The inspection apparatus (electronic component inspection apparatus) 1 shown in fig. 1 and 2 is an apparatus for inspecting/testing (hereinafter, simply referred to as "inspection") electrical characteristics of electronic components such as IC devices such as BGA (Ball Grid Array) packages and LGA (Land Grid Array) packages, LCD (Liquid Crystal Display), CIS (complementary metal oxide semiconductor Image Sensor), and the like. For convenience of explanation, the electronic component for detection will be described below as a representative example of the case where an IC device is used, and will be referred to as "IC device 90".

As shown in fig. 1 and 2, an inspection apparatus (electronic component inspection apparatus) 1 includes: a conveying device (electronic component conveying device) 10 for conveying an IC device (electronic component) 90, an inspection unit 16, a setting display unit 40 having a display unit 41 and an operation unit 42, and a control device 30. The transfer device 10 includes an electronic component mounting unit 2 on which an IC device 90 can be mounted. The electronic component mounting unit 2 includes, for example, a tray 200, an electronic component supply unit 14, an electronic component collection unit 18, a temperature adjustment unit 12, a collection tray 19, a turntable (not shown), and the like (hereinafter, these mounting units are also referred to as "electronic component mounting unit 2" when they are not distinguished from each other). The conveying device 10 includes a mounting portion image acquiring unit 50, and the mounting portion image acquiring unit 50 includes an imaging device (imaging unit) 51 and an illumination device 52 (see fig. 3) capable of imaging an image of the electronic component mounting portion 2.

In the present embodiment, the conveying device 10 (see fig. 3) is configured by a configuration in which the inspection unit 16 and an inspection control unit 312 included in a control device 30 (described later) are removed from the inspection device 1.

As shown in fig. 1 and 2, the inspection apparatus 1 is divided into a tray supply area a1, a device supply area a2, an inspection area A3 in which the inspection portion 16 is provided, a device collection area a4, and a tray removal area a 5.

These regions are separated from each other by a wall portion, a shutter, or the like, not shown. The device supply region a2 is a first chamber R1 partitioned by a wall, a shutter, or the like. The inspection area a3 is a second chamber R2 partitioned by a wall, a shutter, or the like. The device collection area a4 is a third chamber R3 partitioned by walls, shutters, and the like. The first chamber R1 (device supply region a2), the second chamber R2 (inspection region A3), and the third chamber R3 (device collection region a4) are configured to ensure airtightness and thermal insulation, respectively. Thereby, the first chamber R1, the second chamber R2, and the third chamber R3 can maintain humidity and temperature as much as possible, respectively. The first chamber R1 and the second chamber R2 are controlled to have a predetermined humidity and a predetermined temperature, respectively, and can be inspected in, for example, a normal temperature environment, a low temperature environment, and a high temperature environment.

In the inspection apparatus 1, the IC device 90 is inspected (electrically inspected) in the inspection area A3 in the middle of the respective areas sequentially from the tray supply area a1 to the tray removal area a 5. In the "inspection (electrical inspection)" of the present embodiment, for example, whether or not the IC device 90 is turned on is checked, and whether or not an expected output is obtained when a specific signal is input is checked. This makes it possible to determine whether or not the IC device is disconnected or short-circuited. Further, an inspection for checking the operation of a circuit (not shown) provided in the IC device 90 may be performed.

The inspection apparatus 1 will be described below for each of the regions a1-a 5.

(tray supply area)

As shown in fig. 2, the tray supply area a1 is an area where the tray 200 (electronic component mounting section 2) on which the plurality of IC devices 90 in an unchecked state are arranged is supplied. A plurality of trays 200 can be stacked in the tray supply area a 1.

(device supply region)

As shown in fig. 2, the device supply area a2 is an area for supplying a plurality of IC devices 90 on a tray 200 from the tray supply area a1 to the inspection area A3, respectively.

Tray conveyance mechanisms

11A and 11B that convey the tray 200 are provided so as to straddle the tray supply area a1 and the component supply area a 2.

In the component supply area a2, a temperature adjustment unit 12 (electronic component placement unit 2), a supply robot (component transfer head) 13, and a supply empty tray transfer mechanism 15 are provided.

The temperature adjustment unit 12 is a device in which the IC device 90 is disposed, and the disposed IC device 90 is heated or cooled to adjust (control) the IC device 90 to a temperature suitable for inspection. In the configuration shown in fig. 2, two temperature adjustment units 12 are disposed and fixed in the Y-axis direction. The IC devices 90 on the tray 200 loaded into the tray supply area a1 by the tray conveying mechanism 11A are conveyed and placed on any one of the temperature adjustment units 12.

The supply robot 13 is a transfer unit that transfers the IC devices 90, and is supported in the device supply area a2 so as to be movable in the X-axis direction, the Y-axis direction, and the Z-axis direction. The supply robot 13 is responsible for the conveyance of the IC devices 90 between the tray 200 and the temperature adjustment unit 12, which are carried in from the tray supply area a1, and the conveyance of the IC devices 90 between the temperature adjustment unit 12 and the electronic component supply unit 14 (electronic component placement unit 2) described later. The supply robot 13 includes a plurality of gripping portions (not shown) for gripping the IC devices 90. Each of the holding portions has a suction nozzle and can hold the IC device 90 by suction. The supply robot 13 can heat or cool the IC device 90 to adjust the temperature of the IC device 90 to a temperature suitable for inspection, as in the temperature adjustment unit 12.

The empty tray supply conveyance mechanism 15 is a conveyance section (conveyance mechanism) that conveys the empty tray 200 with all the IC devices 90 removed, in the X-axis direction. After the conveyance, the empty tray 200 is returned from the component supply area a2 to the tray supply area a1 by the tray conveyance mechanism 11B.

(examination region)

As shown in fig. 2, the inspection area a3 is an area where the IC device 90 is inspected. In the inspection area a3, an electronic component supply unit 14, an inspection unit 16, a measurement robot (device transfer head) 17, and an electronic component collection unit 18 (electronic component placement unit 2) are provided. In the present embodiment, the electronic component supply unit 14 and the electronic component collection unit 18 are configured to be independently movable, but may be configured to be connected or integrated so as to be movable in the same direction.

The electronic component supply unit 14 is a conveying unit on which the temperature-adjusted (temperature-controlled) IC device 90 is placed and which conveys the IC device to the vicinity of the inspection unit 16. The electronic component supply section 14 is capable of reciprocating between the device supply area a2 and the inspection area A3 along the X-axis direction. In the configuration shown in fig. 2, two electronic component supply units 14 are arranged in the Y-axis direction. The IC device 90 on the temperature adjustment unit 12 is carried and placed by any of the electronic component supply units 14. Then, the conveyance is performed by the supply robot 13. The electronic component supply unit 14 can heat or cool the IC device 90 to adjust the temperature of the IC device 90 to a temperature suitable for inspection, as in the temperature adjustment unit 12.

The inspection unit 16 is a unit for inspecting and testing the electrical characteristics of the IC device 90, and is a holding unit for holding the IC device 90 when the IC device 90 is inspected. The inspection unit 16 is provided with a plurality of probes electrically connected to terminals of the IC device 90 in a state where the IC device 90 is held. The terminals of the IC device 90 are electrically connected (contacted) to the probes, and the IC device 90 is inspected (electrically inspected) through the probes. The inspection unit 16 can heat or cool the IC device 90 to adjust the temperature of the IC device 90 to a temperature suitable for inspection, as in the temperature adjustment unit 12.

The measurement robot 17 is a transfer unit that transfers the IC devices 90, and is movably supported in the inspection area a 3. The measuring robot 17 can carry and place the IC device 90 on the electronic component supply unit 14 carried in from the device supply area a2 on the inspection unit 16. When the IC device 90 is inspected, the measurement robot 17 presses the IC device 90 against the inspection unit 16, thereby bringing the IC device 90 into contact with the inspection unit 16. Thus, as described above, the terminals of the IC device 90 are electrically connected to the probes of the inspection unit 16. The measurement robot 17 includes a plurality of gripping portions (not shown) for gripping the IC devices 90. Each of the holding portions includes a suction nozzle and can hold the IC device 90 by suction. The measurement robot 17 can heat or cool the IC device 90 to adjust the temperature of the IC device 90 to a temperature suitable for inspection, as in the temperature adjustment unit 12. In the present embodiment, the number of the measuring robots 17 is one as shown in the drawing, but two or more may be provided.

The electronic component collection unit 18 is a conveying unit that carries the IC device 90 subjected to the inspection by the inspection unit 16 and conveys the IC device to the device collection area a 4. The electronic component collecting section 18 is capable of reciprocating between the inspection area A3 and the device collecting area a4 in the X-axis direction. In the configuration shown in fig. 2, two electronic component collecting units 18 are arranged in the Y-axis direction, similarly to the electronic component supplying unit 14. The IC device 90 on the inspection unit 16 is carried and placed by any of the electronic component collection units 18. Then, the conveyance is performed by the measurement robot 17.

As shown in fig. 4, the placement portion 181 is formed in a concave shape that is open upward, and has a shape in which the cross-sectional area thereof decreases toward the bottom surface. The placement portion 181 having such a shape is composed of a bottom surface and four inclined side surfaces. Such a side surface of the mounting portion 181 functions as a guide surface for guiding the IC device 90 to the mounting portion 181 when the IC device 90 is mounted. This makes it possible to easily mount the IC device 90 on the mounting portion 181.

On the surfaces (side surfaces and bottom surface) constituting the mounting portion 181, an antireflection process is performed to reduce the reflection on the surfaces. Thus, when the electronic component mounting unit 2 is imaged by the imaging device 51 included in the mounting unit image acquiring unit 50, which will be described later, it is possible to suppress the incidence of unnecessary light onto the imaging element (not shown) included in the imaging device 51. Therefore, a clearer image can be obtained by the imaging device 51 described later.

The antireflection treatment is not particularly limited, and examples thereof include formation of an antireflection film, roughening treatment (treatment for increasing light scattering), and black treatment (treatment for increasing light absorption).

(device recovery region)

As shown in fig. 2, the device recovery area a4 is an area where the IC device 90 whose inspection is finished is recovered. The component collecting area a4 is provided with a collecting tray 19, a collecting robot 20, and a collecting empty tray conveyance mechanism 21. Three empty trays 200 are also prepared in the component collecting area a 4.

The recovery tray 19 is an electronic component mounting part 2 on which the IC device 90 is mounted. The recovery tray 19 is fixed in the device recovery area a4, and in the configuration shown in fig. 2, three trays are arranged in parallel in the X-axis direction. The empty tray 200 is also the electronic component mounting part 2 on which the IC device 90 is mounted, and three trays are arranged in parallel in the X-axis direction. The IC device 90 moved to the electronic component collecting section 18 in the device collecting area a4 is carried and placed by any of the collecting tray 19 and the empty tray 200. Thereby, the IC devices 90 are collected and distinguished (sorted) for each inspection result. The IC devices 90 are distinguished from each other by the recovery robot 20 based on the inspection result. The recovery robot 20 distinguishes the IC devices 90 by a command from the control device 30 described later.

The recovery robot 20 is a transfer unit that transfers the IC devices 90, and is supported in the device recovery area a4 so as to be movable in the X-axis direction, the Y-axis direction, and the Z-axis direction. The collection robot 20 can transfer the IC devices 90 from the electronic component collection unit 18 to the collection tray 19 and the empty tray 200. The collection robot 200 includes a plurality of gripping portions (not shown) for gripping the IC devices 90. Each of the holding portions has a suction nozzle and can hold the IC device 90 by suction.

The recovered empty tray conveying mechanism 21 is a conveying part (conveying mechanism) that conveys the empty tray 200 carried in from the tray removal area a5 in the X direction. After the conveyance, the empty tray 200 is assigned to a position where the IC device 90 is collected, that is, any one of the three empty trays 200.

(tray removal region)

The tray removal area a5 is an area where the tray 200 in which the plurality of IC devices 90 in the inspection completed state are arranged is collected and removed. A plurality of trays 200 can be stacked in the tray removal area a 5.

Tray conveyance mechanisms

22A and 22B that convey one tray 200 at a time are provided so as to straddle device collection area a4 and tray removal area a 5. Tray conveyance mechanism 22A conveys tray 200 on which IC devices 90 that have been inspected are mounted from device collection area a4 to tray removal area a 5. The tray conveyance mechanism 22B conveys the tray 200 for collecting the holes of the IC devices 90 from the tray removal area a5 to the device collection area a 4.

In each of the above-described regions a1-a5, the first chamber R1, the second chamber R2, and the third chamber R3 are provided with a temperature sensor (thermometer) for detecting the temperature in the chamber, a humidity sensor (hygrometer) for detecting the humidity (relative humidity) in the chamber, and an oxygen concentration sensor (oxygen concentration meter) for detecting the oxygen concentration in the chamber, which are not shown. In the present embodiment, the temperature sensor, the humidity sensor, and the oxygen concentration sensor are provided in each of the first chamber R1, the second chamber R2, and the third chamber R3, but the locations where the temperature sensor, the humidity sensor, and the oxygen concentration sensor are provided are arbitrary.

Although not shown, the inspection apparatus 1 includes a dry air supply mechanism. The dry air supply mechanism is configured to be able to supply a gas such as air or nitrogen having a low humidity (hereinafter, also referred to as dry air) to the first chamber R1, the second chamber R2, and the third chamber R3. Therefore, by supplying dry air as needed, condensation and freezing (freezing) of the IC device 90 can be prevented.

In the above embodiment, the inspection apparatus 1 is configured to be capable of performing an inspection in a normal temperature environment, a low temperature environment, and a high temperature environment, but is not limited to this, and may be configured to perform an inspection in at least one of the three environments. For example, the configuration for use in a low-temperature environment such as a shutter, a hygrometer, an oxygen concentration meter, and dry air may not be included.

(control device)

As shown in fig. 3, the control device 30 has a function of controlling each part of the inspection apparatus 1, and includes a control unit 31 and a storage unit 32.

The control Unit 31 is configured to include, for example, a CPU (Central Processing Unit), and includes a drive control Unit 311, an inspection control Unit 312, an imaging control Unit 313, and a sample image creating Unit 314. The storage unit 32 is configured to include, for example, a ROM (read only Memory) and a RAM (random access Memory).

The drive control unit 311 controls the drive and the like of the respective units (

tray conveying mechanisms

11A, 11B, temperature adjustment unit 12, supply robot 13, supply empty tray conveying mechanism 15, electronic component supply unit 14, inspection unit 16, measurement robot 17, electronic component collection unit 18, collection robot 20, collection empty tray conveying mechanism 21, and

tray conveying mechanisms

22A, 22B).

The inspection control unit 312 can also perform, for example, inspection of the IC device 90 disposed in the inspection unit 16 based on a program (software) stored in the storage unit 32.

The imaging control unit 313 controls the driving of the placement unit image acquisition unit 50. The imaging control unit 313 processes the signal from the imaging device 51, and converts the image of the electronic component mounting unit 2 acquired by the mounting unit image acquiring unit 50 into data (generates image data).

The sample image creating unit 314 creates a sample image of the electronic component mounting unit 2 based on the image data. The sample image creating unit 314 adjusts the brightness of the sample image. The sample image creating unit 314 adjusts the clipping position of the sample image with respect to the image data. The sample image creating unit 314 adjusts at least one of the brightness of the sample image and the position of the sample image captured from the image data.

The sample image creating unit 314 displays the luminance of the pixels and the number of pixels in the image on the display unit 41 based on the image pickup signal of the image pickup device 51. In this way, the luminance of the image can be easily adjusted by comparing the luminance value of the entire image based on the luminance with a predetermined threshold value (luminance value), and the luminance value can be easily confirmed, which is very convenient for the luminance adjustment.

The sample image creating unit 314 automatically adjusts the brightness of the sample image based on the brightness of the pixels in the image and the number of pixels. In this way, the brightness can be automatically controlled.

The sample image creating unit 314 digitizes the brightness of the pixels in the image and the number of pixels. In this case, the luminance can be automatically controlled easily.

The digitization is to create a histogram in which the luminance of pixels in an image is plotted on the horizontal axis, which is the first axis, and the number of pixels is plotted on the vertical axis, which is the second axis. In this case, by using a known histogram and generating a numerical value by the sample image creating unit 314, the sample image creating unit 314 can be easily configured and an appropriate numerical value can be generated.

The sample image creating unit 314 displays the histogram on the display unit 41. In this case, the tendency of luminance can be easily grasped by displaying the histogram.

The sample image creating unit 314 adjusts the brightness of the sample image using the brightness adjustment parameter input from the operation unit (input unit) 42. In this case, the value of the adjusted brightness can be easily controlled.

The adjustment of the clipping position of the sample image is adjusted by subjecting the image data of the captured image of the imaging device 51 to differential processing. In this case, the enhancement processing can be easily performed by performing the differentiation processing on the image and creating the image.

The control unit 31 has a function of displaying the driving of each unit, the inspection result, the image data, and the like on the display unit 41, a function of performing processing in accordance with an input from the operation unit 42, and the like.

The storage unit 32 stores programs and data for the control unit 31 to perform various processes.

(setting display part)

As shown in fig. 1 and 3, the setting display unit 40 includes a display unit 41 and an operation unit 42.

The display unit 41 includes a monitor 411 for displaying the driving of each unit, the inspection result, and the like. The monitor 411 may be formed of a liquid crystal display panel, a display panel such as an organic EL, or the like. The operator can set and confirm various processes, conditions, and the like of the inspection apparatus 1 via the monitor 411.

The operation unit 42 is an input device such as a mouse 421, and outputs an operation signal corresponding to an operation by an operator to the control unit 31. Therefore, the operator can instruct the control unit 31 to perform various processes using the mouse 421.

In the present embodiment, the mouse 421 is used as the operation unit 42, but the operation unit 42 is not limited to this, and may be an input device such as a keyboard, a trackball, or a touch panel.

(mounting part image acquisition part)

The mounting portion image acquiring unit 50 has a function of acquiring an image of the electronic component mounting portion 2. As shown in fig. 2, the mount image acquiring unit 50 is provided in the tray supply area a2 and the component collecting area a4 on the supply robot 13 and the collecting robot 20. That is, the mounting portion image acquiring unit 50 is provided at a position where an image of the electronic component mounting portion 2 can be acquired.

The placing section image acquiring unit 50 includes a first placing section image acquiring unit 50a and a second placing section image acquiring unit 50 b. The first mounting portion image acquiring unit 50a and the second mounting portion image acquiring unit 50b are disposed above the electronic component mounting portion 2.

In the present embodiment, when the first placing portion image acquiring unit 50a and the second placing portion image acquiring unit 50b are used as one placing portion image acquiring unit 50, the number of the placing portion image acquiring units 50 is two, but the number of the placing portion image acquiring units 50 is not limited to this, and may be any.

The placement-portion image acquiring unit 50 is supported by the supply robot 13 and the recovery robot 20 so as to be disposed above the electronic component placement portion 2. Thus, the placement portion image acquisition unit 50 can acquire an image of the upper surface 911 of the electronic component placement portion 2 from vertically above the electronic component placement portion 2.

The first mounting portion image acquiring unit 50a and the second mounting portion image acquiring unit 50b have an imaging device 51 and an illumination device 52, respectively. The illumination device 52 may be not only continuous illumination but also intermittent intense light (flash) as long as the exposure time can be controlled.

The imaging device 51 includes an imaging element that receives light from the electronic component mounting unit 2 and converts the light into an electrical signal. The imaging Device 51 is not particularly limited, and examples of the imaging element include a camera (CCD camera) using a CCD (charge coupled Device) image sensor, a camera using a CMOS (Complementary Metal Oxide Semiconductor) image sensor, and an electronic camera (digital camera) such as a camera using a MOS image sensor. Further, by analyzing the image data by using, for example, a differential interference method, a fourier transform method, or the like, it is possible to enhance a fine shape and a shape which is difficult to see, and it is possible to improve the shape detection sensitivity. Also, fine damage and damage that is difficult to see can be enhanced, so that the damage detection sensitivity can be improved.

The imaging device 51 is configured such that the imaging area is substantially equal to or larger than the size of the upper surface 911 of the electronic component mounting part 2.

Although not shown, the image pickup device 51 preferably includes an optical system such as an optical lens or an autofocus mechanism. Thus, for example, even when the electronic component mounting unit 2 has a different height from the imaging device, a clear image can be obtained.

The illumination device 52 is a light source device that is driven to irradiate the electronic component mounting unit 2 with light when the imaging device 51 performs imaging of the electronic component mounting unit 2. The illumination device 52 can suppress an image from becoming dark due to insufficient light quantity, and can obtain a clearer image.

In the present embodiment, the illumination device 52 has an annular shape and is disposed around the imaging device 51. This allows the electronic component mounting part 2 to be uniformly irradiated with light. The shape and arrangement of the illumination device 52 are not limited to the above configuration.

The mounting portion image acquiring unit 50 configured as described above irradiates the electronic component mounting portion 2 with light by the illuminating device 52, and captures an image of the electronic component mounting portion 2 by the imaging device 51. The signal from the imaging device 51 is received in the imaging control unit 313. The imaging control unit 313 processes a signal from the imaging device 51 to generate two-dimensional image data of the image of the electronic component mounting unit 2.

Further, three-dimensional image data may be generated using the image of the electronic component mounting unit 2 acquired by the mounting unit image acquiring unit 50. In this case, for example, although not shown, two or more (for example, three) mounting unit image acquiring units 50 may be provided for one arrangement row.

(examples)

The following describes a series of operations of the inspection apparatus 1 configured as described above, and an acquisition of an image of the electronic component mounting unit 2.

An example of the flow of automatic registration of a sample image in the sample image creating unit 314 will be described below.

The sample image creating unit 314 according to the present embodiment automatically creates a sample image. The sample image creating unit 314 automatically performs the operations of "brightness adjustment" and "clipping of the sample image".

First, in step S10, the imaging control unit 313 moves the mounting unit image acquiring unit 50 above the electronic component mounting unit 2.

Next, in step S20, the sample image creating unit 314 adjusts the brightness of the image of the electronic component mounting unit 2.

Next, in step S30, the sample image creating unit 314 determines a sample image region of the image of the electronic component mounting unit 2.

Next, in step S40, the sample image creating unit 314 captures and registers the sample image of the electronic component mounting unit 2. Then, the automatic registration of the sample image is ended.

An example of the processing of "brightness adjustment" in step S20 will be described below.

The sample image creating unit 314 digitizes the brightness of the pixels in the image and the number of pixels. In this case, the luminance can be automatically controlled easily. The sample image creating unit 314 determines an appropriate setting value from the luminance distribution in the captured image in the automation of the "luminance adjustment". At this time, the adjusted setting time is exposure time, shutter speed, illumination brightness, aperture, illumination lighting time, and the like. Further, the lighting time may be adjusted when flashing is used.

First, in step S210, the mounting portion image acquiring unit 50 images the electronic component mounting portion 2.

Next, in step S220, the sample image creating unit 314 creates a luminance distribution of the image of the electronic component mounting unit 2.

The digitization is to create a histogram in which the luminance of pixels in an image is plotted on the horizontal axis (first axis) and the number of pixels is plotted on the vertical axis (second axis). In this case, by using a known histogram and generating a numerical value by the sample image creating unit 314, the sample image creating unit 314 can be easily configured and an appropriate numerical value can be generated.

Next, in step S230, the sample image creating unit 314 determines an appropriate luminance. The distribution of the histogram is evaluated to determine the brightness.

As shown in the lower graph of fig. 7, when the right end of the distribution in the histogram 70 is located on the right side of the reference value, it is determined that the image is bright. If it is bright, the process proceeds to step S240.

As shown in the upper diagram of fig. 7, when the right end of the distribution in the histogram 74 is located on the left side of the reference value, it is determined that the image is dark. In the case of darkness, the process proceeds to step S250.

Next, in step S240, the sample image creating unit 314 darkens the pixels in the image (shortens the exposure time). The distribution is contained within a predetermined reference value. Specifically, the distribution of the histogram 70 is reduced and is contained within the reference value so as to be the distribution of the histogram 72.

Next, in step S250, the sample image creating unit 314 brightens the pixels in the image (increases the exposure time). The distribution is contained within a predetermined reference value. Specifically, the distribution of the histogram 74 is enlarged, and the histogram is fully contained within the reference value so as to be the distribution of the histogram 72.

And then back.

An example of the process of "sample image area determination" in step S30 will be described below.

The adjustment of the clipping position of the sample image is adjusted by subjecting the image data of the captured image of the imaging device 51 to differential processing. In this case, the enhancement processing can be easily performed by performing the differentiation processing on the image and creating the image. In automation of the "clipping of the sample image", a sample image area in the captured image is determined based on the sizes of the IC device 90 and the electronic component mounting part 2, and the image is clipped. Features within the image (symmetry) are also utilized in the determination of the sample image area. The adjustment of the clipping position of the sample image is determined by confirming the edge in the image.

For example, the confirmation is performed by the following method.

First, in step S310, the sample image creating unit 314 determines a provisional sample image region of the image of the electronic component mounting unit 2, the image center is larger than the size of the electronic component mounting unit 2, a differential image of the image is created, edges are extracted, and an extraction frame (electronic component mounting unit size + α) is determined based on the size of the electronic component mounting unit 2.

Next, in step S320, the sample image creating unit 314 performs symmetry evaluation of the sample image while changing the temporary sample image region in the vertical and horizontal directions.

For example, the sample image creating unit 314 calculates the rotational symmetry of the sample image. The sample image creating unit 314 cuts out the sample image. The sample image creating unit 314 extracts the area of the edge portion of the sample image. The sample image creating unit 314 enlarges the capture frame, and repeats capturing of the sample image and extraction of the area of the edge portion (up to a predetermined maximum value).

Next, in step S330, the sample image creating unit 314 sets the position with the highest symmetry as the sample image region. The sample image creating unit 314 regards the position with high symmetry as the center of the sample image. The sample image creating unit 314 determines an optimum edge position from the distribution of the capture frame and the edge area, and determines a capture position of the sample image. The most suitable edge position is determined using, for example, the magnitude of edge area saturation or an edge area above a certain threshold. And then back.

An example of the flow of the plurality of times of processing performed when the sample image creating unit 314 automatically registers the sample image will be described below.

In the registration processing of the sample image in fig. 5, a more appropriate sample image can be obtained by performing the processing a plurality of times. In order to obtain a more appropriate sample image, "brightness adjustment" and "clipping of the sample image" are repeated a plurality of times.

Next, in step S30, the sample image creating unit 314 determines a sample image area of the electronic component mounting unit 2.

Next, in step S32, the imaging control unit 313 moves the mounting unit image acquiring unit 50 to a position where the sample image area of the electronic component mounting unit 2 can be imaged at the center.

Next, in step S34, the sample image creating unit 314 adjusts the brightness in the sample image region of the electronic component mounting unit 2 to be more suitable.

Next, in step S36, the sample image creating unit 314 determines a sample image area of the electronic component mounting unit 2. This enables the use of the sample image of the electronic component mounting unit 2 captured at the center of the mounting unit image acquiring unit 50.

As described above, in the inspection apparatus 1, the mounting unit image acquiring unit 50 acquires an image of the electronic component mounting unit 2.

According to the present embodiment, at least one of the brightness of the sample image and the position of the sample image cut with respect to the image can be adjusted. This makes it possible to obtain an optimal sample image. As a result, the conveying device 10 and the inspection device 1 that can realize high-precision conveyance by correcting the conveying position can be provided.

Further, the most appropriate registration can be performed without depending on the operator. The burden on the registration operator is reduced.

(second embodiment)

The present embodiment will be described below, but differences from the first embodiment will be mainly described, and descriptions of the same matters will be omitted.

The conveying device 10 according to the present embodiment includes a supply conveyance correction setting screen (sample image display setting unit) 80, and the supply conveyance correction setting screen 80 is capable of displaying setting information of a sample image of the electronic component mounting unit 2 based on an image and includes a sample automatic registration button (instruction receiving unit) 82 capable of receiving an instruction to automatically register the sample image.

The supply conveyance correction setting screen 80 includes a detection recess selection button (electronic component mounting portion selection portion) 84 that can select the electronic component mounting portion 2. The operator (operator) selects the electronic component mounting part 2 by using the detection recess selection button 84. The automatic registration of the sample image is performed by an operator (operator) selecting the sample automatic registration button 82. When the sample automatic registration button 82 is selected, the sample image creating unit 314 automatically adjusts at least one of the brightness of the sample image and the position of the sample image captured from the image.

The operator (operator) operates the operation unit 42 by, for example, operating the mouse 421 to move a cursor to a position of each operation button (icon) displayed on the display unit 41 and to make a selection (click).

Some or all of the operation buttons displayed on the display unit 41 may be provided as mechanical operation buttons such as push buttons.

Fig. 11 is a flowchart showing the process of automatically registering a sample image according to the present embodiment.

First, in step S50, the sample image creating unit 314 registers the sample image of the tray 200 (electronic component mounting unit 2) (see fig. 5 and 9).

Next, in step S60, the sample image creating unit 314 registers the sample image of the electronic component supply unit 14 (electronic component mounting unit 2) (see fig. 5 and 9).

Next, in step S70, the sample image creating unit 314 registers the sample image of the temperature adjustment unit 12 (electronic component mounting unit 2) (see fig. 5 and 9).

Next, in step S80, the sample image creating unit 314 registers a sample image of a rotary stage (not shown) (the electronic component mounting unit 2) (see fig. 5 and 9). Then, the automatic registration of the sample image is ended.

Fig. 12 is a diagram showing a sample image registration processing status screen for automatic registration of a sample image according to the present embodiment.

In the automatic registration, a sample registration processing status screen 86 showing that the sample (sample image) of the supply shuttle (electronic component supply section 14) is being registered is displayed.

(modification example)

The mounting-unit image acquiring unit 50 may be supported by the support unit 60 so as to be disposed above the electronic component mounting unit 2. Thus, the placement portion image acquisition unit 50 can acquire information on the state of the upper surface 911 of the electronic component placement portion 2 from vertically above the electronic component placement portion 2. The support portion 60 is attached to, for example, a support leg (not shown) that supports the inspection unit 16 or the measurement robot 17.

Fig. 13 is a schematic side view showing a mount image acquiring unit 50 according to a modification.

As shown in fig. 13, the placement portion image acquiring unit 50 may be supported by the measurement robot 17 so as to be disposed above the electronic component placement portion 2. Thus, the placement portion image acquiring unit 50 can acquire an image of the inspection portion 16 from vertically above the inspection portion 16.

In the above description, the mounting portion image acquiring unit 50 captures one electronic component mounting portion 2 by one shot, but a plurality of electronic component mounting portions 2 may be captured by one shot. The mounting unit image acquiring unit 50 may divide one electronic component mounting unit 2 into a plurality of parts and take an image. The number of divisions in this case is not particularly limited, and may be set as appropriate according to various conditions such as the performance of the imaging device 51, and preferably as large as possible. This enables the image to be acquired with higher accuracy than in the case where the image of the electronic component mounting unit 2 is acquired in a lump.

Although the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention have been described above based on the illustrated embodiments, the present invention is not limited thereto, and the configurations of the respective parts may be replaced with any configurations having the same functions. Further, other arbitrary configurations may be added to the present invention.

For example, in the above-described embodiment, the placement portion image acquisition unit 50 includes the imaging device 51 and the illumination device 52, but the configuration of the placement portion image acquisition unit 50 is not limited to this. For example, the mounting unit image acquiring unit 50 may be a device that irradiates laser light onto the surface of the electronic component, scans the laser light, and receives the laser light reflected by the surface.

Further, in the above-described embodiment, the placement portion image acquisition unit 50 is configured to image the upper surface of the electronic component placement portion 2 in the vertical direction, but is not limited to this, and for example, the placement portion image acquisition unit 50 may be configured to be capable of imaging the back surface, the side surface, and the like of the electronic component.

Claims

1. An electronic component conveying device is characterized by comprising:

an electronic component mounting part on which an electronic component can be mounted;

an imaging unit capable of imaging an image of the electronic component mounting unit;

a sample image display setting unit that can display setting information of a sample image of the electronic component mounting unit based on the image and has an instruction accepting unit that can accept an instruction for automatic registration of the sample image, the sample image display setting unit having an electronic component mounting unit selecting unit that can select the electronic component mounting unit, and when instructed by the instruction accepting unit, can automatically adjust at least one of a brightness of the sample image and a position where the sample image is captured with respect to the image; and

and a sample image creation unit capable of creating a sample image of the electronic component placement unit based on the image.

2. The electronic component carrier device according to claim 1, wherein the electronic component carrier device further comprises a plurality of holding members,

the sample image creating unit automatically adjusts the brightness of the sample image based on the brightness of the pixels in the image and the number of pixels.

3. The electronic component carrier device according to claim 1, wherein the electronic component carrier device further comprises a plurality of holding members,

the electronic component conveying device is provided with an input part for inputting a brightness adjusting parameter,

the sample image creating unit adjusts the brightness of the sample image using the input brightness adjustment parameter.

4. The electronic component carrier device according to any one of claims 1 to 3,

the adjustment of the cut-out position of the sample image is performed by performing differential processing on the image data of the image captured by the imaging unit.

5. The electronic component carrier device according to any one of claims 1 to 3,

the electronic component conveying device is provided with a display part,

the sample image creating unit displays the brightness of the pixels and the number of pixels in the image on the display unit based on the image pickup signal of the image pickup unit.

6. The electronic component carrier device according to any one of claims 1 to 3,

the sample image creating unit digitizes the brightness of the pixels in the image and the number of pixels.

7. The electronic component carrier device according to claim 6, wherein the electronic component carrier device further comprises a plurality of holding members,

the digitizing is a histogram in which the luminance of pixels in the image is defined as a first axis and the number of pixels is defined as a second axis orthogonal to the first axis.

8. The electronic component carrier device according to claim 7,

the sample image creating unit displays the histogram on the display unit.

9. An electronic component conveying device is characterized by comprising:

an imaging unit capable of imaging an image of the electronic component mounting unit; and

a sample image display setting unit capable of displaying setting information of a sample image of the electronic component mounting unit based on the image, and having an instruction receiving unit capable of receiving an instruction for automatic registration of the sample image,

the sample image display setting section has an electronic component mounting portion selection section that can select the electronic component mounting portion,

when instructed by the instruction accepting unit, at least one of the brightness of the sample image and the position of the sample image captured from the image can be automatically adjusted.

10. An electronic component inspection apparatus, comprising:

a sample image display setting unit that can display setting information of a sample image of the electronic component mounting unit based on the image and has an instruction accepting unit that can accept an instruction for automatic registration of the sample image, the sample image display setting unit having an electronic component mounting unit selecting unit that can select the electronic component mounting unit, and when instructed by the instruction accepting unit, can automatically adjust at least one of a brightness of the sample image and a position where the sample image is captured with respect to the image;

a sample image creating unit capable of creating a sample image of the electronic component mounting unit based on the image; and

an inspection unit that inspects the electronic component.