JP6754206B2 - Light emitting device - Google Patents

Description

The present invention relates to a light emitting device using an LED element as a light emitting element.

Conventionally, as an issue of a light emitting device including an LED element and a phosphor, improvement of heat dissipation of the LED element has been mentioned.

As an example of the structure of the light emitting device that solves such a conventional problem, the one described in Patent Document 1 below can be mentioned. The conventional light emitting device described in Patent Document 1 includes a lead frame which is an electrode member insert-molded in a resin package, and an LED element is mounted on the front surface (upper surface side of a representative drawing) of the lead frame. The lead frame is extended to the outer surface of the package, and heat is released from the lead frame to the outside to improve heat dissipation from the LED element. Further, the lid member, which is a wavelength conversion member containing a phosphor, is arranged above the LED element in the opening of the package in which the resin is molded, and is caulked and fixed by the resin.

Japanese Unexamined Patent Publication No. 2004-335740 (page 4, FIG. 1)

However, in the conventional light emitting device described in Reference 1, when the excitation heat of the wavelength conversion member also increases due to the increase in the brightness of the LED element, the method of fixing the wavelength conversion member is caulking and fixing with a resin having low thermal conductivity. Therefore, the wavelength conversion member cannot release the excitation heat and becomes high in temperature. In this way, the wavelength conversion member described in Cited Document 1 has a problem that the light conversion efficiency is lowered.

Further, in the conventional light emitting device, when the wavelength conversion member is crimped and fixed, a convex portion of the resin is formed in the crimped region. As a result, if a translucent member such as a lens is to be placed closely on the wavelength conversion member, a translucent member having a complicated structure must be created in consideration of the shape of the convex portion formed in the crimped region. There was also the problem of not being.

Therefore, an object of the present invention is to positively dissipate heat from the wavelength conversion member in a light emitting device in which the wavelength conversion member is caulked and fixed, and to transmit light having a simple structure in which the upper surface and the lower surface of the wavelength conversion member are planar. It is an object of the present invention to provide a light emitting device capable of closely arranging optical members.

The light emitting device of the present invention adopts the following configuration in order to achieve the above object.

The light emitting device of the present invention is arranged on an LED element mounted on a substrate, a metal frame having a rectangular shape in a plan view arranged so as to surround the LED element, a step portion formed inside the metal frame , and a step portion. The wavelength conversion member includes a flat plate-shaped wavelength conversion member, the wavelength conversion member is provided with a notch having a slope shape at the upper end portion, and the metal frame is formed so as to cut out the four corners of the rectangle. It has a mold engaging part and an upright part provided at a location corresponding to the notch, and the notch of the wavelength conversion part is formed by the deformed part due to the plastic deformation of the upright part when a force is applied to the metal frame. fixed by caulking, and a height from the lower surface of the substrate to the upper surface of the wavelength converting portion, the height from the lower surface of the substrate to the upper surface of the metal frame and wherein the same as a Turkey.

Further, in the metal frame , the mold engaging portion may have an L-shaped notch in a plan view, and the metal frame may have an upright portion on the outside of the stepped portion and a notch on the upper corner of the upright portion.

Further, a translucent member having a flat lower surface and closely arranged on the upper surface of the metal frame and the wavelength conversion member may be provided.

Further, the translucent member may be a lens.

Since the wavelength conversion member is directly caulked and fixed to a metal frame having high thermal conductivity, heat dissipation from the wavelength conversion member is improved. This has the effect of increasing the light conversion efficiency of the wavelength conversion member.
Further, by making the height from the lower surface of the substrate to the upper surface of the wavelength conversion member the same as the height from the lower surface of the substrate to the upper surface of the metal frame, the lower surface is said to be flat on the wavelength conversion member and the metal frame. There is also an effect that the translucent members having a simple shape can be easily arranged in close contact with each other.

It is a main part perspective view of the embodiment of the light emitting device of this invention. It is sectional drawing of embodiment of the light emitting device of this invention. It is sectional drawing which provided the lens of embodiment of the light emitting device of this invention. In each embodiment of the present invention, the arrangement of the metal frame before deformation and the wavelength conversion member inside the metal frame is shown, (a) is a perspective view, and (b) is a sectional view. An example of the upper mold of the mold for deforming the metal frame is shown, (a) is a perspective view of the lower surface side thereof, and (b) is a perspective view of the upper surface side thereof. The state before and after the deformation of the metal frame is shown together with the upper mold, (a) is a perspective view immediately before the deformation, (b) is a sectional view thereof, (c) is a perspective view after the deformation is completed, and (d) is a sectional view thereof. is there.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Explanation of structure Fig. 1 to Fig. 3>
The external structure of the light emitting device according to the present embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a perspective view of a main part showing only the metal frame 3 and the wavelength conversion member 4, and the description of other members is omitted. FIG. 2 is a cross-sectional view of the light emitting device according to the present embodiment.

As shown in FIGS. 1 and 2, in the present embodiment, the wavelength conversion member 4 is arranged on the upper surface of the light emitting device 10, and all the peripheral edges are fixed by the metal frame 3. The substrate 2 is formed of an exposed electrode surface mainly made of a metal or ceramic material, and a plurality of LED elements 1 and an electrode surface (not shown) are electrically bonded. Here, the heat generated when the LED element 1 emits light is dissipated to the surroundings via the substrate 2, but the configuration is not limited to this, and for example, the conventional example described in Patent Document 1 or other It may be like a conventional example not described.

The metal frame 3 is arranged on the substrate 2 and surrounds the metal frame 3 so as to accommodate a plurality of LED elements 1. The metal frame 3 is formed of a metal material that deforms relatively easily, has high plasticity, and has excellent thermal conductivity, for example, a material such as aluminum or copper. The metal frame 3 has a step portion 3a in the inner region, and a peripheral edge portion of the lower surface of the wavelength conversion member 4 is placed on the upper surface of the step portion 3a.

The wavelength conversion member 4 is a flat plate-shaped member in which phosphors are dispersed and arranged in a transparent base material. Its planar shape is square in this example and has a thick plate shape. The material of the base material is preferably made of translucent ceramics or glass material rather than translucent resin from the viewpoint of translucency, thermal conductivity and heat resistance. This phosphor is excited by the light of the LED element 1 that emits blue light or ultraviolet light, and emits light having a wavelength different from that of the LED element 1. As a result, by mixing the light of the LED element and the colors of a plurality of phosphors, it is possible to have a color rendering effect different from the original emission color of the LED element 1, such as turning white light.

Further, the wavelength conversion unit 4 includes a notch portion 4a at the peripheral end portion. As shown in FIG. 2, the cutout portion 4a in the present embodiment is formed so that the side surface of the wavelength conversion member 4 has a slope shape. The cutouts 4a are formed on four side surfaces excluding the upper surface and the lower surface of the wavelength conversion member, whereby the shape of the wavelength conversion member 4 is a weight platform shape in which the cross-sectional area gradually decreases from the lower surface to the upper surface. It has become. The cutout portion 4a is plastically deformed by applying a force to a part of the metal of the metal frame 3, and is caulked and fixed by the deformed portion 3d protruding inside the metal frame 3. In this way, the wavelength conversion member 4 is fixed to the stepped portion 3a of the metal frame 3.

Further, the metal of the metal frame 3 crimps only the notch 4a of the wavelength conversion unit to prevent the metal from reaching the upper surface of the wavelength conversion member 4, so that the metal does not reach the upper surface of the wavelength conversion member 4 from the lower surface of the substrate 2 to the upper surface of the wavelength conversion member 4. The height from the lower surface of the substrate 2 to the upper surface of the metal frame 3 can be made substantially the same.

With such a configuration, as shown in FIG. 3, when the front translucent member 5 having a flat lower surface is arranged on the upper surfaces of the metal frame 3 and the wavelength conversion member 4, the metal frame 3 and The wavelength conversion member 4 and the front translucent member 5 can be arranged in close contact with each other. In the present embodiment, a convex lens having a flat lower surface is used for the front translucent member 5, but if the lower surface is a flat optical member, another configuration (prism including a plate-shaped member) is used. You may.

<Action of the embodiment>
The excitation heat generated by the wavelength conversion member 4 is directly transferred from the notch 4a to the metal frame 3 by heat conduction without using a resin such as an adhesive, so that the heat is effectively dissipated to the outside. Further, since the heights of the upper surface of the metal frame 3 and the upper surface of the wavelength conversion member 4 are substantially the same, the front surface having a flat lower surface on the metal frame 3 and the wavelength conversion member 4 has a simple structure. The translucent member 5 can be arranged in close contact with each other.

<Effect of embodiment>
In this way, according to the configuration of the present embodiment, the excitation heat generated by the wavelength conversion member 4 is effectively dissipated to the metal frame 3, thereby reducing the temperature quenching of the phosphor and the wavelength conversion member. The luminous efficiency of 4 can be increased. Further, by arranging the front translucent member 5 having a flat lower surface in close contact with the metal frame 3 and the wavelength conversion member 4, the wavelength conversion member 4 passes through the front translucent member 5 and the metal frame 3 is placed. It is possible to form a new heat dissipation path leading to. As a result, the excitation heat can be further dissipated, so that the luminous efficiency of the wavelength conversion member 4 is further increased. Further, if the front translucent member 5 is an optical member such as a convex lens as in the present embodiment, the lower surface of the front translucent member can have a simple planar shape, which facilitates optical design, and as a result, is desired. It becomes easier to obtain the optical effect.

Next, a method of manufacturing the light emitting device according to the present embodiment will be described.
The method of manufacturing the light emitting device is as follows: Step 1: A step of arranging the LED element and the frame on the substrate, Step 2: A step of placing the wavelength conversion member on the stepped portion of the frame, and Step 3: Wavelength conversion member. It is composed of a process of caulking and fixing. Of these, with respect to step 1, any conventionally known method may be used, and since it is not a main part of the present invention, the description thereof will be omitted. Hereinafter, a specific manufacturing method for caulking and fixing the wavelength conversion member 4 to the metal frame 3 from the steps 2 and 3 will be described.

<Step 2: Step of placing the wavelength conversion member on the stepped portion of the frame body Fig. 4>
4A and 4B are views showing the arrangement relationship between the metal frame 13 and the wavelength deforming member 4 before being caulked, where FIG. 4A is a perspective view and FIG. 4B is a cross-sectional view. The metal frame 13 before being crimped is provided with an upright portion 13b on the outside of the step portion 3a. The wavelength conversion member 4 is placed on the stepped portion 3a so that the slope shape of the cutout portion 4a faces upward. The height from the step portion 3a to the upper surface of the upright portion 13b is set to be larger than the height to the upper surface of the wavelength conversion member 4. Further, the upper corner portion of the upright portion 13b on each side is provided with a notch portion 13c to form a slope shape, and the mold engaging portion 3e is provided at the four corners of the metal frame 3.

<Mold Figure 5>
Next, a mold for caulking and fixing will be described.
FIG. 5 shows an upper mold of a mold used for fixing the wavelength conversion member 4 to the metal frame 3 as shown in FIGS. 1 to 3 by caulking the upright portion 13b of the metal frame 13 before being crimped. It is a figure which shows an example of 6th form. (A) is a perspective view of the lower surface side inverted to show the shape of the lower surface of the upper mold 6, and (b) is a perspective view of the upper surface side in the original orientation. 6a is an upper surface portion, 6b is a side surface portion, 6c is a ceiling portion on the lower surface side, 6d is a protruding portion, and 6e is a slope portion.

The mold consists of an upper mold and a lower mold. The lower mold has a square tubular shape with a bottom and an upright wall surface, and is fixed to a press machine, but is not shown. The tubular inner surface of the lower mold has dimensions suitable for the outer surface of the metal frame 13 and the side surface portion 6b of the upper mold before being crimped, and the upper mold 6 slides up and down inside the lower mold. Further, the slope portion 6e is formed so that the angle with respect to the horizontal plane is shallower than that of the cutout portion 13c of the metal frame 3 shown in FIG.

<Step 3: Step of caulking and fixing the wavelength conversion member FIG. 6>
6A and 6B are views showing the state before and after the deformation of the metal frame together with the upper mold, FIG. 6A is a state perspective view immediately before the deformation processing, FIG. 6B is a sectional view thereof, and FIG. 6C is a perspective view after the deformation processing is completed. , (D) is a cross-sectional view thereof.
At this time, the metal frame 13 before being caulked and fixed in FIGS. 6A and 6B is placed on the stepped portion 3a of the metal frame 13 before the wavelength conversion member 4 is caulked and fixed. It is placed on the bottom of a lower mold (not shown).
At this time, the square tubular lower mold flows only to the inside of the metal frame 13 before the metal of the upright portion 3b of the metal frame 3 is caulked and fixed, and prevents the metal frame 3 from protruding outward. Although not shown, the action is self-evident.

In FIGS. 6A and 6B, the ceiling portion 6c of the upper mold 6 has a planar shape and is placed on the upper surface of the upright portion 13b of the metal frame 13 before being crimped and fixed. As described above, since the upper surface of the upright portion 13b is higher than the upper surface of the wavelength conversion member, a predetermined amount of gap is formed between the upper surface of the wavelength conversion member 4 and the ceiling portion 6c. Further, the protruding end side of the protruding portion 6d is partially engaged with the mold engaging portion 13e of the metal frame 13 before being crimped and fixed.

In FIGS. 6 (c) and 6 (d), the metal frame 13 is placed before the upper surface portion 6a of the upper mold 6 is pressed by a press machine (not shown) and the tip of the protruding portion 6d of the upper mold 6 is crimped and fixed. The upper mold 6 is sunk until it comes into contact with the bottom surface of the lower mold. At this time, by adjusting the amount of metal above the wavelength conversion member in the upright portion of FIG. 6B, the ceiling portion 6c on the lower surface side of the upper mold 6 is brought into contact with the upper surface of the wavelength conversion member 4. Can be done. That is, the upright portion 13b shown in FIG. 6A is crushed by the ceiling portion 6c and protrudes inward of the metal frame to form a deformed portion 3d, and only the notch portion 4a of the wavelength conversion member 4 is caulked and fixed to form a corrugated metal frame. The height of the upper surface of 3 and the upper surface of the wavelength conversion member 4 can be the same.

At that time, excessive pressing can be prevented by having the protruding portion 6d.
Further, as described above, in the upper mold 6, both the slope portion 6e and the notch portion 13c of the metal frame 13 before being caulked and fixed have an inclined surface, and the slope portion 6e has a shallower angle with respect to the horizontal plane than the notch portion 13c. It is formed. As a result, the inclined portion 6e and the notched portion 13c both serve as guides, so that the corner portion of the wavelength conversion member 4 having less metal can be neatly crimped and fixed nearby.
The upright portion 13b of the metal frame 13 before being caulked and fixed so that the metal does not ride on the upper surface of the wavelength conversion member 4 and no unnecessary gap is formed when the upper mold 6 of the mold is fully lowered. Of course, the height, the shape / dimension of the cutout portion 13c, the protruding portion 6d of the upper die 6, and the shape / dimension of the slope portion 6e thereof are set. In this way, the caulking fixing of the wavelength conversion member 4 is completed.

<About other embodiments>
In the present embodiment, the cutout portion 4a of the wavelength conversion member 4 has a slope shape, but the cutout portion 4 may be formed as a step (staircase) shape instead of the slope shape. However, since the metal can be plastically deformed more smoothly in the slope shape than in the step shape, caulking and fixing can be performed more neatly.

Further, in the present embodiment, the upper surface of the wavelength conversion member 4 is square, but the present invention is not limited to this, and may be rectangular or circular. Further, the shape of the metal frame 3 may be arbitrarily changed according to the shape of the wavelength conversion member 4.
Further, in the present embodiment, all four sides of the wavelength conversion member 4 are crimped and fixed, but the present invention is not limited to this, and only a part of the wavelength conversion member 4 may be fixed, for example, only two facing sides are fixed.
Further, in the present embodiment, the front translucent member 5 is a convex lens, but the present invention is not limited to this, and is not limited to this, for example, an optical member such as another lens or a prism, or a transparent heat conductive member having no optical function. You may.

Further, in the present embodiment, the number of the LED elements 1 has been described as a plurality, but the number is not limited and may be one.
Further, the mounting method of the LED element is not particularly limited, and the electrode surface and the electrode of the LED element may be bonded by wire bonding after flip-chip mounting on the substrate or die bond mounting.

In addition, it is conceivable to give various changes to the material and shape of each member. The light emitting device may be configured by using a light emitting element other than the LED element.

1 LED element 2 Substrate 3 Metal frame 3a Step part 3d Deformed part 4 Wavelength conversion member 4a Notch part 5 Front translucent member 6 Mold 6a Top part 6b Side part 6c Ceiling part 6d Protruding part 6e Slope part 10 Light emitting device 13 Caulking Metal frame before fixing 13b Upright part 13c Notch part 13e Mold engaging part

Claims (4)

LED elements mounted on the board and
A rectangular metal frame in a plan view arranged so as to surround the LED element,
The stepped portion formed inside the metal frame and
A flat plate-shaped wavelength conversion member arranged at the step portion is provided.
The wavelength conversion member is provided with a notch having a slanted shape at the upper end portion thereof.
The metal frame has a mold engaging portion formed so as to cut out the four corners of the rectangle, and an upright portion provided at a portion corresponding to the cutout portion.
The notch portion of the wavelength conversion portion is caulked and fixed by the deformed portion due to the plastic deformation of the upright portion when a force is applied to the metal frame, and the height from the lower surface of the substrate to the upper surface of the wavelength conversion portion and the lower surface of the substrate. height of the upper surface of the metal frame from the light-emitting device comprising the same and a Turkey. The metal frame is characterized in that the mold engaging portion is an L-shaped notch in a plan view, and has an upright portion on the outside of the stepped portion and a notch on the upper corner of the upright portion. The light emitting device according to. The light emitting device according to claim 1 or 2, wherein the lower surface is flat and includes a translucent member arranged in close contact with the metal frame and the upper surface of the wavelength conversion member. The light emitting device according to claim 3, wherein the translucent member is a lens.

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