JPH10233532A - Light emitting diode - Google Patents
Light emitting diodeInfo
- Publication number
- JPH10233532A JPH10233532A JP9037427A JP3742797A JPH10233532A JP H10233532 A JPH10233532 A JP H10233532A JP 9037427 A JP9037427 A JP 9037427A JP 3742797 A JP3742797 A JP 3742797A JP H10233532 A JPH10233532 A JP H10233532A
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- chip
- light
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007789 gas Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 11
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 2
- 229910052754 neon Inorganic materials 0.000 claims description 2
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 claims description 2
- 238000002834 transmittance Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 30
- 239000000853 adhesive Substances 0.000 abstract description 9
- 230000001070 adhesive effect Effects 0.000 abstract description 9
- 230000006866 deterioration Effects 0.000 abstract description 6
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 22
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000000746 purification Methods 0.000 description 7
- 229920003002 synthetic resin Polymers 0.000 description 7
- 239000000057 synthetic resin Substances 0.000 description 7
- 230000001954 sterilising effect Effects 0.000 description 6
- 241000894006 Bacteria Species 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 3
- 230000000844 anti-bacterial effect Effects 0.000 description 3
- 238000004659 sterilization and disinfection Methods 0.000 description 3
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000001580 bacterial effect Effects 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052792 caesium Inorganic materials 0.000 description 1
- TVFDJXOCXUVLDH-UHFFFAOYSA-N caesium atom Chemical compound [Cs] TVFDJXOCXUVLDH-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000009982 effect on human Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、紫外線を含む光を
発光する発光ダイオードに関し、特に、紫外線を放出し
やすくして自ら放射する紫外線による劣化を抑制するこ
とができる発光ダイオードに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode that emits light containing ultraviolet light, and more particularly to a light emitting diode that can easily emit ultraviolet light and can suppress deterioration due to ultraviolet light emitted by itself.
【０００２】[0002]
【従来の技術】従来、一般に、紫外線を含む光を発光す
る発光ダイオードとしては、例えば、図９に示すような
ものが知られている。この図９は、白色光を発光する白
色発光ダイオード１を示すものであり、青色光を発光す
る発光ダイオードチップ２を有し、この発光ダイオード
チップ２の表面には、青色光を黄色光に変換するイット
リウム・アルミニウム・ガーネット（ＹＡＧ）系の蛍光
体が塗布されている。2. Description of the Related Art Conventionally, as a light emitting diode which emits light including ultraviolet rays, for example, a light emitting diode as shown in FIG. 9 has been known. FIG. 9 shows a white light emitting diode 1 that emits white light, has a light emitting diode chip 2 that emits blue light, and the surface of the light emitting diode chip 2 converts blue light into yellow light. Yttrium aluminum garnet (YAG) phosphor is applied.
【０００３】図９において、３及び４は所定の間隔をあ
けて並列に設けられた第１及び第２の端子であり、第１
の端子３の先端には、上面が凹んだカップ状の金属カッ
プ５が一体に設けられている。この金属カップ５の凹部
５ａは反射鏡の役目をなしており、この凹部５ａ内に
は、紫外線を含む光を発光する発光ダイオードチップ２
が収容されている。この発光ダイオードチップ２の表面
電極と第１，第２の端子３，４とは、ワイヤ６によって
それぞれ接続されている。In FIG. 9, reference numerals 3 and 4 denote first and second terminals provided in parallel at a predetermined interval.
A metal cup 5 having a concave upper surface is integrally provided at the tip of the terminal 3. The concave portion 5a of the metal cup 5 serves as a reflecting mirror. The light emitting diode chip 2 that emits light including ultraviolet light is provided in the concave portion 5a.
Is housed. The surface electrode of the light emitting diode chip 2 and the first and second terminals 3 and 4 are connected by wires 6 respectively.
【０００４】この発光ダイオードチップ２の上には、蛍
光体をバインダに分散させて液状にしたものを乾燥させ
た蛍光体層７が設けられている。この金属カップ５を含
む第１，第２の端子３，４の先端部は透明な合成樹脂８
で固められており、これによって白色発光ダイオード１
が構成されている。On the light emitting diode chip 2, there is provided a phosphor layer 7 obtained by dispersing a phosphor in a binder to form a liquid and drying the liquid. The tips of the first and second terminals 3 and 4 including the metal cup 5 are made of a transparent synthetic resin 8.
The white light emitting diode 1
Is configured.
【０００５】この白色発光ダイオード１によれば、発光
ダイオードチップ２が放射する青色光の一部が蛍光体層
７を透過すると共に、残りの青色光は蛍光体層７内の蛍
光体に当たって黄色の光となる。この２色の青色光と黄
色光とが混ざり合って人の目を刺激することにより、人
には全体として白色が見えることになる。According to the white light emitting diode 1, a part of the blue light emitted from the light emitting diode chip 2 passes through the phosphor layer 7, and the remaining blue light hits the phosphor in the phosphor layer 7 and becomes yellow. It becomes light. By mixing the two colors of blue light and yellow light to stimulate the eyes of a person, the person can see white as a whole.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、上述し
たような従来の発光ダイオード１にあっては、一般に紫
外線が人に対して悪影響を与えるために、その紫外線を
外部に放射させない構造となっていた。即ち、発光ダイ
オードチップ２が収容された金属カップ５を含む第１，
第２の端子３，４の先端部全体が透明な合成樹脂８でモ
ールドされており、このように全体をモールド体とする
ことによって紫外線を合成樹脂８に吸収させ、その紫外
線が外部に放射されるのを防止する構成となっていた。However, the conventional light emitting diode 1 as described above has a structure in which ultraviolet rays are not radiated to the outside because ultraviolet rays generally have an adverse effect on humans. . That is, the first and the first including the metal cup 5 in which the light emitting diode chip 2 is accommodated.
The entire distal end portions of the second terminals 3 and 4 are molded with a transparent synthetic resin 8, and thus the whole is made into a molded body so that the synthetic resin 8 absorbs ultraviolet rays, and the ultraviolet rays are radiated to the outside. Was configured to prevent the
【０００７】そのため、紫外線を吸収した合成樹脂８が
その紫外線によって劣化が促進され、発光ダイオード１
の耐久性が短いという課題があった。更に、合成樹脂８
が吸収した紫外線によって発光ダイオードチップ２の表
面に塗布されたＹＡＧ系の蛍光体や蛍光体層７内の蛍光
体が劣化され、白色光の白色が落ちて変色を起こしやす
いという課題があった。For this reason, the deterioration of the synthetic resin 8 which has absorbed the ultraviolet rays is promoted by the ultraviolet rays, and
However, there was a problem that the durability was short. Furthermore, synthetic resin 8
The YAG-based phosphor applied to the surface of the light-emitting diode chip 2 and the phosphor in the phosphor layer 7 are deteriorated by the ultraviolet rays absorbed by the light-emitting diode chip 2, and there is a problem that white light of white light is dropped and discoloration easily occurs.
【０００８】本発明は、このような従来の課題に鑑みて
なされたものであり、紫外線の放射を抑えるのではな
く、これとは逆に紫外線を積極的に放射させる構成とし
て、自ら発光する紫外線による劣化を抑制して耐久性の
向上を図ると共に、新たな用途の開拓に寄与することが
できる発光ダイオードを提供することを目的としてい
る。SUMMARY OF THE INVENTION The present invention has been made in view of such a conventional problem, and does not suppress the emission of ultraviolet rays. It is an object of the present invention to provide a light emitting diode capable of suppressing deterioration due to light emission, improving durability, and contributing to the development of new applications.
【０００９】[0009]
【課題を解決するための手段】上述したような課題等を
解決し、上記目的を達成するために、本発明の発光ダイ
オードは、紫外線を含む光を発光する発光ダイオードチ
ップを、少なくともレンズ部が透明な容器内に設けたチ
ップ収容室に収容すると共に、そのチップ収容室内には
紫外線を放射しやすい気体を充填して密封したことを特
徴としている。Means for Solving the Problems In order to solve the above-mentioned problems and achieve the above object, a light-emitting diode of the present invention comprises a light-emitting diode chip that emits light containing ultraviolet light, and at least a lens portion. It is housed in a chip housing chamber provided in a transparent container, and the chip housing chamber is filled with a gas that easily emits ultraviolet rays and sealed.
【００１０】上述のように構成したことにより、本発明
の発光ダイオードは、容器内のチップ収容室には紫外線
を放射しやすい気体が充填密封されているため、発光ダ
イオードチップによって発光された光が外部に積極的に
放射される。従って、自ら発光する紫外線に基づく容器
等の劣化を抑制できると共に、紫外線を取り出しやすく
して新たな用途を拓くことができる。[0010] With the above-described structure, the light emitting diode of the present invention has the chip accommodating chamber in the container filled and sealed with a gas that easily emits ultraviolet light, so that the light emitted by the light emitting diode chip can emit light. Actively radiated to the outside. Therefore, it is possible to suppress the deterioration of the container or the like based on the ultraviolet light that emits light by itself, and to easily take out the ultraviolet light to open up a new use.
【００１１】[0011]
【発明の実施の形態】以下、本発明の実施例を図面を参
照して説明する。図１〜図８は本発明の実施例を示すも
ので、図１は第１実施例の縦断面図、図２は第１実施例
の横断面図である。また、図３は第２実施例の縦断面
図、図４は第３実施例の縦断面図、図５は第４実施例の
縦断面図、図６は第５実施例の縦断面図、図７は第６実
施例の縦断面図、更に、図８は本発明に係る発光ダイオ
ードの使用例を説明するための断面図である。Embodiments of the present invention will be described below with reference to the drawings. 1 to 8 show an embodiment of the present invention. FIG. 1 is a longitudinal sectional view of the first embodiment, and FIG. 2 is a transverse sectional view of the first embodiment. 3 is a longitudinal sectional view of the second embodiment, FIG. 4 is a longitudinal sectional view of the third embodiment, FIG. 5 is a longitudinal sectional view of the fourth embodiment, FIG. 6 is a longitudinal sectional view of the fifth embodiment, FIG. 7 is a longitudinal sectional view of the sixth embodiment, and FIG. 8 is a sectional view for explaining an example of use of the light emitting diode according to the present invention.
【００１２】図１及び図２に示す第１実施例の発光ダイ
オード１０は、発光ダイオードチップ９が収容される容
器としての容器１１を、基台としての絶縁基板１２と、
胴体部としての円筒体１３と、レンズ部としてのレンズ
体１４との３部材で構成したものである。絶縁基板１２
は、電子回路の部品が装着される電気絶縁物からなる基
台であって、例えば、プリント基板やセラミック板等が
用いられる。この絶縁基板１２は円板形をなしており、
その上面中央部には、紫外線を含む光を発光する発光ダ
イオードチップ９が載置され、接着剤その他の固着手段
によって固定されている。A light emitting diode 10 according to a first embodiment shown in FIGS. 1 and 2 comprises a container 11 as a container in which a light emitting diode chip 9 is accommodated, an insulating substrate 12 as a base,
It is composed of three members: a cylindrical body 13 as a body part and a lens body 14 as a lens part. Insulating substrate 12
Is a base made of an electric insulator on which components of an electronic circuit are mounted. For example, a printed board, a ceramic plate, or the like is used. This insulating substrate 12 has a disc shape,
A light-emitting diode chip 9 that emits light including ultraviolet light is mounted on the center of the upper surface, and is fixed by an adhesive or other fixing means.
【００１３】この発光ダイオードチップ９の両側には、
導電性に優れた一対の端子１５，１６が絶縁基板１２を
上下方向へ貫通するように互いに平行に設けられてい
る。一対の端子１５，１６は、絶縁基板１２の２つの穴
に嵌合されてそれぞれ気密に固定されており、各端子１
５，１６の上端面には、はんだ付け等の接続手段によっ
てワイヤ１７の一端がそれぞれ接続されている。これら
ワイヤ１７の他端は、発光ダイオードチップ９表面の電
極にはんだ付け等の接続手段によってそれぞれ接続され
ており、このようなワイヤボンディングによって発光ダ
イオードチップ９と一対の端子１５とが互いに電気接続
されている。On both sides of the light emitting diode chip 9,
A pair of terminals 15 and 16 having excellent conductivity are provided in parallel with each other so as to penetrate the insulating substrate 12 in the vertical direction. The pair of terminals 15 and 16 are fitted in two holes of the insulating substrate 12 and are hermetically fixed, respectively.
One ends of the wires 17 are connected to upper end surfaces of the wires 5 and 16 by connecting means such as soldering. The other ends of the wires 17 are connected to electrodes on the surface of the light emitting diode chip 9 by connection means such as soldering, respectively, and the light emitting diode chip 9 and the pair of terminals 15 are electrically connected to each other by such wire bonding. ing.
【００１４】このワイヤボンディングの後、発光ダイオ
ードチップ９の表面には、例えばシリコン樹脂等の被膜
からなる保護膜を設けておくことが好ましい。このよう
に保護膜で発光ダイオードチップ９を被覆することによ
り、その後の搬送時等において、誤って何かと接触して
発光ダイオードチップ９に傷が付けられるのを防止する
ことができる。After the wire bonding, it is preferable to provide a protective film made of a film such as a silicon resin on the surface of the light emitting diode chip 9. By covering the light emitting diode chip 9 with the protective film in this way, it is possible to prevent the light emitting diode chip 9 from being erroneously brought into contact with something and damaged during the subsequent transportation or the like.
【００１５】この発光ダイオードチップ９が実装された
絶縁基板１２には、円筒体１３の下端部が嵌合されてい
る。この円筒体１３と絶縁基板１２とは、その嵌合部に
接着剤を塗布するか或いは円筒体１３の縁にカシメ加工
を施す等の固着手段を加えることによって互いに密着さ
せて接合し、その密着面間に気体が通過できないように
する。この円筒体１３の材質としては、例えば、アルミ
ニウム合金、銅合金（例えば黄銅等）等の金属が好適で
あり、その内面を鏡面にして反射鏡として用いることに
より、発光ダイオードチップ９から発光された光をより
多く外部へ放射されることができる。The lower end of the cylindrical body 13 is fitted to the insulating substrate 12 on which the light emitting diode chip 9 is mounted. The cylindrical body 13 and the insulating substrate 12 are brought into close contact with each other by applying an adhesive to the fitting portion or by applying a fixing means such as caulking the edge of the cylindrical body 13, and joined. Prevent gas from passing between surfaces. As a material of the cylindrical body 13, for example, a metal such as an aluminum alloy or a copper alloy (for example, brass or the like) is suitable, and light is emitted from the light emitting diode chip 9 by using the inner surface as a mirror surface and using it as a reflecting mirror. More light can be emitted to the outside.
【００１６】しかしながら、円筒体１３の材質として
は、金属以外にも合成樹脂その他の材料を用いることも
できる。この場合、使用される材質によっては円筒体１
３の内面が鏡面にならないことがあるが、そのときには
円筒体の内面に、例えばアルミニウム箔等の表面が鏡面
となり得るものを貼付し、或いは塗料として塗布して、
その内面を鏡面とすることが望ましい。However, as the material of the cylindrical body 13, a synthetic resin or other materials can be used in addition to metal. In this case, depending on the material used, the cylindrical body 1
In some cases, the inner surface of 3 may not be a mirror surface. At that time, for example, an aluminum foil or the like whose surface can be a mirror surface is attached to the inner surface of the cylindrical body, or applied as a paint,
It is desirable that the inner surface be a mirror surface.
【００１７】この円筒体１３の上端部にはレンズ体１４
が嵌合固定され、この円筒体１３とレンズ体１４との嵌
合部にも接着剤を充填するか或いは円筒体１３の縁にカ
シメ加工を施す等の固着手段を加えることによって、円
筒体１３とレンズ体１４とを気密に接合させる。これに
より、その内部にチップ収容室１８が設定された気密性
を有する容器１１が構成されている。At the upper end of the cylindrical body 13, a lens body 14 is provided.
The fitting portion between the cylindrical body 13 and the lens body 14 is also filled with an adhesive, or a fixing means such as caulking the edge of the cylindrical body 13 is added. And the lens body 14 are hermetically bonded. Thus, the airtight container 11 in which the chip accommodating chamber 18 is set is configured.
【００１８】この容器１１のレンズ体１４は、発光ダイ
オードチップ９から発光された光を外部へ放射するレン
ズ部分をなすものであり、見やすくなるよう光を拡大さ
せるために半球形のレンズ状に形成されている。このレ
ンズ体１４の材質としては、例えば、紫外線透過性の石
英ガラス、紫外線透過性のフッ素樹脂、及びこれらと同
様の性質を有する合成樹脂その他のレンズ材料を用いる
ことができる。このレンズ体１４は、光を外部へ放射す
るために透明でなければならないが、その色については
無色透明であってもよく、また有色透明であってもよ
い。The lens body 14 of the container 11 forms a lens portion for radiating the light emitted from the light emitting diode chip 9 to the outside. The lens body 14 is formed in a hemispherical lens shape so as to enlarge the light so that it is easy to see. Have been. As the material of the lens body 14, for example, ultraviolet-transmitting quartz glass, ultraviolet-transmitting fluororesin, a synthetic resin having the same properties as these, and other lens materials can be used. The lens body 14 must be transparent in order to emit light to the outside, but its color may be colorless and transparent, or may be colored and transparent.
【００１９】この容器１１の内部に設けられたチップ収
容室１８には、紫外線を放射しやすい性質を有する気体
を充填させて封入する。このチップ収容室１８に密封さ
れる気体としては、例えば、アルゴン、ヘリウム、クリ
プトン、ネオン、キセノン等の不活性ガスを適用するこ
とができ、これ以外にも、窒素ガスや水銀蒸気等を用い
ることもできる。The chip accommodating chamber 18 provided inside the container 11 is filled with a gas having a property of easily radiating ultraviolet rays and sealed therein. As the gas to be sealed in the chip accommodating chamber 18, for example, an inert gas such as argon, helium, krypton, neon, xenon, or the like can be used. In addition, nitrogen gas, mercury vapor, or the like can be used. Can also.
【００２０】図３に示す第２実施例の発光ダイオード２
０は、基台と胴体部とを一体にして胴付基台２２を形成
し、この胴付基台２２とレンズ体２３との２部材で容器
２１を構成したものである。胴付基台２２は、円板状の
基台部２２ａと、この基台部２２ａの一面側に突出して
一体に形成された環状の胴体部２２ｂとを有し、この胴
体部２２ｂ側の基台部２２ａ中央には、発光ダイオード
チップ９が接着剤等の固着手段によって固定されてい
る。The light emitting diode 2 of the second embodiment shown in FIG.
Reference numeral 0 denotes a case in which the base and the body are integrally formed to form a body-mounted base 22, and the container 21 is formed of two members, the body-mounted base 22 and the lens body 23. The body-attached base 22 has a disk-shaped base part 22a and an annular body part 22b integrally formed by protruding from one surface side of the base part 22a. The light emitting diode chip 9 is fixed to the center of the base 22a by fixing means such as an adhesive.
【００２１】更に、胴筒体２２ｂの先端部内側には周方
向に連続する環状の取付溝２４が設けられており、この
取付溝２４にはレンズ体２３が嵌合されている。そし
て、胴筒体２２ｂの先端部は内側にカシメられており、
これによってレンズ体２３の抜け出しが防止されている
と共に、その内部に設定されたチップ収容室１８の気密
性が保持されている。このレンズ体２３は、中央部が若
干突出した凸レンズ形をなしており、このような形状の
レンズ部を用いることもできる。他の構成は、上述した
第１実施例と同様であるため、その説明は省略する。Further, an annular mounting groove 24 which is continuous in the circumferential direction is provided inside the distal end portion of the barrel 22b, and a lens body 23 is fitted in the mounting groove 24. The tip of the barrel 22b is caulked inward,
Thus, the lens body 23 is prevented from coming off, and the airtightness of the chip housing chamber 18 set therein is maintained. The lens body 23 has a convex lens shape with a slightly protruding central portion, and a lens portion having such a shape can be used. Other configurations are the same as those of the above-described first embodiment, and a description thereof will be omitted.
【００２２】図４に示す第３実施例の発光ダイオード３
０は、胴体部とレンズ部とを一体にして胴付レンズ体３
２を形成し、この胴付レンズ体３２と絶縁基板３３との
２部材で容器３１を構成したものである。胴付レンズ体
３２は、円筒状に形成された胴体部３２ａと、この胴体
部３２ａの一端に連続して一体に形成されたレンズ部３
２ｂとを有し、このレンズ部３２ｂは、上述した第１実
施例のレンズ体１４と同様に半球体として形成されてい
る。また、絶縁基板３３は、同じく第１実施例の絶縁基
板１２と同様の構成を有しており、同様にして発光ダイ
オードチップ９と第１及び第２の端子１５，１６とが設
けられている。The light emitting diode 3 of the third embodiment shown in FIG.
0 is a body-mounted lens body 3 having a body part and a lens part integrated.
2 is formed, and the container 31 is constituted by two members, the lens body 32 with the body and the insulating substrate 33. The body-mounted lens body 32 includes a body part 32a formed in a cylindrical shape, and a lens part 3 formed continuously and integrally with one end of the body part 32a.
2b, and the lens portion 32b is formed as a hemisphere like the lens body 14 of the first embodiment described above. Further, the insulating substrate 33 has the same configuration as the insulating substrate 12 of the first embodiment, and similarly, the light emitting diode chip 9 and the first and second terminals 15 and 16 are provided. .
【００２３】この胴付レンズ体３２と絶縁基板３３と
は、胴体部３２ａの開口側の端面に塗布された接着剤に
より接着され、内部のチップ収容室１８内に所定の気体
を封入した状態で密封されている。この胴付レンズ体３
２は、その全体が紫外線透過性を有する透明な材質（例
えば、紫外線透過性のフッ素樹脂や石英ガラス等）によ
って形成されているが、少なくともレンズ部３２ｂが同
様の材質によって形成されていればよいものである。そ
の他の構成は、上述した第１実施例と同様であるため、
その説明は省略する。The body-mounted lens body 32 and the insulating substrate 33 are adhered to each other with an adhesive applied to the open end surface of the body portion 32a, and a predetermined gas is sealed in the chip housing chamber 18 inside. Sealed. This body-mounted lens body 3
2, the whole is formed of a transparent material having an ultraviolet transmitting property (for example, a fluororesin or quartz glass having an ultraviolet transmitting property), but it is sufficient that at least the lens portion 32b is formed of the same material. Things. Other configurations are the same as those of the first embodiment described above.
The description is omitted.
【００２４】図５に示す第４実施例の発光ダイオード４
０は、上記第３実施例で示した胴付レンズ体３２の胴体
部３２ａを長く設定して胴付レンズ体４２を形成し、そ
の胴体部４２ａの内側に絶縁基板４３を嵌合させて容器
４１を構成したものである。胴付レンズ体４２の胴体部
４２ａと絶縁基板４３との嵌合部には、接着剤を充填す
るか或いは胴体部４２ａの縁にカシメ加工を施す等の固
着手段を加え、これにより、胴付レンズ体４２と絶縁基
板４３とを気密に接合させるようにする。その他の構成
は、上記実施例と同様である。The light emitting diode 4 of the fourth embodiment shown in FIG.
0 denotes a case where the body 32a of the body lens 32 shown in the third embodiment is set to be long to form a body lens 42, and an insulating substrate 43 is fitted inside the body 42a to form a container. 41. The fitting portion between the body portion 42a of the body-mounted lens body 42 and the insulating substrate 43 is provided with a fixing means such as filling with an adhesive or caulking the edge of the body portion 42a. The lens body 42 and the insulating substrate 43 are hermetically bonded. Other configurations are the same as in the above embodiment.
【００２５】図６に示す第５実施例の発光ダイオード５
０は、上記第４実施例で示した胴付レンズ体４２の胴体
部４２ａの内側に筒体５２ｃを介在させ、この筒体５２
ｃと胴体部５２ａとレンズ部５２ｂとで胴付レンズ体５
２を形成し、筒体５２ｃの内側に絶縁基板５３を嵌合さ
せて容器５１を構成したものである。筒体５２ｃは、そ
の目的に応じて各種の材質のものを適用することができ
る。The light emitting diode 5 of the fifth embodiment shown in FIG.
0 indicates that the cylindrical body 52c is interposed inside the body portion 42a of the body-mounted lens body 42 shown in the fourth embodiment,
c, the body part 52a and the lens part 52b
2 is formed, and an insulating substrate 53 is fitted inside the cylindrical body 52c to form the container 51. The cylindrical body 52c can be made of various materials according to the purpose.
【００２６】例えば、筒体５２ｃとして、第１実施例に
示したような金属製の円筒体を用いる場合には、チップ
収容室１８の周囲を鏡面として光を反射させることによ
り、発光ダイオードチップ９から放出される光をより一
層外部に出しやすくすることができる。また、筒体５２
ｃとして、熱伝導性に優れたセラミックスを用いる場合
には、放熱効果を増加させて、発光ダイオード５０の温
度上昇を効果的に抑制することができる。For example, when a metal cylindrical body such as that shown in the first embodiment is used as the cylindrical body 52c, the periphery of the chip accommodating chamber 18 is mirror-reflected so that the light emitting diode chip 9 can be used. Light emitted from the light source can be more easily emitted to the outside. The cylindrical body 52
When a ceramic having excellent thermal conductivity is used as c, the heat radiation effect can be increased and the temperature rise of the light emitting diode 50 can be effectively suppressed.
【００２７】尚、第５実施例では、筒体５２ｃは胴付レ
ンズ体５２の胴体部５２ａに圧入されていて、その筒体
５２ｃと絶縁基板５３との嵌合部には接着剤が充填さ
れ、これにより、胴付レンズ体５２と絶縁基板５３とが
気密に接合されている。また、レンズ部５２ｂの形状と
しては、表裏両面が互いに平行をなす平板状のレンズ形
が用いられている。その他の構成は、上記実施例と同様
である。In the fifth embodiment, the cylindrical body 52c is press-fitted into the body 52a of the body-mounted lens body 52, and the fitting portion between the cylindrical body 52c and the insulating substrate 53 is filled with an adhesive. Thus, the body-mounted lens body 52 and the insulating substrate 53 are air-tightly joined. As the shape of the lens portion 52b, a flat lens shape in which both front and back surfaces are parallel to each other is used. Other configurations are the same as in the above embodiment.
【００２８】図７に示す第６実施例の発光ダイオード６
０は、上記第５実施例で示した筒体５２ｃを胴付レンズ
体５２の胴体部５２ａと一体成形したものである。この
胴付レンズ体６２は、例えば、筒体６２ｃを胴体部６２
ａの内側に配してインサート成形することによって容易
に製作することができる。また、絶縁基板６３には外向
きのフランジ部６３ａが設けられており、このフランジ
部６３ａの端面には胴付レンズ体６２の開口側の端面が
当接するように構成されている。このようにフランジ部
６３ａと胴付レンズ体６２の端面とを当接させることに
より、絶縁基板６３と胴付レンズ体６２との高さ方向の
位置決めを簡単且つ確実に行うことができる。The light emitting diode 6 of the sixth embodiment shown in FIG.
Numeral 0 indicates that the cylindrical body 52c shown in the fifth embodiment is integrally formed with the body portion 52a of the body-mounted lens body 52. The body-mounted lens body 62 is formed by, for example, connecting the cylindrical body 62 c to the body portion 62.
It can be easily manufactured by arranging it inside a and performing insert molding. The insulating substrate 63 is provided with an outward flange portion 63a, and the end surface of the flange portion 63a is configured so that the end surface on the opening side of the body-mounted lens body 62 abuts. In this way, by bringing the flange portion 63a into contact with the end surface of the body-mounted lens body 62, the positioning in the height direction between the insulating substrate 63 and the body-mounted lens body 62 can be performed simply and reliably.
【００２９】この第６実施例に係る胴付レンズ体６２と
絶縁基板６３とは、その嵌合部に接着剤を塗布して接合
してもよく、また、その嵌合部にカシメ加工を加えて接
合する構成としてもよい。また、レンズ部６２ｂの形状
としては、表面が若干円弧状に突出した凸レンズ形が用
いられている。その他の構成は、上記実施例と同様であ
る。The torso lens body 62 and the insulating substrate 63 according to the sixth embodiment may be joined by applying an adhesive to a fitting portion thereof, or by caulking the fitting portion. It is good also as a structure which joins. As the shape of the lens portion 62b, a convex lens shape whose surface slightly protrudes in an arc shape is used. Other configurations are the same as in the above embodiment.
【００３０】このような構成を有する発光ダイオード１
０，２０，３０，４０，５０，６０は、例えば、図８に
示すような浄水装置等に用いることができる。この浄水
装置は、発光ダイオード１０（これらの代表として第１
実施例のものを示す。）が発光する光に含まれる紫外線
の殺菌作用により、装置内を流れる水を殺菌して衛生状
態に維持するための装置である。The light emitting diode 1 having such a configuration
0, 20, 30, 40, 50, and 60 can be used in, for example, a water purification device as shown in FIG. This water purification device includes a light emitting diode 10 (the first
An example is shown. Is a device for sterilizing water flowing in the device and maintaining a sanitary condition by a sterilizing action of ultraviolet light contained in the emitted light.
【００３１】図８に示すように、浄水装置７０は、上面
に開口した筒状（円筒でも角筒でもよい。）のタンク本
体７１と、このタンク本体７１の上面開口を閉じる蓋体
７２とを備えている。このタンク本体７１の上部には、
衛生的な状態に維持すべき対象物としての水が供給され
る供給口７３が設けられ、タンク本体７１の下部には、
衛生的に維持された水を排出するための排出口７４が設
けられている。このタンク本体７１の内部にはろ過器７
５が配設されており、このろ過器７５によってタンク本
体７１内の通路が供給口７３側と排出口７４側とに仕切
られている。As shown in FIG. 8, the water purification device 70 includes a cylindrical (both cylindrical or rectangular) tank body 71 opened on the upper surface and a lid 72 closing the upper surface opening of the tank body 71. Have. In the upper part of this tank body 71,
A supply port 73 for supplying water as an object to be maintained in a sanitary state is provided.
An outlet 74 for discharging sanitary maintained water is provided. A filter 7 is provided inside the tank body 71.
5 is disposed, and a passage in the tank main body 71 is partitioned by the filter 75 into a supply port 73 side and a discharge port 74 side.
【００３２】また、蓋体７２の内側には内付け基板７６
が配設されており、この内付け基板７６の内面には、本
発明に係る発光ダイオード１０が多数個固定されてい
る。これらの発光ダイオード１０は、紫外線を含む光を
発光してろ過器７５より供給口７３側を照射する。更
に、タンク本体７１の下部外側には外付け基板７７が配
設されており、この外付け基板７７の内面にも、本発明
に係る発光ダイオード１０が多数個固定されている。こ
れらの発光ダイオード１０は、紫外線を含む光を発光し
てろ過器７５より排出口７４側を照射する。この外付け
基板７７は、タンク本体７１の外形が円柱状であれば円
環形とし、角柱状であれば角環形とする。An internal substrate 76 is provided inside the lid 72.
The light emitting diode 10 according to the present invention is fixed on the inner surface of the internal substrate 76. These light emitting diodes 10 emit light including ultraviolet rays and irradiate the supply port 73 side from the filter 75. Further, an external board 77 is provided outside the lower portion of the tank body 71, and a large number of the light emitting diodes 10 according to the present invention are also fixed to the inner surface of the external board 77. These light emitting diodes 10 emit light including ultraviolet rays and irradiate the outlet 74 side from the filter 75. The external substrate 77 has an annular shape if the outer shape of the tank body 71 is cylindrical, and has an annular shape if the outer shape of the tank body 71 is prismatic.
【００３３】この外付け基板７７に発光ダイオード１０
を設けたことに対応させて、これの内側に位置するタン
ク本体７１の部分は、光透過性を有する材質とする必要
がある。尚、排出口７４側の発光ダイオード１０は、内
付け基板に搭載してタンク本体７１内に収容する構成と
することもできる。The light emitting diode 10 is mounted on the external board 77.
Accordingly, the portion of the tank body 71 located inside the tank body needs to be made of a light transmissive material. The light emitting diode 10 on the discharge port 74 side may be configured to be mounted on an internal substrate and housed in the tank body 71.
【００３４】更に、タンク本体７１の底部内面には、発
光ダイオード１０の発光により放射された光が当たるこ
とによって光電子を発生する光電子発生部材７８が設け
られている。この光電子発生部材７８としては、金属及
び非金属のいずれでもよく、例えば、セシウム、バリウ
ム、カリウム、ナトリウム、リチウム、ルビジウム、ニ
ッケル、白金、シリコン、シリコンカーバイト、酸化マ
グネシウム等を適用することができる。このように光電
子発生部材７８で光電子を発生させることにより、タン
ク本体７１内及び水中に含まれている菌の増殖を抑制
し、殺菌効果を高めることができる。Further, on the inner surface of the bottom of the tank body 71, there is provided a photoelectron generating member 78 which generates photoelectrons by being irradiated with light emitted by the light emission of the light emitting diode 10. As the photoelectron generating member 78, any of a metal and a nonmetal may be used, and for example, cesium, barium, potassium, sodium, lithium, rubidium, nickel, platinum, silicon, silicon carbide, magnesium oxide, etc. can be applied. . By generating photoelectrons by the photoelectron generating member 78 in this manner, the growth of bacteria contained in the tank main body 71 and in the water can be suppressed, and the bactericidal effect can be enhanced.
【００３５】このような構成を有する浄水装置７０は、
例えば、次のようにして使用される。まず、内付け基板
７６及び外付け基板７７の各発光ダイオード１０に通電
し、この状態で供給口７３から水をタンク本体７１内に
供給する。このタンク本体７１内に導入された水は、ろ
過器７５の供給口７３側において内付け基板７６に装着
された発光ダイオード１０によって光の照射を受ける。
その結果、照射光に含まれる紫外線の殺菌作用により、
菌の増殖が抑制されて水の汚染が防止されると共に、そ
の水を清浄な衛生的状態にすることができる。The water purification device 70 having such a configuration is as follows.
For example, it is used as follows. First, power is supplied to the light emitting diodes 10 of the internal substrate 76 and the external substrate 77, and in this state, water is supplied from the supply port 73 into the tank body 71. The water introduced into the tank main body 71 is irradiated with light by the light emitting diode 10 mounted on the internal substrate 76 on the supply port 73 side of the filter 75.
As a result, due to the bactericidal action of the ultraviolet light contained in the irradiation light,
Bacterial growth is suppressed and water contamination is prevented, and the water can be brought into a clean and sanitary state.
【００３６】このタンク本体７１の供給口７３側におい
て発光ダイオード１０の光による殺菌作用を受けた水
は、ろ過器７５を通過して異物が取り除かれた後、排出
口７４側に流入される。このタンク本体７１内の排出口
７４側に移動した水は、タンク本体７１の外部に取り付
けられた外付け基板７７に装着された発光ダイオード１
０による光の照射と、光電子発生部材７８から発生され
る光電子の照射とを受けることになる。その結果、照射
光に含まれる紫外線の殺菌作用等を再度受けることにな
り、これにより更なる菌の増殖が抑制されて水の汚染が
十分且つ確実に防止される。このように二重に殺菌作用
を受けた水が排出口７４から排出されるため、人等に対
して清浄な衛生的状態にある水を十分に供給することが
できる。The water which has been sterilized by the light of the light emitting diode 10 on the supply port 73 side of the tank body 71 passes through the filter 75 to remove foreign substances, and then flows into the discharge port 74 side. The water that has moved toward the discharge port 74 in the tank body 71 is removed by the light emitting diode 1 mounted on the external board 77 mounted outside the tank body 71.
0 and the irradiation of photoelectrons generated from the photoelectron generating member 78. As a result, the bacterium is again subjected to the bactericidal action and the like of the ultraviolet light contained in the irradiation light, whereby further growth of bacteria is suppressed, and water contamination is sufficiently and reliably prevented. Since the water that has been subjected to the double sterilization action is discharged from the discharge port 74 in this manner, clean and sanitary water can be sufficiently supplied to humans and the like.
【００３７】この場合、本実施例に係る発光ダイオード
１０によれば、従来の発光ダイオードのように紫外線の
放射を抑制するのではなく、チップ収容室１８を設けて
紫外線を放射しやすい窒素ガスやアルゴンガス等の気体
を封入して積極的に紫外線を放射させることができる構
成としたため、紫外線による殺菌作用を高めて殺菌効率
を向上させることができる。従って、この発光ダイオー
ド１０を用いることにより、殺菌効率の高い優れた浄水
装置７０を得ることができる。In this case, according to the light emitting diode 10 of the present embodiment, instead of suppressing the emission of ultraviolet rays unlike the conventional light emitting diode, the chip housing chamber 18 is provided to provide nitrogen gas or the like which easily emits ultraviolet rays. Since a structure in which a gas such as an argon gas is sealed and ultraviolet rays can be radiated positively is provided, a sterilizing action by the ultraviolet rays can be enhanced and sterilization efficiency can be improved. Therefore, by using this light emitting diode 10, an excellent water purification device 70 having high sterilization efficiency can be obtained.
【００３８】この発光ダイオード１０の使用に好適な装
置としては、上記浄水装置７０に限定されるものではな
く、この他にも例えば、自動飲料販売機の容量タンク、
精製水容器、水洗トイレ用給水タンク等の液体を扱う装
置は勿論のこと、液体を扱わない電話機の送受話器等の
菌の増殖を抑制して衛生的な状態に維持するための衛生
装置等にも用いることができる。Apparatuses suitable for use of the light emitting diode 10 are not limited to the water purification device 70 described above.
Not only devices that handle liquids such as purified water containers and flush toilet water tanks, but also sanitary devices that suppress the growth of bacteria such as telephone handsets that do not handle liquids and maintain sanitary conditions. Can also be used.
【００３９】以上説明したが、本発明は上記実施例に限
定されるものではなく、例えば、上記実施例において
は、円筒体１３及びその他の胴体部２２ｂ，３２ｂ…の
形状を円形とした例について説明したが、その形状は四
角形、三角形、五角形、六角形その他の多角形でもよ
く、その他にも各種の形状を適用することができる。更
に、図６及び図７に示す実施例では、筒体５２ｃ，６２
ｃを胴体部５２ａ，６２ａの内側に配した例について説
明したが、胴体部５２ａ，６２ａの外側に筒体５２ｃ，
６２ｃを配する構成とすることもできる。このように、
本発明は、その趣旨を逸脱しない範囲で種々変更できる
ものである。As described above, the present invention is not limited to the above embodiment. For example, in the above embodiment, the cylindrical body 13 and the other body portions 22b, 32b,. Although described, the shape may be a quadrangle, a triangle, a pentagon, a hexagon, or other polygons, and various other shapes can be applied. Further, in the embodiment shown in FIGS. 6 and 7, the cylinders 52c, 62
Although the example in which c is arranged inside the body parts 52a and 62a has been described, the cylindrical body 52c and the body 52c are arranged outside the body parts 52a and 62a.
62c may be provided. in this way,
The present invention can be variously modified without departing from the spirit thereof.
【００４０】[0040]
【発明の効果】以上説明したように、本発明によれば、
紫外線を含む光を発光する発光ダイオードチップを、少
なくともレンズ部が透明な容器内のチップ収容室に収容
すると共に紫外線を放射しやすい気体を密封する構成と
したため、紫外線を外部に積極的に放射させることがで
きると共に、自ら発光する紫外線による劣化を抑制する
ことができ、耐久性の向上を図ることができる発光ダイ
オードが得られる。更に、従来の発光ダイオードのよう
に紫外線の放射を抑制するのではなく、自ら積極的に紫
外線を多量に放射させることができるため、これまで必
要とされていなかった新たな分野にも使用することがで
き、この種の発光ダイオードにおける新たな用途の開拓
に寄与し得る発光ダイオードを提供することができる。As described above, according to the present invention,
A light emitting diode chip that emits light containing ultraviolet light is housed in a chip housing chamber in a transparent container at least with a lens portion, and a gas that easily emits ultraviolet light is sealed, so that ultraviolet light is actively emitted to the outside. Thus, a light emitting diode that can suppress deterioration due to ultraviolet light emitted by itself and can improve durability can be obtained. Furthermore, instead of suppressing the emission of ultraviolet light as in the conventional light emitting diode, it can actively emit a large amount of ultraviolet light by itself, so that it can be used in new fields that were not needed before. Accordingly, it is possible to provide a light emitting diode that can contribute to the development of a new application in this kind of light emitting diode.
【図１】本発明に係る発光ダイオードの第１実施例を示
す断面図である。FIG. 1 is a sectional view showing a first embodiment of a light emitting diode according to the present invention.
【図２】図１のＡ−Ａ線部分の断面図である。FIG. 2 is a sectional view taken along line AA of FIG.
【図３】本発明に係る発光ダイオードの第２実施例を示
す断面図である。FIG. 3 is a sectional view showing a second embodiment of the light emitting diode according to the present invention.
【図４】本発明に係る発光ダイオードの第３実施例を示
す断面図である。FIG. 4 is a sectional view showing a third embodiment of the light emitting diode according to the present invention.
【図５】本発明に係る発光ダイオードの第４実施例を示
す断面図である。FIG. 5 is a sectional view illustrating a light emitting diode according to a fourth embodiment of the present invention.
【図６】本発明に係る発光ダイオードの第５実施例を示
す断面図である。FIG. 6 is a sectional view showing a light emitting diode according to a fifth embodiment of the present invention.
【図７】本発明に係る発光ダイオードの第６実施例を示
す断面図である。FIG. 7 is a sectional view showing a light emitting diode according to a sixth embodiment of the present invention.
【図８】本発明に係る発光ダイオードの使用状態の一実
施例を示すもので、この発光ダイオードが使用された浄
水装置の断面図である。FIG. 8 is a cross-sectional view of a water purification device using the light emitting diode according to an embodiment of the present invention, in which the light emitting diode is used.
【図９】従来の発光ダイオードを示す断面図である。FIG. 9 is a cross-sectional view showing a conventional light emitting diode.
９ 発光ダイオードチップ １０，２０，３０，４０，５０，６０ 発光ダイオード １１，２１，３１，４１，５１，６１ 容器 １２，３３，４３，５３，６３ 絶縁基板（基台） １３ 円筒体（胴体部） １４，２３ レンズ体（レンズ部） １５，１６ 端子 １７ ワイヤ １８ チップ収容室 ２２ 胴付基台 ３２，４２，５２，６２ 胴付レンズ体 ３２ａ，４２ａ，５２ａ，６２ａ 胴体部 ３２ｂ，４２ｂ，５２ｂ，６２ｂ レンズ部 ５２ｃ，６２ｃ 筒体 9 Light-emitting diode chip 10, 20, 30, 40, 50, 60 Light-emitting diode 11, 21, 31, 41, 51, 61 Container 12, 33, 43, 53, 63 Insulating substrate (base) 13 Cylindrical body (body part) ) 14,23 Lens body (lens part) 15,16 Terminal 17 Wire 18 Chip accommodating chamber 22 Body base 32,42,52,62 Body body lens body 32a, 42a, 52a, 62a Body part 32b, 42b, 52b , 62b Lens part 52c, 62c Cylindrical body
Claims (3)
ドチップを、少なくともレンズ部が透明な容器内に設け
たチップ収容室に収容すると共に、上記チップ収容室内
には紫外線を放射し易い気体を充填して密封したことを
特徴とする発光ダイオード。1. A light-emitting diode chip that emits light containing ultraviolet light is housed in a chip housing chamber provided with at least a lens portion in a transparent container, and the chip housing chamber is filled with a gas that easily emits ultraviolet light. A light emitting diode, characterized by being sealed.
て、 上記容器のレンズ部は、紫外線透過性を有する石英ガラ
ス材又はフッ素樹脂材で形成したことを特徴とする発光
ダイオード。2. The light emitting diode according to claim 1, wherein the lens portion of the container is formed of a quartz glass material or a fluororesin material having an ultraviolet transmittance.
て、 上記気体は、アルゴン若しくはネオン等の不活性ガス、
窒素ガス又は水銀蒸気であることを特徴とする発光ダイ
オード。3. The light emitting diode according to claim 1, wherein the gas is an inert gas such as argon or neon.
A light emitting diode comprising nitrogen gas or mercury vapor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9037427A JPH10233532A (en) | 1997-02-21 | 1997-02-21 | Light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9037427A JPH10233532A (en) | 1997-02-21 | 1997-02-21 | Light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10233532A true JPH10233532A (en) | 1998-09-02 |
Family
ID=12497228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9037427A Pending JPH10233532A (en) | 1997-02-21 | 1997-02-21 | Light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10233532A (en) |
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| WO2002012127A3 (en) * | 2000-08-04 | 2004-12-09 | Color Kinetics Inc | Ultraviolet light emitting diode systems and methods |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05343812A (en) * | 1992-06-12 | 1993-12-24 | Kubota Corp | Semiconductor device |
| JPH08153896A (en) * | 1994-11-25 | 1996-06-11 | Seiwa Denki Kk | Light emitting diode and led display |
| JPH098361A (en) * | 1995-06-19 | 1997-01-10 | Toyoda Gosei Co Ltd | Light emitting diode |
-
1997
- 1997-02-21 JP JP9037427A patent/JPH10233532A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05343812A (en) * | 1992-06-12 | 1993-12-24 | Kubota Corp | Semiconductor device |
| JPH08153896A (en) * | 1994-11-25 | 1996-06-11 | Seiwa Denki Kk | Light emitting diode and led display |
| JPH098361A (en) * | 1995-06-19 | 1997-01-10 | Toyoda Gosei Co Ltd | Light emitting diode |
Cited By (36)
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| WO2002012127A3 (en) * | 2000-08-04 | 2004-12-09 | Color Kinetics Inc | Ultraviolet light emitting diode systems and methods |
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| JP2004071771A (en) * | 2002-08-05 | 2004-03-04 | Okaya Electric Ind Co Ltd | Light emitting diode |
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| EP1597776B1 (en) * | 2003-02-28 | 2015-04-01 | OSRAM Opto Semiconductors GmbH | Semiconductor light emitting device |
| US9666772B2 (en) | 2003-04-30 | 2017-05-30 | Cree, Inc. | High powered light emitter packages with compact optics |
| US8901585B2 (en) | 2003-05-01 | 2014-12-02 | Cree, Inc. | Multiple component solid state white light |
| WO2004109813A3 (en) * | 2003-05-30 | 2005-04-21 | Osram Opto Semiconductors Gmbh | Light-emitting diode |
| JP4492219B2 (en) * | 2004-06-11 | 2010-06-30 | 日亜化学工業株式会社 | Support substrate, method of forming semiconductor device using the support substrate, and semiconductor device |
| JP2005353893A (en) * | 2004-06-11 | 2005-12-22 | Nichia Chem Ind Ltd | Method of forming support substrate and semiconductor device using support substrate and semiconductor device |
| US7948694B2 (en) | 2004-08-23 | 2011-05-24 | Osram Opto Semiconductor Gmbh | Apparatus for an optoelectronic device and componnent having an optoelectronic device and an apparatus |
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| JP2007311707A (en) * | 2006-05-22 | 2007-11-29 | Ushio Inc | Ultraviolet ray emitting element package |
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