JP6753745B2 - 熱伝導シート、及び半導体装置 - Google Patents

熱伝導シート、及び半導体装置 Download PDF

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Publication number
JP6753745B2
JP6753745B2 JP2016177977A JP2016177977A JP6753745B2 JP 6753745 B2 JP6753745 B2 JP 6753745B2 JP 2016177977 A JP2016177977 A JP 2016177977A JP 2016177977 A JP2016177977 A JP 2016177977A JP 6753745 B2 JP6753745 B2 JP 6753745B2
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JP
Japan
Prior art keywords
heat
heat conductive
conductive sheet
fibrous filler
fiber length
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016177977A
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English (en)
Japanese (ja)
Other versions
JP2018046073A (ja
Inventor
荒巻　慶輔
慶輔 荒巻
弘幸 良尊
弘幸 良尊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to JP2016177977A priority Critical patent/JP6753745B2/ja
Priority to CN201780065575.3A priority patent/CN109891577B/zh
Priority to PCT/JP2017/031980 priority patent/WO2018047828A1/ja
Priority to TW106131013A priority patent/TWI714804B/zh
Publication of JP2018046073A publication Critical patent/JP2018046073A/ja
Application granted granted Critical
Publication of JP6753745B2 publication Critical patent/JP6753745B2/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2016177977A 2016-09-12 2016-09-12 熱伝導シート、及び半導体装置 Active JP6753745B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016177977A JP6753745B2 (ja) 2016-09-12 2016-09-12 熱伝導シート、及び半導体装置
CN201780065575.3A CN109891577B (zh) 2016-09-12 2017-09-05 导热片和半导体装置
PCT/JP2017/031980 WO2018047828A1 (ja) 2016-09-12 2017-09-05 熱伝導シート、及び半導体装置
TW106131013A TWI714804B (zh) 2016-09-12 2017-09-11 熱傳導片及半導體裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016177977A JP6753745B2 (ja) 2016-09-12 2016-09-12 熱伝導シート、及び半導体装置

Publications (2)

Publication Number Publication Date
JP2018046073A JP2018046073A (ja) 2018-03-22
JP6753745B2 true JP6753745B2 (ja) 2020-09-09

Family

ID=61562508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016177977A Active JP6753745B2 (ja) 2016-09-12 2016-09-12 熱伝導シート、及び半導体装置

Country Status (4)

Country Link
JP (1) JP6753745B2 (zh)
CN (1) CN109891577B (zh)
TW (1) TWI714804B (zh)
WO (1) WO2018047828A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113150558B (zh) 2021-05-12 2021-11-26 广东思泉新材料股份有限公司 一种定向导热片及其制备方法、及半导体散热装置
WO2023157829A1 (ja) * 2022-02-16 2023-08-24 デンカ株式会社 放熱シートの製造方法及び放熱シート
JP7433521B1 (ja) 2022-03-25 2024-02-19 バンドー化学株式会社 熱伝導性シート
WO2023190587A1 (ja) * 2022-03-29 2023-10-05 積水ポリマテック株式会社 熱伝導性シート及び熱伝導性シートの製造方法
US11615999B1 (en) 2022-07-22 2023-03-28 GuangDong Suqun New Material Co., Ltd Oriented heat conducting sheet and preparation method thereof, and semiconductor heat dissipating device

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000192337A (ja) * 1998-12-21 2000-07-11 Mitsubishi Chemicals Corp 黒鉛質炭素繊維及びそれを用いた放熱シート
JP2001322139A (ja) * 2000-05-16 2001-11-20 Jsr Corp 複合シートの製造方法および複合シート
JP4833398B2 (ja) * 2000-09-18 2011-12-07 ポリマテック株式会社 熱伝導性成形体の製造方法
JP2002097372A (ja) * 2000-09-20 2002-04-02 Polymatech Co Ltd 熱伝導性高分子組成物及び熱伝導性成形体
JP2003026828A (ja) * 2001-07-18 2003-01-29 Jsr Corp 熱伝導シートおよびその製造方法並びに熱伝導板
JP2003201116A (ja) * 2001-10-10 2003-07-15 Showa Denko Kk アルミナ粒、アルミナ粒の製造方法、アルミナ粒を含む組成物
WO2006003774A1 (ja) * 2004-07-06 2006-01-12 Mitsubishi Corporation 半導体用ヒートシンクに好適な炭素繊維強化炭素複合材料の製造方法
JP4911674B2 (ja) * 2005-02-21 2012-04-04 キヤノン株式会社 加熱定着部材および加熱定着装置
JP2009108118A (ja) * 2007-10-26 2009-05-21 Teijin Ltd ピッチ系炭素短繊維フィラー及びそれを用いた成形体
JP4971958B2 (ja) * 2007-11-30 2012-07-11 帝人株式会社 シート状熱伝導性成形体
JP2012023335A (ja) * 2010-06-17 2012-02-02 Sony Chemical & Information Device Corp 熱伝導性シート及びその製造方法
JP5668349B2 (ja) * 2010-07-22 2015-02-12 三菱樹脂株式会社 放熱性部材及び筐体
EP2871674B1 (en) * 2012-07-07 2020-12-02 Dexerials Corporation Thermally conductive sheet
CN104212368B (zh) * 2013-05-31 2019-08-16 日东电工株式会社 导热性粘合片
JP6069112B2 (ja) * 2013-06-19 2017-02-01 デクセリアルズ株式会社 熱伝導性シート及び熱伝導性シートの製造方法
JP5779693B2 (ja) * 2013-06-27 2015-09-16 デクセリアルズ株式会社 熱伝導性シート、及びその製造方法、並びに半導体装置
JP6178389B2 (ja) * 2014-12-25 2017-08-09 デクセリアルズ株式会社 熱伝導シートの製造方法、熱伝導シート、及び半導体装置

Also Published As

Publication number Publication date
CN109891577A (zh) 2019-06-14
WO2018047828A1 (ja) 2018-03-15
CN109891577B (zh) 2023-10-24
TW201826465A (zh) 2018-07-16
TWI714804B (zh) 2021-01-01
JP2018046073A (ja) 2018-03-22

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