JP6732239B2 - パワーモジュール基板およびその生産方法 - Google Patents
パワーモジュール基板およびその生産方法 Download PDFInfo
- Publication number
- JP6732239B2 JP6732239B2 JP2016248685A JP2016248685A JP6732239B2 JP 6732239 B2 JP6732239 B2 JP 6732239B2 JP 2016248685 A JP2016248685 A JP 2016248685A JP 2016248685 A JP2016248685 A JP 2016248685A JP 6732239 B2 JP6732239 B2 JP 6732239B2
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- Prior art keywords
- etching
- power module
- copper plate
- adhesive
- peeling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000005530 etching Methods 0.000 claims description 96
- 239000000463 material Substances 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 33
- 239000000853 adhesive Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 31
- 230000000873 masking effect Effects 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 238000005219 brazing Methods 0.000 claims description 19
- 239000000919 ceramic Substances 0.000 claims description 14
- 239000007921 spray Substances 0.000 claims description 14
- 238000000059 patterning Methods 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 50
- 229910052802 copper Inorganic materials 0.000 description 50
- 239000010949 copper Substances 0.000 description 50
- 206010040844 Skin exfoliation Diseases 0.000 description 46
- 239000002585 base Substances 0.000 description 30
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 21
- 238000004140 cleaning Methods 0.000 description 17
- 230000001070 adhesive effect Effects 0.000 description 15
- 239000000243 solution Substances 0.000 description 12
- 238000012545 processing Methods 0.000 description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000002313 adhesive film Substances 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 229920013716 polyethylene resin Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- LDDQLRUQCUTJBB-UHFFFAOYSA-O azanium;hydrofluoride Chemical compound [NH4+].F LDDQLRUQCUTJBB-UHFFFAOYSA-O 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910017855 NH 4 F Inorganic materials 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- LDDQLRUQCUTJBB-UHFFFAOYSA-N ammonium fluoride Chemical compound [NH4+].[F-] LDDQLRUQCUTJBB-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000010893 paper waste Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
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- Manufacturing Of Printed Circuit Boards (AREA)
Description
12−上側銅回路板
14−ロウ材
16−セラミックス基板
18−下側銅回路板
20−マスキングフィルム
100−スプレイエッチング装置
124−パワーモジュール母材
200−ピーリングユニット
Claims (2)
- セラミックス基板にロウ材を介して金属回路板が接合されてなるパワーモジュール基板の生産方法であって、
前記金属回路板に自己粘着型耐エッチングフィルムを貼付するマスキングステップと、
前記自己粘着型耐エッチングフィルムに対して、所望形状の回路パターンに対応するパターニング処理を施すことによって、前記自己粘着型耐エッチングフィルムにおける回路パターンに対応する領域以外を除去するパターニングステップと、
前記自己粘着型耐エッチングフィルムが除去された領域をスプレイエッチング処理によってエッチングするエッチングステップと、
を少なくとも含むパワーモジュール基板の生産方法。 - 前記パターニングステップにおいて、レーザによって、前記自己粘着型耐エッチングフィルムとともに前記金属回路板の一部を除去することを特徴とする請求項1に記載のパワーモジュール基板の生産方法。
Priority Applications (1)
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---|---|---|---|
JP2016248685A JP6732239B2 (ja) | 2016-12-22 | 2016-12-22 | パワーモジュール基板およびその生産方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2016248685A JP6732239B2 (ja) | 2016-12-22 | 2016-12-22 | パワーモジュール基板およびその生産方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018101763A JP2018101763A (ja) | 2018-06-28 |
JP6732239B2 true JP6732239B2 (ja) | 2020-07-29 |
Family
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Family Applications (1)
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JP2016248685A Active JP6732239B2 (ja) | 2016-12-22 | 2016-12-22 | パワーモジュール基板およびその生産方法 |
Country Status (1)
Country | Link |
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JP (1) | JP6732239B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020136638A (ja) * | 2019-02-26 | 2020-08-31 | 三菱マテリアル株式会社 | 絶縁回路基板の製造方法 |
KR20210142631A (ko) | 2019-03-26 | 2021-11-25 | 미쓰비시 마테리알 가부시키가이샤 | 절연 회로 기판 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6211291A (ja) * | 1985-07-09 | 1987-01-20 | 株式会社東芝 | 回路板の製造方法 |
JPH0667425A (ja) * | 1992-08-21 | 1994-03-11 | Mitsubishi Rayon Co Ltd | 可視光線硬化型光重合性組成物 |
JPH083767A (ja) * | 1994-06-14 | 1996-01-09 | Fujitsu Ltd | エッチング方法 |
JPH09116255A (ja) * | 1995-10-16 | 1997-05-02 | Oki Electric Ind Co Ltd | 回路パターンの形成方法 |
JP3449458B2 (ja) * | 1997-05-26 | 2003-09-22 | 電気化学工業株式会社 | 回路基板 |
JP4401096B2 (ja) * | 2003-03-26 | 2010-01-20 | Dowaホールディングス株式会社 | 回路基板の製造方法 |
JP4362597B2 (ja) * | 2003-05-30 | 2009-11-11 | Dowaメタルテック株式会社 | 金属−セラミックス回路基板およびその製造方法 |
JP4688706B2 (ja) * | 2006-01-27 | 2011-05-25 | 京セラ株式会社 | 放熱基板およびこれを用いた半導体装置 |
JP2008016507A (ja) * | 2006-07-03 | 2008-01-24 | Toshiba Tec Corp | 電気配線の製造方法 |
CN104011852B (zh) * | 2011-12-20 | 2016-12-21 | 株式会社东芝 | 陶瓷铜电路基板和使用了陶瓷铜电路基板的半导体装置 |
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2016
- 2016-12-22 JP JP2016248685A patent/JP6732239B2/ja active Active
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