JP6712765B2 - 高周波基板 - Google Patents
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- JP6712765B2 JP6712765B2 JP2016108984A JP2016108984A JP6712765B2 JP 6712765 B2 JP6712765 B2 JP 6712765B2 JP 2016108984 A JP2016108984 A JP 2016108984A JP 2016108984 A JP2016108984 A JP 2016108984A JP 6712765 B2 JP6712765 B2 JP 6712765B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/22—Antenna units of the array energised non-uniformly in amplitude or phase, e.g. tapered array or binomial array
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- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means
- H01Q9/0457—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means electromagnetically coupled to the feed line
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
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- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
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- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
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- H01Q21/00—Antenna arrays or systems
- H01Q21/29—Combinations of different interacting antenna units for giving a desired directional characteristic
- H01Q21/293—Combinations of different interacting antenna units for giving a desired directional characteristic one unit or more being an array of identical aerial elements
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- H—ELECTRICITY
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- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
- H01Q3/30—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array
- H01Q3/34—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
- H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
- H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/32—Adaptation for use in or on road or rail vehicles
- H01Q1/3208—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used
- H01Q1/3233—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q11/00—Electrically-long antennas having dimensions more than twice the shortest operating wavelength and consisting of conductive active radiating elements
- H01Q11/02—Non-resonant antennas, e.g. travelling-wave antenna
- H01Q11/04—Non-resonant antennas, e.g. travelling-wave antenna with parts bent, folded, shaped, screened or electrically loaded to obtain desired phase relation of radiation from selected sections of the antenna
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/08—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a rectilinear path
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
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- Variable-Direction Aerials And Aerial Arrays (AREA)
- Details Of Aerials (AREA)
- Radar Systems Or Details Thereof (AREA)
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Description
図1は、本発明の第1実施形態に係る高周波基板の構成を模式的に示す上面斜視図である。図2は、本発明の第1実施形態に係る高周波基板の構成を模式的に示す下面斜視図である。図3は、本発明の第1実施形態に係る高周波基板の構成の一部を模式的に示す断面図である。図4は、本発明の第1実施形態に係る高周波基板の構成の一部を模式的に示す上面図である。図5は、本発明の第1実施形態に係る高周波基板の構成の一部を模式的に示す下面図である。
以下、本発明の第2実施形態に係る高周波基板の構成ついて、図7ないし図9を用いて説明する。
以下、本発明の第3実施形態に係る高周波基板について説明する。
以下、本発明の第4実施形態に係る高周波基板について説明する。
以下、本発明の第5実施形態に係る高周波基板ついて説明する。
1a 第1積層板
1b 第2積層板
1c 第3積層板
1d 第4積層板
2 第2積層部(第2の電気絶縁性基材)
3 スルーホール
4 ビア
4a マイクロビア
4b インナービア
6 配線(アンテナ)パターン
7 ソルダーレジスト
9 整合回路
10 RFチップ
11 その他の回路部品
100 高周波基板
102 電気絶縁性基材
104 スルーホール
106 インピーダンス調整構造
Claims (8)
- 基板の片面に高周波信号の位相を制御することでビーム方向を調整するフェーズドアレイアンテナを備え、
前記フェーズドアレイアンテナの送信と受信の周波数は同じであり、
前記基板の前記フェーズドアレイアンテナが形成された面と異なる面には前記フェーズドアレイアンテナを形成するアンテナ素子とRFチップとのインピーダンスを整合させる整合回路が形成されており、
前記フェーズドアレイアンテナと前記整合回路は前記基板に形成されたスルーホールを介して接続されており、
前記スルーホールは前記基板の前記フェーズドアレイアンテナが形成された面と異なる面に開口を有する非貫通のビアで囲まれるように配置され、
前記非貫通のビアは、前記基板の表層に形成されたマイクロビアと、前記基板の内層に形成されたインナービアが厚み方向に階段状に接続された構造である、
高周波基板。 - 前記非貫通のビアは、前記基板の表層に形成されたマイクロビアと、前記基板の内層に形成されたインナービアが厚み方向に同一軸上にスタックされた構造である、
請求項1に記載の高周波基板。 - 前記マイクロビアの直径と前記インナービアの直径は等しい、
請求項1又は2に記載の高周波基板。 - 前記マイクロビアの直径と前記インナービアの直径は異なる、
請求項1に記載の高周波基板。 - 前記フェーズドアレイアンテナが形成されている電気絶縁性基材の誘電率及び誘電損失は、前記整合回路が形成されている電気絶縁性基材の誘電率及び誘電損失よりも小さい、
請求項1又は2に記載の高周波基板。 - 前記非貫通のビアは、前記整合回路が形成されている電気絶縁性基材の誘電率と等しい誘電率を有する基材にのみ形成されている、
請求項1ないし3のいずれか一項に記載の高周波基板。 - 前記スルーホールと、前記スルーホールを囲むように配置された前記非貫通のビアとの距離は、前記フェーズドアレイアンテナの送信及び受信周波数における波長の1/4以下である、
請求項1ないし4のいずれか一項に記載の高周波基板。 - 前記フェーズドアレイアンテナが形成されている電気絶縁性基材と、前記整合回路が形成されている電気絶縁性基材の主剤は、同じである、
請求項1ないし5のいずれか一項に記載の高周波基板。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016108984A JP6712765B2 (ja) | 2016-05-31 | 2016-05-31 | 高周波基板 |
CN201710275315.0A CN107437656B (zh) | 2016-05-31 | 2017-04-25 | 天线模块 |
EP17171760.6A EP3252870B1 (en) | 2016-05-31 | 2017-05-18 | Antenna module |
US15/603,062 US10141658B2 (en) | 2016-05-31 | 2017-05-23 | Antenna module |
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JP2016108984A JP6712765B2 (ja) | 2016-05-31 | 2016-05-31 | 高周波基板 |
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JP2017215197A JP2017215197A (ja) | 2017-12-07 |
JP6712765B2 true JP6712765B2 (ja) | 2020-06-24 |
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JP2016108984A Active JP6712765B2 (ja) | 2016-05-31 | 2016-05-31 | 高周波基板 |
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US (1) | US10141658B2 (ja) |
EP (1) | EP3252870B1 (ja) |
JP (1) | JP6712765B2 (ja) |
CN (1) | CN107437656B (ja) |
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JP2019149502A (ja) * | 2018-02-28 | 2019-09-05 | 京セラ株式会社 | 印刷配線板 |
JP7176870B2 (ja) * | 2018-07-05 | 2022-11-22 | 株式会社デンソーテン | 整合回路基板及びレーダ装置 |
CN111129746A (zh) * | 2018-10-30 | 2020-05-08 | 富士康(昆山)电脑接插件有限公司 | 电子设备及其制作方法 |
CN109525270B (zh) * | 2018-11-23 | 2023-08-08 | 上海庆科信息技术有限公司 | 线路板和无线通信模块 |
US11564316B2 (en) | 2018-11-29 | 2023-01-24 | Lockheed Martin Corporation | Apparatus and method for impedance balancing of long radio frequency (RF) via |
US11169240B1 (en) | 2018-11-30 | 2021-11-09 | Ball Aerospace & Technologies Corp. | Systems and methods for determining an angle of arrival of a signal at a planar array antenna |
JP7231428B2 (ja) | 2019-02-12 | 2023-03-01 | 日本ピラー工業株式会社 | 高周波回路基板の製造方法、及び高周波回路基板 |
US11327142B2 (en) | 2019-03-29 | 2022-05-10 | Ball Aerospace & Technologies Corp. | Systems and methods for locating and tracking radio frequency transmitters |
CN110068800A (zh) * | 2019-05-23 | 2019-07-30 | 无锡国芯微电子系统有限公司 | 毫米波多通道多功能soc芯片 |
CN112467356B (zh) * | 2019-09-09 | 2024-01-02 | 北京小米移动软件有限公司 | 一种天线组件及终端 |
KR102562039B1 (ko) | 2021-08-05 | 2023-08-02 | 아사히 가세이 가부시키가이샤 | 안테나 부재 |
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JP2000196331A (ja) * | 1998-12-24 | 2000-07-14 | Nec Corp | フェーズドアレイアンテナおよびその製造方法 |
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US20170346195A1 (en) | 2017-11-30 |
US10141658B2 (en) | 2018-11-27 |
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EP3252870A1 (en) | 2017-12-06 |
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