JP6711108B2 - ケーブル接続基板 - Google Patents
ケーブル接続基板 Download PDFInfo
- Publication number
- JP6711108B2 JP6711108B2 JP2016087330A JP2016087330A JP6711108B2 JP 6711108 B2 JP6711108 B2 JP 6711108B2 JP 2016087330 A JP2016087330 A JP 2016087330A JP 2016087330 A JP2016087330 A JP 2016087330A JP 6711108 B2 JP6711108 B2 JP 6711108B2
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- Japan
- Prior art keywords
- layer
- substrate
- cable
- signal layer
- solder joint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000004020 conductor Substances 0.000 claims description 39
- 239000000758 substrate Substances 0.000 claims description 39
- 229910000679 solder Inorganic materials 0.000 claims description 28
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 239000003989 dielectric material Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 56
- 230000005540 biological transmission Effects 0.000 description 7
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 2
- 208000032365 Electromagnetic interference Diseases 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/53—Fixed connections for rigid printed circuits or like structures connecting to cables except for flat or ribbon cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/707—Soldering or welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
- H01R13/6595—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members with separate members fixing the shield to the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
- H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
- H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
Description
図1乃至図5を参照しつつ、第1実施形態のケーブル接続基板について説明する。図1は第1実施形態のケーブル接続基板の概略構成を模式的に示す説明図である。図2は第1実施形態の基板の概略構成を模式的に示す説明図である。図3(A)は第1層の主要部を示す説明図であり、図3(B)は信号層の主要部を示す説明図であり、図3(C)は第2層の主要部を示す説明図である。図4(A)は基板の第1面側に設けられた第1開口部の周囲を示す説明図であり、図4(B)は基板の第2面側に設けられた第2開口部の周囲を示す説明図である。図5はケーブルの先端部を示す説明図である。なお、図1や図2は、断面図であり、各部材にハッチンが施されている。一方、図3(A)〜図4(B)は断面図ではないが、説明を分かり易くするために、図3(A)〜図4(B)に表わされた各部材には、部材毎に図1や図2に表わされている部材と共通のハッチングが施されている。
つぎに、図6を参照しつつ、第2実施形態について説明する。第2実施形態のケーブル接続基板50が第1実施形態のケーブル接続基板1と異なる点は、ケーブル接続基板50が誘電体35を備えている点である。第2実施形態の他の構成は、第1実施形態と異なるところがないので、共通する構成要素については、図面中、同一の参照番号を付し、その詳細な説明は省略する。
10 基板
10a 第1面
10a1 第1開口部
10b 第2面
10c 挿通孔
10d 第2開口部
11 第1層
11b ランド
12 第2層
13 信号層
13a 接続孔
20 ケーブル
21 内部導体
22 絶縁体
23 外部導体
31 第1半田接合部
32 第2半田接合部
35 誘電体
Claims (3)
- 基板内に配置されている信号層と、前記基板内に前記信号層を挟む状態で配置されている第1層及び第2層と、
外部導体と内部導体とを備えた同軸ケーブルであって、前記基板に接続され、前記基板の第1面側に延びるケーブルと、
前記ケーブルが備える前記外部導体と前記第1層とを接合する第1半田接合部と、
前記基板内において、前記ケーブルが備える前記内部導体の先端部と前記信号層とを接合する第2半田接合部と、
を、備え、
前記第1層は、前記信号層と前記第1面との間に配置されるとともに、前記基板の前記第1面側に形成された開口部内に露出したランドを備え、
前記信号層は、前記内部導体が接続される接続孔を備え、
前記第1半田接合部は、前記外部導体の先端面を前記第1層が備える前記ランドに密着させた状態で前記外部導体と前記第1層とを接合しており、
前記第2半田接合部は、外周壁面を前記接続孔の内周面に接触させた状態で前記接続孔に挿し込まれている前記内部導体と前記信号層とを接合している
ケーブル接続基板。 - 前記基板は、前記第1面の裏面側となる第2面側から前記信号層に到達している空間を備え、
前記第2半田接合部は、前記空間内に配置されており、
前記空間内に配置され、前記第2半田接合部を封止する誘電体を備える請求項1に記載のケーブル接続基板。 - 前記基板は、前記第1面の裏面側となる第2面側から前記信号層に到達している空間を備え、
前記内部導体の先端面は、前記信号層の前記空間側の面と面一とされている請求項1または2に記載のケーブル接続基板。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016087330A JP6711108B2 (ja) | 2016-04-25 | 2016-04-25 | ケーブル接続基板 |
US15/486,378 US10111319B2 (en) | 2016-04-25 | 2017-04-13 | Cable connection board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016087330A JP6711108B2 (ja) | 2016-04-25 | 2016-04-25 | ケーブル接続基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017199726A JP2017199726A (ja) | 2017-11-02 |
JP6711108B2 true JP6711108B2 (ja) | 2020-06-17 |
Family
ID=60090561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016087330A Expired - Fee Related JP6711108B2 (ja) | 2016-04-25 | 2016-04-25 | ケーブル接続基板 |
Country Status (2)
Country | Link |
---|---|
US (1) | US10111319B2 (ja) |
JP (1) | JP6711108B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10490915B2 (en) | 2017-06-07 | 2019-11-26 | Mitas Electronics, Llc | Gaussian chamber cable direct connector |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4701491A (en) | 1986-10-27 | 1987-10-20 | Dow Corning Corporation | Silicone extrusion stock |
US5046966A (en) * | 1990-10-05 | 1991-09-10 | International Business Machines Corporation | Coaxial cable connector assembly |
US5199879A (en) * | 1992-02-24 | 1993-04-06 | International Business Machines Corporation | Electrical assembly with flexible circuit |
JPH0621613A (ja) * | 1992-07-01 | 1994-01-28 | Hitachi Constr Mach Co Ltd | 配線用基板および同軸ケーブルの接続部の構造 |
JPH0637412A (ja) * | 1992-07-15 | 1994-02-10 | Fujitsu Ltd | プリント配線板 |
JPH0766516A (ja) * | 1993-08-31 | 1995-03-10 | Ibiden Co Ltd | プリント配線板及びプリント配線板におけるスルーホール形成方法 |
US6541711B1 (en) * | 2000-05-22 | 2003-04-01 | Cisco Technology, Inc. | Isolated ground circuit board apparatus |
JP2006222386A (ja) * | 2005-02-14 | 2006-08-24 | Toshiba Corp | プリント配線板、プリント回路基板、電子機器 |
JP5506737B2 (ja) | 2011-05-27 | 2014-05-28 | 株式会社日立製作所 | 信号伝送回路 |
-
2016
- 2016-04-25 JP JP2016087330A patent/JP6711108B2/ja not_active Expired - Fee Related
-
2017
- 2017-04-13 US US15/486,378 patent/US10111319B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2017199726A (ja) | 2017-11-02 |
US10111319B2 (en) | 2018-10-23 |
US20170311435A1 (en) | 2017-10-26 |
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