JP6710215B2 - 光源モジュール及び照明装置{light source module and lighting device} - Google Patents
光源モジュール及び照明装置{light source module and lighting device} Download PDFInfo
- Publication number
- JP6710215B2 JP6710215B2 JP2017537959A JP2017537959A JP6710215B2 JP 6710215 B2 JP6710215 B2 JP 6710215B2 JP 2017537959 A JP2017537959 A JP 2017537959A JP 2017537959 A JP2017537959 A JP 2017537959A JP 6710215 B2 JP6710215 B2 JP 6710215B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- light source
- source module
- light emitting
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/008—Combination of two or more successive refractors along an optical axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Securing Globes, Refractors, Reflectors Or The Like (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150008707A KR20160089142A (ko) | 2015-01-19 | 2015-01-19 | 광원 모듈 및 조명 장치 |
| KR10-2015-0008707 | 2015-01-19 | ||
| KR1020150010571A KR20160090590A (ko) | 2015-01-22 | 2015-01-22 | 광원 모듈 및 조명 장치 |
| KR10-2015-0010571 | 2015-01-22 | ||
| KR1020150049710A KR20160120527A (ko) | 2015-04-08 | 2015-04-08 | 광원 모듈 및 조명 장치 |
| KR10-2015-0049710 | 2015-04-08 | ||
| PCT/KR2016/000548 WO2016117905A1 (ko) | 2015-01-19 | 2016-01-19 | 광원 모듈 및 조명 장치 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018502433A JP2018502433A (ja) | 2018-01-25 |
| JP2018502433A5 JP2018502433A5 (enExample) | 2019-02-21 |
| JP6710215B2 true JP6710215B2 (ja) | 2020-06-17 |
Family
ID=56417370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017537959A Active JP6710215B2 (ja) | 2015-01-19 | 2016-01-19 | 光源モジュール及び照明装置{light source module and lighting device} |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US10627088B2 (enExample) |
| JP (1) | JP6710215B2 (enExample) |
| WO (1) | WO2016117905A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016120256A1 (de) * | 2016-10-24 | 2018-04-26 | Ledvance Gmbh | Beleuchtungsvorrichtung mit variabler lichtverteilung |
| JP6876972B2 (ja) * | 2016-11-22 | 2021-05-26 | パナソニックIpマネジメント株式会社 | 照明装置 |
| JP2018098126A (ja) * | 2016-12-16 | 2018-06-21 | パナソニックIpマネジメント株式会社 | 発光装置及び照明装置 |
| JP6854466B2 (ja) * | 2017-02-03 | 2021-04-07 | パナソニックIpマネジメント株式会社 | 発光装置及び照明装置 |
| JP6883784B2 (ja) * | 2017-04-24 | 2021-06-09 | パナソニックIpマネジメント株式会社 | 照明装置 |
| JP7199048B2 (ja) * | 2018-09-19 | 2023-01-05 | パナソニックIpマネジメント株式会社 | 発光装置、及びそれを備える移動体 |
| JP7189438B2 (ja) * | 2019-02-19 | 2022-12-14 | テイ・エス テック株式会社 | 照明装置 |
| CN212390157U (zh) * | 2020-05-28 | 2021-01-22 | 漳州立达信光电子科技有限公司 | 线条灯 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7646028B2 (en) * | 2003-06-17 | 2010-01-12 | Semiconductor Components Industries, L.L.C. | LED driver with integrated bias and dimming control storage |
| KR100516123B1 (ko) | 2005-08-30 | 2005-09-21 | 주식회사 누리플랜 | 라인형 엘이디 조명등 |
| US7479660B2 (en) * | 2005-10-21 | 2009-01-20 | Perkinelmer Elcos Gmbh | Multichip on-board LED illumination device |
| US8471479B2 (en) | 2007-07-27 | 2013-06-25 | Sharp Kabushiki Kaisha | Illumination device and display device using the same |
| KR101519331B1 (ko) * | 2008-02-18 | 2015-05-13 | 삼성디스플레이 주식회사 | 백라이트 어셈블리 및 이를 갖는 표시장치 |
| GB2458972B (en) | 2008-08-05 | 2010-09-01 | Photonstar Led Ltd | Thermally optimised led chip-on-board module |
| AU2009282776B2 (en) * | 2008-08-21 | 2013-10-10 | Elemedia Tech Of America, Llc | LED light engine |
| JP2011138715A (ja) * | 2009-12-29 | 2011-07-14 | Atex Co Ltd | Led照明装置 |
| US8723427B2 (en) | 2011-04-05 | 2014-05-13 | Abl Ip Holding Llc | Systems and methods for LED control using on-board intelligence |
| JP5441229B2 (ja) * | 2012-01-24 | 2014-03-12 | 株式会社KMTec | 照明器具 |
| JP2013206670A (ja) * | 2012-03-28 | 2013-10-07 | Panasonic Corp | 発光モジュールおよびそれを用いた照明器具 |
| JP2014072149A (ja) * | 2012-10-01 | 2014-04-21 | Panasonic Corp | 照明用光源及び照明装置 |
| KR20140063922A (ko) | 2012-11-19 | 2014-05-28 | 서울반도체 주식회사 | Led 조명장치 |
-
2016
- 2016-01-19 WO PCT/KR2016/000548 patent/WO2016117905A1/ko not_active Ceased
- 2016-01-19 US US15/544,436 patent/US10627088B2/en active Active
- 2016-01-19 JP JP2017537959A patent/JP6710215B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018502433A (ja) | 2018-01-25 |
| US10627088B2 (en) | 2020-04-21 |
| US20170350579A1 (en) | 2017-12-07 |
| WO2016117905A1 (ko) | 2016-07-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6710215B2 (ja) | 光源モジュール及び照明装置{light source module and lighting device} | |
| JP5330496B2 (ja) | 発光素子、発光素子の製造方法、及び発光素子パッケージ | |
| KR101998765B1 (ko) | 발광소자 패키지 | |
| TWI436503B (zh) | 發光裝置及發光裝置封裝件 | |
| TWI489655B (zh) | 發光裝置封裝件及照明系統 | |
| KR102080778B1 (ko) | 발광 소자 패키지 | |
| US20110227111A1 (en) | Light emitting device and light emitting device package | |
| KR20150142327A (ko) | 발광 소자 및 발광 소자 패키지 | |
| CN102891160A (zh) | 半导体发光装置和发光设备 | |
| US8928016B2 (en) | Light emitting device, light emitting device package, and light system | |
| US8809884B2 (en) | Light emitting device including an electrode on a textured surface, light emitting device package and lighting system | |
| EP2369644A2 (en) | Light emitting diode, method of manufacturing the same, light emitting diode package and lighting system including the same | |
| KR20170082889A (ko) | 발광소자 | |
| US9444016B2 (en) | Light emitting device | |
| JP2011146707A (ja) | 発光素子チップ、発光素子パッケージ | |
| KR20220051320A (ko) | 광원 모듈 및 조명 장치 | |
| KR20170124281A (ko) | 발광소자 패키지 | |
| KR20160090590A (ko) | 광원 모듈 및 조명 장치 | |
| KR101710889B1 (ko) | 발광 소자 | |
| KR20170082872A (ko) | 발광소자 | |
| KR20160120527A (ko) | 광원 모듈 및 조명 장치 | |
| KR20170077367A (ko) | 자외선 발광소자 패키지 | |
| KR102509312B1 (ko) | 발광 소자 패키지 | |
| KR101873587B1 (ko) | 발광소자 패키지 및 조명 장치 | |
| KR20140104294A (ko) | 반도체 발광소자 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190108 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190108 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20191129 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191210 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200122 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200519 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200526 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6710215 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |