JP2018502433A - 光源モジュール及び照明装置{light source module and lighting device} - Google Patents
光源モジュール及び照明装置{light source module and lighting device} Download PDFInfo
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- JP2018502433A JP2018502433A JP2017537959A JP2017537959A JP2018502433A JP 2018502433 A JP2018502433 A JP 2018502433A JP 2017537959 A JP2017537959 A JP 2017537959A JP 2017537959 A JP2017537959 A JP 2017537959A JP 2018502433 A JP2018502433 A JP 2018502433A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/008—Combination of two or more successive refractors along an optical axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
Abstract
Description
Claims (20)
- 基板と、
前記基板の上に位置した複数の発光素子パッケージと、
前記基板の上に位置した複数の駆動素子と、
前記基板の上に位置した連結端子部と、を含み、
前記基板の両端部と前記連結端子部との間の間隔は、前記基板の両端部と隣接した前記発光素子パッケージと前記基板の両端部との間の間隔以上である、光源モジュール。 - 前記複数の発光素子パッケージ、複数の駆動素子、及び連結端子部は、前記基板の上面の上に配置された、請求項1に記載の光源モジュール。
- 前記基板の上面の上には、前記複数の駆動素子、前記複数の発光素子パッケージ、及び前記連結端子部を電気的に連結する配線パターンを更に含む、請求項1に記載の光源モジュール。
- 前記連結端子部は、前記基板の一端と隣接した第1連結端子と、前記基板の他端と隣接した第2連結端子とを含む、請求項1に記載の光源モジュール。
- 前記基板の両端部と隣接した前記発光素子パッケージと前記基板の両端部との間の間隔は、前記複数の発光素子パッケージの間のピッチの1/2の長さを有する、請求項1に記載の光源モジュール。
- 前記基板の背面に配置された配線パターンを更に含む、請求項1に記載の光源モジュール。
- 前記基板には、前記配線パターン、前記複数の発光素子パッケージ、前記複数の駆動素子、及び前記連結端子部を電気的に連結するコンタクトホールを更に含む、請求項6に記載の光源モジュール。
- 前記複数の発光素子パッケージ及び連結端子部は、前記基板の一面上に配置され、
前記複数の駆動素子は、前記基板の背面に配置された、請求項1に記載の光源モジュール。 - 前記基板の上面に前記複数の発光素子パッケージと連結された第1配線パターンと、
前記基板の下面に前記複数の駆動素子と連結された第2配線パターンと、
前記第1及び第2配線パターンを電気的に連結するコンタクトホールと、を更に含む、請求項8に記載の光源モジュール。 - 前記連結端子部は、前記基板の一端と隣接した第1連結端子と、前記基板の他端と隣接した第2連結端子とを含む、請求項1に記載の光源モジュール。
- 前記第1及び第2連結端子は、前記基板の横方向と平行な方向に実装された、請求項10に記載の光源モジュール。
- 前記第1及び第2連結端子は、前記基板の縦方向と平行な方向に実装された、請求項7に記載の光源モジュール。
- 前記第1及び第2連結端子は、前記基板の横方向と縦方向との間の方向に傾斜するように実装された、請求項7に記載の光源モジュール。
- 請求項1〜13のいずれか一項に記載の光源モジュールを含む、照明装置。
- 前記光源モジュールを収納する下部カバーと、前記下部カバーを覆う上部カバーとを含み、
前記下部カバーは、
内側面から内側方向に突出した第1突起と、
前記第1突起によって形成され、前記上部カバーがスライドタイプで結合される第1係止溝と、
前記下部カバーは、内部底面から一定間隔離隔して内側面から内側方向に突出した第2突起と、
前記底面と前記第2突起との間に形成され、前記光源モジュールがスライドタイプで結合される第2係止溝と、を含み、
前記基板の下部面は、前記下部カバーの底面と直接接触する、請求項14に記載の照明装置。 - 前記光源モジュールと前記下部カバーとの間には絶縁部材と、前記下部カバーの両側端に前記光源モジュールの両側端を覆うサイドカバーとを含み、
前記サイドカバーは、固定部材が挿入される第1ホールを含み、前記下部カバーの底面には、前記第1ホールと対応する第2ホールを含み、前記光源モジュールの第1及び第2係止溝のそれぞれは、前記第1及び第2ホールと重なった、請求項14に記載の照明装置。 - 前記光源モジュールを収納する上面が開口したボディ部と、
前記ボディ部の上面を覆う上部カバーと、
前記光源モジュールの上に位置した少なくとも一つ以上の光学レンズと、を含む、請求項14に記載の照明装置。 - 請求項1から13のいずれか一項に記載の第1光源モジュールと、
請求項1から13のいずれか一項に記載の第2光源モジュールと、
前記第1光源モジュールと前記第2光源モジュールを連結する連結部材と、を含む、照明装置。 - 前記第1及び第2光源モジュールは、横方向または縦方向に連結される、請求項18に記載の照明装置。
- 前記第1光源モジュールは複数個からなり、
前記第2光源モジュールは複数個からなり、
前記第1及び第2光源モジュールは、横方向及び縦方向に相互連結される、請求項18に記載の照明装置。
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
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KR1020150008707A KR20160089142A (ko) | 2015-01-19 | 2015-01-19 | 광원 모듈 및 조명 장치 |
KR10-2015-0008707 | 2015-01-19 | ||
KR1020150010571A KR20160090590A (ko) | 2015-01-22 | 2015-01-22 | 광원 모듈 및 조명 장치 |
KR10-2015-0010571 | 2015-01-22 | ||
KR1020150049710A KR20160120527A (ko) | 2015-04-08 | 2015-04-08 | 광원 모듈 및 조명 장치 |
KR10-2015-0049710 | 2015-04-08 | ||
PCT/KR2016/000548 WO2016117905A1 (ko) | 2015-01-19 | 2016-01-19 | 광원 모듈 및 조명 장치 |
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JP2018502433A true JP2018502433A (ja) | 2018-01-25 |
JP2018502433A5 JP2018502433A5 (ja) | 2019-02-21 |
JP6710215B2 JP6710215B2 (ja) | 2020-06-17 |
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US (1) | US10627088B2 (ja) |
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WO (1) | WO2016117905A1 (ja) |
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JP6876972B2 (ja) * | 2016-11-22 | 2021-05-26 | パナソニックIpマネジメント株式会社 | 照明装置 |
JP2018098126A (ja) * | 2016-12-16 | 2018-06-21 | パナソニックIpマネジメント株式会社 | 発光装置及び照明装置 |
JP6854466B2 (ja) * | 2017-02-03 | 2021-04-07 | パナソニックIpマネジメント株式会社 | 発光装置及び照明装置 |
JP6883784B2 (ja) * | 2017-04-24 | 2021-06-09 | パナソニックIpマネジメント株式会社 | 照明装置 |
JP7199048B2 (ja) | 2018-09-19 | 2023-01-05 | パナソニックIpマネジメント株式会社 | 発光装置、及びそれを備える移動体 |
CN212390157U (zh) * | 2020-05-28 | 2021-01-22 | 漳州立达信光电子科技有限公司 | 线条灯 |
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JP6710215B2 (ja) | 2020-06-17 |
WO2016117905A1 (ko) | 2016-07-28 |
US20170350579A1 (en) | 2017-12-07 |
US10627088B2 (en) | 2020-04-21 |
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