JP6708792B2 - 粉末積層造形用の検出修復装置及びその方法 - Google Patents
粉末積層造形用の検出修復装置及びその方法 Download PDFInfo
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Description
3 修復ユニット
4 検出ユニット
5 イメージファイル切断層
21 粉末床プラットフォーム
22 粉末敷設機構
23 レーザーユニット
24 粉末フィーダー
31 移動機構
32 機構
41 カメラ
42 コントローラ
43 レーザー輪郭センサ
100 検出修復装置
101 ワーク
102 切削工具ハウジング
311 二次元移動プラットフォーム
312 多軸並列式ツール
313 移動ホルダー
320 主軸
321 切削工具
322 レーザークラッディング装置
323 交換ジョイント
Claims (15)
- 積層造形で製造されたワークに検出及び修復を行う粉末積層造形用の検出修復方法であって、
粉末敷設機構を用いて粉末を粉末床プラットフォームに敷設する粉末敷設ステップと、
レーザーユニットを用いて前記粉末床プラットフォームに敷設した粉末を溶融する溶融ステップと、
カメラを用いて、前記粉末床プラットフォームの溶融後の画像データを取得して、コントローラに伝送して検出を行う溶融検出ステップと、
前記コントローラが、前記溶融後の画像データの検出結果に基づいて、仕上げ機構を駆動して前記ワークの表面を修復させるか否かを判断する溶融修復ステップと、
を含み、
前記溶融検出ステップは、前記溶融後の画像データの凸起領域を検出して、前記凸起領域の位置及びサイズを算出するための凸起領域検出サブステップを有し、
前記溶融検出ステップはさらに、前記凸起領域検出サブステップの後に、所定仕上げ経路、前記凸起領域の位置及びサイズに基づいて、凸起領域仕上げ経路を算出する凸起領域仕上げ経路算出サブステップを有する、ことを特徴とする粉末積層造形用の検出修復方法。 - 前記凸起領域の明るさが、前記溶融後の画像データの切断層輪郭領域の平均明るさの110%以上である、ことを特徴とする請求項1に記載の粉末積層造形用の検出修復方法。
- 前記溶融修復ステップにおいて、前記仕上げ機構の複数の切削工具で前記凸起領域仕上げ経路に従って前記ワークの表面を仕上げる、ことを特徴とする請求項2に記載の粉末積層造形用の検出修復方法。
- 前記溶融検出ステップは、前記溶融後の画像データの窪み領域を検出して、前記窪み領域の位置及びサイズを算出する窪み領域検出サブステップを有する、ことを特徴とする請求項1に記載の粉末積層造形用の検出修復方法。
- 前記窪み領域の明るさが、前記溶融後の画像データの切断層輪郭領域の平均明るさの90%以下である、ことを特徴とする請求項4に記載の粉末積層造形用の検出修復方法。
- 前記溶融検出ステップはさらに、前記窪み領域検出サブステップの後に、所定仕上げ経路、前記窪み領域の位置及びサイズに基づいて窪み領域仕上げ経路を算出する窪み領域仕上げ経路算出サブステップを有する、ことを特徴とする請求項4に記載の粉末積層造形用の検出修復方法。
- 前記溶融修復ステップにおいて、前記仕上げ機構の複数の切削工具で前記窪み領域仕上げ経路に従って前記ワークの表面をリーミングして、次に前記仕上げ機構のレーザークラッディング装置によって前記ワークの表面にレーザークラッディングを行う、ことを特徴とする請求項6に記載の粉末積層造形用の検出修復方法。
- 積層造形で製造されたワークに検出及び修復を行う粉末積層造形用の検出修復方法であって、
粉末敷設機構を用いて粉末を粉末床プラットフォームに敷設する粉末敷設ステップと、
レーザーユニットを用いて前記粉末床プラットフォームに敷設した粉末を溶融する溶融ステップと、
カメラを用いて、前記粉末床プラットフォームの溶融後の画像データを取得して、コントローラに伝送して検出を行う溶融検出ステップと、
前記コントローラが、前記溶融後の画像データの検出結果に基づいて、仕上げ機構を駆動して前記ワークの表面を修復させるか否かを判断する溶融修復ステップと、
を含み、
前記粉末敷設ステップの後に、前記カメラを用いて、前記粉末床プラットフォームの粉末敷設後の画像データを取得して、前記コントローラに伝送して検出を行う粉末敷設検出ステップをさらに有し、
前記粉末敷設検出ステップは、前記粉末敷設後の画像データの切断層領域の明るさを検出する粉末敷設検出サブステップと、前記粉末敷設後の画像データの切断層輪郭領域の明るさを検出する反り検出サブステップとを有する、ことを特徴とする粉末積層造形用の検出修復方法。 - 前記粉末敷設検出サブステップにおいて、前記粉末敷設後の画像データの粉末未敷設領域が前記切断層領域の30%以上である場合、粉末敷設不良と判断する、ことを特徴とする請求項8に記載の粉末積層造形用の検出修復方法。
- 前記反り検出サブステップにおいて、前記粉末敷設後の画像データの反り領域が前記切断層輪郭領域の10%以上である場合、前記ワークに反りが生じたと判断する、ことを特徴とする請求項8に記載の粉末積層造形用の検出修復方法。
- 前記粉末敷設検出ステップの後にさらに、前記コントローラが前記粉末敷設後の画像データの検出結果に基づいて、粉末敷設、若しくは粉末敷設欠陥排除をするか否かを判断する粉末敷設修復ステップを含む、ことを特徴とする請求項8に記載の粉末積層造形用の検出修復方法。
- 積層造形で製造されたワークに検出及び修復を行う粉末積層造形用の検出修復装置であって、
前記ワークを形成するための粉末床プラットフォームと、前記粉末床プラットフォームに設けられて粉末を前記粉末床プラットフォームに敷設する粉末敷設機構と、前記粉末床プラットフォームの上方に設けられて前記粉末を溶融するレーザーユニットとを有する粉末床ユニットと、
前記粉末床プラットフォームの上方に設けられる移動機構と、前記移動機構に取り付けられて前記ワークの表面を修復する仕上げ機構とを有する修復ユニットと、
前記粉末床プラットフォームの上方に設けられて、前記粉末床プラットフォームの画像データを取得するカメラと、前記画像データを受信して、前記画像データに基づいて、粉末敷設、若しくは粉末敷設欠陥排除、又は前記仕上げ機構を駆動して前記ワークの表面を修復させることをするか否かを判断するコントローラを有する検出ユニットと、
を含み、
前記検出ユニットが、粉末敷設後の画像データの切断層領域の明るさを検出し、粉末敷設後の前記画像データの切断層輪郭領域の明るさを検出する反り検出を実行することを特徴とする粉末積層造形用の検出修復装置。 - 前記移動機構は、前記粉末床プラットフォームの上方に設けられた二次元移動プラットフォームと、前記二次元移動プラットフォームに設けられた多軸並列式ツールとを有する、ことを特徴とする請求項12に記載の粉末積層造形用の検出修復装置。
- 前記仕上げ機構は、複数の切削工具及び少なくとも1つのレーザークラッディング装置を有し、前記切削工具及びレーザークラッディング装置は前記多軸並列式ツールに交換可能に取り付けられる、ことを特徴とする請求項13に記載の粉末積層造形用の検出修復装置。
- 前記検出ユニットは、前記多軸並列式ツールに取り付けられて、前記粉末床プラットフォームの輪郭を検出するためのレーザー輪郭センサをさらに有する、ことを特徴とする請求項13に記載の粉末積層造形用の検出修復装置。
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