JP6700771B2 - インプリント装置、及び物品の製造方法 - Google Patents

インプリント装置、及び物品の製造方法 Download PDF

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Publication number
JP6700771B2
JP6700771B2 JP2015245647A JP2015245647A JP6700771B2 JP 6700771 B2 JP6700771 B2 JP 6700771B2 JP 2015245647 A JP2015245647 A JP 2015245647A JP 2015245647 A JP2015245647 A JP 2015245647A JP 6700771 B2 JP6700771 B2 JP 6700771B2
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JP
Japan
Prior art keywords
substrate
mold
gas
imprint apparatus
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015245647A
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English (en)
Japanese (ja)
Other versions
JP2017112231A5 (ko
JP2017112231A (ja
Inventor
一樹 中川
一樹 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2015245647A priority Critical patent/JP6700771B2/ja
Priority to PCT/JP2016/084972 priority patent/WO2017104382A1/en
Priority to KR1020187019253A priority patent/KR102081527B1/ko
Publication of JP2017112231A publication Critical patent/JP2017112231A/ja
Publication of JP2017112231A5 publication Critical patent/JP2017112231A5/ja
Application granted granted Critical
Publication of JP6700771B2 publication Critical patent/JP6700771B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/36—Imagewise removal not covered by groups G03F7/30 - G03F7/34, e.g. using gas streams, using plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2015245647A 2015-12-16 2015-12-16 インプリント装置、及び物品の製造方法 Active JP6700771B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2015245647A JP6700771B2 (ja) 2015-12-16 2015-12-16 インプリント装置、及び物品の製造方法
PCT/JP2016/084972 WO2017104382A1 (en) 2015-12-16 2016-11-25 Imprint apparatus, and method of manufacturing article
KR1020187019253A KR102081527B1 (ko) 2015-12-16 2016-11-25 임프린트 장치 및 물품 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015245647A JP6700771B2 (ja) 2015-12-16 2015-12-16 インプリント装置、及び物品の製造方法

Publications (3)

Publication Number Publication Date
JP2017112231A JP2017112231A (ja) 2017-06-22
JP2017112231A5 JP2017112231A5 (ko) 2019-01-24
JP6700771B2 true JP6700771B2 (ja) 2020-05-27

Family

ID=59056275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015245647A Active JP6700771B2 (ja) 2015-12-16 2015-12-16 インプリント装置、及び物品の製造方法

Country Status (3)

Country Link
JP (1) JP6700771B2 (ko)
KR (1) KR102081527B1 (ko)
WO (1) WO2017104382A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108539052B (zh) * 2018-03-30 2019-07-09 华中科技大学 一种封装柔性显示薄膜的装置、系统及方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7641840B2 (en) * 2002-11-13 2010-01-05 Molecular Imprints, Inc. Method for expelling gas positioned between a substrate and a mold
US7316554B2 (en) * 2005-09-21 2008-01-08 Molecular Imprints, Inc. System to control an atmosphere between a body and a substrate
US20110140304A1 (en) * 2009-12-10 2011-06-16 Molecular Imprints, Inc. Imprint lithography template
JP5647029B2 (ja) * 2011-02-18 2014-12-24 キヤノン株式会社 インプリント装置及び物品の製造方法
JP6064466B2 (ja) * 2012-09-11 2017-01-25 大日本印刷株式会社 インプリント方法およびそれを実施するためのインプリント装置
TWI667146B (zh) * 2012-10-04 2019-08-01 日商大日本印刷股份有限公司 壓印方法
JP6230041B2 (ja) * 2013-04-18 2017-11-15 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法

Also Published As

Publication number Publication date
KR20180090357A (ko) 2018-08-10
KR102081527B1 (ko) 2020-02-25
WO2017104382A1 (en) 2017-06-22
JP2017112231A (ja) 2017-06-22

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