JP6700423B2 - ボンディング装置 - Google Patents
ボンディング装置 Download PDFInfo
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- JP6700423B2 JP6700423B2 JP2018555956A JP2018555956A JP6700423B2 JP 6700423 B2 JP6700423 B2 JP 6700423B2 JP 2018555956 A JP2018555956 A JP 2018555956A JP 2018555956 A JP2018555956 A JP 2018555956A JP 6700423 B2 JP6700423 B2 JP 6700423B2
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- main shaft
- platen assembly
- shaft
- bonding apparatus
- bonding
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- 230000005540 biological transmission Effects 0.000 claims description 21
- 230000008602 contraction Effects 0.000 claims description 2
- 230000013011 mating Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 32
- 238000000034 method Methods 0.000 description 12
- 229910052710 silicon Inorganic materials 0.000 description 12
- 239000010703 silicon Substances 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
- H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
- B29C66/826—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined
- B29C66/8266—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined
- B29C66/82661—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined by means of vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B1/00—Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen
- B30B1/18—Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen by screw means
- B30B1/181—Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen by screw means the screw being directly driven by an electric motor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/061—Cushion plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
- B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
- B29C66/816—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps
- B29C66/8163—Self-aligning to the joining plane, e.g. mounted on a ball and socket
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
- B29C66/822—Transmission mechanisms
- B29C66/8223—Worm or spindle mechanisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Fluid Mechanics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Wire Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
接合パワーソースとしての役割をするモータ1と、
モータ1に固定連結されてモータ1によって駆動され、モータ1からの力を自己に連結された他の構成要素に向け、下方に伝達するように構成された伝達装置と、
天側部分に位置する天側チャンバ壁5、および底側部分に位置する底側チャンバ壁8を含むチャンバ壁によって画定された真空チャンバ6と、
を含む。一般的な場合、真空チャンバ6は、接合品質を劣化させる可能性のある、接合対象のシリコンウエハまたはウエハの間のエアバブルを防止すべく、ボンディング装置により行われる接合加工で圧力が加えられている間、真空チャンバ6からエアを抜くために、真空ポンプに連結することが可能である。
Claims (12)
- 上から下方に、
駆動装置と、
前記駆動装置に固定連結された伝達装置と、
前記伝達装置に連結された上部プラテンアセンブリと、
前記上部プラテンアセンブリと協働する下部プラテンアセンブリであって、前記下部プラテンアセンブリと前記上部プラテンアセンブリとの間に配置された接合の対象体を支持するように構成される、前記下部プラテンアセンブリと、
前記上部プラテンアセンブリおよび前記下部プラテンアセンブリの両方が中に収容される真空チャンバと、
を含む、ボンディング装置であって、
前記上部プラテンアセンブリは、前記上部プラテンアセンブリが、前記接合の対象体に均等な圧力を加えることが可能なように伸張できる可撓性プラテンによって、前記伝達装置に連結され、
前記可撓性プラテンが、上から下方に、上部プレートと下部プレートとを含み、前記上部プレートは伸張可能部材によって前記下部プレートに連結され、前記伸張可能部材が、一方端を前記上部プレートに、他方端を前記下部プレートに連結された下部じゃばらを含み、前記伸張可能部材に対する繋止機構が、前記上部プレートと前記下部プレートとの間にさらに配置され、前記伸張可能部材の伸張および収縮を限定するように構成される、ボンディング装置。 - 回転繋止機構が、前記可撓性プラテンと前記伝達装置との間に連結され、前記上部プラテンアセンブリが前記伝達装置の中心軸周りに回転するのを阻止するように構成される、請求項1に記載のボンディング装置。
- 前記伝達装置が、前記可撓性プラテンの上部に固定された主シャフトを含み、前記主シャフトは、前記真空チャンバの内部から前記真空チャンバの外部に延び、前記駆動装置に固定連結されている、請求項1に記載のボンディング装置。
- 前記主シャフトが、球面すべりスラスト軸受を通して前記可撓性プラテンの前記上部に固定される、請求項3に記載のボンディング装置。
- 前記真空チャンバが、上側部分に位置する天側チャンバ壁と下側部分に位置する底側チャンバ壁とを含み、前記主シャフトは、前記真空チャンバの前記内部から前記天側チャンバ壁を通り抜けて前記真空チャンバの前記外部に延びる、請求項3に記載のボンディング装置。
- ガイドシャフトが、前記天側チャンバ壁に設けられ、前記主シャフトの周りに均等に分布配置され、前記主シャフトの頂部に、直径が前記主シャフトより大きい上部フランジが設けられ、前記ガイドシャフトは、前記主シャフトが前記ガイドシャフトに沿って上下移動可能なように、前記上部フランジと摺動可能に係合される、請求項5に記載のボンディング装置。
- 前記上部フランジが、前記ガイドシャフトに対応する円形穴を画定し、前記ガイドシャフトが前記円形穴を通して挿入され、前記ガイドシャフトは、前記対応する円形穴と適応するクリアランスを形成する、請求項6に記載のボンディング装置。
- 前記主シャフトが深孔を画定し、前記深孔内に配置されたテーパーシャフトねじによって前記駆動装置に連結され、前記テーパーシャフトねじは、前記深孔と適応するクリアランスを形成する、請求項6に記載のボンディング装置。
- ねじナットは、前記上部フランジの端面に固定連結され、前記ねじナットがねじ嵌合で前記テーパーシャフトねじの上に配置されるように、前記テーパーシャフトねじと係合する内ねじ山を有する、請求項8に記載のボンディング装置。
- 前記主シャフトを囲む下部フランジが前記天側チャンバ壁に配置され、前記伝達装置は、一方端を前記上部フランジに、他方端を前記下部フランジに固定された上部じゃばらを備えており、前記上部じゃばらの各々は、前記主シャフトの中心軸と前記ガイドシャフトのうちのどの1つの中心軸との間の距離よりも小さな半径を有する、請求項9に記載のボンディング装置。
- 前記駆動装置と前記ねじナットとの間で、前記テーパーシャフトねじの上にスラスト軸受が配置される、請求項9に記載のボンディング装置。
- 前記駆動装置がモータである、請求項1に記載のボンディング装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610284256.9A CN107331604B (zh) | 2016-04-29 | 2016-04-29 | 一种键合设备 |
CN201610284256.9 | 2016-04-29 | ||
PCT/CN2017/082390 WO2017186161A1 (zh) | 2016-04-29 | 2017-04-28 | 一种键合设备 |
Publications (2)
Publication Number | Publication Date |
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JP2019515496A JP2019515496A (ja) | 2019-06-06 |
JP6700423B2 true JP6700423B2 (ja) | 2020-05-27 |
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Application Number | Title | Priority Date | Filing Date |
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JP2018555956A Active JP6700423B2 (ja) | 2016-04-29 | 2017-04-28 | ボンディング装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10780684B2 (ja) |
JP (1) | JP6700423B2 (ja) |
KR (1) | KR102177305B1 (ja) |
CN (1) | CN107331604B (ja) |
SG (1) | SG11201809491TA (ja) |
TW (1) | TWI663634B (ja) |
WO (1) | WO2017186161A1 (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
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DE102018114029B3 (de) * | 2018-06-12 | 2019-10-10 | Gebr. Schmidt Fabrik für Feinmechanik GmbH & Co. KG | Presse |
CN110814785B (zh) * | 2018-08-10 | 2021-04-02 | 上海微电子装备(集团)股份有限公司 | 限位装置及限位系统 |
CN110053289B (zh) * | 2019-05-14 | 2024-04-16 | 苏州美图半导体技术有限公司 | 真空胶键合机 |
CN110040684B (zh) * | 2019-05-14 | 2024-04-09 | 苏州美图半导体技术有限公司 | 自动解键合机 |
CN111613544B (zh) * | 2020-06-04 | 2023-03-10 | 山东晶升电子科技有限公司 | 真空晶圆键合机 |
US11884426B2 (en) * | 2020-07-08 | 2024-01-30 | Hamilton Sundstrand Corporation | Compression apparatus and methods of making and using the same |
CN112786523B (zh) * | 2021-01-11 | 2022-06-03 | 北京航空航天大学 | 一种用于芯片封装的热压烧结夹具及芯片封装方法 |
CN113710007B (zh) * | 2021-08-31 | 2022-04-12 | 东莞市黄江大顺电子有限公司 | 一种用于软硬结合板的辅助压合装置 |
CN115091450B (zh) * | 2022-07-15 | 2023-09-01 | 万勋科技(深圳)有限公司 | 柔性机械臂及机器人 |
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Publication number | Priority date | Publication date | Assignee | Title |
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US6793756B2 (en) * | 2002-03-22 | 2004-09-21 | Lg. Phillips Lcd Co., Ltd. | Substrate bonding apparatus for liquid crystal display device and method for driving the same |
US20040187616A1 (en) * | 2003-03-26 | 2004-09-30 | Watson Douglas C. | Bellows lateral stiffness adjustment |
JP4679890B2 (ja) | 2004-11-29 | 2011-05-11 | 東京応化工業株式会社 | サポートプレートの貼り付け装置 |
JP5296395B2 (ja) | 2008-03-03 | 2013-09-25 | 株式会社アドウェルズ | 接合装置 |
JP5518313B2 (ja) | 2008-08-29 | 2014-06-11 | ピーエスフォー ルクスコ エスエイアールエル | センスアンプ回路及び半導体記憶装置 |
KR20100034450A (ko) * | 2008-09-24 | 2010-04-01 | 삼성전자주식회사 | 기판접합장치 |
WO2010055730A1 (ja) * | 2008-11-14 | 2010-05-20 | 東京エレクトロン株式会社 | 貼り合わせ装置及び貼り合わせ方法 |
KR101085116B1 (ko) * | 2009-06-29 | 2011-11-18 | 에이피시스템 주식회사 | 기판 지지 모듈 및 기판 접합 장치 |
JP5129848B2 (ja) * | 2010-10-18 | 2013-01-30 | 東京エレクトロン株式会社 | 接合装置及び接合方法 |
JP5134673B2 (ja) * | 2010-10-29 | 2013-01-30 | 東京エレクトロン株式会社 | 貼り合わせ装置及び貼り合わせ方法 |
JP5558452B2 (ja) * | 2011-10-21 | 2014-07-23 | 東京エレクトロン株式会社 | 貼り合わせ装置 |
CN202434479U (zh) * | 2012-01-09 | 2012-09-12 | 中国科学院苏州纳米技术与纳米仿生研究所 | 一种原位等离子体清洗和键合晶片的设备 |
CN103489805A (zh) * | 2012-06-12 | 2014-01-01 | 苏州美图半导体技术有限公司 | 晶圆键合系统 |
JP6045972B2 (ja) * | 2013-04-25 | 2016-12-14 | 東京エレクトロン株式会社 | 接合装置、接合システムおよび接合方法 |
JP6104700B2 (ja) * | 2013-05-16 | 2017-03-29 | 東京エレクトロン株式会社 | 接合方法、接合装置および接合システム |
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TWI663634B (zh) | 2019-06-21 |
CN107331604B (zh) | 2020-06-16 |
US20190131149A1 (en) | 2019-05-02 |
US10780684B2 (en) | 2020-09-22 |
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JP2019515496A (ja) | 2019-06-06 |
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