SG11201809491TA - Bonding device - Google Patents

Bonding device

Info

Publication number
SG11201809491TA
SG11201809491TA SG11201809491TA SG11201809491TA SG11201809491TA SG 11201809491T A SG11201809491T A SG 11201809491TA SG 11201809491T A SG11201809491T A SG 11201809491TA SG 11201809491T A SG11201809491T A SG 11201809491TA SG 11201809491T A SG11201809491T A SG 11201809491TA
Authority
SG
Singapore
Prior art keywords
platen
flexible
assembly
platen assembly
upper platen
Prior art date
Application number
SG11201809491TA
Inventor
Hui Fu
Feixiang Shang
Original Assignee
Shanghai Micro Electronics Equipment Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micro Electronics Equipment Group Co Ltd filed Critical Shanghai Micro Electronics Equipment Group Co Ltd
Publication of SG11201809491TA publication Critical patent/SG11201809491TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/826—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined
    • B29C66/8266—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined
    • B29C66/82661—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps without using a separate pressure application tool, e.g. the own weight of the parts to be joined using fluid pressure directly acting on the parts to be joined by means of vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B1/00—Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen
    • B30B1/18—Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen by screw means
    • B30B1/181—Presses, using a press ram, characterised by the features of the drive therefor, pressure being transmitted directly, or through simple thrust or tension members only, to the press ram or platen by screw means the screw being directly driven by an electric motor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/061—Cushion plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
    • B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/816—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/8163—Self-aligning to the joining plane, e.g. mounted on a ball and socket
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/822—Transmission mechanisms
    • B29C66/8223—Worm or spindle mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis

Abstract

A bonding device. A flexible platen is disposed between an upper platen assembly () and a transmission device, and the flexible platen of the upper platen assembly (9) is located inside a vacuum chamber (6). The flexible platen is of a scalable structure. Therefore, when the flexible platen stretches or expands to have a larger volume, the flexible platen applies a downward pressure to the upper platen assembly (9) connected to the flexible platen, so that the upper platen assembly (9) moves downwards slowly. After the upper platen assembly (9) and a lower platen assembly (7) are both adhered to objects to be bonded tightly, the flexible platen continues applying the downward pressure to the upper platen assembly (9). In this way, the upper platen assembly (9) can apply a pressure to the objects to be bonded evenly. In addition, the flexible platen has the flexibility, and is relatively slow in stretching or volume expansion. Therefore, it is ensured that the upper platen assembly (9) applies a pressure slowly and evenly. 15
SG11201809491TA 2016-04-29 2017-04-28 Bonding device SG11201809491TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610284256.9A CN107331604B (en) 2016-04-29 2016-04-29 Bonding equipment
PCT/CN2017/082390 WO2017186161A1 (en) 2016-04-29 2017-04-28 Bonding device

Publications (1)

Publication Number Publication Date
SG11201809491TA true SG11201809491TA (en) 2018-11-29

Family

ID=60160709

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201809491TA SG11201809491TA (en) 2016-04-29 2017-04-28 Bonding device

Country Status (7)

Country Link
US (1) US10780684B2 (en)
JP (1) JP6700423B2 (en)
KR (1) KR102177305B1 (en)
CN (1) CN107331604B (en)
SG (1) SG11201809491TA (en)
TW (1) TWI663634B (en)
WO (1) WO2017186161A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018114029B3 (en) * 2018-06-12 2019-10-10 Gebr. Schmidt Fabrik für Feinmechanik GmbH & Co. KG Press
CN110814785B (en) * 2018-08-10 2021-04-02 上海微电子装备（集团）股份有限公司 Limiting device and limiting system
CN110053289B (en) * 2019-05-14 2024-04-16 苏州美图半导体技术有限公司 Vacuum adhesive bonding machine
CN110040684B (en) * 2019-05-14 2024-04-09 苏州美图半导体技术有限公司 Automatic bond-releasing machine
CN111613544B (en) * 2020-06-04 2023-03-10 山东晶升电子科技有限公司 Vacuum wafer bonding machine
US11884426B2 (en) * 2020-07-08 2024-01-30 Hamilton Sundstrand Corporation Compression apparatus and methods of making and using the same
CN112786523B (en) * 2021-01-11 2022-06-03 北京航空航天大学 Hot-pressing sintering clamp for chip packaging and chip packaging method
CN113710007B (en) * 2021-08-31 2022-04-12 东莞市黄江大顺电子有限公司 A supplementary compression fittings for soft or hard board
CN115091450B (en) * 2022-07-15 2023-09-01 万勋科技(深圳)有限公司 Flexible mechanical arm and robot

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6793756B2 (en) * 2002-03-22 2004-09-21 Lg. Phillips Lcd Co., Ltd. Substrate bonding apparatus for liquid crystal display device and method for driving the same
US20040187616A1 (en) * 2003-03-26 2004-09-30 Watson Douglas C. Bellows lateral stiffness adjustment
JP4679890B2 (en) * 2004-11-29 2011-05-11 東京応化工業株式会社 Support plate pasting device
JP5296395B2 (en) 2008-03-03 2013-09-25 株式会社アドウェルズ Joining device
JP5518313B2 (en) 2008-08-29 2014-06-11 ピーエスフォー ルクスコ エスエイアールエル Sense amplifier circuit and semiconductor memory device
KR20100034450A (en) * 2008-09-24 2010-04-01 삼성전자주식회사 Wafer bonding apparatus
JP5282100B2 (en) * 2008-11-14 2013-09-04 東京エレクトロン株式会社 Bonding apparatus and bonding method
KR101085116B1 (en) * 2009-06-29 2011-11-18 에이피시스템 주식회사 Subtrate holder module and subtrate assembliing appartus having the same
JP5129848B2 (en) * 2010-10-18 2013-01-30 東京エレクトロン株式会社 Joining apparatus and joining method
JP5134673B2 (en) * 2010-10-29 2013-01-30 東京エレクトロン株式会社 Bonding apparatus and bonding method
JP5558452B2 (en) * 2011-10-21 2014-07-23 東京エレクトロン株式会社 Bonding device
CN202434479U (en) * 2012-01-09 2012-09-12 中国科学院苏州纳米技术与纳米仿生研究所 In situ plasma cleaning and wafer bonding equipment
CN103489805A (en) * 2012-06-12 2014-01-01 苏州美图半导体技术有限公司 Wafer bonding system
JP6045972B2 (en) * 2013-04-25 2016-12-14 東京エレクトロン株式会社 Joining apparatus, joining system, and joining method
JP6104700B2 (en) * 2013-05-16 2017-03-29 東京エレクトロン株式会社 Joining method, joining apparatus and joining system

Also Published As

Publication number Publication date
WO2017186161A1 (en) 2017-11-02
CN107331604B (en) 2020-06-16
TWI663634B (en) 2019-06-21
US20190131149A1 (en) 2019-05-02
KR20190002626A (en) 2019-01-08
TW201806002A (en) 2018-02-16
JP6700423B2 (en) 2020-05-27
US10780684B2 (en) 2020-09-22
JP2019515496A (en) 2019-06-06
KR102177305B1 (en) 2020-11-10
CN107331604A (en) 2017-11-07

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