JP5296395B2 - Joining device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bonding apparatus that can precisely and easily perform alignment adjustment of the bonding surfaces of objects to be bonded or a stage on which objects to be bonded are held, thereby enabling excellent bonding. <P>SOLUTION: Fine alignment adjustment of a stage part 15 is carried out by detecting a load applied on the stage part 15 by loadcells 35a, 35b, 35c and moving a X-Y stage mechanism 11 by a X-Y table control section 52 so as to make a load balance detected uniform, while an alignment reference surface of a reference body 45 is abutted and pressed to a predetermined position including the center of curvature P of a spherical base part 25 of the stage part 15 by a pressing means 2. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a joining apparatus such as an ultrasonic vibration joining apparatus that joins a plurality of objects to be joined.

  Conventionally, when joining a plurality of stacked objects to be joined, in order to join the desired positions of the objects to be joined with high accuracy, the joining surfaces of the objects to be joined can be pressurized and joined with a uniform load. In addition, copying adjustment of the parallelism of the bonding surfaces of the objects to be bonded and the upper surface of the stage holding the objects to be bonded is performed before bonding.

  Generally, a copying apparatus is provided with a copying adjustment mechanism, and copying adjustment is performed by changing the position and inclination of a stage that holds an object to be bonded.

  For example, in the planar adjustment mechanism of Patent Document 1, a stage having a spherical outer shape portion on the lower surface is provided on the base portion via a support portion. The support portion is composed of a roll-shaped support portion capable of horizontal movement in the horizontal tangent direction of the spherical outer shape portion on the lower surface of the stage and rotational movement about the horizontal tangent line of the spherical outer shape portion. When the object to be bonded is pressed by the pressurizing mechanism while holding the bonded object on the upper surface of the stage, the stage moves to any direction in the horizontal plane so that the tilt can be freely changed like a pendulum in any direction. And the inclination of a to-be-joined object can be changed arbitrarily.

  The stage is connected to a horizontal movement mechanism. When a force is applied to the upper surface of the stage, the stage follows the spherical outer shape, and the stage moves horizontally by the horizontal movement mechanism following the movement. Conversely, the stage can be moved horizontally by a horizontal movement mechanism to change the inclination of the stage along the spherical outer shape. Therefore, pressurize the workpiece while holding the workpiece on the top of the stage, move the horizontal movement mechanism so that the bonding surface of the workpieces follows, and adjust the copying of the bonding surfaces of the workpieces. ing.

  Moreover, in the plane adjustment mechanism of Patent Document 1, the position of the object to be joined also changes in the vertical direction by changing the tilt of the stage. Therefore, by providing a plate spring-like member that generates an urging force in the vertical direction under the stage, the vertical displacement of the stage when the stage is moved in the horizontal direction with the object to be joined pressed is applied to the plate. The inclination and position of the stage are adjusted by absorbing the elastic force of the spring-like member. Therefore, after the joining surfaces of the objects to be joined are substantially imitated by the pressurization to the objects to be joined and the horizontal movement of the plane moving mechanism, the copying adjustment is performed using the elasticity of the leaf spring-like member.

JP 2003-295020 A (paragraphs 0035, 0068-0070, 0073, 0078, 0081, 0083, 0094, FIG. 2)

  However, the invention described in Patent Document 1 is complicated because it is necessary to repeatedly adjust the vertical movement control of the pressurization mechanism and the movement control of the horizontal movement mechanism when performing the plane adjustment. Adjustment of the moving direction and moving distance of the stage is complicated. Therefore, it is not easy to perform plane adjustment with high accuracy.

  In addition, it is possible to perform horizontal movement of the stage in a pressurized state by the above-described leaf spring-like member. However, since the above-described leaf spring-like member is thin and easily damaged, the stage is in a pressurized state. If the horizontal movement is greatly performed, the leaf spring-shaped member may be destroyed. Therefore, there is a problem that the stage cannot be moved beyond a predetermined range in a pressurized state, and it is difficult to stably perform the copying adjustment with high accuracy.

  Further, since the invention described in Patent Document 1 does not include a mechanism for monitoring whether or not the copying adjustment is performed with high accuracy, the copying is confirmed by, for example, confirming that the image is taken in an enlarged image monitor. Adjustments are being made. Therefore, it is not easy to determine whether or not the copying adjustment is strictly performed.

  Therefore, the present invention provides a joining apparatus that can easily and accurately perform the copying adjustment of the joining surfaces of the objects to be joined or the stage that holds the objects to be joined, and enables good joining. Objective.

In order to solve the above-described problems, a joining apparatus according to the present invention is a joining apparatus that joins a plurality of stacked objects to be joined, and a support base installed on a base and the support base. A support base, a spherical base having a spherical surface on the lower surface and disposed slidably with respect to the support; and a copying reference in which an object to be joined is placed on the upper surface and installed on the upper surface of the spherical base. And a connecting mechanism disposed on the lower surface side of the spherical base, and connected to the spherical base by the connecting mechanism and moved in two directions perpendicular to each other in a horizontal plane to support the spherical base A mounting means having a moving mechanism for slidingly moving the spherical base by following the reference, a pressing means having a reference body having a copying reference surface, and the reference body on the upper surface of the copying reference portion With the pressurizing means in a state where the copying reference surface is in contact Comprising a detection means for detecting a load balance according to the mounting means and the serial reference body to said spherical base portion which is the scanning movement by pressurizing, and control means for the load balance controls the moving mechanism so as to be uniform The coupling mechanism has a cylindrical portion fixed to one of the spherical base and the moving mechanism, and a spherical concave portion for holding a spherical body slidably, and is fixed to the other of the spherical base and the moving mechanism. and receiving the one end is characterized in Rukoto and a shaft portion to which the other end is fixed to the sphere to slide internally fitted to the cylindrical portion in the axial direction and the axial direction around the cylindrical portion (claim 1).

Moreover, the joining apparatus concerning this invention is a joining apparatus which joins the several to-be-joined to-be-joined object, The mounting base by which a to-be-joined object is mounted in the upper surface, and the support stand installed in the lower surface side of the base A copying apparatus comprising: a supporting portion installed under the supporting base; a spherical base portion having a spherical surface on an upper surface thereof; and a slidable arrangement with respect to the supporting portion; and a reference body having a copying reference surface. A reference portion; a connection mechanism disposed on the upper surface side of the spherical base; and the connection mechanism connected to the spherical base by the connection mechanism and moving in two directions perpendicular to each other in a horizontal plane to move the spherical base A pressurizing means having a moving mechanism for slidingly moving the spherical base portion by sliding with respect to the support portion; and the pressurizing means in a state where the scanning reference surface of the reference body is in contact with the upper surface of the mounting table. By applying pressure to the reference body and the mounting table. Detecting means for detecting a load balance according to the spherical base was, and control means for controlling the moving mechanism so that the load balance is uniform, wherein the connecting mechanism, the spherical base and the moving mechanism A cylindrical portion fixed to one of the two, a spherical concave portion holding the spherical body slidably, a receiving portion fixed to the other of the spherical base and the moving mechanism, and one end fixed to the spherical body There has been characterized Rukoto and a shaft portion to slide internally fitted to the cylindrical portion in the axial direction and the axial direction around the cylindrical portion (claim 2).

Further, the joining device according to the present invention is a joining device for joining a plurality of stacked objects to be joined, a spherical base portion having a spherical surface on the upper surface and installed on a base, and a slide on the spherical base portion. A support portion disposed movably, a support base installed on the support portion, a coupling mechanism disposed on the upper surface side of the spherical base portion, and the spherical base portion coupled by the coupling mechanism And a moving mechanism that moves in two directions orthogonal to each other and slides the support portion with respect to the spherical base to move the support portion, and an object to be joined is placed on the upper surface of the support base. A mounting means having a mounting table, a pressing means having a reference body having a copying reference surface, and the pressing means in a state where the copying reference surface of the reference body is in contact with the upper surface of the mounting table. The reference body and the mounting means are moved by applying pressure. Comprising a detection means for detecting a load balance according to the spherical base and a control means for the load balance controls the moving mechanism to be uniform, wherein the connecting mechanism, the spherical base and the moving mechanism A cylindrical portion fixed to one side, a spherical concave portion that holds the sphere slidably, a receiving portion fixed to the other of the spherical base and the moving mechanism, one end fixed to the sphere and the other end It is characterized in Rukoto and a shaft portion for internally fitted to slide on said cylindrical portion and the shaft and axial direction around the cylindrical portion (claim 3).

Further, the bonding apparatus according to the present invention is a bonding apparatus for bonding a plurality of stacked objects to be bonded, a mounting table on which an object to be bonded is mounted on an upper surface, a support table installed on a base, A support portion installed on the support base, a spherical base portion having a spherical surface on the bottom surface and slidably disposed with respect to the support portion; and a lower surface side of the spherical base portion. A connecting mechanism, and a moving mechanism that is connected to the spherical base portion by the connecting mechanism and moves in two directions orthogonal to each other and slides the spherical base portion with respect to the support portion so as to follow the spherical base portion. And a pressing means having a reference body having a copying reference surface under the base, and the reference means by the pressing means with the copying reference surface of the reference body in contact with the upper surface of the mounting table. The spherical base moved by copying the body and the mounting table Comprising a detection means for detecting a load balance according, and a control means for the load balance controls the moving mechanism so as to uniformly, the connecting mechanism is secured to one of said spherical base portion and said moving mechanism A cylindrical portion, a spherical concave portion that holds the spherical body slidably, a receiving portion fixed to the other of the spherical base and the moving mechanism, one end fixed to the spherical body, and the other end to the cylindrical portion. and a shaft portion to slide internally fitted to the cylindrical portion in the axial direction and the direction around the axis is characterized in Rukoto (claim 4).

In the bonding apparatus according to claim 1, the center of curvature of the spherical surface of the spherical base is located on the upper surface side of the scanning reference portion, and the center of the upper surface of the scanning reference portion is the spherical surface of the spherical base . It is characterized by being on a line passing through the center of curvature and perpendicular to the upper surface of the scanning reference portion (claim 5).

Further, in the joining device according to claim 2, the center of curvature of the spherical surface of the spherical base is located on the lower surface side of the reference body having the scanning reference surface, and the center of the lower surface of the reference body is the spherical surface. It is characterized in that it is on a line perpendicular to the scanning reference plane through the center of curvature of the spherical surface of the base (claim 6).

  Further, in the joining device according to any one of claims 1 to 6, the detection means includes a load sensor arranged at each vertex position of an equilateral triangle, and the center of gravity of the equilateral triangle is the sphere base portion. It is characterized by being on a line that passes through the center of curvature of the spherical surface and is perpendicular to the plane formed by the apex of the regular triangle (claim 7).

  According to the first aspect of the invention, since the movement control of the moving mechanism is performed while monitoring the load balance detected by the detecting means, the reference reference surface of the reference object is brought into contact with the upper surface of the reference reference portion and the mounting means. After performing the copy adjustment by applying pressure, the load balance applied to the spherical base can be detected by the detecting means, and the moving mechanism can be controlled so as to make the load balance uniform and fine adjustment can be performed with high accuracy. Therefore, the upper surface of the scanning reference portion and the scanning reference surface of the reference body can be easily copied with high accuracy.

  According to the second aspect of the invention, since the movement mechanism is controlled while monitoring the load balance detected by the detecting means, the reference reference surface of the reference body and the mounting table are brought into contact with the upper surface of the mounting table. After pressurizing and performing copying adjustment, the load balance applied to the spherical base can be detected by the detecting means, and the moving mechanism can be controlled to make fine adjustment with high accuracy so that the load balance becomes uniform. Therefore, the upper surface of the mounting table and the copying reference surface of the reference body can be easily copied with high accuracy.

  According to the invention of claim 3, since the movement control of the moving mechanism is performed while monitoring the load balance detected by the detecting means, the reference reference surface and the mounting means are brought into contact with the upper surface of the mounting table by contacting the reference reference surface of the reference object. After pressurizing and performing copying adjustment, the load balance applied to the spherical base can be detected by the detecting means, and the moving mechanism can be controlled to make fine adjustment with high accuracy so that the load balance becomes uniform. Therefore, the upper surface of the mounting table and the copying reference surface of the reference body can be easily copied with high accuracy.

  According to the invention of claim 4, since the movement control of the moving mechanism is performed while monitoring the load balance detected by the detection means, the reference reference surface of the reference body is brought into contact with the upper surface of the mounting table so that the reference body and the mounting table are After pressurizing and performing copying adjustment, the load balance applied to the spherical base can be detected by the detecting means, and the moving mechanism can be controlled to make fine adjustment with high accuracy so that the load balance becomes uniform. Therefore, the upper surface of the mounting table and the copying reference surface of the reference body can be easily copied with high accuracy.

  According to the invention of claim 5, even if the spherical base portion slides and moves on the support portion, the position of the center of curvature of the spherical surface of the spherical base portion does not change, and the center of the upper surface of the scanning reference portion is the spherical base portion. The load balance is applied to the spherical base by contacting the reference surface with a position that includes the center of the upper surface of the reference surface. Can be detected stably and accurately. In addition, it is possible to easily adjust the copying by controlling the moving mechanism so that the load balance applied to the spherical base is uniform.

  According to the invention of claim 6, since the center of the lower surface of the reference body provided with the copying reference surface passes through the center of curvature of the spherical surface of the spherical base and is on a line perpendicular to the copying reference surface, the copying reference surface By bringing the position including the center of the lower surface of the surface into contact with the upper surface of the mounting table, the load balance applied to the spherical base can be detected stably and accurately. In addition, it is possible to easily adjust the copying by controlling the moving mechanism so that the load balance applied to the spherical base is uniform.

  According to the invention of claim 7, the center of gravity of the equilateral triangle having the load sensor disposed at the vertex position is on a line perpendicular to the plane formed by the apex of the equilateral triangle through the center of curvature of the spherical surface of the spherical base. Therefore, the scanning mechanism of the spherical base portion or the support portion can be adjusted by controlling the moving mechanism so that the center of gravity of the load detected by each load sensor overlaps the center of gravity of the equilateral triangle. In addition, when the detected values of the load sensors provided at the vertex positions of the equilateral triangle are equal, the center of gravity of the load and the position of the equilateral triangle match, so the control of the moving mechanism is performed so that the detected values of the load sensor are equal. It can be performed. Therefore, it is possible to adjust the copying more simply.

(First embodiment)
A first embodiment in which an ultrasonic vibration bonding apparatus is taken as an example of a bonding apparatus according to the present invention will be described with reference to FIGS. 1 to 6. 1 is a schematic configuration diagram of a bonding apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of mounting means for mounting a first object to be bonded, FIG. 3 is a top view of the mounting means, and FIG. FIG. 5 and FIG. 6 are schematic configuration diagrams of the mounting means in the modified example. In this embodiment, an apparatus for joining objects to be joined by ultrasonic vibration will be described.

1. Apparatus Configuration As shown in FIG. 1, the bonding apparatus according to the present embodiment includes a mounting means 1 for holding a first object to be bonded, a pressing means 2 for pressing the object to be bonded, and an entire apparatus. And a control device 3 for monitoring and controlling the operation.

  As shown in FIGS. 1 to 4, the mounting means 1 includes an XY table mechanism 11 as a moving mechanism in the present invention, a support 12, and a support base 13 on a base 10, and rollers 14 a, 14 b, 14c, the stage part 15, and the connection mechanism 16. In addition, the base 10, the support column 12, and the support base 13 are fixed and operate together.

  The XY table mechanism 11 includes drive motors 20a and 20b made of servo motors, ball screws (not shown), and horizontal movement tables 11a and 11b configured to be movable in the XY directions, respectively. Yes. In the horizontal movement tables 11a and 11b, when the drive motors 20a and 20b are excited and operated, the rotations of the drive motors 20a and 20b are transmitted to the ball screws to rotate the ball screws, and both the tables 11a and 11b are moved to the ball screws. Are moved in the X direction and Y direction, respectively. Further, by reversing the current flowing through the drive motors 20a and 20b, the rotation of the drive motors 20a and 20b is reversed, and both tables 11a and 11b move in the opposite directions in the X and Y directions, respectively.

  When the excitation of the drive motors 20a and 20b is canceled, both tables 11a and 11b move freely regardless of the operation of the drive motors 20a and 20b, and the drive motors 20a and 20b are excited to rotate. When the servo control signal is given, both tables 11a and 11b move in conjunction with rotation of the drive motors 20a and 20b. Further, when the drive motors 20a and 20b are stopped in an excited state, both the tables 11a and 11b are fixed at predetermined positions.

  The stage portion 15 includes a spherical base portion 25 having a cylindrical lower peripheral surface processed into a spherical shape and having a spherical surface on the lower surface, and the same shape as the spherical base portion 25 in plan view, and a first object to be bonded on the upper surface. The scanning reference unit 26 is held. The copying reference portion 26 is formed by sequentially laminating a holding portion 29 for holding an object to be joined via a heat insulating portion 27 and a heater portion 28 on the upper surface of the spherical base portion 25. Further, the scanning reference portion 26 is located at the position of the center of curvature P of the spherical surface of the lower surface of the spherical base portion 25 (here, the point P in FIG. 1 and below corresponds to the center of curvature), and the center of the upper surface of the scanning reference portion 26 is approximately. They are arranged to match. By arranging in this way, if the scanning adjustment is performed based on the center of the upper surface of the scanning reference portion 26, the scanning adjustment can be performed with high accuracy. Further, by holding the object to be bonded at a position including the center of the upper surface of the above-described scanning reference portion 26, a stable bonding operation can be performed.

  The holding unit 29 that holds the first workpiece is provided with a suction mechanism (not shown) for holding the workpiece by vacuum suction. Note that the method for holding the object to be bonded is not limited to the vacuum adsorption method described above, and other methods may be used. Further, the copying reference unit 26 does not necessarily include the heater unit 28 for heating the object to be joined as in the present embodiment.

  The spherical base 25 is connected to the XY table mechanism 11 via the connecting mechanism 16. As shown in FIG. 1, the coupling mechanism 16 includes a round bar-like shaft body whose upper end is disposed at the center of the lower surface of the spherical base 25, and a shaft portion 30 formed of a sphere integrally formed with the lower end of the shaft body; A cylindrical portion 31 that is externally fitted to the shaft body of the shaft portion 30 and slidably supports the shaft portion 30 in the axial direction and the direction around the shaft, and a sphere of the shaft portion 30 fixed to the upper surface of the upper horizontal movement table 11a. And a receiving portion 32 having a spherical concave portion for slidably holding.

  Here, the shaft body of the shaft portion 30 is disposed on a line passing through the center of curvature P of the spherical surface of the spherical base portion 25 of the stage portion 15.

  With such a configuration, the inclination of the stage unit 15 can be freely changed in accordance with the operation of both the tables 11a and 11b of the XY table mechanism 11 by the spherical body of the shaft unit 30 of the coupling mechanism 16 and the receiving unit 32. . Further, when the inclination of the stage unit 15 is changed by the movement of the XY table mechanism 11, the shaft unit 30 is pivoted with respect to the cylindrical unit 31 of the coupling mechanism 16 with the movement of the stage unit 15 and the XY table mechanism 11. Since the distance fluctuation between the stage part 15 and the XY table mechanism 11 is absorbed and adjusted by sliding in the axial direction of the part 30 and the axial direction, the inclination angle of the upper surface of the scanning reference part 26 of the stage part 15 Can be changed.

  In addition, the stage unit 15 is supported on the upper surface of the support base 13 via three rollers 14a, 14b, and 14c arranged at positions corresponding to the apexes of the equilateral triangle. Further, the spherical surface of the spherical base 25 is slidably supported by the rollers 14a, 14b, and 14c with the following configuration.

  As shown in FIG. 3, each of the rollers 14 a, 14 b, and 14 c is configured by a shaft 33 that is disposed in the horizontal direction and a stroke portion 34 that is externally fitted to the shaft 33, and the stroke portion 34 is the axial direction of the shaft 33. The shaft 33 can be moved by a predetermined amount and can freely rotate around the shaft 33. Therefore, the inclination angle of the upper surface of the scanning reference portion 26 of the stage portion 15 can be varied by the operation of each roller 14a, 14b, 14c, and the stage portion 15 can be copied stably with respect to the reference body (reference numeral 45 in FIG. 1). Can be moved.

  In the state in which the excitation of the drive motors 20 a and 20 b of the XY table mechanism 11 is released, when the upper surface of the copying reference unit 26 is pressurized to a predetermined inclination, the XY table mechanism 11 Move in conjunction with the tilt. Further, when the XY table mechanism 11 stops at a predetermined position while the drive motors 20a and 20b of the XY table mechanism 11 are excited, the XY table mechanism 11 is fixed, and the stage unit 15 The tilt is also fixed. Therefore, the means for controlling the excitation of the drive motors 20a and 20b corresponds to the fixing mechanism in the present invention.

  Furthermore, between each roller 14a, 14b, 14c and the support stand 13, three load cells 35a, 35b, 35c which consist of load sensors, such as a strain gauge for detecting the load concerning the stage part 15, and a semiconductor pressure sensor, are provided. Each is arranged. At this time, each load cell 35a, 35b, 35c is arranged at each vertex position of the equilateral triangle, and the center of gravity position of the equilateral triangle formed by each load cell 35a, 35b, 35c is the center of curvature P of the spherical surface of the spherical base 25. The load cells 35a, 35b, and 35c are arranged so as to be positioned on a vertical line passing through.

  Each load cell 35a, 35b, 35c is arranged at the apex of the equilateral triangle as described above, and the center of gravity of the equilateral triangle passes through the curvature center P of the spherical surface of the spherical base 25 as described above. As long as it is located on the line, it may be arranged not only under the rollers 14a, 14b, 14c, but also under the base 10 or the support base 13, for example. Moreover, as long as each load cell 35a, 35b, 35c is arrange | positioned in the above-mentioned position, each roller 14a, 14b, 14c does not need to be arrange | positioned at the vertex of an equilateral triangle.

  The pressurizing means 2 includes a head portion 39 that holds the second object to be bonded, and a vertical drive mechanism 40 that abuts the second object to be bonded to the first object to be bonded.

  As shown in FIG. 1, the head unit 39 includes a resonator 42 having a vibrator 41. The resonator 42 is disposed in the head portion 39 with the position of the minimum vibration amplitude point supported by the resonator support portion 43. A holding portion 44 for holding the second object to be bonded is provided on the lower surface of the center portion of the resonator corresponding to the position of the maximum vibration amplitude point of the resonator 42. A vacuum suction method is used as a method for holding the second object to be joined, and a suction mechanism (not shown) is provided in the holding portion 44. Note that the method for holding the object to be bonded is not limited to the vacuum adsorption method, and may be a method for holding the object mechanically. The holding unit 44 may be formed at any one of the maximum vibration amplitude points located at both ends of the resonator 42 or at other positions.

  Moreover, when joining of to-be-joined objects is performed by a heating, you may provide the heating mechanism, such as a heater, in the head part 39. FIG.

  Further, the holding unit 44 not only holds the object to be joined, but also holds a reference body 45 having a reference surface for scanning adjustment when performing scanning adjustment as will be described later, and performs scanning adjustment using the reference surface as a reference. I do. When performing copying adjustment, instead of holding the reference body 45, the lower surface of the holding portion 44 itself may be used as a copying reference surface.

  The control means 3 includes a load detection unit 50, a pressurization control unit 51, an XY table control unit 52, and an ultrasonic vibration control unit 53. The load of the stage unit 15 applied to each of the load cells 35a, 35b, and 35c is detected by the load detection unit 50 of the control device 3, and the load balance of the detected load cells 35a, 35b, and 35c becomes uniform (however, The scanning control of the stage unit 15 is performed by the pressurization control unit 51 and the XY table control unit 52 so that the offset amount at the time of zero load of each cell is ignored. The ultrasonic vibration control unit 53 controls the vibration of the vibrator 41, and controls the ultrasonic vibration applied to the object to be bonded at the time of bonding. Here, the load detection unit 50 and the XY table control unit 52 correspond to the “control unit” in the present invention.

2. Scanning Adjustment Operation Next, the scanning adjustment operation will be described. The scanning adjustment is performed prior to the joining of the first and second objects to be bonded, and the center of the upper surface of the copying reference portion 26 on which the first object to be bonded is mounted without holding both objects to be bonded. In the state where the copying reference surface of the reference body 45 of the head portion 39 is in contact.

  First, copy adjustment is performed. First, the excitation of the drive motors 20a and 20b of the XY table mechanism 11 is released so that the XY table mechanism 11 moves freely when the upper surface of the scanning reference portion 26 of the stage unit 15 is pressurized. To. Then, the head unit 39 is lowered by the vertical drive mechanism 40 so that the copying reference surface of the reference body 45 held by the holding unit 44 of the head unit 39 contacts a predetermined position including the center of the upper surface of the copying reference unit 26. .

  When a predetermined pressure is applied by the pressurization control unit 51 in a state where the scanning reference surface of the reference body 45 is in contact with the upper surface of the scanning reference portion 26, the upper surface of the scanning reference portion 26 is inclined with respect to the scanning reference surface of the reference body 45. According to the predetermined inclination. At this time, the spherical surface of the spherical base portion 25 of the stage portion 15 slides on the rollers 14a, 14b, and 14c and rotates around the center of curvature P of the spherical surface.

  Each roller 14a, 14b, 14c moves along the axial direction of the shaft 33 and around the shaft as the stroke portion 34 of each roller 14a, 14b, 14c moves as the spherical surface of the spherical base 25 slides. The stage unit 15 is copied and adjusted so that the upper surface of the line 26 coincides with the copying reference surface. At this time, since the stage portion 15 is adjusted following the curvature center P of the spherical surface of the spherical base portion 25, the connecting mechanism 16 disposed on the lower surface of the spherical base portion 25 is also a line passing through the curvature center P. That is, while rotating around the axis of the shaft portion 30 and the stage portion 15 moving in the vertical direction, the cylindrical portion 31 of the coupling mechanism 16 slides in the direction of the shaft portion 30.

  Since the excitation of the drive motors 20a and 20b of the XY table mechanism 11 is released and both the tables 11a and 11b can move freely, the both tables 11a and 11b are predetermined in conjunction with the movement of the connecting mechanism 16. Move to the copying position.

  Then, when the upper surface of the scanning reference portion 26 follows a predetermined inclination that matches the scanning reference surface of the reference body 45, the drive motors 20a and 20b of the XY table mechanism 11 are excited to thereby excite the XY table mechanism 11. Therefore, the stage unit 15 is fixed at a predetermined inclination in the copying state.

  Subsequently, in the state in which the stage unit 15 is substantially moved by copying in this way and the drive motors 20a and 20b of the XY table mechanism 11 are excited, fine adjustment of copying is performed. In the state where the copying adjustment is almost completed as described above, the stage unit 15 remains in a state where the upper surface of the copying reference unit 26 is pressurized by the pressurizing unit 2. In this state, the load balance applied to the stage unit 15 is detected. The load balance applied to the stage unit 15 is detected by detecting the load balance applied to each load cell 35a, 35b, 35c by the load detection unit 50 of the control mechanism 3.

  Since the center of gravity of the equilateral triangle formed by each load cell 35a, 35b, 35c is located on a vertical line passing through the center of curvature P of the spherical surface of the spherical base 25, it is detected by each load cell 35a, 35b, 35c. If the applied load is the same, the load (pressure) applied by the pressurization control unit 51 is concentrated on the center of gravity of the equilateral triangle. Therefore, fine adjustment of the scanning of the stage unit 15 is performed so that the detected loads by the load cells 35a, 35b, and 35c are equal.

  That is, fine adjustment of copying is performed by feedback control by the load detection unit 50, the pressurization control unit 51, and the XY table control unit 52 of the control device 3, and the vertical drive mechanism 40 is controlled by the pressurization control unit 51. The XY table control unit 52 causes the XY table control unit 52 to keep the detected loads of the load cells 35a, 35b, and 35c equal to each other while maintaining a predetermined pressure on the upper surface of the copying reference unit 26 by the head unit 39. When the drive motors 20a and 20b of the table mechanism 11 are driven to move both the tables 11a and 11b in the X and Y directions, and the detected loads of the load cells 35a, 35b and 35c become equal, the drive motors 20a and 20b. The rotation is stopped in the excited state, and the stage unit 15 is finely adjusted to the copying position with high accuracy.

  When the fine adjustment of copying is thus completed, the head unit 39 is raised by the vertical drive mechanism 40, and then the first and second objects to be joined are held by the copying reference unit 26 and the holding unit 44, respectively, with a predetermined pressure. Under pressure, ultrasonic vibration is applied to perform the bonding operation.

3. Next, the joining operation by ultrasonic vibration will be described. The substrate 55, which is the first object to be bonded according to the present embodiment, includes a circuit electrode 56 on the substrate surface as shown in FIG. 4, for example. Further, the chip 57 which is the second object to be bonded is provided with metal bumps 58, and the circuit electrodes 56 of the substrate 55 and the metal bumps 58 of the chip 57 are bonded.

  As described above, the substrate 55 is adsorbed and held at a position including the center of the upper surface of the scanning reference portion 26 with the circuit electrode 56 facing upward. Further, the chip 57 is sucked and held by the holding portion 44 of the head portion 39 so that the metal bump 58 corresponds to a predetermined bonding position of the circuit electrode 56 of the substrate 55. The head drive 39 is lowered by the vertical drive mechanism 40 so that the metal bumps 58 of the chip 57 abut on a predetermined position of the circuit electrode 56 of the substrate 55, and ultrasonic vibration is applied to the abutted substrate 55 and the chip 57. Is applied to perform the bonding operation.

  The ultrasonic vibration is generated by applying a predetermined voltage to the vibrator 41 by the ultrasonic vibration control unit 53 of the control device 3. The vibrator 41 generates vibration by the applied voltage, and the vibration of the vibrator 41 is transmitted by the resonator 42 to the chip 57 disposed in the holding unit 44 of the head unit 39. And the chip | tip 57 vibrates by the transmitted ultrasonic vibration, and the circuit electrode 56 of the board | substrate 55 contact | abutted with the metal bump 58 of the chip | tip 57 is slid. By this sliding, a film or oxide film due to impurities is removed and a new surface is exposed at the joint surface between the circuit electrode 56 and the metal bump 58. Then, on the surfaces of both objects to be bonded whose exposed surfaces are exposed, the atoms are attracted to each other, so that both objects to be bonded are bonded.

  Note that the load balance applied to the stage portion 15 is detected by the load cells 35a, 35b, and 35c not only before the joining operation but also during the joining operation, so that the above-described load balance becomes uniform by feedback control. 15 scanning adjustments may be performed.

  When the joining is completed, the vibration of the vibrator 41 is stopped and the suction of the substrate 55 and the chip 57 is released. Then, the head unit 39 is raised by the vertical drive mechanism 40, and the joined objects (substrate 55, chip 57) that have been joined are taken out, and a series of joining operations is finished.

  Therefore, according to the present embodiment, since each load cell 35a, 35b, 35c can perform fine adjustment of copying by feedback control while detecting the load applied to the stage portion 15, the copying adjustment can be easily performed with high accuracy. It can be carried out.

  Note that the end of the bonding may be determined based on the applied pressure, the application time of ultrasonic vibration, or the like, and a sensor for determining the end of the bonding may be provided. Moreover, you may join, heating a to-be-joined object during ultrasonic vibration joining. By performing ultrasonic vibration bonding while heating the object to be bonded, it is possible to reduce the ultrasonic vibration amplitude applied to the object to be bonded or to shorten the bonding time. Therefore, damage to the object to be bonded due to ultrasonic vibration can be prevented.

(Modification)
Further, in the coupling mechanism 16 shown in FIG. 1, the receiving portion 32 is disposed on the XY table mechanism 11 and the cylindrical portion 31 is disposed on the spherical base 25, but these arrangements are reversed. There may be. That is, as shown in FIG. 5, the receiving portion 32 may be fixed to the spherical base portion 25 side and the cylindrical portion 31 may be fixed to the XY table mechanism 11 side. With such a configuration, the inclination of the stage unit 15 can be increased even when the moving distance of the XY table mechanism 11 is small. Therefore, such an arrangement is effective when the inclination of the upper surface of the stage unit 15 is greatly changed.

  Further, the connecting mechanism 16 described above may be configured as shown in FIG. As shown in the figure, receiving portions 36 and 37 having conical circumferential concave portions are provided on the upper surface of the XY table mechanism 11 and the lower surface of the spherical base portion 25, respectively. A configuration in which a ball-shaped sphere 38 is disposed between the two may be used. With such a configuration, the tilt of the stage unit 15 is adjusted by the movement of the XY table mechanism 11, so that the stage unit 15 can be made to follow more smoothly.

  In the present embodiment, the position of the XY table mechanism 11 is fixed by exciting the drive motors 20a and 20b of the XY table mechanism 11, but by providing a fixing mechanism such as a brake plate, The Y table mechanism 11 may be fixed at a predetermined copying position.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 7 is a schematic configuration diagram of the bonding apparatus according to this embodiment, and differences from the first embodiment will be described below. In FIG. 7, the same reference numerals as those in FIGS. 1 to 4 denote the same or corresponding elements.

  In the joining apparatus shown in the present embodiment, the mounting table 70 on which the first object to be joined is placed, the pressurizing means 2, and the means corresponding to the mounting means 1 shown in the first embodiment are the first implementation. It is built in and arranged upside down from the form.

  That is, as shown in FIG. 7, the pressing means 2 includes a base 10, an XY table 11, a support 12, a support base 13, rollers 14 a, 14 b and 14 c, and a spherical base 25. The copying reference unit 26, the coupling mechanism 16, and load cells 35a, 35b, and 35c are provided. Further, the base 10 is installed in the vertical drive mechanism 40 of the pressurizing means 2. Note that the base 10, the support column 12, and the support base 13 are fixedly connected to each other so as to move integrally.

  Further, a resonator 42 having a vibrator 41 is supported and attached to the lower surface of the spherical base portion 25 by a resonator support portion 43, and the holding portion 44 provided in the central portion of the resonator 42 has a scanning reference. A reference body 45 having a surface is provided, and the center of curvature P of the spherical surface of the spherical base 25 is located at the center of the lower surface of the reference body 45. Therefore, the resonator 42 having the vibrator 41, the resonator support portion 43, the holding portion 44, and the reference body 45 correspond to the copying reference portion 26 in the present embodiment.

  Accordingly, when the copying reference surface of the reference body 45 is brought into contact with the mounting table 70 and pressed, the spherical base 25 and the rollers 14a, 14b, and 14c provided in the pressing unit 2 slide to adjust the copying. It is the structure to do.

  In addition, the other apparatus structure of this embodiment is the same as that of 1st Embodiment, and each operation | movement of each mechanism and each part is also the same as that of 1st Embodiment, respectively. Therefore, since the copying operation (including fine adjustment) and the joining operation are the same as those in the first embodiment, detailed description of the operation is omitted.

  Therefore, according to the second embodiment, each load cell 35a, 35b, 35c provided on the pressurizing means 2 side can perform fine adjustment of copying by feedback control while detecting the load applied to the spherical base 25. Therefore, the copying adjustment can be easily performed with high accuracy.

  In this embodiment, since the object to be joined is joined by ultrasonic vibration joining, the scanning reference unit 26 includes the resonator 42 having the vibrator 41. However, the invention is not limited to the resonator 42. For example, a heater or the like is provided. It is good also as providing.

  Also in the present embodiment, the modifications shown in FIGS. 5 and 6 may be used as in the first embodiment.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 8 is a schematic configuration diagram of the bonding apparatus according to the present embodiment, and differences from the first embodiment will be described in detail below. In FIG. 8, the same reference numerals as those in FIGS. 1 to 4 denote the same or corresponding elements.

  The joining apparatus shown in the present embodiment is substantially the same as the joining apparatus shown in the first embodiment, except that the mounting means 1 is disposed upside down from the first embodiment. It is the point comprised as follows.

  That is, as shown in FIG. 8, the spherical base 25 is installed on the base 10 of the mounting means 1, the rollers 14a, 14b, 14c, the support base 13, the support column 12, and the first object to be joined on the upper surface. Are mounted, an XY table 11, a coupling mechanism 16, and load cells 35a, 35b, and 35c. Moreover, the support | pillar 12, the support stand 13, and the mounting base 80 are fixedly connected, and can move integrally. The spherical curvature center P of the spherical base 25 is an arbitrary position on the lower surface side of the spherical base 25.

  Accordingly, when the copying reference surface of the reference body 45 is brought into contact with the mounting table 80 and is pressed, the rollers 14a, 14b, and 14c slide relative to the spherical base 25 provided in the mounting means 1. As a result, the support table 13, the support column 12, and the mounting table 80 move together, and the copying adjustment is performed.

  In addition, the other apparatus structure of this embodiment is the same as that of 1st Embodiment, and each operation | movement of each mechanism and each part is also the same as that of 1st Embodiment, respectively. Therefore, since the copying operation (including fine adjustment) and the joining operation are the same as those in the first embodiment, detailed description of the operation is omitted.

  Therefore, according to the third embodiment, even if the mounting means 1 is arranged upside down, the load cells 35a, 35b, 35c perform fine adjustment of copying by feedback control while detecting the load applied to the spherical base 25. Therefore, the copying adjustment can be easily performed with high accuracy.

  In the present embodiment, similar to the first embodiment, the modifications shown in FIGS. 5 and 6 may be used.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 9 is a schematic configuration diagram of the bonding apparatus according to the present embodiment, and differences from the first embodiment will be described in detail below. In FIG. 9, the same reference numerals as those in FIGS. 1 to 4 denote the same or corresponding parts.

  The joining apparatus shown in the present embodiment is substantially the same as the joining apparatus shown in the first embodiment, but the difference from the first embodiment is that the pressurizing means 2 is equipped with the mounting means shown in the first embodiment. The means corresponding to 1 is incorporated in the same vertical direction.

  That is, as shown in FIG. 9, the mounting table 90 on which the first object is mounted, the pressurizing means 2, the base 10, the XY table 11, the support column 12, and the support base. 13, rollers 14 a, 14 b, 14 c, a spherical base 25, a coupling mechanism 16, and load cells 35 a, 35 b, 35 c are provided. Further, the base 10, the support column 12 and the support base 13 are fixedly connected and can be moved integrally. The spherical curvature center P of the spherical base 25 is an arbitrary position on the upper surface side of the spherical base 25. Therefore, this embodiment is different from the second embodiment in that the upper surface of the spherical base 25 is installed in the vertical drive mechanism 40 of the pressurizing means 2.

  Furthermore, a resonator 42 having a vibrator 41 is supported and attached to the lower surface of the base 10 by a resonator support portion 43, and the holding reference portion 44 provided in the central portion of the resonator 42 has a scanning reference surface. Is provided.

  Therefore, when the copying reference surface of the reference body 45 is brought into contact with the mounting table 90 and pressed, the spherical base 25 provided in the pressing means 2 and the rollers 14a, 14b, and 14c slide, and the support table. 13, the support column 12, the base 10, the resonator 42 having the vibrator 41 supported by the resonator support portion 43, and the reference body 45 are integrally moved to perform copying adjustment.

  In addition, the other apparatus structure of this embodiment is the same as that of 1st Embodiment, and each operation | movement of each mechanism and each part is also the same as that of 1st Embodiment, respectively. Therefore, since the copying operation (including fine adjustment) and the joining operation are the same as those in the first embodiment, detailed description of the operation is omitted.

  Therefore, according to the fourth embodiment, each load cell 35a, 35b, 35c provided on the pressurizing means 2 side can perform fine adjustment of copying by feedback control while detecting the load applied to the spherical base 25. Therefore, the copying adjustment can be easily performed with high accuracy.

  In the present embodiment, similar to the first embodiment, the modifications shown in FIGS. 5 and 6 may be used.

(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described with reference to FIG. FIG. 10 is a schematic configuration diagram of the bonding apparatus according to the present embodiment, and differences from the first embodiment will be described in detail below. 10, the same reference numerals as those in FIGS. 1 to 4 denote the same or corresponding parts.

  The joining apparatus shown in the present embodiment is substantially the same as the joining apparatus shown in the first embodiment, but is different from the first embodiment in that an XY as a moving mechanism including the drive motors 20a and 20b. Instead of the table mechanism 11, a slide table mechanism 60 that does not have a drive mechanism including slide tables 60a and 60b disposed on the base 10 so as to be movable in the X direction and the Y direction, respectively, and piezoelectric actuators 64a, 64b, 64 c and a piezo control unit 65. Then, as shown in FIG. 10, the receiving portion 32 of the coupling mechanism 16 is fixed to substantially the center of the upper surface of the upper table 60 a of the slide table mechanism 60, so that the slide table mechanism 60 is connected to the spherical base portion by the coupling mechanism 16. 25. Therefore, the slide table mechanism 60 moves to a predetermined position when the upper surface of the stage unit 15 is pressurized and performs a copying operation.

  Note that a thin plate 62 made of stainless steel (SUS) having a thickness of about 1 mm is interposed between the slide table mechanism 60 and the receiving portion 32 of the coupling mechanism 16. Along with this, the thin plate 62 also moves.

  In the base 10, air cylinders 61a and 61b are arranged at an angle of about 90 degrees in the circumferential direction so as to be substantially located on a line in the moving direction of the orthogonal slide tables 60a and 60b. . When air is supplied to the air cylinders 61a and 61b, the piston portions 63a and 63b of the air cylinders 61a and 61b move upward, and the thin plate 62 is pressed against the lower surface of the support base 13, thereby restricting the movement of the thin plate 62. Thus, the slide table mechanism 60 is fixed at a predetermined position. Accordingly, in the present embodiment, the air cylinders 61a and 61b and the thin plate 62 correspond to a fixing mechanism.

  Piezo actuators 64a, 64b, and 64c that perform expansion and contraction operations by applying a voltage are disposed below the load cells 35a, 35b, and 35c. The piezoelectric control unit 65 controls the piezoelectric actuators 64a, 64b. , 64c is adjusted, and the expansion / contraction of the piezo actuators 64a, 64b, 64c is adjusted.

  Hereinafter, the copying adjustment operation in the present embodiment will be described.

  First, similarly to the first embodiment, the vertical drive mechanism is configured so that the copying reference surface of the reference body 45 held by the holding unit 44 of the head unit 39 contacts a predetermined position including the center of the upper surface of the copying reference unit 26. The head unit 39 is lowered by 40.

  Then, with the scanning reference surface of the reference body 45 in contact with the upper surface of the scanning reference portion 26, a predetermined pressure is applied by the pressure control unit 51, and the upper surface of the scanning reference portion 26 is the surface of the scanning reference surface of the reference body 45. In accordance with the inclination, adjustment is performed following a predetermined inclination. At this time, the spherical surface of the spherical base 25 of the stage unit 15 slides on the rollers 14a, 14b, and 14c and rotates around the center of curvature P of the spherical surface.

  Each roller 14a, 14b, 14c moves along the axial direction of the shaft 33 and around the shaft as the stroke portion 34 of each roller 14a, 14b, 14c moves as the spherical surface of the spherical base 25 slides. The stage unit 15 is copied and adjusted so that the upper surface of the line 26 coincides with the copying reference surface. At this time, since the stage portion 15 is adjusted following the curvature center P of the spherical surface of the spherical base portion 25, the connecting mechanism 16 disposed on the lower surface of the spherical base portion 25 is also a line passing through the curvature center P. That is, while rotating around the axis of the shaft portion 30 and the stage portion 15 moving in the vertical direction, the cylindrical portion 31 of the coupling mechanism 16 slides in the direction of the shaft portion 30. Since the slide tables 60a and 60b themselves do not include a drive mechanism such as a motor, the slide tables 60a and 60b move to a predetermined copying position in conjunction with the movement of the coupling mechanism 16.

  Then, air is supplied to the air cylinders 61a and 61b by an air pump (not shown) in a state where the upper surface of the scanning reference portion 26 follows a predetermined inclination that matches the scanning reference surface of the reference body 45, and the air cylinders 61a and 61b. The piston portions 63a and 63b are moved upward, the thin plate 62 is pressed against the lower surface of the support base 13, the slide table mechanism 60 is fixed at a predetermined position, and the upper surface of the stage portion 15 is tilted and held at a predetermined angle. To do.

  Subsequently, fine adjustment of copying is performed. As in the first embodiment, in the state in which the scanning adjustment is almost completed as described above, the upper surface of the scanning reference portion 26 remains pressurized by the pressurizing unit 2 in this state. Thus, the vertical drive mechanism 40 is controlled by the pressurization control unit 51 of the control device 3, and the upper surface of the copying reference unit 26 is held in a state where a predetermined pressure is applied.

  And the piezo control part which comprises the control means in this invention so that the detection load of each load cell 35a, 35b, 35c from which the load balance concerning the stage part 15 is detected by the load detection part 50 of the control apparatus 3 becomes equal. A predetermined voltage is applied to each of the piezo actuators 64a, 64b, and 64c by 65, the piezo actuators 64a, 64b, and 64c expand and contract, the stage portion moves up and down, and the inclination of the upper surface of the scanning reference portion 26 is adjusted. When the detected loads of the load cells 35a, 35b, and 35c become equal, the expansion and contraction of the piezo actuators 64a, 64b, and 64c is stopped at that position by stopping the voltage application, and the fine adjustment of the scanning is finished.

  Thus, when fine adjustment of copying is completed, the head unit 39 is raised by the vertical drive mechanism 40, and then the substrate 55 as the first object to be bonded and the chip 57 as the second object to be bonded are respectively held by the holding mechanism 29. In the same manner as the joining operation in the first embodiment, the joining operation is performed by applying ultrasonic vibration under a predetermined pressure.

  Therefore, according to the fifth embodiment, the fine adjustment of the scanning of the stage unit 15 is performed by the control of the piezo actuators 64a, 64b, and 64c. Therefore, the fine adjustment of the scanning can be performed with high accuracy. At this time, the piezoelectric actuators 64a, 64b, and 64c are small and have a large driving force, which is very advantageous in designing a small joining device.

  In this embodiment, the piezo actuators 64a, 64b, and 64c are used only as a moving mechanism for moving the stage portion 15 in the vertical direction to perform scanning adjustment. However, the piezo actuators 64a, 64b, and 64c are used for load detection. The load balance of the stage unit 15 may be detected by detecting expansion and contraction of the piezoelectric actuators 64a, 64b, and 64c when the upper surface of the scanning reference unit 26 is pressurized. If comprised in this way, since loading of load cell 35a, 35b, 35c can be abbreviate | omitted, it will become possible to make a joining apparatus smaller.

  Further, the fixing of the slide table mechanism 60 is not limited to the fixing mechanism using the air cylinders 61a and 61b and the thin plate 62 as in the present embodiment. Also, during the joining operation, the load balance of the stage may be detected by the load cells 35a, 35b, and 35c, and the copying adjustment may be performed by feedback control.

  Further, the arrangement of the air cylinders 61a and 61b is not limited to the arrangement at an angle of about 90 degrees in the circumferential direction, and may be arranged at any position. Further, the number of air cylinders is not limited to two, and three or more may be arranged.

  In addition, the arrangement positions of the piezo actuators 64a, 64b, and 64c are not limited to the lower side of the load cells 35a, 35b, and 35c, and may be the upper side of the load cells 35a, 35b, and 35c, and other positions.

  Further, as a modification, the coupling mechanism 16 may be, for example, the coupling mechanism shown in FIGS. 5 and 6 of the first embodiment, and the piezoelectric actuators 64a, 64b, 64c, the piezoelectric control unit 65, the air cylinder 61a of the present embodiment, 61b may be combined with the second to fourth embodiments.

(Sixth embodiment)
Next, a sixth embodiment of the present invention will be described with reference to FIG. FIG. 11A is a plan view of a schematic configuration diagram of the shaft motor 68a, and FIG. 11B is a front view. Hereinafter, differences from the first embodiment will be described in detail.

  The joining apparatus shown in the present embodiment is substantially the same as the joining apparatus shown in the first embodiment, but is different from the first embodiment in the XY table mechanism 11 driven by the drive motors 20a and 20b. Instead, a shaft motor type XY table mechanism 68 is provided as a moving mechanism configured by combining shaft motors so as to be movable in the XY directions.

  As shown in FIG. 11, the shaft motor 68a has a long shaft 70 in which magnets having different polarities are alternately arranged on a table 69, a shaft support portion 71 that supports the shaft 70, and the shaft 70 passes therethrough. A movable body 73 having a coil disposed so as to surround the periphery of the shaft 70, and two guides 74 disposed in parallel to the shaft 70 through both ends of the movable body 73, 75 and a holding body 77 that stands on the table 69 and holds both ends of the guides 74 and 75. The other shaft motor has the same configuration, and a shaft motor type XY table mechanism 68 is configured by two shaft motors.

  Then, a linear motor is formed by the coil inside the movable body 73 and the magnet of the shaft 70, and the current flowing through the coil inside the movable body 73 is adjusted to move the movable body 73. Therefore, since the movable body 73 moves directly along the guides 74 and 75 without the ball screw by the operation of the linear motor, the shaft motor type XY table mechanism 68 is disposed as the moving mechanism of this embodiment. Therefore, the copying adjustment can be performed at high speed and with high accuracy.

  Further, since the shaft motor 68a has a driving force larger than that of the driving motors 20a and 20b shown in the first embodiment, the shaft motor 68a is high even when the pressing force for pressurizing the stage unit 15 is large or the stage unit 15 is large. It is possible to perform copying adjustment with accuracy.

  The other apparatus configuration of the present embodiment is the same as that of the first embodiment. Therefore, the copying operation (including fine adjustment) and the joining operation are also the same as those of the first embodiment, and thus description of the operation is omitted.

  Therefore, according to the sixth embodiment, more accurate scanning adjustment can be performed at high speed, and the workpiece can be joined by performing scanning adjustment more simply. Further, since the linear motor is formed by the magnet of the shaft 70 and the coil of the movable body 73, the apparatus can be miniaturized.

  Also in this embodiment, the XY stage can be fixed at a predetermined position by exciting the shaft motor 68a, but other fixing mechanisms may be provided. Moreover, as a structure of a connection mechanism, in addition to what is shown in FIG. 1, what is shown in FIG.5, FIG.6 etc. may be sufficient. Further, instead of the XY table mechanism 11 of the second to fourth embodiments, the shaft motor type XY table mechanism 68 of this embodiment may be combined.

  The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the present invention.

  As an example, since the above-described embodiment describes a bonding apparatus using ultrasonic vibration, the head unit 39 includes a vibrator 41 and a resonator 42. In the case of bonding a bonded object, an apparatus configuration that does not include the vibrator 41 and the resonator 42 may be employed.

  For example, when the object to be bonded is made of a metal such as gold, the layer of impurities or oxide adhering to the surface of the bonded part is crushed by abutting and crushing the bonded part of both bonded objects. A new surface appears and the objects to be joined can be joined together. Moreover, also when joining a to-be-joined object with adhesives, such as resin, after performing the copy adjustment of the to-be-joined object surface, it can join by pressurizing to-be-joined objects.

  Further, in addition to the above-described bonding by pressurization, a bonding apparatus for bonding by heating an object to be bonded may be used.

  In this case, as shown in FIG. 1, the scanning reference portion 26 on which the first object to be bonded is provided with a heater portion 28, and the objects to be bonded can be pressed and heated to perform bonding. In addition to the holding stage, a heater may be provided in the holding portion of the head portion on which the second object is mounted, and the heater is arranged in any of the mounting means 1 and the pressurizing means 2. Also good.

  Further, the bonding method of the objects to be bonded may be a combination of the above-described ultrasonic vibration bonding, pressure bonding, and heating bonding, and the bonding apparatus may include the vibrator 41, the resonator 42, the heater unit 28, and the like. You may combine. Further, other bonding methods may be used.

  Further, when high accuracy is not required for the copying adjustment, a joining device that omits a mechanism for fine adjustment of copying such as the load cells 35a, 35b, 35c and the control device 3 may be used.

  Further, as in the above-described embodiment, not only the bonding of the chip and the substrate, but also any combination of the objects to be bonded such as bonding of the substrates may be used. In addition, the material, size, shape, etc. of the object to be joined may be any.

  Further, the load detecting means is not limited to the load cell and the piezoelectric actuator as in the above-described embodiment, but may be other load detecting means such as a semiconductor pressure sensor.

  Moreover, it is good also as providing the alignment adjustment mechanism for adjusting the joining position of to-be-joined objects with high precision.

It is a schematic block diagram of the joining apparatus in 1st Embodiment of this invention. It is a perspective view of the mounting means in 1st Embodiment of this invention. It is a top view of the mounting means in FIG. It is a partial schematic block diagram of the joining apparatus carrying a to-be-joined object. It is a schematic block diagram of the mounting means in the modification of 1st Embodiment of this invention. It is another schematic block diagram of the mounting means in the modification of 1st Embodiment of this invention. It is a schematic block diagram of the joining apparatus in 2nd Embodiment of this invention. It is a schematic block diagram of the joining apparatus in 3rd Embodiment of this invention. It is a schematic block diagram of the joining apparatus in 4th Embodiment of this invention. It is a schematic block diagram of the joining apparatus in 5th Embodiment of this invention. It is a schematic block diagram of the principal part of the shaft motor type XY table mechanism in 6th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Loading means 2 ... Pressurizing means 11 ... XY table mechanism (movement mechanism)
14a, 14b, 14c ... Roller (supporting part)
15... Stage 16... Connection mechanism 35a, 35b, 35c... Load cell (detection means)
50 ...... Load detector (control means)
52 ... XY table control section (control means)
55 …… Board (Substrate)
57 …… Chip (bonded object)
60 …… Slide table mechanism (moving mechanism)
61a, 61b ...... Air cylinder (fixing mechanism)
62 …… Thin plate (fixing mechanism)
64a, 64b, 64c ... Piezo actuator (moving mechanism)
65 …… Piezo control unit (control means)
68 …… Shaft motor type XY table mechanism (moving mechanism)
70, 80, 90 ... mounting table

Claims (7)

In a joining apparatus for joining a plurality of superposed objects,
A support base installed on the base; a support part installed on the support base; a spherical base part having a spherical surface on the bottom surface and slidably disposed with respect to the support part; A copying reference portion placed on the upper surface of the spherical base portion on which an object is mounted, a connection mechanism disposed on the lower surface side of the spherical base portion, and the spherical base portion are connected by the connection mechanism. A mounting mechanism having a moving mechanism that moves in two directions orthogonal to each other in a horizontal plane and slides the spherical base portion relative to the support portion to follow and move the spherical base portion;
A pressurizing means including a reference body having a copying reference surface;
The load balance applied to the spherical base portion that has been copied and moved by pressurizing the reference body and the mounting means by the pressing means in a state where the reference reference surface of the reference body is in contact with the upper surface of the copying reference portion. Detecting means for
Control means for controlling the moving mechanism so that the load balance is uniform,
The coupling mechanism has a cylindrical portion fixed to one of the spherical base and the moving mechanism, and a spherical concave portion that slidably holds a sphere, and is fixed to the other of the spherical base and the moving mechanism. A joining apparatus comprising: a receiving portion; and a shaft portion having one end fixed to the sphere and the other end internally fitted in the cylindrical portion and sliding in the axial direction and the axial direction with the cylindrical portion. In a joining apparatus for joining a plurality of superposed objects,
A mounting table on which an object to be bonded is mounted;
A support base installed on the lower surface side of the base; a support part installed under the support base; a spherical base part having a spherical surface on the upper surface and disposed slidably with respect to the support part; A scanning reference portion having a reference body having a scanning reference surface, a connecting mechanism disposed on the upper surface side of the spherical base, and two orthogonal to each other in a horizontal plane connected to the spherical base by the connecting mechanism. A pressurizing unit having a moving mechanism that moves in a direction and slides the spherical base with respect to the support to move the spherical base.
The load balance applied to the spherical base portion that has been copied and moved by pressurizing the reference body and the mounting table by the pressing means while the copying reference surface of the reference body is in contact with the upper surface of the mounting table is detected. Detection means;
Control means for controlling the moving mechanism so that the load balance is uniform,
The coupling mechanism has a cylindrical portion fixed to one of the spherical base and the moving mechanism, and a spherical concave portion that slidably holds a sphere, and is fixed to the other of the spherical base and the moving mechanism. A joining apparatus comprising: a receiving portion; and a shaft portion having one end fixed to the sphere and the other end internally fitted in the cylindrical portion and sliding in the axial direction and the axial direction with the cylindrical portion. In a joining apparatus for joining a plurality of superposed objects,
A spherical base portion having a spherical surface on an upper surface and installed on a base, a support portion slidably disposed on the spherical base portion, a support base installed on the support portion, and the spherical surface A connecting mechanism disposed on the upper surface side of the base, and connected to the spherical base by the connecting mechanism and moved in two directions perpendicular to each other to slide the support part relative to the spherical base. A mounting unit having a moving mechanism that moves the supporting unit in accordance with the mounting unit, and a mounting table that is installed on the support table and on which an object to be bonded is mounted;
A pressurizing means including a reference body having a copying reference surface;
Detection for detecting a load balance applied to the spherical base moved by applying pressure to the reference body and the mounting means by the pressing means in a state where the copying reference surface of the reference body is in contact with the upper surface of the mounting table. Means,
Control means for controlling the moving mechanism so that the load balance is uniform,
The coupling mechanism has a cylindrical portion fixed to one of the spherical base and the moving mechanism, and a spherical concave portion that slidably holds a sphere, and is fixed to the other of the spherical base and the moving mechanism. A joining apparatus comprising: a receiving portion; and a shaft portion having one end fixed to the sphere and the other end internally fitted in the cylindrical portion and sliding in the axial direction and the axial direction with the cylindrical portion. In a joining apparatus for joining a plurality of superposed objects,
A mounting table on which an object to be bonded is mounted;
A support base installed on a base; a support part installed on the support base; a spherical base part having a spherical surface on a lower surface and disposed slidably with respect to the support part; and the spherical surface A connecting mechanism disposed on the lower surface side of the base, and connected to the spherical base by the connecting mechanism and moved in two directions orthogonal to each other, and the spherical base is slid relative to the support. A pressure mechanism having a reference body having a reference surface to be copied under the base;
The load balance applied to the spherical base portion that has been copied and moved by pressurizing the reference body and the mounting table by the pressing means while the copying reference surface of the reference body is in contact with the upper surface of the mounting table is detected. Detection means;
Control means for controlling the moving mechanism so that the load balance is uniform,
The coupling mechanism has a cylindrical portion fixed to one of the spherical base and the moving mechanism, and a spherical concave portion that slidably holds a sphere, and is fixed to the other of the spherical base and the moving mechanism. A joining apparatus comprising: a receiving portion; and a shaft portion having one end fixed to the sphere and the other end internally fitted in the cylindrical portion and sliding in the axial direction and the axial direction with the cylindrical portion.   The center of curvature of the spherical surface of the spherical base is located on the upper surface side of the scanning reference portion, and the center of the upper surface of the scanning reference portion passes through the center of curvature of the spherical surface of the spherical base and is relative to the upper surface of the scanning reference portion. The bonding apparatus according to claim 1, wherein the bonding apparatus is on a vertical line.   The center of curvature of the spherical surface of the spherical base is located on the lower surface side of the reference body having the scanning reference surface, and the center of the lower surface of the reference body passes through the center of curvature of the spherical surface of the spherical base and the scanning reference surface The bonding apparatus according to claim 2, wherein the bonding apparatus is on a line perpendicular to the line. The detection means includes a load sensor disposed at each vertex position of an equilateral triangle,
7. The center of gravity of the equilateral triangle is on a line perpendicular to the plane that passes through the center of curvature of the spherical surface of the spherical base and is formed by the apex of the equilateral triangle. 8. The joining apparatus as described.

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