JP7025744B2 - Joining device and joining method - Google Patents

Description

The present invention relates to a joining device and a joining method for joining two substrates.

Conventionally, as a technique for joining two substrates, diffusion joining for joining at a relatively high temperature and high pressure is widely used. In the case of diffusion bonding, the temperature applied to the bonded body at the time of bonding is higher than the temperature at the time of using this bonded body. Therefore, the bonded body is used in a temperature environment that is significantly different from that at the time of bonding, and distortion and changes in characteristics during use are unavoidable. For example, when used in an optical device such as a power laser oscillator, a slight distortion due to a change in the temperature environment may cause a significant deterioration in performance.

In recent years, in order to solve such a problem of diffusion bonding, bonding by surface activation of bonding by activating the surface of the object to be bonded with an ion beam or the like has been put into practical use. This surface activation bonding enables bonding at a temperature closer to normal temperature or at an arbitrary temperature according to the usage conditions as compared with diffusion bonding. As a result, in the bonded body, the temperature difference between the time of joining and the time of use becomes small, and distortion and changes in characteristics are reduced. A joining device using such joining by surface activation has been widely proposed.

However, these conventional proposals are limited to the proposal of a technique for joining two minute objects to be joined. By the way, when two objects to be joined are joined, it is necessary to ensure high-precision parallelism between the surfaces of the joined bodies to be joined at the time of joining. That is, the surfaces of the two objects to be joined are required to be in contact with each other while maintaining parallelism with high accuracy. In the case of a conventional minute object to be joined, the effect of surface parallelism on the joining is small. However, as the size of the bonded body increases, the parallelism of the surface of the bonded body has a greater influence on the bonding performance of the bonded body. Therefore, there is a problem that the larger the object to be joined, the higher the parallelism of the surface is required, which hinders the increase in size of the bonded body.

Japanese Patent No. 2791429 Japanese Unexamined Patent Publication No. 2002-313688 Japanese Unexamined Patent Publication No. 2006-337619 Japanese Patent No. 5549108 Japanese Patent No. 6045972

Katsumata, Ichikawa, Shoji "High-efficiency, high-power operation of room-temperature bonding Nd: YAG / diamond composite structure laser with anti-reflective coating on the interface" 64th JSAP Spring Meeting 15p-213-8 (2017.3) )

Therefore, an object of the present invention is to provide a joining device and a joining method in which the parallelism of a pair of opposing substrates is enhanced and stable bonding is achieved even with a large substrate.

In the invention according to claim 1 , the first holding portion that holds the first substrate is connected to the connection holding portion with a universal joint portion interposed therebetween. As a result, the posture of the first holding portion with respect to the connection holding portion changes. Further, the collar-shaped portion provided in the first holding portion is sandwiched between the pressing member provided in the connection holding portion and the support member. Therefore, the collar-shaped portion provided in the first holding portion is fixed between the pressing member and the support member by adjusting the pressing force of the pressing member. By fixing the collar-shaped portion, the posture of the first holding portion that holds the first substrate is fixed with respect to the connection holding portion.

Prior to joining the first substrate and the second substrate, the first substrate held in the first holding portion is pressed against the second substrate to be joined held in the second holding portion. At this time, when the first substrate and the second substrate come into contact with each other, the first holding portion that holds the first substrate swivels around the universal joint portion as a fulcrum, and is in a posture that matches the second substrate. That is, the contact between the first substrate and the second substrate ensures that the first substrate and the second substrate are parallel to each other. The posture of the first holding portion that holds the first substrate with respect to the connection holding portion changes according to the second substrate. By adjusting the pressing force of the pressing member that sandwiches the collar-shaped portion while the posture of the first holding portion is changed in this way, the posture of the first holding portion with respect to the connection holding portion is fixed. By fixing the posture of the first holding portion with respect to the connection holding portion, even if the first substrate and the second substrate are once separated and then brought into contact with each other again, the first holding portion that holds the first substrate is the second substrate. The posture that matches the posture is maintained. As a result, the first substrate held by the first holding portion maintains parallelism with the second substrate. Therefore, it is possible to increase the parallelism between the pair of first and second substrates facing each other, and it is possible to easily secure the parallelism even with a large substrate and achieve stable bonding.

Schematic diagram showing the main part of the joining device according to one embodiment Schematic diagram showing a schematic configuration of a joining device according to an embodiment Schematic sectional view showing a main part of a joining device according to an embodiment. Schematic diagram showing a joining procedure of a joined body by a joining device according to one embodiment. Schematic diagram showing a joining procedure of a joined body by a joining device according to one embodiment. Schematic diagram showing a joining procedure of a joined body by a joining device according to one embodiment. Schematic diagram showing another embodiment of the joining procedure of the joined body by the joining device according to one embodiment.

Hereinafter, an embodiment of the joining device will be described with reference to the drawings.
The joining device 10 shown in FIG. 2 includes a chamber 11, a vacuum pump 12, and a turbo molecular pump 13. The chamber 11 is an airtight container, and the inside is depressurized by the vacuum pump 12 and the turbo molecular pump 13. The inside of the chamber 11 is depressurized to an ultra-high vacuum state of about ^10-6 Pa by using the turbo molecular pump 13. The chamber 11 is fixed to equipment such as a building (not shown). The vacuum pump 12 and the turbo molecular pump 13 correspond to the decompression mechanism unit.

In addition to the above, the joining device 10 includes a first holding unit 21, a second holding unit 22, a connection holding unit 23, a drive mechanism unit 24, a beam irradiation unit 25, and a beam irradiation unit 26. The first holding portion 21 holds the first substrate 31 at one end in the axial direction. The second holding portion 22 is provided so as to face the first holding portion 21 and holds the second substrate 32. The second holding portion 22 is fixed to the chamber 11. The connection holding unit 23 is connected to the first holding unit 21. The drive mechanism unit 24 integrally drives the connected first holding unit 21 and the connection holding unit 23. In the case of the present embodiment, the drive mechanism unit 24 reciprocates the integrated first holding unit 21 and the connection holding unit 23 in the axial direction of the first holding unit 21. That is, the drive mechanism unit 24 drives the first holding unit 21 in a direction approaching or separating from the second holding unit 22. As a result, the distance between the first substrate 31 held by the first holding portion 21 and the second substrate 32 held by the second holding portion 22 is the distance between the first holding portion 21 and the second holding portion 24 by the drive mechanism portion 24. It changes depending on the drive of the connection holding unit 23.

The beam irradiation unit 25 and the beam irradiation unit 26 generate an ion beam by, for example, a FAB (Fast Atom Bombardment or Fast Atom Beam) method. The beam irradiation unit 25 irradiates the first substrate 31 held by the first holding unit 21 with a beam. By irradiating the first substrate 31 with a beam from the beam irradiation unit 25, the first substrate 31 is surface-treated. Similarly, the beam irradiation unit 26 irradiates the second substrate 32 held by the second holding unit 22 with a beam. By irradiating the second substrate 32 with a beam from the beam irradiation unit 26, the second substrate 32 is surface-treated.

The first substrate 31 and the second substrate 32 can be made of different materials or the same kind of material. For example, when joining laser oscillating elements, the first substrate 31 is a laser oscillating material such as Nd: YAG, and the second substrate 32 is a heat radiating material such as diamond or sapphire. The first substrate 31 may be used as a heat dissipation material, and the second substrate 32 may be used as an oscillation material. Further, the same kind of material may be used as the first substrate 31 and the second substrate 32, for example, a crystal having a different crystal plane used as a nonlinear optical material. As described above, the materials of the first substrate 31 and the second substrate 32 can be arbitrarily selected.

Next, the main part of the joining device 10 will be described with reference to FIGS. 1 and 3.
The joining device 10 further includes a flange-shaped portion 41, an accommodating portion 42, a pressing member 43, and a support member 44. The collar-shaped portion 41 is provided in the first holding portion 21. The flange-shaped portion 41 projects radially outward from the first holding portion 21. The flange-shaped portion 41 may be provided in a continuous annular shape over the entire circumference of the first holding portion 21 in the circumferential direction, or may be provided discontinuously in the circumferential direction. Further, in the case of the present embodiment, the flange-shaped portion 41 is provided so as to project in an annular shape at the end of the first holding portion 21, that is, the end opposite to the second holding portion 22 in the axial direction. That is, in the case of the present embodiment, the first holding portion 21 holds the first substrate 31 at one end in the axial direction, and has a collar-shaped portion 41 at the other end. The flange-shaped portion 41 is not limited to the axial end of the first holding portion 21, and may be provided in the middle of the axial direction.

The first holding portion 21 is integrally connected to the connection holding portion 23 with the universal joint portion 45 interposed therebetween. The first holding portion 21 can rotate with the universal joint portion 45 as a fulcrum by arranging the universal joint portion 45 between the first holding portion 21 and the connection holding portion 23. As a result, the relative postures of the first holding portion 21 and the connection holding portion 23 change with the universal joint portion 45 as a fulcrum. The connection holding unit 23 is driven in the axial direction, that is, up and down in FIGS. 1 and 2 by the drive mechanism unit 24. Therefore, the connection holding portion 23 moves in the axial direction integrally with the first holding portion 21. The connection holding portion 23 moves along the guide portion 46 provided in the chamber 11 as shown in FIG. Therefore, the posture of the connection holding portion 23 with respect to the chamber 11 does not change. As a result, the posture of the connection holding portion 23 does not change with the second holding portion 22 fixed to the chamber 11. That is, the connection holding portion 23 moves in the axial direction while maintaining the posture with respect to the second substrate 32 held by the second holding portion 22. The universal joint portion 45 is not limited to the configuration shown in FIG. 1, and may have any configuration as long as the postures of the first holding portion 21 and the connection holding portion 23 can be changed.

The connection holding unit 23 has an accommodating unit 42. The accommodating portion 42 is provided at the end of the connection holding portion 23 on the second holding portion 22 side. In the case of the present embodiment, the accommodating portion 42 has a first wall portion 421 and a second wall portion 422 that sandwich the flange-shaped portion 41 in the axial direction. The first wall portion 421 projects radially outward from the connection holding portion 23. The second wall portion 422 is provided on the second holding portion 22 side of the first wall portion 421 in parallel with the first wall portion 421. The flange-shaped portion 41 is sandwiched between the first wall portion 421 and the second wall portion 422. As shown in FIG. 3, the collar-shaped portion 41 has a first surface 411 facing the first wall portion 421 and a second surface 412 facing the second wall portion 422. The first wall portion 421 and the second wall portion 422 are connected by a connecting wall portion 423. As a result, the accommodating portion 42 is integrally formed by the first wall portion 421, the second wall portion 422, and the connecting wall portion 423. The axial thickness of the flange-shaped portion 41 is smaller than the distance between the first wall portion 421 and the second wall portion 422. Further, the outer diameter of the flange-shaped portion 41 is smaller than the inner diameter of the accommodating portion 42. Therefore, the collar-shaped portion 41 accommodated in the accommodating portion 42 can change its posture inside the accommodating portion 42. The first wall portion 421 and the second wall portion 422 may be continuous or discontinuous in the circumferential direction of the connection holding portion 23.

The pressing member 43 is provided on the connection holding portion 23. Specifically, the pressing member 43 is provided so as to penetrate the first wall portion 421, and its tip is in contact with the first surface 411 of the flange-shaped portion 41. By contacting the flange-shaped portion 41, the pressing member 43 presses the flange-shaped portion 41 housed in the accommodating portion 42 in the axial direction. That is, in the case of the present embodiment, the pressing member 43 presses the collar-shaped portion 41 toward the second holding portion 22 side.

In the case of the present embodiment, the pressing member 43 has a main body 431 and a contact member 432. The main body 431 has a male screw on the outer wall. By engaging the male screw of the pressing member 43 with the female screw formed on the first wall portion 421, the pressing member 43 can move the first wall portion 421 in the axial direction. As a result, the pressing member 43 moves toward the flange-shaped portion 41 by tightening the screw, and presses the flange-shaped portion 41 against the second holding portion 22 side. Two or more pressing members 43 are provided in the circumferential direction of the accommodating portion 42. It is preferable that three or more pressing members 43 are provided in the circumferential direction of the accommodating portion 42. By providing three pressing members 43 in the circumferential direction of the accommodating portion 42, the position of the flange-shaped portion 41 pressed by the pressing member 43 is stabilized.

The contact member 432 is provided at the end of the main body 431 on the flange-shaped portion 41 side. As a result, the contact member 432 can come into contact with the first surface 411 of the flange-shaped portion 41. A part of the outer wall of the contact member 432 is formed in a spherical shape, and the contact member 432 can be swiveled inside the main body 431. The contact member 432 has a flat surface 433 at the tip, that is, on the side of the collar-shaped portion 41, and the flat surface 433 comes into contact with the first surface 411 of the flange-shaped portion 41 to stabilize the posture. The pressing member 43 shown in FIG. 3 is an example of the present embodiment, and is not limited to this example as long as the flange-shaped portion 41 can be pressed in the axial direction, such as a bolt or a press-fitting member. Can be configured as.

The support member 44 is provided on the side opposite to the pressing member 43 with the flange-shaped portion 41 interposed therebetween. That is, the support member 44 is provided so as to penetrate the second wall portion 422, and the tip thereof is in contact with the second surface 412 of the flange-shaped portion 41. As a result, the support member 44 supports the collar-shaped portion 41 pressed by the pressing member 43 from the side opposite to the pressing member 43. It is preferable that the central axis of the support member 44 coincides with the central axis of the pressing member 43. By aligning the central axes of the support member 44 and the pressing member 43, the force applied to the flange-shaped portion 41 is stabilized, and unexpected inclination of the flange-shaped portion 41 can be reduced.

In the case of the present embodiment, the support member 44 has a main body 441, an elastic member 442, and a contact member 443. The main body 441 is screwed to the second wall portion 422. The elastic member 442 can be expanded and contracted in the axial direction, that is, in the axial direction of the first holding portion 21. The elastic member 442 can be applied as long as it generates an elastic force, such as a coil spring, a disc spring, and rubber. The contact member 443 is provided at the end of the elastic member 442 on the flange-shaped portion 41 side. As a result, the contact member 443 can come into contact with the second surface 412 of the flange-shaped portion 41. In the contact member 443, the flange-shaped portion 41, that is, the portion in contact with the second surface 412 is formed in a spherical shape. In the case of this embodiment, the contact member 443 is formed in a spherical shape. The support member 44 shown in FIG. 3 is an example of the present embodiment, and is not limited to this example as long as the flange-shaped portion 41 can be supported from the opposite side against the pressing force of the pressing member 43. It can be configured. For example, the support member 44 may be composed of only the elastic member 442 by eliminating the contact member 443. Further, the support member 44 may be formed by integrating the contact member 443 and the elastic member 442 with an elastic body such as rubber. Further, the support member 44 may have a shape in which the elastic member 442 is eliminated and the support member 44 protrudes from the second wall portion 422 integrally with the connection holding portion 23.

Next, a method of joining the first substrate 31 and the second substrate 32 by the joining device 10 having the above configuration will be described.
(Substrate holding process)
As shown in FIG. 4, the first substrate 31 is held by the first holding portion 21. Similarly, the second substrate 32 is held by the second holding portion 22. The first substrate 31 and the second substrate 32 are held by the first holding portion 21 and the second holding portion 22, respectively, by chucking, suction, or the like. When the first substrate 31 and the second substrate 32 are held, the drive mechanism unit 24 drives the integrated first holding unit 21 and the connection holding unit 23 toward the second holding unit 22. As a result, the first substrate 31 held by the first holding portion 21 approaches the second substrate 32 held by the second holding portion 22.

(Positioning process)
As shown in FIG. 5, in the positioning step, the drive mechanism unit 24 drives the integrated first holding unit 21 and the connection holding unit 23 toward the second holding unit 22. As a result, the first substrate 31 held by the first holding portion 21 and the second substrate 32 held by the second holding portion 22 are in contact with each other. That is, the first substrate 31 is pressed against the second substrate 32. At this time, the force of the first substrate 31 in contact with the second substrate 32 is set to be smaller than that at the time of actual joining. Further, the pressing member 43 is loosened. Therefore, the first holding portion 21 can freely rotate with the universal joint portion 45 as a fulcrum.

The second substrate 32 held by the second holding portion 22 includes a slight inclination due to a dimensional tolerance of the joining device 10 or an individual difference of the second substrate 32 itself. By lightly pressing the first substrate 31 against the second substrate 32, the posture of the first substrate 31 held by the first holding portion 21 changes according to the posture of the second substrate 32 including this slight inclination. do. That is, since the first holding portion 21 that holds the first substrate 31 can be swiveled with the universal joint portion 45 as a fulcrum as described above, the first holding portion 21 is adjusted to the posture of the first substrate 31 to be held. Posture changes. Then, the first substrate 31 and the second substrate 32 are lightly pressed against each other, and the posture of the first substrate 31 held by the first holding portion 21 matches the second substrate 32, that is, the first substrate 31. When the plane parallelism between the surface and the second substrate 32 is ensured, the pressing member 43 is advanced toward the flange-shaped portion 41. A plurality of pressing members 43 provided in the circumferential direction are all advanced toward the flange-shaped portion 41. In the case of the present embodiment, the pressing member 43 moves toward the flange-shaped portion 41 by rotating the pressing member 43 on which the male screw is formed. The flange-shaped portion 41 is supported by the support member 44 on the side opposite to the pressing member 43. As a result, the flange-shaped portion 41 is sandwiched between the pressing member 43 and the support member 44.

By pressing the pressing member 43 against the collar-shaped portion 41 in this way, the postures of the first holding portion 21 and the connection holding portion 23 are fixed. That is, the positional relationship between the first holding portion 21 and the connection holding portion 23 that swivels around the universal joint portion 45 as a fulcrum is fixed by sandwiching the flange-shaped portion 41 between the pressing member 43 and the support member 44. Here, the posture of the second holding portion 22 that holds the second substrate 32 is maintained constant with the connection holding portion 23 through the chamber 11 and the drive mechanism portion 24. Therefore, by fixing the postures of the first holding portion 21 and the connection holding portion 23, the posture of the first substrate 31 is fixed with respect to the second substrate 32 held by the second holding portion 22. That is, the position of the first substrate 31 is determined as a position where parallelism is ensured with respect to the second substrate 32. Then, the posture between the first holding portion 21 and the connection holding portion 23 is fixed by the pressing member 43.

(Beam irradiation process)
When the posture of the first holding portion 21 and the connection holding portion 23 is fixed by the pressing member 43, the drive mechanism portion 24 has the first holding portion 21 and the connection holding portion 23 integrated as shown in FIG. Drive upward of 6. As a result, the first substrate 31 is separated from the second substrate 32. After the first holding unit 21 and the connection holding unit 23 move to the preset positions and then the inside of the chamber 11 is depressurized, the beam irradiation unit 25 and the beam irradiation unit 26 irradiate the beam, that is, the beam irradiation unit 25. Irradiates the first substrate 31 with the beam 51, and the beam irradiating unit 26 irradiates the second substrate 32 with the beam 52. As a result, the surfaces of the first substrate 31 and the second substrate 32 are surface-treated by the beam 51 or the beam 52.

(Joining process)
When the irradiation of the beam 51 by the beam irradiation unit 25 and the irradiation of the beam 52 by the beam irradiation unit 26 are completed, the drive mechanism unit 24 again has the integrated first holding unit 21 and the connection holding unit 23 as shown in FIG. Drive downwards. As a result, the first substrate 31 approaches and contacts the second substrate 32. Then, the drive mechanism unit 24 lowers the first holding unit 21 and the connection holding unit 23 so that the contact force between the first substrate 31 and the second substrate 32 becomes a preset set value. Push it to the side. As a result, the first substrate 31 held by the first holding portion 21 is pressed against the second substrate 32 at the set value. At this time, since the postures of the first holding portion 21 and the connection holding portion 23 are fixed as described in the positioning step described above, the first substrate 31 held by the first holding portion 21 is second. The parallelism with the substrate 32 is maintained. Therefore, the first substrate 31 and the second substrate 32 are in contact with each other with high-precision parallelism.

The drive mechanism unit 24 maintains the set value against the second substrate 32 for a preset time and presses the first substrate 31 to join the first substrate 31 and the second substrate 32. When the joining between the first substrate 31 and the second substrate 32 is completed, the drive mechanism portion 24 moves the first holding portion 21 and the connection holding portion 23 integrally upward again. As a result, the joining between the first substrate 31 held by the first holding portion 21 and the second substrate 32 held by the second holding portion 22 is completed.

(Modification example)
An example of modification of the joining procedure according to the above will be described.
In the above embodiment, a two-layer bonded body is formed from the first substrate 31 and the second substrate 32. In the modified example, an example of laminating two or more multi-layered substrates will be described with reference to FIG. 7.
In the case of the modification shown in FIG. 7, as shown in (A), after the substrate 61 corresponding to the first substrate and the substrate 62 corresponding to the second substrate are joined as the bonded body 63, as shown in (B). The bonded body 63 is held as it is in the second holding portion 22. That is, by releasing the holding of the substrate 61 by the first holding portion 21, when the first holding portion 21 and the connection holding portion 23 are separated from the second holding portion 22, the substrate 61 and the substrate 62 are joined to each other. 63 is in a state of being held by the second holding portion 22 as it is. In this way, the first holding portion 21 moves upward in FIG. 7 while the bonded body 63 is held by the second holding portion 22. Then, as shown in (C), the joined body 64 is newly held in the first holding portion 21. In this case, the bonded body 63 held by the second holding portion 22 corresponds to the second substrate, and the bonded body 64 newly held by the first holding portion 21 corresponds to the first substrate.

When the bonded body 64 is newly held by the first holding portion 21, the bonded body 63 held by the bonded body 64 and the second holding portion 22 receives a beam from the beam irradiation unit 25 and the beam irradiation unit 26. Be irradiated. As a result, the surface treatment of the bonded body 64 and the bonded body 63 is performed. Then, the first holding portion 21 and the connection holding portion 23 holding the joined body 64 move to the second holding portion 22 side as shown in (D). As a result, the bonded body 64 held by the first holding portion 21 is joined to the bonded body 63 held by the second holding portion 22.

As shown in (A), when the substrate 61 and the substrate 62 are first joined, the parallelism between the substrate 61 and the substrate 62 is adjusted prior to the joining as in the above-described embodiment. That is, the posture of the first holding portion 21 with respect to the connection holding portion 23 is already fixed in the positioning step prior to joining the substrate 61 and the substrate 62. That is, when each board having a common lot is used, factors that affect the securing of parallelism such as the dimensional tolerance of the joining device 10 and the tolerance of each board are the factors that affect the securing of parallelism when the board 61 and the board 62 are first joined. Be adjusted. Therefore, when a new joined body 64 is joined to the joined body 63 in (D) as the second step, the joined body 63 and the joined body do not have to adjust the posture of the first holding portion 21 with respect to the connection holding portion 23. 64 is joined. As shown in (E), the bonded body 65 of the bonded body 63 and the bonded body 64 is also held by the second holding portion 22. By repeating the steps (A) to (E), a multi-layered bonded body having three or more layers can be continuously formed. Further, when the positioning step is carried out prior to the step (A) to form a multi-layered bonded body having three or more layers, reliable bonding is achieved while ensuring parallelism with high accuracy, and processing is performed. The number of man-hours can be reduced.

As a matter of course, as the number of layers of the bonded body increases, a small error may be accumulated and it may become difficult to maintain parallelism. When the accumulation of errors is expected in this way, as in the initial embodiment, the two objects to be joined are tentatively pressed against the first holding portion 21 before irradiating the beam from the beam irradiating portions 25 and 26. It may be configured to adjust the posture with the connection holding portion 23.

In one embodiment described above, the first holding portion 21 that holds the first substrate 31 is connected to the connection holding portion 23 with the universal joint portion 45 interposed therebetween. As a result, the first holding portion 21 can change its posture with respect to the connection holding portion 23. Further, the collar-shaped portion 41 provided in the first holding portion 21 is sandwiched between the pressing member 43 provided in the connection holding portion 23 and the support member 44. Therefore, the collar-shaped portion 41 provided in the first holding portion 21 is fixed between the pressing member 43 and the support member 44 by adjusting the pressing force of the pressing member 43. By fixing the flange-shaped portion 41, the posture of the first holding portion 21 that holds the first substrate 31 with respect to the connection holding portion 23 is fixed.

Prior to joining the first substrate 31 and the second substrate 32, the first substrate 31 held by the first holding portion 21 is attached to the second substrate 32 to be joined held by the second holding portion 22. Pressed. At this time, when the first substrate 31 and the second substrate 32 are in contact with each other, the first holding portion 21 that holds the first substrate 31 swivels around the universal joint portion 45 as a fulcrum, and has a posture that matches the second substrate 32. It becomes. That is, when the first substrate 31 and the second substrate 32 are in contact with each other, the plane parallelism between the first substrate 31 and the second substrate 32 is ensured. The posture of the first holding portion 21 that holds the first substrate 31 with respect to the connection holding portion 23 changes according to the second substrate 32. By adjusting the pressing force of the pressing member 43 that sandwiches the flange-shaped portion 41 in the state where the posture of the first holding portion 21 is changed in this way, the posture of the first holding portion 21 with respect to the connection holding portion 23 is fixed. By fixing the posture of the first holding portion 21 with respect to the connection holding portion 23, the first holding portion 21 that holds the first substrate 31 even when the first substrate 31 and the second substrate 32 are once separated and then brought into contact with each other again. Maintains a posture that matches the second substrate 32. As a result, the surface parallelism of the first substrate 31 held by the first holding portion 21 with the second substrate 32 is maintained. Therefore, the parallelism between the pair of the first substrate 31 and the second substrate 32 facing each other can be increased, and even if the first substrate 31 and the second substrate 32 are increased in size, the parallelism is easily secured and stable bonding is performed. Can be achieved.

In one embodiment, the surface treatment of the first substrate 31 and the second substrate 32 is performed by irradiating the beam irradiation unit 25 to the first substrate 31 and the beam irradiation unit 26 to the second substrate 32 with a beam such as an ion beam. Is given. As a result, even if the first substrate 31 and the second substrate 32 are increased in size, they can be joined by surface activation. Therefore, the first substrate 31 and the second substrate 32 are joined under an arbitrary temperature environment. As a result, the temperature conditions at the time of joining can be adjusted when the bonded body of the first substrate 31 and the second substrate 32 is used. By matching the temperature conditions at the time of joining to the temperature conditions at the time of using the joined body in this way, distortions and changes in characteristics that occur in the joined body during use can be reduced. Therefore, the characteristics of the joined body obtained by joining are stable, and a joined body with high optical and physical accuracy can be obtained. In particular, in the case of a material such as a laser oscillator whose efficiency changes greatly depending on the temperature conditions at the time of use, the influence on the performance due to the temperature environment can be greatly suppressed. Then, by using a configuration as in the present embodiment in which the position of the first holding portion 21 is determined while lightly contacting the first substrate 31 and the second substrate 32 prior to the irradiation of the beam, a laser having a large size is used. An oscillating element is obtained. As a result, it is possible to increase the output of the laser light emitted from the laser oscillation element.

In one embodiment, the pressing member 43 has a swivel contact member 432 at the tip of the main body 431. Further, in the support member 44, the contact member 443 in contact with the flange-shaped portion 41 is formed in a spherical shape. As a result, the collar-shaped portion 41 housed in the accommodating portion 42 is allowed to change in an extremely small posture even when the postures of the first holding portion 21 and the connection holding portion 23 are fixed. Further, even if the support member 44 has an elastic portion such as an elastic member 442, a slight change in the posture of the flange-shaped portion 41 is allowed. Therefore, even if a dimensional error sufficiently small compared to the tolerance of the joining device 10 occurs in the first substrate 31 and the second substrate 32, the error is absorbed by the change in the posture of the flange-shaped portion 41 in the accommodating portion 42. Tolerance. That is, the slight change in posture between the first holding portion 21 and the connection holding portion 23 due to the minute dimensional error of the first substrate 31 and the second substrate 32 is due to the change in the posture of the flange-shaped portion 41 in the accommodating portion 42. Be absorbed. As a result, when the first substrate 31 and the second substrate 32 are continuously joined, the connection is held with the first holding portion 21 for each joining even when the postures of the first holding portion 21 and the connection holding portion 23 are fixed. The parallelism between the first substrate 31 and the second substrate 32 is ensured without adjusting the posture with the portion 23. Therefore, when the plurality of first substrates 31 and the second substrate 32 are repeatedly bonded, or when a plurality of substrates are continuously bonded, high-precision parallelism is ensured without making adjustments for each bonding. It is possible to reduce the man-hours.

The present invention described above is not limited to the above embodiment, and can be applied to various embodiments without departing from the gist thereof.
In one embodiment described above, an example in which the first holding portion 21 and the second holding portion 22 are arranged in the direction of gravity, that is, in the vertical direction has been described. However, the first holding portion 21 and the second holding portion 22 may be arranged not only in the vertical direction but also in the horizontal direction.

The present disclosure has been described in accordance with the examples, but it is understood that the present disclosure is not limited to the examples and structures. The present disclosure also includes various variations and variations within a uniform range. In addition, various combinations and forms, as well as other combinations and forms that include only one element, more, or less, are within the scope and scope of the present disclosure.

In the drawing, 10 is a joining device, 11 is a chamber, 12 is a vacuum pump (decompression mechanism), 13 is a turbo molecular pump (decompression mechanism), 21 is a first holding part, 22 is a second holding part, and 23 is a connection. The holding part, 24 is the drive mechanism part, 25 and 26 are the beam irradiation parts, 31 is the first substrate, 32 is the second substrate, 41 is the flange-shaped part, 42 is the accommodating part, 43 is the pressing member, and 44 is the support member. 45 is a universal joint portion, 431 is a main body, 432 is a contact member, 442 is an elastic member, and 443 is a contact member.

Claims (6)

A joining device that joins a first substrate and a second substrate that is separate from the first substrate by activating the surfaces of the first substrate and the second substrate.
A first holding portion that holds the first substrate at one end in the axial direction,
A second holding portion provided so as to face the first holding portion and holding the second substrate, and a second holding portion.
A connection holding portion that is integrally connected to the first holding portion with a universal joint portion sandwiched between them.
A drive mechanism unit that integrally drives the first holding portion and the connection holding portion in a direction approaching or separating from the second holding portion.
A collar-shaped portion provided in the first holding portion and protruding radially outward from the first holding portion, and a collar-shaped portion.
An accommodating portion provided in the connection holding portion, sandwiching the brim-shaped portion from both sides in the axial direction, and accommodating the brim-shaped portion.
A pressing member provided in the connection holding portion, which is in contact with one surface of the flange-shaped portion in the axial direction of the first holding portion and presses the flange-shaped portion in the axial direction.
The collar that is provided on the side opposite to the pressing member across the collar-shaped portion in the connection holding portion, is in contact with the other surface of the collar-shaped portion in the axial direction of the first holding portion, and is pressed by the pressing member. A support member that supports the shape and
A joining device equipped with. The joining device according to claim 1, wherein the central axis of the pressing member and the central axis of the support member coincide with each other. A chamber accommodating the first holding portion and the second holding portion,
A decompression mechanism that depressurizes the inside of the chamber,
The joining device according to claim 1 or 2, further comprising. The joining device according to claim 3, further comprising a beam irradiating unit that is provided inside the chamber and emits a beam that processes the surface of the first substrate and the surface of the second substrate. The pressing member is
A main body movably provided in the connection holding portion forming the accommodating portion,
A contact member that is rotatably provided at the end of the main body on the collar-shaped portion side and is in contact with the collar-shaped portion.
The joining device according to any one of claims 1 to 4. The support member is
An elastic member that can expand and contract in the axial direction of the first holding portion, and
A contact member provided at the end of the elastic member on the collar-shaped portion side and having a spherically formed portion in contact with the collar-shaped portion.
The joining device according to any one of claims 1 to 5 .

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