JP6692217B2 - 荷電粒子顕微鏡において、試料の表面修正を分析する方法 - Google Patents
荷電粒子顕微鏡において、試料の表面修正を分析する方法 Download PDFInfo
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- JP6692217B2 JP6692217B2 JP2016114894A JP2016114894A JP6692217B2 JP 6692217 B2 JP6692217 B2 JP 6692217B2 JP 2016114894 A JP2016114894 A JP 2016114894A JP 2016114894 A JP2016114894 A JP 2016114894A JP 6692217 B2 JP6692217 B2 JP 6692217B2
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Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15171227.0A EP3104155A1 (en) | 2015-06-09 | 2015-06-09 | Method of analyzing surface modification of a specimen in a charged-particle microscope |
| EP15171227.0 | 2015-06-09 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017004948A JP2017004948A (ja) | 2017-01-05 |
| JP2017004948A5 JP2017004948A5 (enExample) | 2019-07-11 |
| JP6692217B2 true JP6692217B2 (ja) | 2020-05-13 |
Family
ID=53365913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016114894A Active JP6692217B2 (ja) | 2015-06-09 | 2016-06-08 | 荷電粒子顕微鏡において、試料の表面修正を分析する方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US10115561B2 (enExample) |
| EP (2) | EP3104155A1 (enExample) |
| JP (1) | JP6692217B2 (enExample) |
| CN (1) | CN106252187B (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3249676B1 (en) * | 2016-05-27 | 2018-10-03 | FEI Company | Dual-beam charged-particle microscope with in situ deposition functionality |
| EP3518270A1 (en) * | 2018-01-25 | 2019-07-31 | FEI Company | Innovative imaging technique in transmission charged particle microscopy |
| CN110415203A (zh) * | 2018-04-26 | 2019-11-05 | 比亚迪股份有限公司 | 图片检测方法、装置和电子设备 |
| EP3591685A1 (en) * | 2018-07-06 | 2020-01-08 | FEI Company | Electron microscope with improved imaging resolution |
| DE102018120630B3 (de) * | 2018-08-23 | 2019-10-31 | Carl Zeiss Microscopy Gmbh | Verfahren zum Bearbeiten eines Objekts und Programm zur Steuerung eines Partikelstrahlsystems |
| EP3647763B1 (en) * | 2018-10-29 | 2021-07-14 | FEI Company | A method of preparing a biological sample for study in an analysis device |
| DE102019210452A1 (de) * | 2019-07-16 | 2021-01-21 | Carl Zeiss Microscopy Gmbh | Verfahren und Vorrichtung zum Erfassen von Volumeninformationen dreidimensionaler Proben |
| US10921268B1 (en) * | 2019-09-09 | 2021-02-16 | Fei Company | Methods and devices for preparing sample for cryogenic electron microscopy |
| SE543979C2 (en) * | 2019-09-20 | 2021-10-12 | Metso Outotec Finland Oy | Mining Equipment Inspection System, Mining Equipment Inspection Method, and Mining Equipment Inspection Device |
| US20210374467A1 (en) * | 2020-05-29 | 2021-12-02 | Fei Company | Correlated slice and view image annotation for machine learning |
| US11282670B1 (en) * | 2020-12-29 | 2022-03-22 | Fei Company | Slice depth reconstruction of charged particle images using model simulation for improved generation of 3D sample images |
| EP4024039B1 (en) * | 2020-12-30 | 2023-10-25 | FEI Company | Data acquisition and processing techniques for three-dimensional reconstruction |
| DE102021124099B4 (de) * | 2021-09-17 | 2023-09-28 | Carl Zeiss Multisem Gmbh | Verfahren zum Betreiben eines Vielstrahl-Teilchenmikroskops in einem Kontrast-Betriebsmodus mit defokussierter Strahlführung, Computerprogramprodukt und Vielstrahlteilchenmikroskop |
| DE102021214447A1 (de) * | 2021-12-15 | 2023-06-15 | Carl Zeiss Smt Gmbh | Elektronenmikroskop zum Untersuchen einer Probe |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6452677B1 (en) * | 1998-02-13 | 2002-09-17 | Micron Technology Inc. | Method and apparatus for detecting defects in the manufacture of an electronic device |
| JP3648384B2 (ja) * | 1998-07-03 | 2005-05-18 | 株式会社日立製作所 | 集束イオンビーム加工方法及び加工装置 |
| US6399944B1 (en) | 1999-07-09 | 2002-06-04 | Fei Company | Measurement of film thickness by inelastic electron scattering |
| US6322672B1 (en) | 2000-03-10 | 2001-11-27 | Fei Company | Method and apparatus for milling copper interconnects in a charged particle beam system |
| US6753538B2 (en) | 2001-07-27 | 2004-06-22 | Fei Company | Electron beam processing |
| US20040121069A1 (en) | 2002-08-08 | 2004-06-24 | Ferranti David C. | Repairing defects on photomasks using a charged particle beam and topographical data from a scanning probe microscope |
| US7388218B2 (en) | 2005-04-04 | 2008-06-17 | Fei Company | Subsurface imaging using an electron beam |
| US7670956B2 (en) | 2005-04-08 | 2010-03-02 | Fei Company | Beam-induced etching |
| US7476858B2 (en) | 2005-10-26 | 2009-01-13 | Aspex Corporation | Particle detection auditing system and method |
| US10493559B2 (en) | 2008-07-09 | 2019-12-03 | Fei Company | Method and apparatus for laser machining |
| EP2351062A4 (en) | 2008-10-31 | 2012-10-31 | Fei Co | MEASUREMENT AND SENSING OF THE SAMPLE THICKNESS POINT OF A SAMPLE |
| CN105390358B (zh) | 2010-04-07 | 2018-09-04 | Fei 公司 | 组合激光器和带电粒子束系统 |
| JP5764380B2 (ja) | 2010-04-29 | 2015-08-19 | エフ イー アイ カンパニFei Company | Sem画像化法 |
| EP3528276A3 (en) * | 2011-05-13 | 2019-09-04 | Fibics Incorporated | Microscopy imaging method |
| EP2873088A4 (en) * | 2012-07-16 | 2015-08-05 | Fei Co | FINAL POINT DETERMINATION FOR FOCUSED ION BEAM PROCESSING |
| US10465293B2 (en) * | 2012-08-31 | 2019-11-05 | Fei Company | Dose-based end-pointing for low-kV FIB milling TEM sample preparation |
| DE102012217761B4 (de) * | 2012-09-28 | 2020-02-06 | Carl Zeiss Microscopy Gmbh | Verfahren zur Vermeidung von Artefakten beim Serial Block Face Imaging |
| EP2735866A1 (en) * | 2012-11-27 | 2014-05-28 | Fei Company | Method of sampling a sample and displaying obtained information |
| JP6286270B2 (ja) * | 2013-04-25 | 2018-02-28 | エフ イー アイ カンパニFei Company | 透過型電子顕微鏡内で位相版を用いる方法 |
| EP2824445B1 (en) | 2013-07-08 | 2016-03-02 | Fei Company | Charged-particle microscopy combined with raman spectroscopy |
| KR101794744B1 (ko) * | 2013-08-14 | 2017-12-01 | 에프이아이 컴파니 | 하전 입자 비임 시스템용 회로 프로브 |
| CN104795302B (zh) * | 2013-10-29 | 2018-10-02 | Fei 公司 | 具有用于横切应用的过程自动化的图案识别的差分成像 |
| EP2963672A1 (en) | 2014-06-30 | 2016-01-06 | FEI Company | Computational scanning microscopy with improved resolution |
| US9601303B2 (en) * | 2015-08-12 | 2017-03-21 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Charged particle beam device and method for inspecting and/or imaging a sample |
-
2015
- 2015-06-09 EP EP15171227.0A patent/EP3104155A1/en not_active Withdrawn
-
2016
- 2016-06-01 EP EP16172498.4A patent/EP3104392A1/en not_active Withdrawn
- 2016-06-08 JP JP2016114894A patent/JP6692217B2/ja active Active
- 2016-06-08 CN CN201610400193.9A patent/CN106252187B/zh active Active
- 2016-06-08 US US15/177,242 patent/US10115561B2/en active Active
-
2018
- 2018-10-09 US US16/155,297 patent/US10811223B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3104392A1 (en) | 2016-12-14 |
| US20160365224A1 (en) | 2016-12-15 |
| US10811223B2 (en) | 2020-10-20 |
| EP3104155A1 (en) | 2016-12-14 |
| US10115561B2 (en) | 2018-10-30 |
| CN106252187A (zh) | 2016-12-21 |
| CN106252187B (zh) | 2020-12-01 |
| US20190051492A1 (en) | 2019-02-14 |
| JP2017004948A (ja) | 2017-01-05 |
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