JP6685107B2 - ウェハレベルパッケージングされた光学サブアセンブリ及びそれを有する送受信モジュール - Google Patents
ウェハレベルパッケージングされた光学サブアセンブリ及びそれを有する送受信モジュール Download PDFInfo
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- JP6685107B2 JP6685107B2 JP2015210494A JP2015210494A JP6685107B2 JP 6685107 B2 JP6685107 B2 JP 6685107B2 JP 2015210494 A JP2015210494 A JP 2015210494A JP 2015210494 A JP2015210494 A JP 2015210494A JP 6685107 B2 JP6685107 B2 JP 6685107B2
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0261—Non-optical elements, e.g. laser driver components, heaters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0267—Integrated focusing lens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
- H01S5/18302—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL] comprising an integrated optical modulator
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
- G02B6/425—Optical features
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
- Led Device Packages (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
Description
Claims (12)
- アクティブ型光学素子を支持するTSVサブマウント層と、光学窓及びアライメント機能部を有し前記TSVサブマウント層に接合されたサンドイッチキャップと、を含む光学サブアセンブリと、
前記アライメント機能部で前記光学サブアセンブリに着脱可能に取り付けられたジャンパと、
前記ジャンパに着脱可能に取り付けられた光ファイバと、を備え、
前記サンドイッチキャップは、前記TSVサブマウント層の上に配置されたボトムスペーサ層と、当該ボトムスペーサ層の上に配置されたガラス層と、当該ガラス層の上に配置されたアッパスペーサ層と、を含み、
前記ボトムスペーサ層内に、前記アクティブ型光学素子を収容するよう空洞部が形成されており、
前記アクティブ型光学素子からの光を集光する少なくとも一つの第1レンズが、前記空洞部に面した、前記ガラス層の一方面側に形成され、
前記光学サブアセンブリからの光を集光して収差を補正する少なくとも一つの第2レンズが、前記第1レンズ側を向いて前記ジャンパの底面上に形成され、
前記ジャンパに形成された45度の傾斜面上に形成され、光路を変更すると共に前記光学サブアセンブリからの光をさらに集光するよう構成された、少なくとも一つの第3レンズをさらに備えた、
光送受信モジュール。 - 請求項1に記載の光送受信モジュールであって、
ウェハレベルプロセスで前記TSVサブマウント層の一方面側に形成された複数のはんだボールをさらに備えた、
光送受信モジュール。 - 請求項1又は2に記載の光送受信モジュールであって、
前記TSVサブマウント層の上に配置された第1金属層と、当該TSVサブマウント層の下に配置された第2金属層と、をさらに備え、
前記第1金属層及び前記第2金属層はそれぞれ、金属パッドとルーティング配線とを備え、Al、CU、又はAuで形成されており、さらに、前記第1金属層は、前記アクティブ型光学素子を正確に配置するよう構成されたアライメントマークを有する、
光送受信モジュール。 - 請求項1乃至3のいずれかに記載の光送受信モジュールであって、
前記TSVサブマウント層は、周囲に金属を付着させた第1孔と、当該TSVサブマウント層内でシリコン貫通電極を封止することによって密閉パッケージを実現するために金属を充填した第2孔と、を有する構造を備えた、
光送受信モジュール。 - 請求項1乃至4のいずれかに記載の光送受信モジュールであって、
前記第1レンズは、ウェハレベル処理によって前記ガラス層上に形成され、最大限の光を集光してコメリート光とするよう構成される、
光送受信モジュール。 - 請求項1乃至5のいずれかに記載の光送受信モジュールであって、
前記TSVサブマウント層上に配置され、前記ボトムスペーサ層を密閉封止して接地するよう構成された金属シールリングと、光学アライメントのための金属化基準マークと、をさらに備えた、
光送受信モジュール。 - 請求項6に記載の光送受信モジュールであって、
前記金属シールリングと前記金属化基準マークとは、同一の金属付着プロセスで形成され、前記金属シールリングは、Au又は共晶はんだで形成されており、その厚さは10μmよりも小さく形成されている、
光送受信モジュール。 - 請求項1乃至7のいずれかに記載の光送受信モジュールであって、
前記TSVサブマウント層はシリコン製であって、その厚さは50から300μmであり、前記ガラス層の厚さは50から300μmであり、前記アッパスペーサ層はシリコン製であって、その厚さは約500μmであり、さらに、前記ボトムスペーサ層はシリコン製であって、その厚さは1000μmよりも小さい、
光送受信モジュール。 - 請求項1乃至8のいずれかに記載の光送受信モジュールであって、
前記空洞部の側壁は、傾斜して、又は、垂直に形成されている、
光送受信モジュール。 - 請求項1乃至9のいずれかに記載の光送受信モジュールであって、
ICドライバをさらに備え、
前記ICドライバは、前記空洞部に収容されている、
光送受信モジュール。 - 請求項1乃至10のいずれかに記載の光送受信モジュールであって、
ICドライバをさらに備え、
前記ICドライバは、フリップチップによって前記光学サブアセンブリの底部に結合されている、
光送受信モジュール。 - 請求項1乃至11のいずれかに記載の光送受信モジュールであって、
前記サンドイッチキャップは、ウェハレベル陽極接合により形成され、熱圧着により前記TSVサブマウント層に接合される、
光送受信モジュール。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US14/535,310 | 2014-11-06 | ||
US14/535,310 US9429727B2 (en) | 2014-11-06 | 2014-11-06 | Wafer level packaged optical subassembly and transceiver module having same |
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JP2016091023A JP2016091023A (ja) | 2016-05-23 |
JP6685107B2 true JP6685107B2 (ja) | 2020-04-22 |
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US (2) | US9429727B2 (ja) |
JP (1) | JP6685107B2 (ja) |
CN (1) | CN105589139B (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015213644A1 (de) * | 2015-07-20 | 2017-01-26 | Heinz Buse | Vorrichtung zum Vereinzeln von Massengut |
CN106252389B (zh) * | 2016-09-05 | 2023-03-21 | 飞昂创新科技南通有限公司 | 用于光收发器件抗干扰的半导体器件 |
KR101929465B1 (ko) * | 2016-10-18 | 2019-03-14 | 주식회사 옵텔라 | 광학모듈 |
KR102450580B1 (ko) | 2017-12-22 | 2022-10-07 | 삼성전자주식회사 | 금속 배선 하부의 절연층 구조를 갖는 반도체 장치 |
KR102151160B1 (ko) * | 2018-01-09 | 2020-09-02 | 주식회사 네패스 | 광 모듈 |
US10209452B1 (en) * | 2018-03-12 | 2019-02-19 | Cloud Light Technology Limited | Method for fabricating silicon photonics package, active alignment method for light coupling, and silicon photonics package |
JP2019191251A (ja) | 2018-04-19 | 2019-10-31 | 日本電信電話株式会社 | 光モジュール、光配線基板および光モジュールの製造方法 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3316252B2 (ja) * | 1993-04-27 | 2002-08-19 | 三洋電機株式会社 | 光プリントヘッド |
JP2000049414A (ja) * | 1998-07-27 | 2000-02-18 | Canon Inc | 光機能素子装置、これを用いた光送受信装置、光インターコネクション装置および光記録装置 |
KR100940943B1 (ko) * | 2001-08-24 | 2010-02-08 | 쇼오트 아게 | 전자 부품 제조 방법 |
JP2003304004A (ja) * | 2002-04-11 | 2003-10-24 | Citizen Electronics Co Ltd | 光伝送チップ及び取付構造 |
US20040101020A1 (en) * | 2002-11-26 | 2004-05-27 | Photodigm, Inc. | Packaging and passive alignment of light source to single mode fiber using microlens and precision ferrule |
US7520679B2 (en) * | 2003-09-19 | 2009-04-21 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Optical device package with turning mirror and alignment post |
US6998691B2 (en) * | 2003-09-19 | 2006-02-14 | Agilent Technologies, Inc. | Optoelectronic device packaging with hermetically sealed cavity and integrated optical element |
AU2003272062A1 (en) | 2003-10-15 | 2005-04-27 | Xloom Photonics Ltd. | Electro-optical circuitry having integrated connector and methods for the production thereof |
US7364368B2 (en) * | 2004-05-14 | 2008-04-29 | Finisar Corporation | Optoelectronic coupling arrangement and transceiver with such an optoelectronic coupling arrangement |
US7705465B2 (en) * | 2005-04-01 | 2010-04-27 | Panasonic Corporation | Surface-mount type optical semiconductor device and method for manufacturing the same |
CN2819547Y (zh) * | 2005-06-16 | 2006-09-20 | 邹庆福 | 激光二极管的封装结构 |
JP2011522288A (ja) * | 2008-05-30 | 2011-07-28 | コーニング インコーポレイテッド | フォトニックバンドギャップ光ファイバを用いるファイバ集合体 |
DE112010002822T5 (de) * | 2009-07-03 | 2012-06-14 | Seoul Semiconductor Co., Ltd. | Gehäuse für licht emittierende dioden |
US8290008B2 (en) | 2009-08-20 | 2012-10-16 | International Business Machines Corporation | Silicon carrier optoelectronic packaging |
US8390083B2 (en) * | 2009-09-04 | 2013-03-05 | Analog Devices, Inc. | System with recessed sensing or processing elements |
US9442255B2 (en) | 2010-06-29 | 2016-09-13 | Ultra Communications, Inc. | Low profile fiber-to-module interface with relaxed alignment tolerances |
US8469610B2 (en) * | 2011-01-18 | 2013-06-25 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optical connection system with plug having optical turn |
US20120241600A1 (en) * | 2011-03-24 | 2012-09-27 | Centera Photonics Inc. | Optical electrical module |
US9057850B2 (en) * | 2011-03-24 | 2015-06-16 | Centera Photonics Inc. | Optoelectronic module |
US9213152B2 (en) * | 2012-01-09 | 2015-12-15 | Cisco Technology Inc. | Releasable fiber connector for opto-electronic assemblies |
JP5677355B2 (ja) * | 2012-04-02 | 2015-02-25 | 株式会社フジクラ | フェルール、光ファイバ付きフェルール |
JP2013235243A (ja) * | 2012-04-09 | 2013-11-21 | Fujikura Ltd | 光路変更部材 |
US9052476B2 (en) * | 2012-07-04 | 2015-06-09 | Sae Magnetics (H.K.) Ltd. | Wafer-level packaged optical subassembly and transceiver module having same |
US9557478B2 (en) * | 2012-08-28 | 2017-01-31 | Acacia Communications, Inc. | Electronic and optical co-packaging of coherent transceiver |
-
2014
- 2014-11-06 US US14/535,310 patent/US9429727B2/en active Active
-
2015
- 2015-10-22 CN CN201510690565.1A patent/CN105589139B/zh active Active
- 2015-10-27 JP JP2015210494A patent/JP6685107B2/ja active Active
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2016
- 2016-07-04 US US15/201,519 patent/US9739958B2/en active Active
Also Published As
Publication number | Publication date |
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US9739958B2 (en) | 2017-08-22 |
CN105589139B (zh) | 2019-04-23 |
CN105589139A (zh) | 2016-05-18 |
JP2016091023A (ja) | 2016-05-23 |
US20160131861A1 (en) | 2016-05-12 |
US9429727B2 (en) | 2016-08-30 |
US20160313514A1 (en) | 2016-10-27 |
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