JP6683503B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP6683503B2 JP6683503B2 JP2016039310A JP2016039310A JP6683503B2 JP 6683503 B2 JP6683503 B2 JP 6683503B2 JP 2016039310 A JP2016039310 A JP 2016039310A JP 2016039310 A JP2016039310 A JP 2016039310A JP 6683503 B2 JP6683503 B2 JP 6683503B2
- Authority
- JP
- Japan
- Prior art keywords
- insulator
- transistor
- conductor
- oxide
- oxide layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Electroluminescent Light Sources (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
- Thin Film Transistor (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Non-Volatile Memory (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015040858 | 2015-03-03 | ||
JP2015040858 | 2015-03-03 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020055298A Division JP2020115556A (ja) | 2015-03-03 | 2020-03-26 | 半導体装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016167591A JP2016167591A (ja) | 2016-09-15 |
JP2016167591A5 JP2016167591A5 (ja) | 2019-04-04 |
JP6683503B2 true JP6683503B2 (ja) | 2020-04-22 |
Family
ID=56897745
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016039310A Active JP6683503B2 (ja) | 2015-03-03 | 2016-03-01 | 半導体装置 |
JP2020055298A Withdrawn JP2020115556A (ja) | 2015-03-03 | 2020-03-26 | 半導体装置 |
JP2022016905A Withdrawn JP2022062195A (ja) | 2015-03-03 | 2022-02-07 | 半導体装置 |
JP2023186416A Active JP7559181B2 (ja) | 2015-03-03 | 2023-10-31 | 半導体装置 |
JP2024161040A Pending JP2025016437A (ja) | 2015-03-03 | 2024-09-18 | 半導体装置 |
Family Applications After (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020055298A Withdrawn JP2020115556A (ja) | 2015-03-03 | 2020-03-26 | 半導体装置 |
JP2022016905A Withdrawn JP2022062195A (ja) | 2015-03-03 | 2022-02-07 | 半導体装置 |
JP2023186416A Active JP7559181B2 (ja) | 2015-03-03 | 2023-10-31 | 半導体装置 |
JP2024161040A Pending JP2025016437A (ja) | 2015-03-03 | 2024-09-18 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (5) | JP6683503B2 (enrdf_load_stackoverflow) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6871722B2 (ja) * | 2016-11-17 | 2021-05-12 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US20190348537A1 (en) * | 2016-12-27 | 2019-11-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
JP2018206828A (ja) * | 2017-05-31 | 2018-12-27 | 株式会社半導体エネルギー研究所 | 半導体装置、および半導体装置の作製方法 |
US11056491B2 (en) | 2017-06-27 | 2021-07-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
WO2019025912A1 (en) * | 2017-08-04 | 2019-02-07 | Semiconductor Energy Laboratory Co., Ltd. | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME |
KR102630641B1 (ko) | 2018-01-25 | 2024-01-30 | 삼성디스플레이 주식회사 | 표시장치 및 그의 제조방법 |
KR20200138305A (ko) | 2018-03-29 | 2020-12-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 기억 장치 및 전자 기기 |
US11636809B2 (en) | 2019-11-29 | 2023-04-25 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Display substrate and display device |
EP4089740A1 (en) * | 2019-11-29 | 2022-11-16 | BOE Technology Group Co., Ltd. | Array substrate and manufacturing method therefor, display device and display substrate |
KR20210086898A (ko) | 2019-12-31 | 2021-07-09 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조방법 |
JP2023055740A (ja) * | 2021-12-17 | 2023-04-18 | 株式会社半導体エネルギー研究所 | 剥離方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100890957B1 (ko) * | 2002-12-19 | 2009-03-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 및 표시장치의 제작 방법 |
JP5046529B2 (ja) * | 2005-02-25 | 2012-10-10 | 株式会社半導体エネルギー研究所 | 半導体装置 |
JP2009238866A (ja) * | 2008-03-26 | 2009-10-15 | Fuji Electric Device Technology Co Ltd | 半導体装置の製造方法 |
JP5460108B2 (ja) * | 2008-04-18 | 2014-04-02 | 株式会社半導体エネルギー研究所 | 半導体装置及び半導体装置の作製方法 |
US8766269B2 (en) * | 2009-07-02 | 2014-07-01 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, lighting device, and electronic device |
CN102792677B (zh) * | 2010-03-08 | 2015-08-05 | 株式会社半导体能源研究所 | 半导体器件及其制造方法 |
WO2011145468A1 (en) * | 2010-05-21 | 2011-11-24 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and semiconductor device |
TWI597842B (zh) * | 2011-03-25 | 2017-09-01 | 半導體能源研究所股份有限公司 | 場效電晶體及包含該場效電晶體之記憶體與半導體電路 |
US9093538B2 (en) * | 2011-04-08 | 2015-07-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
US8446171B2 (en) * | 2011-04-29 | 2013-05-21 | Semiconductor Energy Laboratory Co., Ltd. | Signal processing unit |
TWI556319B (zh) * | 2011-11-30 | 2016-11-01 | 半導體能源研究所股份有限公司 | 半導體裝置的製造方法 |
KR102097171B1 (ko) * | 2012-01-20 | 2020-04-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
US9099560B2 (en) * | 2012-01-20 | 2015-08-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
KR102330543B1 (ko) | 2012-04-13 | 2021-11-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
JP6026844B2 (ja) * | 2012-10-17 | 2016-11-16 | 株式会社半導体エネルギー研究所 | 半導体装置 |
KR102238682B1 (ko) * | 2013-02-28 | 2021-04-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치와 그 제작 방법 |
JP6376788B2 (ja) | 2013-03-26 | 2018-08-22 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
US20150008428A1 (en) * | 2013-07-08 | 2015-01-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
JP6322503B2 (ja) * | 2013-07-16 | 2018-05-09 | 株式会社半導体エネルギー研究所 | 半導体装置 |
TWI632688B (zh) * | 2013-07-25 | 2018-08-11 | 半導體能源研究所股份有限公司 | 半導體裝置以及半導體裝置的製造方法 |
JP2015053477A (ja) * | 2013-08-05 | 2015-03-19 | 株式会社半導体エネルギー研究所 | 半導体装置および半導体装置の作製方法 |
US9443987B2 (en) * | 2013-08-23 | 2016-09-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
-
2016
- 2016-03-01 JP JP2016039310A patent/JP6683503B2/ja active Active
-
2020
- 2020-03-26 JP JP2020055298A patent/JP2020115556A/ja not_active Withdrawn
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2022
- 2022-02-07 JP JP2022016905A patent/JP2022062195A/ja not_active Withdrawn
-
2023
- 2023-10-31 JP JP2023186416A patent/JP7559181B2/ja active Active
-
2024
- 2024-09-18 JP JP2024161040A patent/JP2025016437A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2022062195A (ja) | 2022-04-19 |
JP2025016437A (ja) | 2025-02-04 |
JP2024012439A (ja) | 2024-01-30 |
JP7559181B2 (ja) | 2024-10-01 |
JP2016167591A (ja) | 2016-09-15 |
JP2020115556A (ja) | 2020-07-30 |
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