JP6683503B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6683503B2
JP6683503B2 JP2016039310A JP2016039310A JP6683503B2 JP 6683503 B2 JP6683503 B2 JP 6683503B2 JP 2016039310 A JP2016039310 A JP 2016039310A JP 2016039310 A JP2016039310 A JP 2016039310A JP 6683503 B2 JP6683503 B2 JP 6683503B2
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Prior art keywords
insulator
transistor
conductor
oxide
oxide layer
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Japanese (ja)
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JP2016167591A5 (ja
JP2016167591A (ja
Inventor
山崎 舜平
舜平 山崎
岡崎 豊
豊 岡崎
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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  • Electroluminescent Light Sources (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Thin Film Transistor (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Non-Volatile Memory (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP2016039310A 2015-03-03 2016-03-01 半導体装置 Active JP6683503B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015040858 2015-03-03
JP2015040858 2015-03-03

Related Child Applications (1)

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JP2020055298A Division JP2020115556A (ja) 2015-03-03 2020-03-26 半導体装置

Publications (3)

Publication Number Publication Date
JP2016167591A JP2016167591A (ja) 2016-09-15
JP2016167591A5 JP2016167591A5 (ja) 2019-04-04
JP6683503B2 true JP6683503B2 (ja) 2020-04-22

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Family Applications (5)

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JP2016039310A Active JP6683503B2 (ja) 2015-03-03 2016-03-01 半導体装置
JP2020055298A Withdrawn JP2020115556A (ja) 2015-03-03 2020-03-26 半導体装置
JP2022016905A Withdrawn JP2022062195A (ja) 2015-03-03 2022-02-07 半導体装置
JP2023186416A Active JP7559181B2 (ja) 2015-03-03 2023-10-31 半導体装置
JP2024161040A Pending JP2025016437A (ja) 2015-03-03 2024-09-18 半導体装置

Family Applications After (4)

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JP2020055298A Withdrawn JP2020115556A (ja) 2015-03-03 2020-03-26 半導体装置
JP2022016905A Withdrawn JP2022062195A (ja) 2015-03-03 2022-02-07 半導体装置
JP2023186416A Active JP7559181B2 (ja) 2015-03-03 2023-10-31 半導体装置
JP2024161040A Pending JP2025016437A (ja) 2015-03-03 2024-09-18 半導体装置

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JP (5) JP6683503B2 (enrdf_load_stackoverflow)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6871722B2 (ja) * 2016-11-17 2021-05-12 株式会社半導体エネルギー研究所 半導体装置
US20190348537A1 (en) * 2016-12-27 2019-11-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
JP2018206828A (ja) * 2017-05-31 2018-12-27 株式会社半導体エネルギー研究所 半導体装置、および半導体装置の作製方法
US11056491B2 (en) 2017-06-27 2021-07-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
WO2019025912A1 (en) * 2017-08-04 2019-02-07 Semiconductor Energy Laboratory Co., Ltd. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
KR102630641B1 (ko) 2018-01-25 2024-01-30 삼성디스플레이 주식회사 표시장치 및 그의 제조방법
KR20200138305A (ko) 2018-03-29 2020-12-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 기억 장치 및 전자 기기
US11636809B2 (en) 2019-11-29 2023-04-25 Chengdu Boe Optoelectronics Technology Co., Ltd. Display substrate and display device
EP4089740A1 (en) * 2019-11-29 2022-11-16 BOE Technology Group Co., Ltd. Array substrate and manufacturing method therefor, display device and display substrate
KR20210086898A (ko) 2019-12-31 2021-07-09 삼성디스플레이 주식회사 표시 장치 및 그 제조방법
JP2023055740A (ja) * 2021-12-17 2023-04-18 株式会社半導体エネルギー研究所 剥離方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100890957B1 (ko) * 2002-12-19 2009-03-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시장치 및 표시장치의 제작 방법
JP5046529B2 (ja) * 2005-02-25 2012-10-10 株式会社半導体エネルギー研究所 半導体装置
JP2009238866A (ja) * 2008-03-26 2009-10-15 Fuji Electric Device Technology Co Ltd 半導体装置の製造方法
JP5460108B2 (ja) * 2008-04-18 2014-04-02 株式会社半導体エネルギー研究所 半導体装置及び半導体装置の作製方法
US8766269B2 (en) * 2009-07-02 2014-07-01 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, lighting device, and electronic device
CN102792677B (zh) * 2010-03-08 2015-08-05 株式会社半导体能源研究所 半导体器件及其制造方法
WO2011145468A1 (en) * 2010-05-21 2011-11-24 Semiconductor Energy Laboratory Co., Ltd. Memory device and semiconductor device
TWI597842B (zh) * 2011-03-25 2017-09-01 半導體能源研究所股份有限公司 場效電晶體及包含該場效電晶體之記憶體與半導體電路
US9093538B2 (en) * 2011-04-08 2015-07-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US8446171B2 (en) * 2011-04-29 2013-05-21 Semiconductor Energy Laboratory Co., Ltd. Signal processing unit
TWI556319B (zh) * 2011-11-30 2016-11-01 半導體能源研究所股份有限公司 半導體裝置的製造方法
KR102097171B1 (ko) * 2012-01-20 2020-04-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US9099560B2 (en) * 2012-01-20 2015-08-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
KR102330543B1 (ko) 2012-04-13 2021-11-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
JP6026844B2 (ja) * 2012-10-17 2016-11-16 株式会社半導体エネルギー研究所 半導体装置
KR102238682B1 (ko) * 2013-02-28 2021-04-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치와 그 제작 방법
JP6376788B2 (ja) 2013-03-26 2018-08-22 株式会社半導体エネルギー研究所 半導体装置およびその作製方法
US20150008428A1 (en) * 2013-07-08 2015-01-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
JP6322503B2 (ja) * 2013-07-16 2018-05-09 株式会社半導体エネルギー研究所 半導体装置
TWI632688B (zh) * 2013-07-25 2018-08-11 半導體能源研究所股份有限公司 半導體裝置以及半導體裝置的製造方法
JP2015053477A (ja) * 2013-08-05 2015-03-19 株式会社半導体エネルギー研究所 半導体装置および半導体装置の作製方法
US9443987B2 (en) * 2013-08-23 2016-09-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device

Also Published As

Publication number Publication date
JP2022062195A (ja) 2022-04-19
JP2025016437A (ja) 2025-02-04
JP2024012439A (ja) 2024-01-30
JP7559181B2 (ja) 2024-10-01
JP2016167591A (ja) 2016-09-15
JP2020115556A (ja) 2020-07-30

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