JP6679320B2 - 接続体の製造方法、電子部品の接続方法 - Google Patents

接続体の製造方法、電子部品の接続方法 Download PDF

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Publication number
JP6679320B2
JP6679320B2 JP2016008718A JP2016008718A JP6679320B2 JP 6679320 B2 JP6679320 B2 JP 6679320B2 JP 2016008718 A JP2016008718 A JP 2016008718A JP 2016008718 A JP2016008718 A JP 2016008718A JP 6679320 B2 JP6679320 B2 JP 6679320B2
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JP
Japan
Prior art keywords
pressure bonding
light irradiation
bonding step
adhesive
transparent substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016008718A
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English (en)
Japanese (ja)
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JP2016136625A (ja
Inventor
太一郎 梶谷
太一郎 梶谷
未希 平尾
未希 平尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to PCT/JP2016/051595 priority Critical patent/WO2016117613A1/ja
Priority to KR1020177010336A priority patent/KR101969248B1/ko
Publication of JP2016136625A publication Critical patent/JP2016136625A/ja
Application granted granted Critical
Publication of JP6679320B2 publication Critical patent/JP6679320B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Liquid Crystal (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
JP2016008718A 2015-01-20 2016-01-20 接続体の製造方法、電子部品の接続方法 Active JP6679320B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2016/051595 WO2016117613A1 (ja) 2015-01-20 2016-01-20 接続体の製造方法、電子部品の接続方法、接続体
KR1020177010336A KR101969248B1 (ko) 2015-01-20 2016-01-20 접속체의 제조 방법, 전자 부품의 접속 방법, 접속체

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015008950 2015-01-20
JP2015008950 2015-01-20

Publications (2)

Publication Number Publication Date
JP2016136625A JP2016136625A (ja) 2016-07-28
JP6679320B2 true JP6679320B2 (ja) 2020-04-15

Family

ID=56512774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016008718A Active JP6679320B2 (ja) 2015-01-20 2016-01-20 接続体の製造方法、電子部品の接続方法

Country Status (3)

Country Link
JP (1) JP6679320B2 (ko)
KR (1) KR101969248B1 (ko)
CN (1) CN107078071B (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109642120B (zh) 2016-12-08 2021-06-08 株式会社Lg化学 基板接合方法和由该基板接合方法制造的显示器基板
JP7130917B2 (ja) * 2017-01-30 2022-09-06 昭和電工マテリアルズ株式会社 接着剤組成物、回路接続材料、フィルム状接着剤、接続構造体及びその製造方法
KR20210018700A (ko) 2019-08-09 2021-02-18 삼성디스플레이 주식회사 접착 부재 및 이를 포함한 표시장치
KR20210122359A (ko) 2020-03-30 2021-10-12 삼성디스플레이 주식회사 표시 장치 및 표시 장치 제조 방법
JP7516191B2 (ja) * 2020-09-29 2024-07-16 日本発條株式会社 ディスク装置用サスペンションの製造方法と、製造装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4967276B2 (ja) * 2005-08-09 2012-07-04 日立化成工業株式会社 回路接続材料並びに回路端子の接続構造体及び接続方法
JP2008252098A (ja) 2008-03-31 2008-10-16 Hitachi Chem Co Ltd 回路板装置の製造法
JP5745944B2 (ja) 2011-06-06 2015-07-08 デクセリアルズ株式会社 接続方法、接続体の製造方法、接続体
JP2013058412A (ja) * 2011-09-08 2013-03-28 Sekisui Chem Co Ltd 絶縁材料、積層体、接続構造体、積層体の製造方法及び接続構造体の製造方法
JP2013105636A (ja) * 2011-11-14 2013-05-30 Dexerials Corp 異方性導電フィルム、接続方法、及び接合体
JP2014096531A (ja) * 2012-11-12 2014-05-22 Dexerials Corp 接続構造体の製造方法及び接続方法
JP2014202821A (ja) * 2013-04-02 2014-10-27 積水化学工業株式会社 液晶表示素子の製造方法及び接合材料

Also Published As

Publication number Publication date
KR20170056662A (ko) 2017-05-23
JP2016136625A (ja) 2016-07-28
KR101969248B1 (ko) 2019-04-15
CN107078071B (zh) 2020-03-03
CN107078071A (zh) 2017-08-18

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