JP6676593B2 - Resin sheet and semiconductor device - Google Patents

Description

  The present invention relates to a resin sheet and a semiconductor device manufactured using the resin sheet.

  In recent years, the demand for smaller and thinner semiconductor packages has been greatly increased. In order to satisfy such demands, fan-out type semiconductor packages have been proposed. As a method of manufacturing a fan-out type semiconductor package, a panel-level fan-out packaging technology (FOPLP), which is manufactured with a square substrate size of about 300 to 700 mm, has attracted attention.

  In the method of manufacturing a semiconductor device of FOPLP, for example, after a resin composition layer formed in a sheet shape is laminated on an electronic component provided on a support, the electronic component is pressed by pressing the resin composition layer. Is embedded in the resin composition layer. Thereafter, by curing the resin composition layer, the electronic component is sealed, and thereafter, a rewiring layer is formed.

  As the resin sheet provided with the resin composition layer as described above, a resin sheet having a configuration in which a support sheet is laminated on the resin composition layer is usually used in order to improve handleability during processing or transportation. May be done. For example, Patent Literature 1 discloses a resin sheet including a resin composition layer and support sheets laminated on both surfaces of the resin composition layer. The surface of the support sheet that is in contact with the resin composition layer is subjected to release treatment with a silicone-based release agent.

  Further, since the resin sheet as described above usually contains a thermosetting resin such as an epoxy resin or a curing accelerator in the resin composition layer, the storage stability tends to be low, and thus refrigerated storage is required. There are cases.

JP 2015-126133 A

  By the way, since the above-mentioned resin sheet has little or no tackiness (tack) on the surface of the resin composition layer, when the resin sheet is stored in a state protected by the support sheet, the interface between the resin composition layer and the support sheet is obtained. However, there is a problem that floating occurs. Furthermore, there was a case where a problem occurred in handling properties such as chipping or cracking in the resin composition layer during processing or transportation. In particular, these problems are caused when a resin sheet is stored under refrigeration at 5 ° C. or lower, when a resin composition layer having a high inorganic filler content is used, and a phenoxy resin is used as a resin component for imparting film forming properties. This becomes noticeable in some cases.

  The present invention has been made in view of such circumstances, and provides a resin sheet which is less likely to float at an interface between a resin composition layer and a support sheet, and has excellent handling properties during processing and transportation. With the goal. The present invention also provides a semiconductor device using such a resin sheet and having good quality.

  In order to achieve the above object, a first aspect of the present invention is a resin sheet used for sealing an electronic component or forming an insulating film in a method of manufacturing a semiconductor device by panel level packaging, wherein the resin sheet is A first support sheet, a resin composition layer laminated on one surface of the first support sheet, and a second composition layer laminated on a surface of the resin composition layer opposite to the first support sheet. And a support sheet, wherein the resin composition layer is formed from a resin composition containing a thermosetting resin, a thermoplastic resin, and inorganic fine particles, and in the resin composition of the inorganic fine particles. The content is 50% by mass or more, the content of the thermoplastic resin in the resin composition is 30% by mass or less, and the content of the thermoplastic resin with the resin composition layer in the first support sheet is 30% by mass or less. The contact surface is not subjected to a release treatment by a silicone-based release agent, and the concentration of a volatile component generated when the resin composition layer is heated at 120 ° C. for 30 minutes as measured by gas chromatography / mass spectrometry, A resin sheet characterized by being 100 ppm or more and 45,000 ppm or less (Invention 1).

  In the resin sheet according to the above invention (Invention 1), the support sheet is provided on both surfaces of the resin composition layer, and the contact surface of the first support sheet with the resin composition layer is not subjected to the release treatment by the silicone-based release agent. Due to this, floating at the interface between the resin composition layer and the support sheet hardly occurs. Further, when the concentration of the volatile component in the resin composition layer is within the above range, the surface of the resin composition layer has a good tack, and this also allows the interface between the resin composition layer and the support sheet. Floating hardly occurs. Further, when the concentration of the volatile component in the resin composition layer is within the above range, the fragility of the resin composition layer is improved. As described above, while the occurrence of floating is suppressed and the brittleness of the resin composition layer is improved, chipping and cracking of the resin composition layer during processing and transportation are less likely to occur, which is excellent. Handleability is achieved.

  In the above invention (Invention 1), the thermoplastic resin preferably does not contain an acrylic resin (Invention 2).

  In the above inventions (Inventions 1 and 2), the surface of the first support sheet on the resin composition layer side is preferably subjected to a release treatment with an alkyd-based release agent (Invention 3).

  In the above inventions (Inventions 1 to 3), the first support sheet preferably includes a resin support base material having a glass transition temperature (Tg) of 50 ° C. or higher (Invention 4).

  In the above inventions (Inventions 1 to 4), the surface of the second support sheet on the resin composition layer side is preferably subjected to a release treatment with a release agent (Invention 5).

  Second, the present invention provides a semiconductor device comprising a cured layer obtained by curing a resin composition layer in the resin sheet (Inventions 1 to 5) (Invention 6).

  ADVANTAGE OF THE INVENTION According to the resin sheet of this invention, it is hard to generate | occur | produce at the interface of a resin composition layer and a support sheet, and it is excellent in the handleability at the time of a process or conveyance. Further, according to the manufacturing method of the present invention, a semiconductor device having good quality can be manufactured using such a resin sheet.

It is a sectional view of a resin sheet concerning one embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described.
[Resin sheet]
FIG. 1 shows a cross-sectional view of a resin sheet 1 according to the present embodiment. As shown in FIG. 1, the resin sheet 1 according to the present embodiment includes a first support sheet 11, a resin composition layer 10 laminated on one surface of the first support sheet 11, and a resin composition layer 10. A second support sheet that is stacked on a surface opposite to the first support sheet.

  Furthermore, the contact surface of the first support sheet 11 in the present embodiment with the resin composition layer 10 is not subjected to a release treatment with a silicone-based release agent. In the present specification, "not subjected to a release treatment with a silicone-based release agent" means that the first support sheet 11 has been subjected to a release treatment with a release agent other than the silicone-based release agent, or It means that the release treatment with the release agent has not been performed.

  As described above, the resin sheet 1 according to the present embodiment has a configuration in which the first support sheet 11 and the second support sheet 12 are laminated on both surfaces of the resin composition layer 10, respectively. 10 is well protected from both sides by the support sheet. Furthermore, the resin sheet 1 according to the present embodiment has a structure in which the contact surface of the first support sheet 11 with the resin composition layer is not subjected to a release treatment by a silicone-based release agent, so that the resin composition layer 10 The desired adhesion is achieved at the interface with the first support sheet 11. As described above, the first support sheet 11 protects one surface side of the resin composition layer 10 and protects the other surface side with the second support sheet 12 according to the present embodiment. In the resin sheet 1, floating at the interface between the resin composition layer 10 and the support sheet hardly occurs.

  In the resin sheet 1 according to the present embodiment, the concentration of volatile components generated when the resin composition layer 10 is heated at 120 ° C. for 30 minutes, measured by gas chromatography mass spectrometry, is 100 ppm or more and 45000 ppm. It is as follows. As a result, the resin composition layer 10 has a good tack on its surface, and it is difficult for the resin composition layer 10 to float at the interface between the resin composition layer 10 and the support sheet. Further, when the concentration of the volatile component is within the above range, the brittleness of the resin composition layer 10 is also improved.

  As described above, in the resin sheet 1 according to the present embodiment, the occurrence of floating at the interface between the resin composition layer 10 and the support sheet is suppressed, and the fragility of the resin composition layer 10 is improved. In addition, the resin composition layer is less likely to be chipped or cracked during processing or transportation, and excellent handling properties are achieved.

1. Resin Composition Layer The resin composition layer 10 in the present embodiment is formed from a resin composition containing a thermosetting resin, a thermoplastic resin, and inorganic fine particles. The resin composition layer 10 has curability, and a cured layer can be formed by curing the resin composition layer 10. The cured layer formed by curing the resin composition layer 10 preferably has insulating properties. By the insulating property of the cured layer, in the obtained semiconductor device, defects such as short circuit are suppressed, and excellent performance can be obtained.

(1) Thermosetting resin The thermosetting resin is not particularly limited, and examples thereof include an epoxy resin, a phenol resin, a naphthol resin, an active ester resin, a benzoxazine resin, and a cyanate ester resin. These can be used alone or in combination of two or more.

  Various known epoxy resins can be used as the epoxy resin. Specifically, glycidyl ethers of phenols such as bisphenol A, bisphenol F, resorcinol, phenyl novolak, and cresol novolak; butanediol, polyethylene glycol, and polypropylene Glycidyl ethers of alcohols such as glycol; Glycidyl ethers of carboxylic acids such as phthalic acid, isophthalic acid and tetrahydrophthalic acid; Glycidyl type or alkyl glycidyl type in which active hydrogen bonded to a nitrogen atom such as aniline isocyanurate is substituted with a glycidyl group Epoxy resin; vinylcyclohexane diepoxide, 3,4-epoxycyclohexylmethyl-3,4-dicyclohexanecarboxylate, 2- (3,4-epoxy) cyclohexane So-called alicyclic epoxides, such as xyl-5,5-spiro (3,4-epoxy) cyclohexane-m-dioxane, into which an epoxy is introduced by, for example, oxidizing a carbon-carbon double bond in the molecule. Can be mentioned. In addition, an epoxy resin having a biphenyl skeleton, a triphenylmethane skeleton, a dicyclohexadiene skeleton, a naphthalene skeleton, or the like can be used. These epoxy resins can be used alone or in combination of two or more. Among the above epoxy resins, glycidyl ether of bisphenol A (bisphenol A type epoxy resin), epoxy resin having a biphenyl skeleton (biphenyl type epoxy resin), epoxy resin having a naphthalene skeleton (naphthalene type epoxy resin) or a combination thereof It is preferred to use.

  Examples of the phenol resin include bisphenol A, tetramethyl bisphenol A, diallyl bisphenol A, biphenol, bisphenol F, diallyl bisphenol F, triphenylmethane-type phenol, tetrakisphenol, novolak-type phenol, cresol novolak resin, and biphenylaralkyl skeleton. Phenol (biphenyl-type phenol) and the like, and among these, it is preferable to use biphenyl-type phenol. These phenolic resins can be used alone or in combination of two or more. When an epoxy resin is used as the curable resin, it is preferable to use a phenol resin together from the viewpoint of reactivity with the epoxy resin and the like.

  The content of the thermosetting resin in the resin composition is preferably 10% by mass or more, particularly preferably 15% by mass or more, and further preferably 20% by mass or more. Further, the content is preferably 60% by mass or less, particularly preferably 50% by mass or less, and further preferably 40% by mass or less. When the content is 10% by mass or more, the curing of the resin composition layer 10 becomes more sufficient, and the electronic component can be more firmly sealed. Further, when the content is 60% by mass or less, curing of the resin composition layer 10 at an unintended stage can be further suppressed, and storage stability becomes more excellent. In addition, the said content of thermosetting resin is a solid content conversion value.

(2) Thermoplastic resin The resin composition in the present embodiment contains a thermoplastic resin at 30% by mass or less. Thereby, excellent film forming properties are imparted to the resin composition, and the handleability of the obtained resin sheet 1 is effectively improved. From such a viewpoint, the content of the thermoplastic resin in the resin composition is preferably 20% by mass or less, particularly preferably 10% by mass or less. The lower limit of the content of the thermoplastic resin is not particularly limited, but is, for example, preferably 1.0% by mass or more, particularly preferably 3.0% by mass or more, and further preferably 5.0% by mass or more. It is preferably at least 0% by mass. In addition, the said content of a thermoplastic resin is a solid content conversion value.

  Examples of the thermoplastic resin include phenoxy resin, olefin resin, polyester resin, polyurethane resin, polyester urethane resin, acrylic resin, amide resin, styrene-isobutylene-styrene copolymer (SIS), and the like. Styrene-based resin, silane-based resin, rubber-based resin, polyvinyl acetal-based resin, polyvinyl butyral resin, polyimide-based resin, polyamide-imide-based resin, polyethersulfone-based resin, polysulfone-based resin, fluorine-based resin, and the like. , Can be used alone or in combination of two or more. These thermoplastic resins may have a curable functional group.

  Here, when a semiconductor device is manufactured using the resin sheet 1 according to the present embodiment for miniaturization of the semiconductor device and miniaturization of wiring, a cured layer formed by curing the resin composition layer 10 A redistribution layer may be provided by forming an electrode thereon. In particular, when the rewiring layer is provided by a semi-additive method described later, in the desmearing process, the cured layer is processed under severe conditions such as exposure to an alkaline solution. In this case, depending on the type of the thermoplastic resin, the cured layer may be dissolved and the wiring forming property may be poor, such as a decrease in the peel strength of plating. Therefore, it is preferable that the thermoplastic resin does not contain an acrylic resin from the viewpoint of forming the wiring on the cured layer. As the thermoplastic resin, it is preferable to use at least one selected from the group consisting of a phenoxy resin, a polyvinyl acetal resin, and a polyvinyl butyral resin among the thermoplastic resins described above.

  Examples of the phenoxy resin include, but are not particularly limited to, bisphenol A type, bisphenol F type, bisphenol A / bisphenol F copolymer type, bisphenol S type, bisphenol acetophenone type, novolak type, fluorene type, dicyclopentadiene type, norbornene. Type, naphthalene type, anthracene type, adamantane type, terpene type, trimethylcyclohexane type, biphenol type, biphenyl type phenoxy resins and the like are exemplified, and among these, it is preferable to use bisphenol A type phenoxy resin. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group and an epoxy group. One phenoxy resin may be used alone, or two or more phenoxy resins may be used in combination.

  When a phenoxy resin is used as the thermoplastic resin, the tack on the surface of the resin composition layer 10 tends to be small. However, the resin sheet 1 according to the present embodiment can effectively suppress the floating at the interface between the resin composition layer 10 and the support sheet even when a phenoxy resin is used as the thermoplastic resin.

  The weight average molecular weight (Mw) of the thermoplastic resin is preferably 100 or more, particularly preferably 1000 or more, and further preferably 10,000 or more. Further, the weight average molecular weight (Mw) of the thermoplastic resin is preferably 1,000,000 or less, particularly preferably 800,000 or less, and further preferably 100,000 or less. When the weight average molecular weight (Mw) of the thermoplastic resin is in the above range, it becomes easier to form the resin composition layer 10 into a sheet. In addition, the weight average molecular weight in this specification is a standard polystyrene conversion value measured by a gel permeation chromatography (Gel Permeation Chromatography; GPC) method.

(3) Inorganic fine particles The resin composition in the present embodiment contains inorganic fine particles at 50% by mass or more. Thereby, the thermal expansion coefficient and the water absorption of the cured layer obtained by curing the resin composition layer 10 become relatively small. Further, the resin composition layer 10 exhibits excellent flexibility, fluidity and adhesiveness. From such a viewpoint, the content of the inorganic fine particles in the resin composition is preferably 55% by mass or more, and particularly preferably 60% by mass or more. The upper limit of the content of the inorganic fine particles is not particularly limited, but is, for example, preferably 90% by mass or less, particularly preferably 85% by mass or less, and further preferably 80% by mass or less. Is preferred. In addition, the said content of inorganic fine particles is a solid content conversion value.

  As the inorganic fine particles, for example, silica, alumina, glass, titanium oxide, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, Fine particles made of aluminum oxide whisker, boron nitride, crystalline silica, amorphous silica, mullite, composite oxide such as cordierite, montmorillonite, smectite, boehmite, talc, iron oxide, silicon carbide, zirconium oxide, etc. These can be exemplified, and these can be used alone or in combination of two or more. Among these, it is preferable to use silica fine particles and alumina fine particles, and it is particularly preferable to use silica fine particles.

  The inorganic fine particles are preferably surface-treated with a surface treatment agent. Thereby, the dispersibility and the filling property of the inorganic fine particles in the resin composition become excellent. Examples of the surface treatment agent include epoxy silane, vinyl silane, silazane compound, alkoxy silane, and silane coupling agent. These may be used alone or in combination.

The minimum coating area of the surface treatment agent is preferably less than 550 m ² / g, particularly preferably 520 m ² / g or less, and more preferably 450 m ² / g or less. On the other hand, the lower limit of the minimum coating area of the surface treatment agent is preferably 100 m ² / g or more, particularly preferably 200 m ² / g or more, and further preferably 300 m ² / g or more. . When the minimum coating area is in the above range, the dispersibility and filling property of the inorganic fine particles in the resin composition are improved, and the formability of the electrode on the cured layer obtained by curing the resin composition layer 10 is improved.

The minimum covering area (m ² / g) of the surface treatment agent refers to the area (m ² ) of the monomolecular film when a monomolecular film is formed using 1 g of the surface treatment agent. The minimum covering area can be theoretically calculated from the structure of the surface treatment agent and the like.

  Preferable examples of the surface treatment agent include epoxy silane such as 3-glycidoxypropyltrimethoxysilane and vinyl silane such as vinyl trimethoxy silane.

  The average particle diameter of the inorganic fine particles is preferably 0.01 μm or more, particularly preferably 0.1 μm or more, and further preferably 0.3 μm or more. Further, the average particle size of the inorganic fine particles is preferably 100 μm or less, particularly preferably 3.0 μm or less, and further preferably 1.0 μm or less. When the average particle diameter of the inorganic fine particles is in such a range, the flexibility and flexibility of the resin composition layer 10 are likely to be excellent, and the content of the inorganic fine particles is set in the range described above. It is easy to adjust to a high filling rate. In addition, when the average particle diameter of the inorganic fine particles is 1.0 μm or less, when the rewiring layer is formed on the cured layer formed by curing the resin composition layer 10 as described above, the electrode formability is reduced. It is easier to improve.

  The maximum particle size of the inorganic fine particles is preferably 0.05 μm or more, and particularly preferably 0.5 μm or more. Further, the maximum particle size is preferably 5 μm or less, and particularly preferably 3 μm or less. When the maximum particle size of the inorganic fine particles is in the above range, the inorganic fine particles can be easily filled in the resin composition, and the coefficient of thermal expansion during curing can be easily suppressed. Further, as described above, when a rewiring layer is formed on a cured layer obtained by curing the resin composition layer 10, fine wiring can be easily formed. The average particle size and the maximum particle size of the inorganic fine particles in this specification were measured by a dynamic light scattering method using a particle size distribution analyzer (manufactured by Nikkiso Co., Ltd., product name “Nanotrack Wave-UT151”). Value.

(4) Curing Catalyst The resin composition in the present embodiment preferably further contains a curing catalyst. Thereby, the curing reaction of the thermosetting resin can effectively proceed, and the resin composition layer 10 can be cured well. Examples of the curing catalyst include an imidazole-based curing catalyst, an amine-based curing catalyst, and a phosphorus-based curing catalyst.

  Specific examples of the imidazole-based curing catalyst include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl -2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-di (hydroxymethyl) imidazole and the like.

  Specific examples of the amine curing catalyst include triazine compounds such as 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)] ethyl-s-triazine and 1,8-diazabicyclo [5,4, 0] Undecene-7 (DBU), tertiary amine compounds such as triethylenediamine, benzyldimethylamine and triethanolamine. Among them, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')] ethyl-s-triazine is preferable.

  Specific examples of the phosphorus-based curing catalyst include triphenylphosphine, tributylphosphine, tri (p-methylphenyl) phosphine, tri (nonylphenyl) phosphine, and the like.

  One of the above curing catalysts may be used alone, or two or more of them may be used in combination.

  From the viewpoint of curability, the above-described curing catalyst preferably has a melting point of 180 ° C. or lower, particularly preferably 100 ° C. or lower, and more preferably 60 ° C. or lower. When the melting point of the curing catalyst is 180 ° C. or less, the resin composition layer 10 can be easily cured well. On the other hand, the lower limit of the melting point of the curing catalyst is preferably room temperature (23 ° C.) or higher from the viewpoint of storage stability.

  The content of the curing catalyst in the resin composition is preferably 0.01% by mass or more, particularly preferably 0.05% by mass or more, and further preferably 0.1% by mass or more. preferable. Further, the content is preferably 2.0% by mass or less, particularly preferably 1.5% by mass or less, and further preferably 1.0% by mass or less. When the content is within the above range, the resin composition layer 10 can be more favorably cured. The above content of the curing catalyst is a solid content converted value.

(5) Other Components The resin composition in the present embodiment may further contain a plasticizer, a stabilizer, a tackifier, a coloring agent, a coupling agent, an antistatic agent, an antioxidant, and the like.

(6) Physical Properties of Resin Composition Layer In the resin sheet 1 according to the present embodiment, when the resin composition layer 10 is heated at 120 ° C. for 30 minutes as measured by gas chromatography mass spectrometry (GC-MS). The concentration of the volatile component generated in the above is 100 ppm or more. Here, the volatile component is, specifically, a residue of the organic solvent component used in the coating liquid for forming the resin composition layer 10.

  When the concentration of the volatile component is 100 ppm or more, the surface of the resin composition layer 10 has a good tack, and the resin composition layer 10, the first support sheet 11 and the second support sheet 12 Floating at the interface of is less likely to occur. In addition, when the concentration of the volatile component is 100 ppm or more, the brittleness of the resin composition layer 10 is improved, and chipping or cracking of the resin composition layer 10 is less likely to occur during processing or transportation, and handling properties are improved. Is improved. From such a viewpoint, the concentration of the volatile component is preferably 1000 ppm or more, and particularly preferably 5000 ppm or more.

  On the other hand, the upper limit of the concentration of the volatile component is 45,000 pp or less, preferably 35,000 pp or less, and more preferably 30000 ppm or less. When the concentration of the volatile component exceeds 45000 ppm, the surface of the resin composition layer 10 becomes excessively sticky, and when the resin composition layer 10 is cured by heat, swelling occurs due to the volatile component and the resulting semiconductor. This causes a problem that the reliability of the device is reduced.

  In the resin sheet 1 according to the present embodiment, the organic solvent component described above remains in the resin composition layer 10 at a specific concentration, so that a good tack is imparted to the surface of the resin composition layer 10, The occurrence of floating at the interface between the resin composition layer 10 and the first and second support sheets 11 and 12 is suppressed, and the fragility of the resin composition layer 10 is improved. The occurrence of chipping or cracking in the resin composition layer 10 is suppressed.

  The concentration of the volatile component can be adjusted depending on the conditions for forming the resin composition layer 10. For example, the concentration of the volatile component of the resin composition layer 10 can be adjusted to the above range by adjusting the drying temperature, the drying time, the type of the organic solvent, and the like when forming the resin composition layer 10.

  The thickness of the resin composition layer 10 can be set in consideration of the use and the like. For example, when the resin sheet 1 according to the present embodiment is used for sealing electronic components in a method for manufacturing a semiconductor device, the thickness of the resin composition layer 10 is preferably 20 μm or more, and more preferably 50 μm or more. More preferably, it is particularly preferably 60 μm or more, and particularly preferably 100 μm or more. Further, the thickness is preferably 1000 μm or less, more preferably 500 μm or less, and particularly preferably 300 μm. When the thickness of the resin composition layer 10 is within the above range, the electronic component can be sealed and sufficiently embedded.

  When the resin sheet 1 according to the present embodiment is used for forming an insulating film in a method for manufacturing a semiconductor device, the thickness of the resin composition layer 10 is not particularly limited, but is preferably 5 μm or more, In particular, it is preferably at least 10 μm, more preferably at least 15 μm. Further, the thickness is preferably not more than 80 μm, particularly preferably not more than 60 μm, and further preferably not more than 40 μm.

2. First Support Sheet The first support sheet 11 is not particularly limited as long as it satisfies that the contact surface with the resin composition layer is not subjected to a release treatment with a silicone-based release agent.

  It is preferable that a resin film, a nonwoven fabric, paper, or the like is used as a supporting base material constituting the first supporting sheet 11, respectively. Examples of the resin film include polyester films such as polyethylene terephthalate film, polybutylene terephthalate film, and polyethylene naphthalate film; polyolefin films such as polyethylene film and polypropylene film; and polyimide films. Examples of the nonwoven fabric include a nonwoven fabric using fibers such as rayon, acrylic, and polyester. Examples of the paper include high quality paper, glassine paper, impregnated paper, and coated paper. These may be used as two or more kinds of laminates. Further, the support base material constituting the first support sheet 11 may be subjected to a surface treatment such as a primer treatment, a corona treatment, a plasma treatment, an oxidation treatment, or the like, on one or both sides thereof, if desired.

  The material constituting the resin film preferably has a glass transition temperature (Tg) of 50 ° C. or higher, particularly preferably a glass transition temperature (Tg) of 55 ° C. or higher, and further has a glass transition temperature (Tg). Is preferably 60 ° C. or higher. When the glass transition temperature (Tg) of the material is 50 ° C. or higher, the resin composition layer 10 is thermally cured in a state where the first support sheet 11 is laminated on the resin composition layer 10. Also, the first support sheet 11 is less likely to be thermally deformed, and the first support sheet 11 is easily separated from the cured layer. Although the upper limit of the glass transition temperature (Tg) is not particularly limited, it is usually preferably 500 ° C. or lower, and particularly preferably 400 ° C. or lower. The glass transition temperature (Tg) is a value measured using a differential scanning calorimeter.

  When the first support sheet 11 has been subjected to a release treatment with a release agent other than the silicone-based release agent, the release agent may be an alkyd-based release agent, a fluorine-based release agent, a long-chain alkyl-based release agent, or an olefin. It is preferable to use at least one selected from a resin-based release agent, an acrylic-based release agent, and a rubber-based release agent, and it is particularly preferable to use an alkyd-based release agent among these.

  The thickness of the first support sheet 11 is usually 10 μm or more and 250 μm or less.

3. Second support sheet As the support base material constituting the second support sheet 12, it is preferable to use a resin film, a nonwoven fabric, paper, or the like. Examples of the resin film include polyester films such as polyethylene terephthalate film, polybutylene terephthalate film, and polyethylene naphthalate film; polyolefin films such as polyethylene film and polypropylene film; and polyimide films. Examples of the nonwoven fabric include a nonwoven fabric using fibers such as rayon, acrylic, and polyester. Examples of the paper include high quality paper, glassine paper, impregnated paper, and coated paper. These may be used as two or more kinds of laminates. In addition, the support base material constituting the second support sheet 12 may be subjected to a surface treatment such as a primer treatment, a corona treatment, a plasma treatment, an oxidation treatment, or the like, on one or both surfaces thereof as desired.

  The contact surface of the second support sheet 12 with the resin composition layer 10 may or may not be subjected to a release treatment by a release agent.

  As the release agent, at least one selected from a silicone release agent, an alkyd release agent, a fluorine release agent, a long-chain alkyl release agent, an olefin resin release agent, an acrylic release agent and a rubber release agent It is preferably used.

  In addition, from the viewpoint of suppressing the occurrence of floating at the interface between the second support sheet 12 and the resin composition layer 10 and improving the handling properties during storage and handling of the resin sheet 1, the second support sheet 12 It is preferable that the contact surface with the resin composition layer 10 is not subjected to a release treatment with a silicone-based release agent.

  The thickness of the second support sheet 12 is not particularly limited, but is usually 20 μm or more and 250 μm or less.

4. Physical Properties of Resin Sheet In the resin sheet 1 according to the present embodiment, the peeling force when the first support sheet 11 is peeled from the resin composition layer 10 is F1, and the second support sheet 12 is separated from the resin composition layer 10 by F1. When the peeling force at the time of peeling is F2, the F1 and the F2 are expressed by the following formula (1).
F1 / F2> 1 (1)
It is preferable to satisfy the following. Thereby, the second support sheet 12 is easily peeled off from the resin composition layer 10 while the first support sheet 11 is left on the resin composition layer 10. Thereby, it becomes possible to effectively suppress the occurrence of chipping or cracking of the resin composition layer 10 due to the peeling operation.

  The above-described peeling force F1 when peeling the first support sheet 11 from the resin composition layer 10 is preferably 0.05 N / 100 mm or more, and particularly preferably 0.1 N / 100 mm or more. Further, the peeling force F1 is preferably 2.0 N / 100 or less, and particularly preferably 1.5 N / 100 mm or less.

  Further, the above-described peeling force F2 when peeling the second support sheet 12 from the resin composition layer 10 is preferably 0.05 N / 100 mm or more, and particularly preferably 0.1 N / 100 mm or more. preferable. Further, the peeling force F2 is preferably 2.0 N / 100 mm or less, and particularly preferably 1.5 N / 100 mm or less.

  When the above-mentioned peeling forces F1 and F2 are within the above ranges, respectively, at the interface between the resin composition layer 10 and the first support sheet 11 or at the interface between the fat composition layer 10 and the second support sheet 12 The occurrence of floating can be effectively suppressed.

  The above-mentioned peeling force was measured as follows. That is, a test piece formed by cutting the resin sheet 1 to a width of 100 mm and a length of 100 mm is T-shaped peeled at a peeling rate of 300 mm / min under an environment of 23 ° C. and a relative humidity of 50% based on JIS K 6854-3: 1999. Then, the first support sheet 11 or the second support sheet 12 is peeled off, and a peeling force F1 or F2 can be obtained as a peeling force (N / 100 mm) measured at that time.

5. Method for Producing Resin Sheet The resin sheet 1 according to the present embodiment is not particularly limited. For example, a coating liquid containing the above-described resin composition and, if desired, further containing a solvent or a dispersion medium is prepared, and the above-described second sheet is prepared. On the support sheet 12 by a known coating method such as a spin coating method, a spray coating method, a bar coating method, a knife coating method, a roll coating method, a roll knife coating method, a blade coating method, a die coating method, and a gravure coating method. The coating liquid is applied to form a coating film, and the coating film is dried to form the resin composition layer 10.

  Here, from the viewpoint of adjusting the concentration of the above-mentioned volatile component in the resin composition layer 10 to the above-described range, the drying temperature of the coating film is preferably set to 50 ° C or higher, and particularly preferably set to 60 ° C or higher. And more preferably 70 ° C. or higher. Further, the drying temperature is preferably 150 ° C. or lower, particularly preferably 140 ° C. or lower, and more preferably 130 ° C. or lower. In addition, the drying time of the coating film is preferably 30 seconds or more from the same viewpoint. Further, the drying time is preferably set to 30 minutes or less. Further, the solid content concentration of the coating liquid is preferably, for example, 30% by mass or more, and particularly preferably 35% by mass or more. Further, the solid content concentration is preferably set to 60% by mass or less, particularly preferably 50% by mass or less.

  Next, the surface of the formed resin composition layer 10 on the side opposite to the second support sheet 12 and one surface of the first support sheet 11 (the release-treated surface when treated with a release agent) The resin sheet 1 can be manufactured by laminating.

  Examples of the solvent include toluene, ethyl acetate, methyl ethyl ketone, isobutyl alcohol, methyl isobutyl ketone, n-butanol, butyl acetate, 2-methoxypropanol, isobutyl acetate, tetrachloroethylene, ethylene glycol monomethyl ether, methyl butyl ketone, isopentyl alcohol, ethylene Examples thereof include organic solvents such as glycol monoethyl ether, N, N-dimethylformamide (DMF), ethylene glycol monoethyl ether acetate, turpentine, cyclohexanone, and ethylene glycol monobutyl ether. Among them, it is preferable to use a high boiling point solvent such as cyclohexanone and ethylene glycol monobutyl ether from the viewpoint that the concentration of the volatile component is easily adjusted to the above-described range, and particularly, cyclohexanone from the viewpoint of versatility and solubility. It is preferred to use

[Semiconductor device]
The semiconductor device according to the present embodiment includes a cured layer obtained by curing the resin composition layer 10 in the resin sheet 1 according to the present embodiment. The conditions for curing the resin composition layer 10 can be performed under conventionally known conditions. Usually, the heating temperature is preferably from 100 ° C. to 240 ° C., and the heating time is preferably from 15 minutes to 300 minutes. The curing of the resin composition layer 10 may be performed stepwise by a plurality of heat treatments. Here, the semiconductor device according to the present embodiment may include a cured layer as a layer for sealing an electronic component, or may include a cured layer as an insulating film. The semiconductor device according to the present embodiment is a semiconductor device manufactured by panel-level packaging, and specific examples thereof include a semiconductor package manufactured by panel-level fan-out packaging technology (FOPLP).

  As described above, the resin sheet 1 according to the present embodiment does not easily cause lifting at the interface between the resin composition layer 10 and the first support sheet 11, and has improved brittleness of the resin composition layer. It has become. Thereby, the resin sheet 1 is less likely to be chipped or cracked in the resin composition layer during processing or transportation, and excellent handling properties are achieved. Therefore, the semiconductor device according to the present embodiment, which is manufactured using the resin sheet 1 according to the present embodiment, has good quality by being manufactured using the resin sheet 1. .

  Further, the resin sheet 1 according to the present embodiment is used as a sheet (sealing resin sheet) for sealing an electronic component or for forming an insulating film in a method of manufacturing a semiconductor device by panel level packaging. It can be suitably used as a sheet (resin sheet for interlayer insulating layer). In addition, the resin sheet 1 according to the present embodiment can be suitably used when refrigerated and stored while being protected by a support sheet, and more specifically, when refrigerated and stored at 5 ° C. or lower. Can be used for Further, the resin sheet 1 according to the present embodiment can be suitably used in a method for manufacturing a semiconductor device in which a rewiring layer is formed on a cured layer formed by curing the resin composition layer 10.

  In addition, the resin sheet 1 according to the present embodiment can be made of resin even when the size of the resin sheet 1 is relatively large as in the case of manufacturing a semiconductor package or the like by fan-out package technology (FOPLP). The occurrence of floating at the interface between the composition layer 10 and the support sheet can be effectively suppressed.

  From the viewpoints as described above, the semiconductor device according to the present embodiment manufactured using the resin sheet 1 according to the present embodiment is excellent in that it is manufactured using the resin sheet 1 according to the present embodiment. It will have quality.

  The embodiments described above are described for facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  Hereinafter, the present invention will be described in more detail with reference to Examples and Test Examples, but the present invention is not limited to the following Test Examples and the like.

[Example 1]
A bisphenol A type phenoxy resin (manufactured by Mitsubishi Chemical Corporation, product name "jER1256") 5.1 parts by mass (solid content conversion, the same applies hereinafter) as a thermoplastic resin and a bisphenol A type epoxy resin (Mitsubishi 5.7 parts by mass of a product name “jER828” manufactured by Kagaku Co., Ltd. and 5.7 parts by mass of a biphenyl-type epoxy resin (product name “NC-3000-L” manufactured by Nippon Kayaku Co., Ltd.) as a thermosetting resin. 4.1 parts by mass of a naphthalene-type epoxy resin (manufactured by DIC, product name "HP-4700") as a thermosetting resin and a biphenyl-type phenol as a thermosetting resin (product name: MEHC -7851-SS ") and 14.1 parts by mass of 2-ethyl-4-methylimidazole as imidazole-based curing catalyst (product name" 2E4MZ ", manufactured by Shikoku Chemicals Co., Ltd., melting point: approx. 0 parts by mass) and 0.1 parts by mass of an epoxysilane-treated silica filler as inorganic fine particles [silica filler (manufactured by Admatechs Co., Ltd., product name “SO-C2”, average particle size: 0.5 μm, maximum particle size: 2 μm (Surface shape: spherical) treated with 3-glycidoxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name “KBM-403”, minimum covering area: 330 m ² / g)] and 65 parts by mass. And a mixture of cyclohexanone and methyl ethyl ketone in a 1: 1 mixed solvent to obtain a coating liquid of a resin composition having a solid content concentration of 40% by mass.

  A release film (manufactured by Lintec, product name) obtained by subjecting the coating solution obtained as described above to a polyethylene terephthalate film (Tg: 67 ° C.) as a first support sheet, one surface of which is subjected to release treatment with an alkyd-based release agent "PET38AL-5", thickness: 38 µm) is applied to a release-treated surface, and the obtained coating film is dried at 100 ° C for 90 seconds to form a resin composition layer having a thickness of 50 µm and a first support sheet. Was obtained.

  Next, as a second support sheet, one side of a polyethylene terephthalate film was subjected to a release treatment with an alkyd-based release agent (Rintech Co., Ltd., product name “PET38X”, thickness: 38 μm). By laminating the surface on the resin composition layer side of the obtained laminate as described above, a resin in which the first support sheet, the resin composition layer, and the second support sheet are sequentially laminated I got a sheet.

In the obtained resin sheet, the peeling force F1 when peeling the first support sheet from the resin composition layer and the peeling force F2 when peeling the second support sheet from the resin composition layer are: The following formula (1)
F1 / F2> 1 (1)
Was satisfied.

[Examples 2 to 4]
A resin sheet was obtained in the same manner as in Example 1, except that the drying conditions for the coating film were changed as shown in Table 1.

[Comparative Example 1]
As a first support sheet, a release film (manufactured by Lintec, product name “SP-PET382150”, thickness: 38 μm) obtained by subjecting one surface of a polyethylene terephthalate film to a release treatment using a silicone-based release agent was used. As a support sheet, a release film (manufactured by Lintec, product name "SP-PET381031," thickness: 38 μm) obtained by subjecting one surface of a polyethylene terephthalate film to a release treatment using a silicone-based release agent was used. A resin sheet was obtained in the same manner as in Example 1, except that the drying conditions were changed as shown in Table 1.

[Comparative Examples 2 and 3]
A resin sheet was obtained in the same manner as in Example 1, except that the drying conditions for the coating film were changed as shown in Table 1.

[Test Example 1] (Measurement of concentration of volatile component)
After cutting the resin sheets manufactured in Examples and Comparative Examples to a size of 10 mm × 50 mm, the first support sheet and the second support sheet were peeled off, and a resin composition layer obtained was used as a measurement sample. The measurement sample was sealed in a measurement vial, heated at 120 ° C. for 30 minutes, and the generated gas was introduced into a gas chromatograph mass spectrometer (manufactured by Shimadzu Corporation, product name “GCMS-QP2010”) to generate the generated gas. Was measured. The amount was defined as the concentration (ppm) of the volatile component. Table 1 shows the results.

[Test Example 2] (Evaluation of tackiness)
The second support sheet was peeled off from the resin sheets manufactured in Examples and Comparative Examples, and the exposed surface of the exposed resin composition layer was touched by finger, and the tackiness on the surface of the resin composition layer was evaluated according to the following criteria. did. Table 1 shows the results.
With tack: There was a feeling that the surface of the resin composition layer was stuck to a finger.
No tack: the surface of the resin composition layer did not feel sticking to a finger.

[Test Example 3] (Evaluation of floating during storage)
After storing the resin sheets manufactured in Examples and Comparative Examples in an environment of 5 ° C. for one week, the occurrence of floating at the interface between the resin composition layer and the support sheet was evaluated. Table 1 shows the results.
A: No lifting occurred at both the interface between the resin composition layer and the first support sheet and the interface between the resin composition layer and the second support sheet.
B: Slight floating occurred at one of the interface between the resin composition layer and the first support sheet and the interface between the resin composition layer and the second support sheet, but at a level that was not problematic in practical use. .
C: Floats that pose a practical problem occurred at both the interface between the resin composition layer and the first support sheet and at the interface between the resin composition layer and the second support sheet.

[Test Example 4] (Evaluation of handling properties)
The second support sheet was peeled off from the resin sheets manufactured in Examples and Comparative Examples, and the exposed surface of the exposed resin composition layer was laminated on a dummy substrate (500 mm × 400 mm). Was peeled off. Next, after heating the resin composition layer at 100 ° C. for 60 minutes, it was further heated at 170 ° C. for 60 minutes to cure the resin composition layer, thereby forming a cured layer. The handleability of the resin sheet in this series of flows was evaluated based on the following criteria. Table 1 shows the results.
A: No chipping or cracking occurred in the resin composition layer.
B: Chipping and cracking slightly occurred in the resin composition layer.
C: Chipping and cracking did not occur in the resin composition layer, but the surface of the resin composition layer was excessively sticky and swelling occurred in the cured layer.
D: At least one of chipping and cracking at a level that is practically problematic occurred in the resin composition layer.

  As shown in Table 1, in the resin sheet according to the example, the occurrence of floating during storage is suppressed, and excellent storage suitability is achieved, and the occurrence of chipping and cracking in the resin composition layer is suppressed, Excellent handling properties.

  The resin sheet according to the present invention can be suitably used as a sheet for sealing electronic components or a sheet for forming an insulating film in a method of manufacturing a semiconductor device by panel level packaging.

DESCRIPTION OF SYMBOLS 1 ... Resin sheet 10 ... Resin composition layer 11 ... First support sheet 12 ... Second support sheet

Claims (6)

In a method of manufacturing a semiconductor device by panel-level packaging, a resin sheet used for sealing electronic components or forming an insulating film,
The resin sheet is a first support sheet, a resin composition layer laminated on one surface of the first support sheet, and a resin composition layer laminated on a surface of the resin composition layer opposite to the first support sheet. A second support sheet,
The resin composition layer is formed from a resin composition containing a thermosetting resin, a thermoplastic resin, and inorganic fine particles,
The content of the inorganic fine particles in the resin composition is 50% by mass or more,
The content of the thermoplastic resin in the resin composition is 30% by mass or less,
The contact surface of the first support sheet with the resin composition layer is not subjected to a release treatment by a silicone-based release agent,
A resin sheet characterized in that the concentration of volatile components generated when the resin composition layer is heated at 120 ° C. for 30 minutes, measured by gas chromatography mass spectrometry, is 100 ppm or more and 45000 ppm or less.   The resin sheet according to claim 1, wherein the thermoplastic resin does not include an acrylic resin.   The resin sheet according to claim 1, wherein a surface of the first support sheet on the resin composition layer side is subjected to a release treatment with an alkyd-based release agent.   The resin sheet according to any one of claims 1 to 3, wherein the first support sheet includes a resin support base material having a glass transition temperature (Tg) of 50 ° C or higher.   The resin sheet according to any one of claims 1 to 4, wherein a surface of the second support sheet on the resin composition layer side is subjected to a release treatment with a release agent.   A semiconductor device comprising a cured layer obtained by curing a resin composition layer in the resin sheet according to claim 1.

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