JP6960276B2 - How to use resin sheets, semiconductor devices, and resin sheets - Google Patents

Description

The present invention relates to a resin sheet used for encapsulating an electronic component, a semiconductor device manufactured by using the resin sheet, and a method of using the resin sheet.

Conventionally, in a method for manufacturing a semiconductor device, an electronic component such as a semiconductor chip is sealed by using a resin sheet having a layer (resin composition layer) in which a sealing material is formed in a sheet shape. For example, the electronic component is sealed by laminating the resin composition layer in the resin sheet on the electronic component provided on the substrate and then curing the resin composition layer.

As the resin sheet as described above, a resin sheet having a structure in which a support sheet is laminated on a resin composition layer may be usually used in order to improve handleability during processing or transportation. For example, Patent Document 1 discloses a resin sheet including a resin composition layer and support sheets laminated on both sides of the resin composition layer. The surface of the support sheet in contact with the resin composition layer is peeled off with a silicone-based release agent. Further, Patent Document 2 discloses a method for manufacturing a semiconductor device using a resin composition layer and a resin sheet provided with a protective film as a support sheet laminated on one side of the resin composition layer. In the manufacturing method, the resin composition layer in the resin sheet is laminated on the semiconductor chip, the resin composition layer is thermoset, and then the protective film is peeled off from the cured layer obtained by thermosetting the resin composition layer. There is. Patent Document 2 discloses, as the protective film, a polyethylene terephthalate film having a thickness of 50 μm and having a silicone release treatment on one side.

Further, since the resin sheet as described above usually contains a thermosetting resin such as an epoxy resin or a curing accelerator in the resin composition layer, the storage stability tends to be low, and therefore refrigeration storage is required. In some cases.

Japanese Unexamined Patent Publication No. 2015-126133 Japanese Unexamined Patent Publication No. 2016-96308

By the way, when the resin composition layer in the resin sheet is thermally cured to form a cured layer in a state where the support sheet is laminated on the resin composition layer, it may be difficult to peel off the support sheet from the cured layer. Here, in the examples of Patent Document 2, by using a protective film having a silicone release treatment on one side, the peeling force when peeling the support sheet from the cured layer is reduced to a predetermined range. It is disclosed.

On the other hand, in the above-mentioned resin sheet, when a resin composition layer having a high content of inorganic filler is used, or depending on the type of resin component, the adhesiveness (tack) on the surface of the resin composition layer may be small. exist. When the resin composition layer having such a small tack is protected by a support sheet treated with a silicone-based release agent as disclosed in Patent Documents 1 and 2, the resin sheet is being transported, stored, processed, etc. In the above, floating is likely to occur at the interface between the resin composition layer and the support sheet. When the floating occurs, problems such as chipping and cracking of the resin composition layer occur during processing and transportation of the resin sheet. In particular, the resin sheet is often stored refrigerated, and the problem of floating becomes remarkable when it is stored refrigerated in this way.

Further, in recent years, it has been considered to manufacture a wafer level package or a panel scale package using a resin sheet. In the production of such a package, a resin sheet having a large area is used, but when the size of the resin sheet is relatively large, the above-mentioned floating is particularly likely to occur.

As described above, in the conventional resin sheet, it is difficult to easily peel off the support sheet from the cured layer and to suppress the floating at the interface between the resin composition layer and the support sheet.

The present invention has been made in view of such an actual situation, and even when the tack on the surface of the resin composition layer is small, floating at the interface between the resin composition layer and the support sheet is unlikely to occur. Further, even when used in a method for manufacturing a semiconductor device for peeling a support sheet from a formed cured layer after thermosetting the resin composition layer, a resin sheet capable of easily peeling the support sheet from the cured layer is provided. The purpose is to do. The present invention also provides a semiconductor device of good quality manufactured using such a sealing sheet and a method of using such a resin sheet.

In order to achieve the above object, firstly, the present invention is a resin sheet used for sealing an electronic component, and the resin sheet is formed on one side of the first support sheet and the first support sheet. It is provided with a laminated curable resin composition layer, and the resin composition layer is formed from a resin composition containing a thermosetting resin and inorganic fine particles, and is contained in the resin composition of the inorganic fine particles. The content in the above is 50% by mass or more and 90% by mass or less, the average particle size of the inorganic fine particles is 0.01 μm or more and 3.0 μm or less, and the first support sheet is a support base material. A feature is that the resin composition layer is laminated on the surface of the first support sheet on the side of the pressure-sensitive adhesive layer, which is provided with a pressure-sensitive adhesive layer laminated on one side of the support base material. (Invention 1).

In the resin sheet according to the above invention (Invention 1), the first support sheet includes a support base material and a pressure-sensitive adhesive layer, and the surface of the pressure-sensitive adhesive layer opposite to the support base material is cured. By being in contact with the sex resin composition layer, the first support sheet adheres well to the curable resin composition layer, whereby the interface between the curable resin composition layer and the first support sheet Even when the first support sheet is peeled off from the cured layer formed by thermally curing the curable resin composition layer, the peeling can be easily performed.

In the above invention (Invention 1), the resin composition layer contains a thermoplastic resin, and the content of the thermoplastic resin in the resin composition is 1.0% by mass or more and 30% by mass or less. It is preferable (Invention 2).

In the above inventions (Inventions 1 and 2), the pressure-sensitive adhesive layer is preferably composed of an acrylic pressure-sensitive adhesive (Invention 3).

In the above inventions (Inventions 1 to 3), in the resin sheet obtained by heating the resin sheet at 100 ° C. for 30 minutes and further heating at 180 ° C. for 60 minutes, the first cured layer obtained by curing the resin composition layer. The peeling force (F12) when peeling the support sheet is preferably 0.5 N / 25 mm or more and 3.0 N / 25 mm or less (Invention 4).

In the above invention (invention 1 to 4), the pressure-sensitive adhesive layer in the first supporting sheet is preferably at 100 ° C., the storage modulus when the measurement frequency was 1Hz is 1 × 10 5 ^Pa or more (Invention 5).

In the above inventions (Inventions 1 to 5), in the first support sheet, the pressure-sensitive adhesive layer surface is attached to a copper foil and heated under the conditions of 100 ° C. and 30 minutes, followed by the conditions of 180 ° C. and 60 minutes. The adhesive strength to the copper foil at room temperature after heating with is 0.7 N / 25 mm or more and 2.0 N / 25 mm or less, and the adhesive layer surface is attached to a polyimide film at 100 ° C. for 30 minutes. After heating under the conditions of 180 ° C. and 60 minutes, the adhesive strength to the polyimide film at room temperature is preferably 0.7 N / 25 mm or more and 2.0 N / 25 mm or less. (Invention 6).

In the above inventions (Inventions 1 to 6), the pressure-sensitive adhesive layer in the first support sheet preferably has a 5% weight loss temperature of 250 ° C. or higher (Invention 7).

In the above inventions (Inventions 1 to 7), the supporting base material is preferably a resin supporting base material having a glass transition temperature (Tg) of 50 ° C. or higher (Invention 8).

In the above inventions (Inventions 1 to 8), it is preferable that the resin sheet includes a second support sheet laminated on a surface of the resin composition layer opposite to the first support sheet (Invention 9). ).

Secondly, the present invention provides a semiconductor device including a cured layer obtained by curing the resin composition layer in the resin sheet (Invention 1 to 9) (Invention 10).

Thirdly, the present invention is the method of using the resin sheet (Invention 1 to 9), in which the step of curing the resin composition layer to obtain a cured layer and after the curing of the resin composition layer are performed. Provided is a method of using a resin sheet, which comprises a step of peeling the first support sheet from the cured layer (Invention 11).

According to the resin sheet of the present invention, even when the tack on the surface of the resin composition layer is small, floating at the interface between the resin composition layer and the support sheet is unlikely to occur, and the heat of the resin composition layer is high. Even when used in a method for manufacturing a semiconductor device for peeling a support sheet from a formed cured layer after curing, the support sheet can be easily peeled from the cured layer. Further, by using the resin sheet of the present invention, a semiconductor device having good quality can be manufactured.

It is sectional drawing of the resin sheet which concerns on one Embodiment of this invention. It is sectional drawing explaining the use method of the resin sheet which concerns on this embodiment. It is sectional drawing explaining the use method of the resin sheet which concerns on this embodiment.

Hereinafter, embodiments of the present invention will be described.
[Resin sheet]
FIG. 1 shows a cross-sectional view of the resin sheet 1 according to the present embodiment. As shown in FIG. 1, the resin sheet 1 according to the present embodiment includes a first support sheet 11 and a curable resin composition layer 10 laminated on one side of the first support sheet 11 (hereinafter, “resin composition”). It is sometimes referred to as "material layer 10"). The first support sheet 11 includes a support base material 111 and an adhesive layer 112 laminated on one side of the support base material 111, and the resin composition layer 10 adheres to the first support sheet 11. It is laminated on the surface of the agent layer 112 side. Further, as shown in FIG. 1, the resin sheet 1 according to the present embodiment includes a second support sheet 12 laminated on a surface of the resin composition layer 10 opposite to the first support sheet 11. Is preferable.

In the resin sheet 1 according to the present embodiment, since the resin composition layer 10 is laminated on the surface of the first support sheet 11 on the pressure-sensitive adhesive layer 112 side, the resin composition layer 10 and the first support sheet are laminated. Floating at the interface with 11 is unlikely to occur. In particular, even when the tack on the surface of the resin composition layer 10 is small, floating at the interface between the resin composition layer 10 and the first support sheet 11 can be effectively suppressed. As a result, in the resin sheet 1 according to the present embodiment, the occurrence of chipping and cracking in the resin composition layer 10 is suppressed during storage and transportation.

Further, in the resin sheet 1 according to the present embodiment, the resin composition layer 10 is thermally cured by laminating the resin composition layer 10 on the surface of the first support sheet 11 on the pressure-sensitive adhesive layer 112 side. Therefore, even when the cured layer is formed, the first support sheet 11 can be easily peeled off from the cured layer.

1. 1. Curable Resin Composition Layer The resin composition layer 10 in the present embodiment is formed from a thermosetting resin and a resin composition containing inorganic fine particles. Here, the content of the inorganic fine particles in the resin composition is 50% by mass or more and 90% by mass or less, and the average particle size of the inorganic fine particles is 0.01 μm or more and 3.0 μm or less. Further, the resin composition layer 10 has curability, and a cured layer can be formed by curing the resin composition layer 10. Further, the cured layer formed by curing the resin composition layer 10 preferably exhibits insulating properties. When the cured layer exhibits insulating properties, defects such as short circuits can be suppressed in the obtained semiconductor device, and excellent performance can be obtained.

(1) Thermosetting resin The thermosetting resin is not particularly limited, and examples thereof include epoxy resin, phenol resin, naphthol resin, active ester resin, benzoxazine resin, and cyanate ester resin. These can be used individually by 1 type or in combination of 2 or more types.

As the epoxy resin, various known epoxy resins can be used. Specifically, glycidyl ethers of phenols such as bisphenol A, bisphenol F, resorcinol, phenylnovolac, and cresolnovolac; butanediol, polyethylene glycol, and the like. Epoxy glycidyl ethers of alcohols such as polypropylene glycol; glycidyl ethers of carboxylic acids such as phthalic acid, isophthalic acid, tetrahydrophthalic acid; glycidyl type or alkyl glycidyl in which active hydrogen bonded to a nitrogen atom such as aniline isocyanurate is replaced with a glycidyl group. Epoxy resin of type; vinylcyclohexanediepoxide, 3,4-epoxycyclohexylmethyl-3,4-dicyclohexanecarboxylate, 2- (3,4-epoxy) cyclohexyl-5,5-spiro (3,4-epoxy) Examples thereof include so-called alicyclic epoxides in which an epoxy is introduced by, for example, oxidizing a carbon-carbon double bond in a molecule, such as cyclohexane-m-dioxane. In addition, an epoxy resin having a biphenyl skeleton, a triphenylmethane skeleton, a dicyclohexadiene skeleton, a naphthalene skeleton, or the like can also be used. These epoxy resins may be used alone or in combination of two or more. Among the above-mentioned epoxy resins, glycidyl ether of bisphenol A (bisphenol A type epoxy resin), epoxy resin having a biphenyl skeleton (biphenyl type epoxy resin), epoxy resin having a naphthalene skeleton (naphthalene type epoxy resin), or a combination thereof can be used. It is preferable to use it.

Examples of the phenol resin include bisphenol A, tetramethylbisphenol A, diallyl bisphenol A, biphenol, bisphenol F, diallyl bisphenol F, triphenylmethane type phenol, tetrakisphenol, novolak type phenol, cresol novolac resin, and biphenyl aralkyl skeleton. Examples thereof include phenol (biphenyl-type phenol) having, and among these, it is preferable to use biphenyl-type phenol. These phenol resins can be used alone or in combination of two or more. When an epoxy resin is used as the curable resin, it is preferable to use a phenol resin in combination from the viewpoint of reactivity with the epoxy resin and the like.

The content of the thermosetting resin in the resin composition is preferably 10% by mass or more, particularly preferably 15% by mass or more, and further preferably 20% by mass or more. The content is preferably 60% by mass or less, particularly preferably 50% by mass or less, and further preferably 40% by mass or less. When the content is 10% by mass or more, the resin composition layer 10 is more sufficiently cured, and the electronic component can be sealed more firmly. Further, when the content is 60% by mass or less, the curing of the resin composition layer 10 at an unintended stage can be further suppressed, and the storage stability becomes more excellent. The content of the thermosetting resin is a solid content conversion value.

(2) Thermoplastic Resin Further, the resin composition in the present embodiment may contain a thermoplastic resin. Examples of the thermoplastic resin include phenoxy resins, olefin resins, polyester resins, polyurethane resins, polyester urethane resins, acrylic resins, amide resins, styrene-isobutylene-styrene copolymers (SIS), and the like. Examples thereof include styrene resin, silane resin, rubber resin, polyvinyl acetal resin, polyvinyl butyral resin, polyimide resin, polyamide imide resin, polyether sulfone resin, polysulfone resin, fluorine resin, etc. One type can be used alone, or two or more types can be used in combination. Moreover, these thermoplastic resins may have a curable functional group.

Here, in order to miniaturize the semiconductor device and miniaturize the wiring, when the semiconductor device is manufactured using the resin sheet 1 according to the present embodiment, the resin composition layer 10 is cured. A rewiring layer may be provided by forming an electrode on the top. In particular, when the rewiring layer is provided by the semi-additive method described later, the cured layer is treated under harsh conditions such as being exposed to an alkaline solution in the process of desmear treatment. In this case, depending on the type of the thermoplastic resin, the cured layer may be melted and the peel strength of the plating may be lowered, resulting in poor wiring formability. Therefore, from the viewpoint of wiring formability to the cured layer, it is preferable that the thermoplastic resin does not contain an acrylic resin. As the thermoplastic resin, it is preferable to use at least one selected from the group consisting of a phenoxy resin, a polyvinyl acetal resin, and a polyvinyl butyral resin among the above-mentioned thermoplastic resins.

The phenoxy resin is not particularly limited, but for example, bisphenol A type, bisphenol F type, bisphenol A / bisphenol F copolymer type, bisphenol S type, bisphenol acetophenone type, novolak type, fluorene type, dicyclopentadiene type, norbornene. Examples thereof include type, naphthalene type, anthracene type, adamantan type, terpen type, trimethylcyclohexane type, biphenol type, and biphenyl type phenoxy resin, and among these, bisphenol A type phenoxy resin is preferably used. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group. One type of phenoxy resin may be used alone, or two or more types may be used in combination.

When a phenoxy resin is used as the thermoplastic resin, the tack on the surface of the resin composition layer 10 tends to be small. However, in the resin sheet 1 according to the present embodiment, even when the tack is reduced in this way, the resin composition layer 10 is laminated on the surface of the first support sheet 11 on the pressure-sensitive adhesive layer 112 side. As a result, floating at the interface between the resin composition layer 10 and the first support sheet 11 can be effectively suppressed. Therefore, the resin sheet 1 according to the present embodiment is also suitable when a phenoxy resin is used as the thermoplastic resin.

The weight average molecular weight (Mw) of the thermoplastic resin is preferably 100 or more, particularly preferably 1000 or more, and further preferably 10,000 or more. The weight average molecular weight (Mw) of the thermoplastic resin is preferably 1 million or less, particularly preferably 800,000 or less, and further preferably 100,000 or less. When the weight average molecular weight (Mw) of the thermoplastic resin is in the above range, it becomes easier to form the resin composition layer 10 in the form of a sheet. The weight average molecular weight in the present specification is a standard polystyrene-equivalent value measured by a gel permeation chromatography (GPC) method.

The content of the thermoplastic resin in the resin composition is preferably 1.0% by mass or more, particularly preferably 3.0% by mass or more, and further preferably 5.0% by mass or more. preferable. The content is preferably 30% by mass or less, particularly preferably 20% by mass or less, and further preferably 10% by mass or less. When the content is in the above range, the film-forming property is improved, and the handleability of the obtained resin sheet is effectively improved. The content of the thermoplastic resin is a solid content conversion value.

(3) Inorganic Fine Particles The resin composition in the present embodiment contains inorganic fine particles in an amount of 50% by mass or more and 90% by mass or less. As a result, the coefficient of thermal expansion and the water absorption rate of the cured layer obtained by curing the resin composition layer 10 become relatively small, whereby the resin composition layer 10 exhibits excellent flexibility, fluidity and adhesiveness. Will be. From such a viewpoint, the content of the inorganic fine particles in the resin composition is preferably 55% by mass or more, and particularly preferably 60% by mass or more. The content is preferably 85% by mass or less, and particularly preferably 80% by mass or less. The content of the inorganic fine particles is a solid content conversion value.

The average particle size of the inorganic fine particles is 0.01 μm or more and 3.0 μm or less. When the average particle size of the inorganic fine particles is 0.01 μm or more, the flexibility and flexibility of the resin composition layer 10 are likely to be excellent, and the content of the inorganic fine particles is set to the above range. It becomes easy to adjust to a high filling rate. Further, when the average particle size of the inorganic fine particles is 3.0 μm or less, the formability of the electrode is likely to be improved when the rewiring layer is formed in the cured layer obtained by curing the resin composition layer 10. .. From these viewpoints, the average particle size of the inorganic fine particles is preferably 0.1 μm or more, and particularly preferably 0.3 μm or more. The average particle size of the inorganic fine particles is preferably 1.0 μm or less.

The maximum particle size of the inorganic fine particles is preferably 0.05 μm or more, and particularly preferably 0.5 μm or more. The maximum particle size is preferably 5 μm or less, and particularly preferably 3 μm or less. When the maximum particle size of the inorganic fine particles is in the above range, the inorganic fine particles can be easily filled in the resin composition, and the coefficient of thermal expansion during curing can be suppressed to a low level. Further, as described above, when the rewiring layer is formed on the cured layer obtained by curing the resin composition layer 10, fine wiring is likely to be formed. The average particle size and the maximum particle size of the inorganic fine particles in the present specification were measured by a dynamic light scattering method using a particle size distribution measuring device (manufactured by Nikkiso Co., Ltd., product name "Nanotrack Wave-UT151"). Let it be a value.

Examples of the inorganic fine particles include silica, alumina, glass, titanium oxide, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, and aluminum nitride. Inorganic fine particles made of composite oxides such as aluminum borate whisker, magnesium nitride, crystalline silica, amorphous silica, mulite, cordierite, montmorillonite, smectite, boehmite, talc, iron oxide, silicon carbide, zirconium oxide, etc. Can be exemplified, and these can be used individually by 1 type or in combination of 2 or more types. Among these, it is preferable to use silica fine particles and alumina fine particles, and it is particularly preferable to use silica fine particles.

The inorganic fine particles are preferably surface-treated with a surface treatment agent. As a result, the dispersibility and filling property of the inorganic fine particles in the resin composition become excellent. Examples of the surface treatment agent include epoxysilane, vinylsilane, silazane compounds, alkoxysilanes, silane coupling agents and the like. These may be used alone or in combination.

The minimum coating area of the surface treatment agent ^{is preferably less than 550 m 2} / g, particularly preferably 520 m ² / g or less, and further preferably 450 m ² / g or less. On the other hand, the lower limit of the minimum coating area of the surface treatment agent ^{is preferably 100 m 2} / g or more, particularly preferably 200 m ² / g or more, and further preferably 300 m ² / g or more. .. When the minimum coating area is in the above range, the dispersibility and filling property of the inorganic fine particles in the resin composition are improved, and the formability of the electrode with respect to the cured layer obtained by curing the resin composition layer 10 is improved.

The minimum coating area (m ^{2 / g) of the surface treatment agent refers to the area (m 2} ) of the monomolecular film when a monomolecular film is formed using 1 g of the surface treatment agent. The minimum covering area can be theoretically calculated from the structure of the surface treatment agent and the like.

Preferable examples of the surface treatment agent include epoxysilanes such as 3-glycidoxypropyltrimethoxysilane and vinylsilanes such as vinyltrimethoxysilane.

(4) Curing catalyst The resin composition in the present embodiment preferably further contains a curing catalyst. As a result, the curing reaction of the thermosetting resin can be effectively advanced, and the resin composition layer 10 can be cured satisfactorily. Examples of the curing catalyst include an imidazole-based curing catalyst, an amine-based curing catalyst, and a phosphorus-based curing catalyst.

The above-mentioned curing catalyst may be used alone or in combination of two or more.

The content of the curing catalyst in the resin composition is preferably 0.01% by mass or more, particularly preferably 0.05% by mass or more, and further preferably 0.1% by mass or more. preferable. The content is preferably 2.0% by mass or less, particularly preferably 1.5% by mass or less, and further preferably 1.0% by mass or less. When the content is in the above range, the resin composition layer 10 can be cured more satisfactorily. The content of the curing catalyst is a solid content conversion value.

(5) Other Ingredients The resin composition in the present embodiment may further contain a plasticizer, a stabilizer, a tackifier, a colorant, a coupling agent, an antistatic agent, an antioxidant and the like.

(6) Thickness of Resin Composition Layer The thickness of the resin composition layer 10 is preferably 20 μm or more, more preferably 50 μm or more, particularly preferably 60 μm or more, and further preferably 100 μm or more. Is preferable. The thickness is preferably 1000 μm or less, preferably 500 μm or less, and more preferably 300 μm or less. When the thickness of the resin composition layer 10 is within the above range, the electronic component can be sealed and sufficiently embedded.

2. First Support Sheet The first support sheet 11 in the present embodiment includes a support base material 111 and an adhesive layer 112 laminated on one side of the support base material 111.

(1) Support base material The support base material 111 is not particularly limited, but for example, it is preferable to use a resin film, a non-woven fabric, paper or the like as the support base material 111. Examples of the resin film include polyester films such as polyethylene terephthalate film, polybutylene terephthalate film and polyethylene naphthalate film; polyolefin films such as polyethylene film and polypropylene film; and polyimide films. Examples of the above-mentioned non-woven fabric include non-woven fabrics using fibers such as rayon, acrylic and polyester. Examples of the above-mentioned paper include high-quality paper, glassine paper, impregnated paper, coated paper and the like. These may be used as two or more kinds of laminated bodies.

The material constituting the resin film preferably has a glass transition temperature (Tg) of 50 ° C. or higher, particularly preferably 55 ° C. or higher, and further preferably 60 ° C. or higher. When the glass transition temperature (Tg) of the material is 50 ° C. or higher, the resin composition layer 10 is thermally cured in a state where the first support sheet 11 is laminated on the resin composition layer 10. However, the first support sheet 11 is less likely to be thermally deformed, which makes it easier for the first support sheet 11 to peel off from the cured layer. Although the upper limit of the glass transition temperature (Tg) is not particularly limited, it is usually preferably 500 ° C. or lower, and particularly preferably 400 ° C. or lower. The glass transition temperature (Tg) is a value measured using a differential scanning calorimeter.

Further, the support base material 111 constituting the first support sheet 11 is subjected to primer treatment, corona treatment, and optionally on one side or both sides for the purpose of improving the adhesion to the pressure-sensitive adhesive layer 112 laminated on the surface thereof. Surface treatment such as plasma treatment and oxidation treatment may be performed.

The thickness of the support base material 111 is not particularly limited, but from the viewpoint of handleability of the resin sheet 1, it is preferably 10 μm or more, particularly preferably 15 μm or more, and further preferably 20 μm or more. preferable. The thickness is preferably 500 μm or less, particularly preferably 100 μm or less, and further preferably 75 μm or less.

The heat shrinkage rate of the support base material 111 in the MD direction and the CD direction when heated at 150 ° C. for 30 minutes is preferably 2.0% or less, particularly 1.5% or less. Is preferable. The lower limit of the heat shrinkage rate in the MD direction and the lower limit value of the heat shrinkage rate in the CD direction of the support base material 111 are preferably as small as possible, and are usually preferably 0.01% or more.

Further, the heat shrinkage rate of the support base material 111 in the MD direction and the heat shrinkage rate of the support base material 111 in the CD direction satisfy the above ranges, and the ratio of the heat shrinkage rate in the MD direction to the heat shrinkage rate in the CD direction ( The heat shrinkage rate in the MD direction / heat shrinkage rate in the CD direction) is preferably in the range of 0.03 or more and 30 or less, and particularly preferably in the range of 0.5 or more and 5.0 or less. By satisfying these, the support base material 111 can prevent the obtained semiconductor device from warping when the first support sheet 11 is peeled off from the formed cured layer after the resin composition layer 10 is thermally cured. can.

The above-mentioned MD direction is a direction parallel to the direction in which the support base material 111 is conveyed when the support base material 111 is formed into a long film, and the CD direction is a direction on the same surface of the support base material 111. It is a direction orthogonal to the MD direction.

The above-mentioned heat shrinkage rate shall be measured by the following method in accordance with JIS Z1712. The support base material 111 has a width of 20 mm and a length of 200 mm, cut in the MD direction and the TD direction, respectively, and hung in a hot air oven at 150 ° C. for heating for 5 minutes. Then, the length after heating is measured, and the ratio (percentage) of the contracted length to the original length is defined as the heat shrinkage rate.

The heat shrinkage of the support base material 111 may be changed, for example, by selecting a material that satisfies a desired range, annealing the support base material 111, or changing the film forming method of the support base material 111. It can also be adjusted by such things (for example, changing the stretching method).

Further, as the supporting base material 111, it is preferable to select one in which low molecular weight components (oligomers) are difficult to precipitate. By using such a support base material 111, oligomers contained in the support base material 111 are prevented from being precipitated by heating when the resin composition layer 10 is cured and transferred to the cured base material, resulting in higher quality. Can manufacture semiconductor devices. Regarding the degree of precipitation of the low molecular weight component, the resin sheet 1 was heated under the conditions of 100 ° C. and 60 minutes, and then heated under the conditions of 170 ° C. and 60 minutes, and then the resin composition layer 10 was cured. After peeling the first support sheet 11 from the cured layer, the exposed surface of the cured layer is observed with a digital microscope (observation magnification 500 times) to confirm the presence or absence of residues derived from low molecular weight components. Can be judged by.

(2) Adhesive Layer The adhesive constituting the pressure-sensitive adhesive layer 112 is not particularly limited as long as the first support sheet 11 exhibits desired adhesiveness to the resin composition layer 10. As an example of the adhesive constituting the adhesive layer 112, an acrylic adhesive, a rubber adhesive, a silicone adhesive, a urethane adhesive, a polyester adhesive, a polyvinyl ether adhesive, or the like can be used. can.

(2-1) Acrylic Adhesive The above-mentioned acrylic adhesive is an adhesive produced by using the adhesive composition P containing the (meth) acrylic acid ester polymer (A), although there is no particular limitation. Is preferable. In addition, in this specification, (meth) acrylic acid ester means both acrylic acid ester and methacrylic acid ester. The same applies to other similar terms.

The (meth) acrylic acid ester polymer (A) preferably contains a (meth) acrylic acid alkyl ester having an alkyl group having 1 to 20 carbon atoms as a monomer constituting the polymer. Thereby, the obtained pressure-sensitive adhesive can exhibit preferable stickiness.

As the (meth) acrylic acid alkyl ester having 1 to 20 carbon atoms in the alkyl group, one type may be used alone, or two or more types may be used in combination. As the (meth) acrylic acid alkyl ester, it is preferable to use a (meth) acrylic acid alkyl ester having an alkyl group having 6 to 10 carbon atoms from the viewpoint of heat resistance, and in particular, (meth) acrylic acid 2 -It is preferable to use ethylhexyl.

The (meth) acrylic acid ester polymer (A) may contain, as a monomer unit constituting the polymer, 10% by mass or more of the (meth) acrylic acid alkyl ester having 1 to 20 carbon atoms of the alkyl group. Particularly, it is preferably contained in an amount of 50% by mass or more, more preferably 70% by mass or more, particularly preferably 85% by mass or more, and further preferably 90% by mass or more. Further, the (meth) acrylic acid ester polymer (A) contains 99% by mass or less of a (meth) acrylic acid alkyl ester having an alkyl group having 1 to 20 carbon atoms as a monomer unit constituting the polymer. In particular, it is preferably contained in an amount of 98% by mass or less, and more preferably 97% by mass or less.

Further, the (meth) acrylic acid ester polymer (A) preferably contains a monomer having a reactive functional group (reactive functional group-containing monomer) as a monomer constituting the polymer. Preferred examples of the reactive functional group-containing monomer include a hydroxyl group-containing monomer, a carboxyl group-containing monomer, and an amino group-containing monomer. These reactive functional group-containing monomers may be used alone or in combination of two or more.

The (meth) acrylic acid ester polymer (A) preferably contains 1% by mass or more of a reactive functional group-containing monomer, and particularly 2% by mass or more, as a monomer unit constituting the polymer. It is preferable, and more preferably, it is contained in an amount of 3% by mass or more. Further, the (meth) acrylic acid ester polymer (A) preferably contains a reactive functional group-containing monomer in an amount of 30% by mass or less and 20% by mass or less as a monomer unit constituting the polymer. It is more preferable to contain it in an amount of 10% by mass or less, and further preferably it is contained in an amount of 7% by mass or less.

Further, the (meth) acrylic acid ester polymer (A) may further contain another monomer as a monomer constituting the polymer. Examples of the other monomer include (meth) acrylic acid ester having an aliphatic ring, non-crosslinkable acrylamide, (meth) acrylic acid ester having a non-crosslinkable tertiary amino group, vinyl acetate, styrene and the like. Can be mentioned. These may be used alone or in combination of two or more.

As the (meth) acrylic acid ester polymer (A), one type may be used alone, or two or more types may be used in combination.

The adhesive composition P for producing the acrylic pressure-sensitive adhesive preferably further contains a cross-linking agent (B), and the acrylic pressure-sensitive adhesive is the same as the above-mentioned (meth) acrylic acid ester polymer (A). It is preferably obtained by cross-linking the adhesive composition P containing the cross-linking agent (B).

The cross-linking agent (B) may be any one that reacts with the reactive functional group of the (meth) acrylic acid ester polymer (A), and is, for example, an isocyanate-based cross-linking agent, an epoxy-based cross-linking agent, or an amine-based cross-linking agent. Agents, melamine-based cross-linking agents, aziridine-based cross-linking agents, hydrazine-based cross-linking agents, aldehyde-based cross-linking agents, oxazoline-based cross-linking agents, metal alkoxide-based cross-linking agents, metal chelate-based cross-linking agents, metal salt-based cross-linking agents, ammonium salt-based cross-linking agents. And so on. The cross-linking agent (B) may be used alone or in combination of two or more.

The content of the cross-linking agent (B) in the adhesive composition P is preferably 0.1 part by mass or more with respect to 100 parts by mass of the (meth) acrylic acid ester polymer (A), and is preferably 1 part by mass. The above is more preferable, and it is particularly preferable that the amount is 2 parts by mass or more, and further preferably 3 parts by mass or more. The content is preferably 20 parts by mass or less, particularly preferably 15 parts by mass or less, and further 10 parts by mass with respect to 100 parts by mass of the (meth) acrylic acid ester polymer (A). It is preferably less than or equal to a portion.

(2-2) Additives The pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 112 includes various commonly used additives such as a refractive index adjuster, an antioxidant, a pressure-sensitive adhesive, and a silane coupling agent, if desired. , Antioxidants, UV absorbers, light stabilizers, softeners, fillers, photohardeners, photopolymerization initiators and the like can be added.

(2-3) Physical Properties of Adhesive Layer The thickness of the adhesive layer 112 is preferably 1 μm or more, particularly preferably 5 μm or more, and further preferably 10 μm or more. The thickness is preferably 500 μm or less, particularly preferably 100 μm or less, and further preferably 50 μm or less.

Adhesive layer 112 is preferably at 100 ° C., the storage modulus when the measurement frequency was 1Hz is 1 × ¹⁰ 5 Pa or more. If the pressure-sensitive adhesive layer 112 has such a storage elastic modulus, the resin composition layer 10 is cured to form a cured layer, and then the first support sheet 11 is more easily peeled off from the cured layer. It is possible to prevent the problem that the adhesive remains on the surface of the cured layer (so-called adhesive residue). At 100 ° C. of the adhesive layer 112, the upper limit of the storage modulus when measured frequency is 1Hz is not particularly limited, is preferably at most 1 × 10 7 ^Pa. The storage elastic modulus is a value measured by a torsional shear method using a dynamic viscoelasticity measuring device, and the details of the measuring method are as described in Examples described later.

The surface of the first support sheet 11 on the side of the pressure-sensitive adhesive layer 112 is attached to a copper foil, heated under the conditions of 100 ° C. and 30 minutes, and subsequently heated at 180 ° C. and 60 minutes, and then the copper foil. The adhesive strength at room temperature is preferably 0.7 N / 25 mm or more and 2.0 N / 25 mm or less. Further, the surface of the first support sheet 11 on the adhesive layer 112 side is attached to a polyimide film, heated under the conditions of 100 ° C. and 30 minutes, and subsequently heated at 180 ° C. and 60 minutes, and then the polyimide. The adhesive strength to the film at room temperature is preferably 0.7 N / 25 mm or more and 2.0 N / 25 mm or less. If the adhesive strength after such heating is within the above range, the first support sheet 11 can be more easily peeled off from the cured layer formed by heat-curing the resin composition layer 10. The details of the method for measuring the adhesive strength will be as described in Examples described later. Further, in the present specification, the room temperature means a temperature of 22 ° C. or higher and 24 ° C. or lower.

The pressure-sensitive adhesive layer 112 is reduced in weight by 5% from the viewpoint of effectively suppressing adhesive residue due to deterioration of the pressure-sensitive adhesive layer 112 when the first support sheet 11 is peeled off from the cured layer after being heated. The temperature is preferably 250 ° C. or higher, more preferably 300 ° C. or higher.

3. 3. Second Support Sheet The resin sheet 1 according to the present embodiment preferably includes a second support sheet 12 laminated on the surface of the resin composition layer 10 opposite to the first support sheet 11. Since the resin sheet 1 according to the present embodiment includes the second support sheet 12, the resin composition layer 10 can be protected from both sides by the first support sheet 11 and the second support sheet 12. As a result, problems in appearance and occurrence of chipping and cracking of the resin composition layer 10 are effectively suppressed.

The second support sheet 12 is not particularly limited, and is, for example, a polyester film such as polyethylene terephthalate, polybutylene terephthalate, or polyethylene naphthalate, a plastic film such as a polyolefin film such as polypropylene or polyethylene, high-quality paper, glassin paper, or impregnated paper. , Paper such as coated paper, non-woven fabric and the like. These may be used as two or more kinds of laminated bodies. The second support sheet 12 may be subjected to surface treatment such as mud treatment and corona treatment.

The contact surface of the second support sheet 12 with the resin composition layer 10 may be peeled off with a release agent. Examples of the release agent include silicone-based release agents, alkyd-based release agents, fluorine-based release agents, long-chain alkyl-based release agents, olefin resin-based release agents, acrylic-based release agents, rubber-based release agents, and the like. Among these, it is preferable to use at least one selected from a silicone-based release agent and an alkyd-based release agent, and in particular, it prevents the occurrence of floating between the second support sheet 12 and the resin composition layer 10. From the viewpoint, it is preferable to use an alkyd-based release agent.

Further, the second support sheet 12 may be provided with an adhesive layer on the surface on the side in contact with the resin composition layer 10. The pressure-sensitive adhesive layer may be the same as the pressure-sensitive adhesive layer 112 included in the first support sheet 11.

The thickness of the second support sheet 12 is not particularly limited, but is usually 20 μm or more and 250 μm or less.

4. Physical Properties of Resin Sheet The peeling force (F11) when peeling the first support sheet 11 from the resin composition layer 10 before curing is preferably 0.1 N / 25 mm or more, and particularly 0.2 N / 25 mm or more. It is preferably 0.3 N / 25 mm or more. The peeling force (F11) is preferably 3.0 N / 25 mm or less, particularly preferably 2.0 N / 25 mm or less, and further preferably 0.5 N / 25 mm or less. When the peeling force (F11) is 0.1 N / 25 mm or more, the floating of the first support sheet 11 and the resin composition layer 10 during storage (particularly refrigerated storage) or handling of the resin sheet 1 Occurrence is effectively suppressed. Further, when the peeling force (F11) is 3.0 N / 25 mm or less, it is possible to effectively suppress chipping and cracking of the resin composition layer 10 when peeling the first support sheet 11. Become. The method for measuring the peeling force (F11) described above is as shown in a test example described later.

Further, when the first support sheet 11 is peeled from the cured layer obtained by heat-curing the resin composition layer 10 in the resin sheet heated at 100 ° C. for 30 minutes and further heated at 180 ° C. for 60 minutes. The peeling force (F12) of is preferably 0.5 N / 25 mm or more, particularly preferably 0.7 N / 25 mm or more, and further preferably 0.8 N / 25 mm or more. The peeling force (F12) is preferably 3.0 N / 25 mm or less, particularly preferably 2.0 N / 25 mm or less, and further preferably 1.5 N / 25 mm or less. When the peeling force (F12) is 0.5 N / 25 mm or more, it is possible to suppress unintended peeling of the first support sheet 11 before and after thermosetting the resin composition layer 10 during the manufacture of a semiconductor device. The surface of the obtained cured layer can be better protected by the first support sheet 11. Further, since the peeling force (F12) is 3.0 N / 25 mm or less, even after heating the first support sheet 11, the resin composition layer 10 is cured from the surface of the cured layer. The first support sheet 11 can be easily peeled off satisfactorily, and chipping or cracking of the resin composition layer 10 can be effectively suppressed. The method for measuring the peeling force (F12) described above is as shown in a test example described later.

When the resin sheet 1 according to the present embodiment includes the second support sheet 12, the peeling force (F2) when the second support sheet 12 is peeled from the resin composition layer 10 before curing is described by the following formula. (1)
F11 / F2> 1 ... (1)
It is preferable that the condition is satisfied. As a result, the second support sheet 12 can be easily peeled off from the resin composition layer 10 while suppressing the occurrence of floating between the first support sheet 11 and the resin composition layer 10. The peeling force (F2) is preferably 0.05 N / 100 mm or more, and particularly preferably 0.10 N / 100 mm or more. Further, the peeling force (F2) is preferably 2.0 N / 100 mm or less. The method for measuring the peeling force (F2) described above is as shown in a test example described later.

5. Method for Producing Resin Sheet The method for producing the resin sheet 1 according to the present embodiment is not particularly limited, and for example, the above-mentioned resin composition and, if desired, a solvent or a dispersion medium are further contained on the second support sheet 12. The coating liquid to be coated is applied and dried (by heat-crosslinking if necessary) to form the resin composition layer 10. After that, the resin composition layer 10 can be manufactured by adhering the surface of the first support sheet 11 prepared separately on the side of the pressure-sensitive adhesive layer 112 to the surface of the resin composition layer 10 opposite to the second support sheet 12. .. The method for producing the first support sheet 11 is not particularly limited, and the first support sheet 11 can be produced by a known method.

Examples of the coating method include known methods such as a spin coating method, a spray coating method, a bar coating method, a knife coating method, a roll coating method, a roll knife coating method, a blade coating method, a die coating method, and a gravure coating method.

Examples of the solvent include organic solvents such as toluene, ethyl acetate and methyl ethyl ketone.

6. Use of Resin Sheet The resin sheet 1 according to this embodiment can be used for sealing electronic components. More specifically, it can be suitably used for encapsulation of electronic components in a method for manufacturing a semiconductor device such as a semiconductor package such as a fan-out type wafer level package or a fan-out type panel level package.

[Semiconductor device]
The semiconductor device according to the present embodiment includes a cured layer obtained by curing the resin composition layer 10 in the resin sheet 1 according to the present embodiment. In particular, the semiconductor device according to the present embodiment includes an electronic component sealed by the cured layer. Examples of such semiconductor devices include semiconductor packages such as fan-out wafer level packages and fan-out panel level packages. These semiconductor devices can be manufactured by the method described later using the resin sheet 1 according to the present embodiment.

As described above, the resin sheet 1 according to the present embodiment is less likely to float at the interface between the resin composition layer 10 and the first support sheet 11, and is cured by thermosetting the resin composition layer 10. The first support sheet 11 can be easily peeled off from the layer. Therefore, the semiconductor device according to the present embodiment manufactured by using the resin sheet 1 has good quality because it is manufactured by using the resin sheet 1 according to the above-described embodiment. It becomes.

[How to use the resin sheet]
The resin sheet 1 according to the present embodiment can be used, for example, for manufacturing a semiconductor device. Hereinafter, a method for manufacturing a semiconductor device including an electronic component sealed by the resin sheet 1 according to the embodiment will be described. 2 and 3 show cross-sectional views illustrating an example of the manufacturing method. First, as shown in FIG. 2A, as a preparatory step, the electronic component 2 is provided on one side of the temporary fixing material 8. The method of providing the electronic component 2 on the temporary fixing material 8 is not particularly limited, and a general method can be adopted. The temporary fixing material 8 is not particularly limited as long as it can temporarily fix the electronic component 2 on the temporary fixing material 8, and is an adhesive sheet composed of a base material and an adhesive layer laminated on the base material. It may be a base material having self-adhesiveness, a hard support plate, or a laminated member composed of a hard support plate and an adhesive layer laminated on the hard support plate. You may.

The electronic component 2 is not particularly limited as long as it is an electronic component to be sealed in general, and examples thereof include a semiconductor chip and the like. Further, the electronic component 2 may have a semiconductor chip mounted at a predetermined position on the interposer. In this case, in such a mounted state, at least a part of the interposer is sealed together with the semiconductor chip and the like. Examples of the interposer include a lead frame, a polyimide tape, a printed circuit board, and the like. Further, a frame made of a metal such as copper or a frame (also referred to as a frame-shaped member) such as a resin frame may be provided around the electronic component 2 on the temporary fixing material 8. In this case, at least a part of the frame-shaped member may be sealed together with the electronic component 2. The frame-shaped member usually includes one or more openings made of holes penetrating in the thickness direction, and a frame-shaped part made of copper or the like or resin.

When the frame-shaped member is used, in the preparatory step, for example, after the frame-shaped member is placed on one side of the temporary fixing member 8, the electronic component 2 is placed at the position of the opening of the frame-shaped member. do. As a result, in the subsequent resin composition layer laminating step, the exudation of the resin composition layer 10 to the outside of the opening can be suppressed, the thickness of the obtained semiconductor device can be made uniform, and the cured layer can be made uniform. It is possible to suppress the occurrence of warpage of the semiconductor device and suppress the warp of the obtained semiconductor device.

Subsequently, as shown in FIG. 2B, as a resin composition layer laminating step, the resin composition in the resin sheet 1 according to the present embodiment is placed on the surface side of the temporary fixing material 8 where the electronic component 2 is provided. Layer 10 is laminated. By the lamination, the electronic component 2 provided on the temporary fixing material 8 is covered with the resin composition layer 10. When laminating the resin composition layer 10, it is preferable to laminate the resin composition layer 10 so as not to create a space around the electronic component 2. When the resin sheet 1 further includes the second support sheet 12, the exposed surface of the resin composition layer 10 exposed by peeling the second support sheet 12 from the resin sheet 1 covers the electronic component 2. It is preferable to stack them. Although the first support sheet 11 may be peeled off from the resin composition layer 10 immediately after laminating the resin composition layer 10, it is preferable that the first support sheet 11 is peeled off after the resin composition layer 10 is cured, as will be described later. The resin composition layer laminating step can be performed under conventionally known laminating conditions using a conventionally known laminating apparatus.

Next, as shown in FIG. 2C, as a curing step, the resin composition layer 10 is cured to form a cured layer 10'. The curing is preferably performed by heating the resin composition layer 10. By the curing, a sealed body 4 including the cured layer 10'and the electronic component 2 sealed by the cured layer 10' is obtained.

In the curing of the resin composition layer 10 by heating described above, it is preferable to heat the resin composition layer 10 at 100 ° C. to 240 ° C. for 15 minutes to 300 minutes, for example. Further, it is preferable that the resin composition layer 10 is cured by the above-mentioned heating stepwise by a plurality of heat treatments.

Next, as shown in FIG. 2D, the temporary fixing material 8 is peeled from the sealing body 4, and the first support sheet 11 is peeled from the sealing body 4.

Next, as shown in FIG. 3A, as an insulating film forming step, an insulating film 9 is formed on the surface of the sealing body 4 exposed by peeling of the temporary fixing material 8 by a general method.

Next, an electrode is formed on the insulating film 9 by any conventionally known method. In the following, an example of forming by the semi-additive method will be described.

As shown in FIG. 3B, a hole 5 penetrating the insulating film 9 is formed. Specifically, a hole 5 is formed in the insulating film 9 that penetrates from the surface of the insulating film 9 opposite to the electronic component 2 to the interface between the insulating film 9 and the electronic component 2. In the cross-sectional view of FIG. 3B, it is shown that two holes 5 are formed in one electronic component 2. The formation of the hole 5 can be performed by a general method.

Next, as a desmear treatment step, the sealant 4 on which the insulating film 9 having the pores 5 formed is laminated is exposed to an alkaline solution. The step can be performed by a conventionally known general method.

Finally, as shown in FIG. 3C, as an electrode forming step, the electrode 6 is formed in the hole 5. The electrode 6 is electrically connected to the electronic component 2 through the hole 5. The electrode 6 can be formed by a general method. From the above, it is possible to obtain a semiconductor device including a cured layer 10'in which the resin composition layer 10 in the resin sheet 1 according to the present embodiment is cured.

Although an example of forming an electrode on the insulating film 9 has been described in FIGS. 3 (b) and 3 (c), holes and electrodes are formed on either the cured layer 10'or the insulating film 9. Alternatively, holes may be formed and electrodes may be formed on both the cured layer 10'and the insulating film 9.

According to the method of using the resin sheet 1 according to the present embodiment, even when the resin sheet 1 is stored in a refrigerator, the occurrence of floating at the interface between the resin composition layer 10 and the support sheet is effectively suppressed. The first support sheet 11 can be easily peeled off from the hardened layer 10', and as a result, the yield can be improved and high quality FOWLP and FOPLP can be produced.

The embodiments described above are described for facilitating the understanding of the present invention, and are not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

Hereinafter, the present invention will be described in more detail by showing Examples and Test Examples, but the present invention is not limited to the following Test Examples and the like.

[Example 1]
(1) Preparation of First Support Sheet Acrylic acid ester copolymer (2-ethylhexyl acrylate 92.8% by mass, 2-hydroxyethyl acrylate 7.0% by mass, 0.2% by mass acrylate) Copolymer) 40 parts by mass, 5 parts by mass of both-terminal hydroxyl group hydride polybutadiene (manufactured by Nippon Soda Co., Ltd., product name "GI-1000") as a tackifier, and a fat having hexamethylene diisocyanate as a cross-linking agent. 3.5 parts by mass of group isocyanate (manufactured by Nippon Polyurethane Industry Co., Ltd., product name "Coronate HX") is mixed in methyl ethyl ketone to prepare a coating liquid for an adhesive composition having a solid content concentration of 30% by mass. Prepared.

Next, the coating liquid of the prepared pressure-sensitive adhesive composition was peeled off from one surface of the polyethylene terephthalate film with a silicone-based peeling layer using a roll coater (manufactured by Lintec Co., Ltd., product name "SP-PET382150"). , Thickness: 38 μm), applied to the peeled surface, heated at 90 ° C for 90 seconds, and then heated at 115 ° C for 90 seconds to dry the coating film, and then used as a supporting base material. Transparent polyethylene terephthalate film (manufactured by Toyo Boseki Co., Ltd., product name "PET50A-4300", thickness: 50 μm, glass transition temperature Tg: 67 ° C., MD direction heat shrinkage rate: 1.2%, CD direction heat shrinkage rate: 0.6 %), A first support sheet composed of a pressure-sensitive adhesive layer made of an acrylic pressure-sensitive adhesive having a thickness of 50 μm and a support base material is laminated on the surface on the side of the pressure-sensitive adhesive layer. It was made in a state of being.

Incidentally, at 100 ° C. The resulting pressure-sensitive adhesive layer, the storage elastic modulus of when the measurement frequency was 1 Hz, it was 2.36 × ¹⁰ 5 Pa. The adhesive strength of the obtained first support sheet to the copper foil was 1.2 N / 25 mm. The adhesive strength of the first support sheet to the polyimide film was 1.1 N / 25 mm. The 5% weight loss temperature of the pressure-sensitive adhesive layer was 304 ° C. These physical property values are measured by the following methods.

(Measurement of storage elastic modulus)
A cylinder (thickness 3 mm) having a diameter of 8 mm was punched out from the pressure-sensitive adhesive layer laminated until the total thickness became 3 mm, and this was used as a sample. The sample is measured by the torsional shear method using a viscoelasticity measuring instrument (manufactured by REOMETRIC, product name "DYNAMIC ANALYZER") in accordance with JIS K7244-6: 1999, under the conditions of measurement frequency: 1 Hz and measurement temperature: 100 ° C. The storage elastic modulus (Pa) was measured in.

(Adhesive strength to copper foil and polyimide film)
The first support sheet was cut to a length of 100 mm and a width of 25 mm, and the release film was peeled off to use as a test piece. It was heated under the condition of 30 minutes, followed by heating under the conditions of 180 ° C. and 60 minutes, and then left for 24 hours under a standard environment (23 ° C., 50% RH). Then, under a standard environment (23 ° C., 50% RH), a tensile tester (manufactured by Shimadzu Corporation, product name "Autograph AG-IS") was used to achieve a peeling angle of 180 ° and a peeling speed of 300 mm / min. The first support sheet was peeled off from the copper foil, and the adhesive strength (mN / 25 mm) was measured. Further, the adhesive strength to the polyimide film described above was measured by the same adhesive strength measuring method as described above, except that the object to which the first support sheet was attached was changed from the copper foil to the polyimide film.

(Measurement of 5% weight loss temperature)
For the pressure-sensitive adhesive layer, a differential thermal / thermogravimetric simultaneous measuring device (manufactured by Shimadzu Corporation, product name "DTG-60") is used, and the inflow gas is nitrogen, the gas inflow rate is 100 ml / min, and the temperature rise rate is 20 ° C./min. Then, the thermogravimetric analysis was performed by raising the temperature from 40 ° C. to 550 ° C. (according to JIS K7120 “Plastic thermogravimetric measurement method”). Based on the obtained thermogravimetric curve, the temperature at which the mass was reduced by 5% with respect to the mass at a temperature of 100 ° C. (5% weight loss temperature) was determined.

(2) Formation of curable resin composition layer Thermosetting with 5.1 parts by mass (solid content equivalent, the same applies hereinafter) of bisphenol A type phenoxy resin (manufactured by Mitsubishi Chemical Corporation, product name "jER1256") as a thermoplastic resin. Bisphenol A type epoxy resin as a thermosetting resin (manufactured by Mitsubishi Chemical Co., Ltd., product name "jER828") 5.7 parts by mass and biphenyl type epoxy resin as a thermosetting resin (manufactured by Nippon Kayaku Co., Ltd., product name "NC-" 3000-L ") 5.7 parts by mass, naphthalene type epoxy resin as a thermosetting resin (manufactured by DIC, product name" HP-4700 ") 4.1 parts by mass, and biphenyl type as a thermosetting resin 14.1 parts by mass of phenol (manufactured by Meiwa Kasei Co., Ltd., product name "MEHC-7851-SS") and 2-ethyl-4-methylimidazole as an imidazole-based curing catalyst (manufactured by Shikoku Kasei Co., Ltd., product name "2E4MZ") 0.1 parts by mass and epoxy silane treated silica filler as inorganic fine particles [Silica filler (manufactured by Admatex, product name "SO-C2", average particle size: 0.5 μm, maximum particle size: 2 μm, shape: spherical ) Was surface-treated with 3-glycidoxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name "KBM-403", minimum coverage area: 330 m ² / g)] 65 parts by mass in methyl ethyl ketone. To obtain a coating liquid of a resin composition having a solid content concentration of 40% by mass.

A release film (manufactured by Lintec Corporation, product name "PET38AL-5", manufactured by Lintec Corporation), in which one surface of a polyethylene terephthalate film is peeled off with an alkyd-based release agent from the coating liquid obtained as described above as a second support sheet. It was applied to a peel-treated surface having a thickness of 38 μm), and the obtained coating film was dried to obtain a laminate of a curable resin composition layer having a thickness of 200 μm and a second support sheet.

(3) Preparation of Resin Sheet Curability of the exposed surface of the pressure-sensitive adhesive layer exposed by peeling the release film from the first support sheet prepared in the above step (1) and the laminate prepared in the above step (2). By laminating the surfaces on the resin composition layer side, a resin sheet obtained by laminating the first support sheet, the curable resin composition layer, and the second support sheet in order was obtained.

[Example 2]
As the second support sheet, except that a release film (manufactured by Lintec Corporation, product name "SP-PET38X", thickness: 38 μm) in which one surface of the polyethylene terephthalate film was peeled off with a non-silicone release layer was used. A resin sheet was obtained in the same manner as in Example 1.

[Comparative Example 1]
As the first support sheet, a release film (manufactured by Lintec Corporation, product name "SP-PET3811", thickness: 38 μm) in which one surface of the polyethylene terephthalate film is peeled off with a silicone-based release agent is used, and a second support sheet is used. As the support sheet, the same as in Example 1 except that a release film (manufactured by Lintec Corporation, product name "SP-PET38131", thickness: 38 μm) in which one surface of the polyethylene terephthalate film was peeled off with a silicone-based release agent was used. A resin sheet was obtained in the same manner.

[Comparative Example 2]
As the first support sheet, a polyethylene terephthalate (PET) film (thickness: 38 μm) whose both sides have not been peeled off with a release agent is used, and as a second support sheet, one side of the polyethylene terephthalate film is made of silicone. A resin sheet was obtained in the same manner as in Example 1 except that a release film (manufactured by Lintec Corporation, product name "SP-PET38131", thickness: 38 μm) that had been peeled off with a system release agent was used.

[Test Example 1] (Evaluation of peelability after thermosetting)
The resin sheets produced in Examples and Comparative Examples were cut into a size of 500 mm × 400 mm. Then, the second support sheet is peeled off from the resin sheet, the exposed curable resin composition layer is laminated on the copper plate, heated at 100 ° C. for 30 minutes, and further heated at 180 ° C. for 60 minutes to be curable. The resin composition layer was cured. Then, the cured layer obtained by curing the curable resin composition layer was cooled to room temperature, and then the first support sheet was peeled off from the cured layer. Regarding the state of peeling at this time, the peelability after thermosetting was evaluated based on the following criteria. The results are shown in Table 1.
A: The first support sheet could be peeled off.
B: The first support sheet could not be peeled off.

[Test Example 2] (Evaluation of floating during storage)
The resin sheets produced in Examples and Comparative Examples were cut into a size of 500 mm × 400 mm and stored in an environment of 5 ° C. for 1 week, and then floated at the interface between the curable resin composition layer and the first support sheet. And the occurrence of floating at the interface between the curable resin composition layer and the second support sheet were confirmed, and the floating during storage was evaluated based on the following criteria. The results are shown in Table 1.
A: No floating occurs at both the interface between the curable resin composition layer and the first support sheet and the interface between the curable resin composition layer and the second support sheet.
AB: No floating occurs at the interface between the curable resin composition layer and the first support sheet, but floating occurs at the interface between the curable resin composition layer and the second support sheet.
B: Floating occurs at both the interface between the curable resin composition layer and the first support sheet and the interface between the curable resin composition layer and the second support sheet.

[Test Example 3] (Measurement of peeling force)
Regarding the resin sheets produced in Examples 1 and 2, the peeling force (F11) when the first support sheet is peeled from the resin composition layer before curing by the following method, and the first support sheet has a resin composition. The peeling force (F12) when the physical layer was heat-cured from the cured layer and the peeling force (F2) when the second support sheet was peeled from the resin composition layer before curing were measured. The results are shown in Table 1.

(1) Measurement of peeling force (F11) The resin sheets produced in Examples 1 and 2 were cut into a width of 25 mm and a length of 250 mm. Next, the second support sheet was peeled off, and the exposed surface of the exposed curable resin composition layer was attached to a stainless steel plate with double-sided tape to prepare a measurement sample. Then, based on JIS Z 0237; 2009, using a universal tensile tester (autograph manufactured by Shimadzu Corporation), the peeling speed was 300 mm / min and the peeling angle was 180 ° in an environment of 23 ° C. and 50% relative humidity. The first support sheet was peeled from the curable resin composition layer, and the peeling force (N / 25 mm) was measured and used as the peeling force (F11).

(2) Measurement of peeling force (F12) The measurement sample prepared in the same manner as in (1) above is heated at 100 ° C. for 30 minutes and then at 180 ° C. for 60 minutes to cure the curable resin composition layer. bottom. Then, the cured layer obtained by curing the curable resin composition layer was cooled to room temperature. With respect to the measured sample after cooling, the peeling force (N / 25 mm) was measured in the same manner as in (1) above, and the peeling force (F12) was used.

(3) Measurement of peeling force (F2) The resin sheets produced in Examples 1 and 2 were cut into a width of 100 mm and a length of 100 mm. Then, based on JIS K6854-3: 1999, the second support sheet was peeled from the curable resin composition layer by T-shaped peeling at a peeling speed of 300 mm / min in an environment of 23 ° C. and a relative humidity of 50%. The peeling force (N / 100 mm) at that time was measured and used as the peeling force (F2).

As shown in Table 1, in the resin sheet according to the example, the first support sheet could be satisfactorily peeled off from the cured layer even after heat curing. Further, in the resin sheet according to the example, the occurrence of floating between the first support sheet and the curable resin composition layer during storage was suppressed. On the other hand, the resin sheet according to Comparative Example 1 was floated during storage. Further, in the resin sheet according to Comparative Example 2, the support sheet could not be peeled off from the formed cured layer after the resin composition layer was heat-cured.

The resin sheet according to the present invention can be suitably used for manufacturing semiconductor devices such as fan-out type wafer level packages and fan-out type panel level packages.

1 ... Resin sheet 10 ... Curable resin composition layer 10'... Curing layer 11 ... First support sheet 111 ... Support base material 112 ... Adhesive layer 12 ... Second support sheet 2 ... Electronic component 4 ... Encapsulant 5 ... Hole 6 ... Electrode 8 ... Temporary fixing material 9 ... Insulating film

Claims (10)

A resin sheet used to seal electronic components.
The resin sheet includes a first support sheet and a curable resin composition layer laminated on one side of the first support sheet.
The resin composition layer is formed of a resin composition containing a thermosetting resin and inorganic fine particles.
The content of the inorganic fine particles in the resin composition is 50% by mass or more and 90% by mass or less.
The average particle size of the inorganic fine particles is 0.01 μm or more and 3.0 μm or less.
The first support sheet includes a support base material and an adhesive layer laminated on one side of the support base material.
The resin composition layer is laminated on the surface of the first support sheet on the side of the pressure-sensitive adhesive layer .
In a resin sheet in which the resin sheet is heated at 100 ° C. for 30 minutes and further heated at 180 ° C. for 60 minutes, the peeling force when the first support sheet is peeled off from the cured layer obtained by curing the resin composition layer. (F12) is 0.5N / 25mm or more and 3.0N / 25mm or less.
The resin sheet is characterized in that the first support sheet is peeled off from the cured layer after the resin composition layer is cured to obtain a cured layer . The resin composition layer contains a thermoplastic resin and contains
The resin sheet according to claim 1, wherein the content of the thermoplastic resin in the resin composition is 1.0% by mass or more and 30% by mass or less. The resin sheet according to claim 1 or 2, wherein the pressure-sensitive adhesive layer is composed of an acrylic pressure-sensitive adhesive. Any of claims 1 to 3 , wherein the pressure-sensitive adhesive layer in the first support sheet has a storage elastic modulus of 1 × 10 ⁵ Pa or more at 100 ° C. at a measurement frequency of 1 Hz. The resin sheet according to item 1. The first support sheet is
After the pressure-sensitive adhesive layer surface is attached to the copper foil and heated under the conditions of 100 ° C. and 30 minutes, and then heated under the conditions of 180 ° C. and 60 minutes, the adhesive force to the copper foil at room temperature is 0. .7N / 25mm or more, 2.0N / 25mm or less,
After the pressure-sensitive adhesive layer surface is attached to the polyimide film and heated under the conditions of 100 ° C. and 30 minutes, and then heated under the conditions of 180 ° C. and 60 minutes, the adhesive force to the polyimide film at room temperature is 0. The resin sheet according to any one of claims 1 to 4 , wherein the resin sheet is 7.N / 25 mm or more and 2.0 N / 25 mm or less. The resin sheet according to any one of claims 1 to 5 , wherein the pressure-sensitive adhesive layer in the first support sheet has a 5% weight loss temperature of 250 ° C. or higher. The resin sheet according to any one of claims 1 to 6 , wherein the supporting base material is a resin supporting base material having a glass transition temperature (Tg) of 50 ° C. or higher. The resin sheet according to any one of claims 1 to 7 , wherein the resin sheet includes a second support sheet laminated on a surface of the resin composition layer opposite to the first support sheet. The resin sheet described. A semiconductor device comprising a cured layer obtained by curing the resin composition layer in the resin sheet according to any one of claims 1 to 8. The method for using the resin sheet according to any one of claims 1 to 8.
A step of curing the resin composition layer to obtain a cured layer,
A method of using a resin sheet, which comprises a step of peeling the first support sheet from the cured layer after curing the resin composition layer.

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