KR102602545B1 - Resin sheet and semiconductor device - Google Patents

Abstract

The object of the present invention is to provide a resin sheet that is less likely to float at the interface between the resin composition layer and the support sheet and has excellent handling properties during processing and transportation.
As a means to solve this problem, the resin sheet 1 is used for encapsulating electronic components or forming an insulating film in a method of manufacturing a semiconductor device by panel level packaging. 1 Equipped with a support sheet 11, a resin composition layer 10, and a second support sheet 12, wherein the resin composition layer 10 includes a thermosetting resin, 30% by mass or less of a thermoplastic resin, and 50% by mass or more of inorganic fine particles. It is formed from a resin composition containing, the contact surface with the resin composition layer 10 of the first support sheet 11 is not subjected to a peeling treatment with a silicone-based release agent, and the resin composition layer is measured by gas chromatography mass spectrometry. A resin sheet (1) is provided in which the concentration of volatile components generated when (10) is heated at 120° C. for 30 minutes is 100 to 45,000 ppm.

Description

Resin sheet and semiconductor device {RESIN SHEET AND SEMICONDUCTOR DEVICE}

The present invention relates to a resin sheet and a semiconductor device manufactured using the resin sheet.

Recently, the demand for smaller and thinner semiconductor packages has increased significantly. To meet these demands, a fan-out type semiconductor package is being proposed. As a method of manufacturing a fan-out type semiconductor package, panel-level fan-out packaging technology (FOPLP), which manufactures a rectangular substrate size of about 300 to 700 mm, is attracting attention.

In the FOPLP semiconductor device manufacturing method, for example, after a resin composition layer formed in a sheet is laminated on an electronic component provided on a support, the electronic component is embedded in the resin composition layer by pressing the resin composition layer. do. After that, the electronic component is sealed by curing the resin composition layer, and then a rewiring layer is formed.

As a resin sheet provided with the above-mentioned resin composition layer, a resin sheet having a structure in which a support sheet is laminated on the resin composition layer is usually used in order to improve handling during processing and transportation. There is. For example, Patent Document 1 discloses a resin sheet including a resin composition layer and a support sheet laminated on both sides of the resin composition layer. The surface of the support sheet in contact with the resin composition layer is subjected to a peeling treatment with a silicone-based release agent.

In addition, since the resin sheet as described above usually contains a thermosetting resin such as an epoxy resin or a curing accelerator in the resin composition layer, storage stability is likely to be low, and therefore, refrigerated storage may be necessary.

Japanese Patent Application Publication No. 2015-126133

However, since the above-mentioned resin sheet has little or almost no adhesiveness (tack) on the surface of the resin composition layer, when stored in a state protected by a support sheet, the interface between the resin composition layer and the support sheet is prone to lifting. There was a problem that occurred. Additionally, there were cases where handling problems occurred, such as fragments or cracks occurring in the resin composition layer during processing or transportation. In particular, these problems arise when the resin sheet is refrigerated and stored at 5°C or lower, when a resin composition layer with a high inorganic filler content is used, and when a phenoxy resin is used as a resin component for imparting film-forming properties. It becomes noticeable in some cases, etc.

The present invention was made in view of such actual conditions, and its purpose is to provide a resin sheet that is less likely to float at the interface between the resin composition layer and the support sheet and has excellent handling properties during processing and transportation. do. Additionally, the present invention provides a semiconductor device with good quality using such a resin sheet.

In order to achieve the above object, firstly, the present invention provides a resin sheet used for encapsulating electronic components or forming an insulating film in a method of manufacturing a semiconductor device by panel level packaging, wherein the resin sheet is a first support sheet. and a resin composition layer laminated on one side of the first support sheet, and a second support sheet laminated on a side of the resin composition layer opposite to the first support sheet, the resin composition The layer is formed from a resin composition containing a thermosetting resin, a thermoplastic resin, and inorganic fine particles, the content of the inorganic fine particles in the resin composition is 50% by mass or more, and the content of the thermoplastic resin in the resin composition is The resin composition layer has a content of 30% by mass or less, the contact surface with the resin composition layer in the first support sheet is not subjected to a peeling treatment with a silicone-based release agent, and is measured by gas chromatography mass spectrometry. A resin sheet is provided, characterized in that the concentration of volatile components generated when heated at 120°C for 30 minutes is 100 ppm or more and 45,000 ppm or less (invention 1).

In the resin sheet according to the invention (invention 1), a support sheet is provided on both sides of the resin composition layer, and the contact surface of the first support sheet with the resin composition layer is not subjected to a peeling treatment with a silicone-based release agent. As a result, lifting at the interface between the resin composition layer and the support sheet is unlikely to occur. In addition, when the concentration of the volatile component in the resin composition layer is within the above range, the surface of the resin composition layer has good tack, and this also prevents the occurrence of lifting at the interface between the resin composition layer and the support sheet. It's difficult to do. Additionally, when the concentration of the volatile component in the resin composition layer is within the above range, the vulnerability of the resin composition layer is improved. As described above, the occurrence of lifting is suppressed and the fragility of the resin composition layer is improved, making it difficult for chips or cracks to occur in the resin composition layer during processing or transportation, and excellent handling properties are achieved.

In the above invention (invention 1), it is preferable that the thermoplastic resin does not contain an acrylic resin (invention 2).

In the above inventions (inventions 1 and 2), it is preferable that the surface of the first support sheet on the resin composition layer side is subjected to a release treatment with an alkyd-based release agent (invention 3).

In the above inventions (inventions 1 to 3), the first support sheet is preferably provided with a resin support substrate having a glass transition temperature (Tg) of 50°C or higher (invention 4).

In the above inventions (inventions 1 to 4), it is preferable that the surface of the second support sheet on the resin composition layer side is subjected to a release treatment with a release agent (invention 5).

Second, the present invention provides a semiconductor device characterized by comprising a cured layer formed by curing the resin composition layer in the resin sheet (inventions 1 to 5) (invention 6).

According to the resin sheet of the present invention, lifting at the interface between the resin composition layer and the support sheet is unlikely to occur, and handling properties during processing and transportation are excellent. Furthermore, according to the manufacturing method of the present invention, a semiconductor device with good quality can be manufactured using such a resin sheet.

1 is a cross-sectional view of a resin sheet according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described.

[Resin sheet]

1 shows a cross-sectional view of the resin sheet 1 according to this embodiment. As shown in FIG. 1, the resin sheet 1 according to the present embodiment includes a first support sheet 11, a resin composition layer 10 laminated on one side of the first support sheet 11, and It is provided with a second support sheet (12) laminated on a surface of the resin composition layer (10) opposite to the first support sheet (11).

In addition, the contact surface of the first support sheet 11 in this embodiment with the resin composition layer 10 has not been subjected to a peeling treatment with a silicone-based release agent. In addition, in this specification, "not subjected to a peeling treatment using a silicone-based release agent" means that the first support sheet 11 has been subjected to a peeling treatment using a release agent other than a silicone-based release agent, or has been subjected to a peeling treatment using a release agent. It means that has not been done.

As described above, the resin sheet 1 according to the present embodiment has a configuration in which the first support sheet 11 and the second support sheet 12 are laminated on both sides of the resin composition layer 10, respectively. , the resin composition layer 10 is well protected from both sides by the support sheet. In addition, in the resin sheet 1 according to the present embodiment, the contact surface with the resin composition layer in the first support sheet 11 is not subjected to a peeling treatment with a silicone-based release agent, so that the resin composition layer 10 and the desired adhesion is achieved at the interface with the first support sheet 11. In this way, one surface side of the resin composition layer 10 is protected by the first support sheet 11, and the other surface side is also protected by the second support sheet 12, according to the present embodiment. In the resin sheet 1 according to this, it is difficult for lifting to occur at the interface between the resin composition layer 10 and the support sheet.

In addition, in the resin sheet 1 according to the present embodiment, the concentration of volatile components generated when the resin composition layer 10 is heated at 120 ° C. for 30 minutes, measured by gas chromatography mass spectrometry, is 100 ppm or more, 45000 ppm. It is as follows. As a result, the resin composition layer 10 has good tack on its surface, and lifting at the interface between the resin composition layer 10 and the support sheet is unlikely to occur. Additionally, when the concentration of the volatile component is within the above range, the vulnerability of the resin composition layer 10 is also improved.

As described above, in the resin sheet 1 according to the present embodiment, the occurrence of lifting at the interface between the resin composition layer 10 and the support sheet is suppressed, and the fragility of the resin composition layer 10 is improved. As a result, it becomes difficult for chips or cracks to occur in the resin composition layer during processing or transportation, and excellent handling properties are achieved.

1. Resin composition layer

The resin composition layer 10 in this embodiment is formed from a resin composition containing a thermosetting resin, a thermoplastic resin, and inorganic fine particles. The resin composition layer 10 has curability, and a cured layer can be formed by curing the resin composition layer 10. In addition, the cured layer formed by curing the resin composition layer 10 preferably exhibits insulating properties. Since the cured layer exhibits insulating properties, defects such as short circuits are suppressed in the resulting semiconductor device, and excellent performance can be obtained.

(1) Thermosetting resin

The thermosetting resin is not particularly limited and includes, for example, epoxy resin, phenol resin, naphthol-based resin, activated ester-based resin, benzoxazine-based resin, cyanate ester-based resin, etc., and these can be used alone. Or, two or more types can be used in combination.

As the epoxy resin, various known epoxy resins can be used, and specifically, glycidyl ethers of phenols such as bisphenol A, bisphenol F, resorcinol, phenyl novolak, and cresol novolac; Glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; Glycidyl ethers of carboxylic acids such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; Glycidyl-type or alkylglycidyl-type epoxy resins in which the active hydrogen bonded to the nitrogen atom, such as aniline isocyanurate, is replaced with a glycidyl group; Vinylcyclohexanediepoxide, 3,4-epoxycyclohexylmethyl-3,4-dicyclohexanecarboxylate, 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy) So-called alicyclic epoxides, such as cyclohexane-m-dioxane, in which epoxy is introduced by oxidizing the carbon-carbon double bond in the molecule, for example. In addition, epoxy resins having a biphenyl skeleton, triphenylmethane skeleton, dicyclohexadiene skeleton, naphthalene skeleton, etc. can also be used. These epoxy resins can be used individually or in combination of two or more types. Among the above-mentioned epoxy resins, glycidyl ether of bisphenol A (bisphenol A type epoxy resin), an epoxy resin having a biphenyl skeleton (biphenyl type epoxy resin), an epoxy resin having a naphthalene skeleton (naphthalene type epoxy resin) or these. It is desirable to use a combination of.

Examples of the phenol resin include bisphenol A, tetramethylbisphenol A, diallylbisphenol A, biphenol, bisphenol F, diallylbisphenol F, triphenylmethane type phenol, tetrakisphenol, novolac type phenol, and cresolano. Examples include rockfish resin and phenol (biphenyl-type phenol) having a biphenyl aralkyl skeleton, and among these, it is preferable to use biphenyl-type phenol. These phenol resins can be used individually or in combination of two or more types. Moreover, when using an epoxy resin as a curable resin, it is preferable to use a phenol resin together from the viewpoint of reactivity with the epoxy resin, etc.

The content of the thermosetting resin in the resin composition is preferably 10 mass% or more, particularly preferably 15 mass% or more, and further preferably 20 mass% or more. Moreover, the content is preferably 60 mass% or less, particularly preferably 50 mass% or less, and more preferably 40 mass% or less. When the content is 10% by mass or more, the curing of the resin composition layer 10 becomes more sufficient, and the electronic component can be sealed more firmly. In addition, when the content is 60% by mass or less, hardening of the resin composition layer 10 at an unintended stage can be further suppressed, and storage stability becomes more excellent. In addition, the above content of thermosetting resin is a solid content conversion value.

(2) Thermoplastic resin

The resin composition in this embodiment contains 30 mass% or less of thermoplastic resin. This provides excellent film-forming properties to the resin composition, and effectively improves the handling properties of the resulting resin sheet 1. From this viewpoint, the content of the thermoplastic resin in the resin composition is preferably 20% by mass or less, and particularly preferably 10% by mass or less. Moreover, the lower limit of the content of the thermoplastic resin is not particularly limited, but for example, it is preferably 1.0 mass% or more, particularly preferably 3.0 mass% or more, and more preferably 5.0 mass% or more. In addition, the above content of thermoplastic resin is a solid content conversion value.

Thermoplastic resins include, for example, phenoxy resin, olefin resin, polyester resin, polyurethane resin, polyester urethane resin, acrylic resin, amide resin, styrene-isobutylene-styrene copolymer (SIS), etc. styrene-based resin, silane-based resin, rubber-based resin, polyvinyl acetal-based resin, polyvinyl butyral resin, polyimide-based resin, polyamidoimide-based resin, polyethersulfone-based resin, polysulfone-based resin, fluorine-based resin, etc. These can be mentioned, and these can be used individually by 1 type or in combination of 2 or more types. Additionally, these thermoplastic resins may have a curable functional group.

Here, when manufacturing a semiconductor device using the resin sheet 1 according to this embodiment in order to miniaturize the semiconductor device or refine the wiring, an electrode is placed on the cured layer formed by curing the resin composition layer 10. By forming, a redistribution layer may be provided. In particular, when providing a redistribution layer by the semi-additive method described later, in the desmear treatment process, the hardened layer is treated under harsh conditions such as exposure to an alkaline solution. In this case, depending on the type of thermoplastic resin, wiring formability may be poor, such as the cured layer dissolving and the peeling strength of the plating being lowered. Therefore, from the viewpoint of wiring formation in the hardened layer, it is preferable that the thermoplastic resin does not contain an acrylic resin. As the thermoplastic resin, it is preferable to use at least one selected from the group consisting of phenoxy resin, polyvinyl acetal resin, and polyvinyl butyral resin among the thermoplastic resins described above.

The phenoxy resin is not particularly limited, but examples include bisphenol A type, bisphenol F type, bisphenol A/bisphenol F copolymerization type, bisphenol S type, bisphenol acetophenone type, novolac type, fluorene type, and dicyclopenta. Phenoxy resins of diene type, norbornene type, naphthalene type, anthracene type, adamantane type, terpene type, trimethylcyclohexane type, biphenol type, and biphenyl type are exemplified, and among these, bisphenol A type phenoxy resin is used. It is desirable to use The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group. Phenoxy-based resins may be used individually, or two or more types may be used together.

Additionally, when a phenoxy resin is used as the thermoplastic resin, the tack on the surface of the resin composition layer 10 tends to become small. However, the resin sheet 1 according to the present embodiment can effectively suppress lifting at the interface between the resin composition layer 10 and the support sheet even when a phenoxy-based resin is used as the thermoplastic resin.

The weight average molecular weight (Mw) of the thermoplastic resin is preferably 100 or more, particularly preferably 1,000 or more, and more preferably 10,000 or more. Additionally, the weight average molecular weight (Mw) of the thermoplastic resin is preferably 1 million or less, particularly preferably 800,000 or less, and more preferably 100,000 or less. If the weight average molecular weight (Mw) of the thermoplastic resin is within the above range, it becomes easier to form the resin composition layer 10 into a sheet shape. In addition, the weight average molecular weight in this specification is a standard polystyrene conversion value measured by Gel Permeation Chromatography (GPC) method.

(3) Inorganic fine particles

The resin composition in this embodiment contains inorganic fine particles in an amount of 50% by mass or more. As a result, the thermal expansion coefficient and water absorption of the cured layer formed by curing the resin composition layer 10 become relatively small. Additionally, the resin composition layer 10 exhibits excellent flexibility, fluidity, and adhesiveness. From this viewpoint, the content of inorganic fine particles in the resin composition is preferably 55% by mass or more, and particularly preferably 60% by mass or more. The upper limit of the content of inorganic fine particles is not particularly limited, but for example, it is preferably 90% by mass or less, particularly preferably 85% by mass or less, and more preferably 80% by mass or less. In addition, the above content of inorganic fine particles is a solid content conversion value.

Inorganic fine particles include, for example, silica, alumina, glass, titanium oxide, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, and aluminum borate whisker. , complex oxides such as boron nitride, crystalline silica, amorphous silica, mullite, cordierite, montmorillonite, smectite, boehmite, talc, iron oxide, silicon carbide, zirconium oxide, etc. can be exemplified, These can be used individually or in combination of two or more types. Among these, it is preferable to use silica fine particles and alumina fine particles, and it is especially preferable to use silica fine particles.

The inorganic fine particles are preferably surface treated with a surface treatment agent. This results in excellent dispersibility and filling properties of the inorganic fine particles in the resin composition. Examples of the surface treatment agent include epoxy silane, vinyl silane, silazane compounds, alkoxy silanes, and silane coupling agents. These may be used individually or in combination.

The minimum coverage area of the surface treatment agent is preferably less than 550 m2/g, particularly preferably 520 m2/g or less, and more preferably 450 m2/g or less. On the other hand, the lower limit of the minimum coverage area of the surface treatment agent is preferably 100 m2/g or more, particularly preferably 200 m2/g or more, and more preferably 300 m2/g or more. When the minimum coverage area is within the above range, the dispersibility and filling properties of the inorganic fine particles in the resin composition are improved, and the formation of an electrode for the cured layer formed by curing the resin composition layer 10 is improved.

In addition, the minimum coverage area (m 2 /g) in the surface treatment agent refers to the area (m 2 ) of the monomolecular film when the monomolecular film is formed using 1 g of the surface treatment agent. The minimum coverage area can be theoretically calculated from the structure of the surface treatment agent, etc.

Suitable examples of surface treatment agents include epoxysilanes such as 3-glycidoxypropyltrimethoxysilane and vinylsilanes such as vinyltrimethoxysilane.

The average particle diameter of the inorganic fine particles is preferably 0.01 μm or more, particularly preferably 0.1 μm or more, and more preferably 0.3 μm or more. Additionally, the average particle diameter of the inorganic fine particles is preferably 100 μm or less, particularly preferably 3.0 μm or less, and more preferably 1.0 μm or less. If the average particle diameter of the inorganic fine particles is in this range, the flexibility and softness of the resin composition layer 10 will easily be excellent, and the content of the inorganic fine particles can be easily adjusted to a high filling rate such as the above-mentioned range. . In addition, when the average particle diameter of the inorganic fine particles is 1.0 μm or less, when forming a redistribution layer on the cured layer formed by curing the resin composition layer 10 as described above, the formation of the electrode becomes easy to improve.

Additionally, the maximum particle size of the inorganic fine particles is preferably 0.05 μm or more, and particularly preferably 0.5 μm or more. Additionally, the maximum particle diameter is preferably 5 μm or less, and particularly preferably 3 μm or less. When the maximum particle size of the inorganic fine particles is within the above range, it becomes easy to fill the resin composition with the inorganic fine particles, and the coefficient of thermal expansion during curing is easily suppressed low. In addition, when forming a rewiring layer on the hardened layer formed by curing the resin composition layer 10 as described above, it becomes easy to form fine wiring. In addition, the average particle diameter and maximum particle diameter of the inorganic fine particles in this specification are the values measured by the dynamic light scattering method using a particle size distribution measuring device (product name "Nanotrack Wave-UT151" manufactured by Nikkiso Co., Ltd.).

(4) Curing catalyst

It is preferable that the resin composition in this embodiment further contains a curing catalyst. As a result, it becomes possible to effectively advance the curing reaction of the thermosetting resin, and it becomes possible to satisfactorily cure the resin composition layer 10. Examples of the curing catalyst include an imidazole-based curing catalyst, an amine-based curing catalyst, and a phosphorus-based curing catalyst.

Specific examples of imidazole-based curing catalysts include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, and 1-benzyl-2-methyl. Imidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2- Methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 2 -Phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-di(hydroxymethyl)imidazole, etc. are mentioned.

Specific examples of amine-based curing catalysts include triazine compounds such as 2,4-diamino-6-[2'-methylimidazolyl-(1')]ethyl-s-triazine, and 1,8-diazabicyclo. Tertiary amine compounds such as [5,4,0]undecen-7 (DBU), triethylenediamine, benzyldimethylamine, and triethanolamine can be mentioned. Among them, 2,4-diamino-6-[2'-methylimidazolyl-(1')]ethyl-s-triazine is preferable.

Additionally, specific examples of the phosphorus-based curing catalyst include triphenylphosphine, tributylphosphine, tri(p-methylphenyl)phosphine, and tri(nonylphenyl)phosphine.

The curing catalyst mentioned above may be used individually by 1 type, or may use 2 or more types together.

From the viewpoint of curing properties, the curing catalyst described above preferably has a melting point of 180°C or lower, particularly preferably 100°C or lower, and more preferably 60°C or lower. If the melting point of the curing catalyst is 180°C or lower, it becomes easy to satisfactorily cure the resin composition layer 10. On the other hand, the lower limit of the melting point of the curing catalyst is preferably at least room temperature (23°C) from the viewpoint of storage stability.

The content of the curing catalyst in the resin composition is preferably 0.01 mass% or more, particularly preferably 0.05 mass% or more, and further preferably 0.1 mass% or more. Moreover, the content is preferably 2.0 mass% or less, particularly preferably 1.5 mass% or less, and more preferably 1.0 mass% or less. When the content is within the above range, it becomes possible to cure the resin composition layer 10 more satisfactorily. In addition, the above content of the curing catalyst is a solid content conversion value.

(5) Other ingredients

The resin composition in this embodiment may further contain a plasticizer, stabilizer, tackifier, colorant, coupling agent, antistatic agent, antioxidant, etc.

(6) Physical properties of the resin composition layer, etc.

In the resin sheet 1 according to the present embodiment, the concentration of volatile components generated when the resin composition layer 10 is heated at 120° C. for 30 minutes, measured by gas chromatography mass spectrometry (GC-MS), is: It is more than 100ppm. Here, the volatile component specifically refers to the residual content of the organic solvent component used in the coating liquid for forming the resin composition layer 10.

When the concentration of the volatile component is 100 ppm or more, the surface of the resin composition layer 10 has good tack, and the resin composition layer 10, the first support sheet 11, and the second support sheet 12 It becomes difficult for lifting at the interface to occur. In addition, when the concentration of the volatile component is 100 ppm or more, the vulnerability of the resin composition layer 10 is improved, it becomes difficult for chips or cracks to occur in the resin composition layer 10 during processing or transportation, and handling properties are improved. do. From this viewpoint, the concentration of the above-mentioned volatile components is preferably 1000 ppm or more, and particularly preferably 5000 ppm or more.

On the other hand, regarding the upper limit of the concentration of the volatile component, it is 45,000 pp or less, especially preferably 35,000 pp or less, and more preferably 30,000 ppm or less. If the concentration of the volatile component exceeds 45000 ppm, the surface of the resin composition layer 10 may become excessively sticky, or swelling may occur due to the volatile component during heat curing of the resin composition layer 10, resulting in the resulting semiconductor This can cause problems such as lowering the reliability of the device.

In the resin sheet 1 according to the present embodiment, the above-mentioned organic solvent component remains at a specific concentration in the resin composition layer 10, so that a good tack is provided to the surface of the resin composition layer 10, and the resin The occurrence of lifting at the interface between the composition layer 10 and the first support sheet 11 and the second support sheet 12 is suppressed, and the vulnerability of the resin composition layer 10 is improved during processing and transportation. The occurrence of fragments and cracks in the resin composition layer 10 during application is suppressed.

The concentration of the above-mentioned volatile components can be adjusted according to the conditions for forming the resin composition layer 10. For example, by adjusting the drying temperature, drying time, type of organic solvent, etc. when forming the resin composition layer 10, the concentration of volatile components in the resin composition layer 10 can be adjusted to the above range.

The thickness of the resin composition layer 10 can be set in consideration of uses, etc. For example, when the resin sheet 1 according to this embodiment is used for encapsulation of electronic components in the semiconductor device manufacturing method, the thickness of the resin composition layer 10 is preferably 20 μm or more, and 50 μm or more. It is more preferable that it is ㎛ or more, it is especially preferable that it is 60 ㎛ or more, and it is especially more preferable that it is 100 ㎛ or more. Moreover, the thickness is preferably 1000 μm or less, more preferably 500 μm or less, and particularly preferably 300 μm. If the thickness of the resin composition layer 10 is within the above range, electronic components can be sealed and sufficiently embedded.

In addition, when the resin sheet 1 according to the present embodiment is used to form an insulating film in a semiconductor device manufacturing method, the thickness of the resin composition layer 10 is not particularly limited, but is preferably 5 μm or more. , it is particularly preferable that it is 10 μm or more, and it is more preferable that it is 15 μm or more. Additionally, the thickness is preferably 80 μm or less, particularly preferably 60 μm or less, and more preferably 40 μm or less.

2. First support sheet

The first support sheet 11 is not particularly limited as long as the contact surface with the resin composition layer is not subjected to a peeling treatment with a silicone-based release agent.

As the support base material constituting the first support sheet 11, it is preferable to use a resin film, non-woven fabric, paper, etc., respectively. Examples of the resin film include polyester films such as polyethylene terephthalate film, polybutylene terephthalate film, and polyethylene naphthalate film; Polyolefin films such as polyethylene film and polypropylene film; Polyimide films, etc. can be mentioned. Examples of the non-woven fabric include non-woven fabric using fibers such as rayon, acrylic, and polyester. Examples of the above paper include fine paper, glassine paper, impregnated paper, and coated paper. These may be used as a laminate of two or more types. Additionally, the support base material constituting the first support sheet 11 may be subjected to surface treatment such as primer treatment, corona treatment, plasma treatment, or oxidation treatment on one or both sides as desired.

The material constituting the resin film preferably has a glass transition temperature (Tg) of 50°C or higher, particularly preferably has a glass transition temperature (Tg) of 55°C or higher, and further preferably has a glass transition temperature (Tg) of 60°C or higher. desirable. Since the glass transition temperature (Tg) of the material is 50°C or higher, even if the resin composition layer 10 is heat-cured in a state in which the first support sheet 11 is laminated on the resin composition layer 10, the first The support sheet 11 becomes less susceptible to thermal deformation, and peeling of the first support sheet 11 from the hardened layer becomes easy. Moreover, the upper limit of the glass transition temperature (Tg) is not particularly limited, but is usually preferably 500°C or lower, and particularly preferably 400°C or lower. In addition, the glass transition temperature (Tg) is a value measured using a differential scanning calorimeter.

When the first support sheet 11 has been subjected to a release treatment using a release agent other than a silicone release agent, the release agent may be selected from alkyd release agents, fluorine release agents, long-chain alkyl release agents, olefin resin release agents, acrylic release agents, and rubber release agents. It is preferable that at least one type is used, and among these, it is particularly preferable to use an alkyd-based release agent.

The thickness of the first support sheet 11 is usually 10 μm or more and 250 μm or less.

3. Second support sheet

As a support base material constituting the second support sheet 12, it is preferable to use a resin film, non-woven fabric, paper, etc. Examples of the resin film include polyester films such as polyethylene terephthalate film, polybutylene terephthalate film, and polyethylene naphthalate film; Polyolefin films such as polyethylene film and polypropylene film; Polyimide films, etc. can be mentioned. Examples of the non-woven fabric include non-woven fabric using fibers such as rayon, acrylic, and polyester. Examples of the above paper include fine paper, glassine paper, impregnated paper, and coated paper. These may be used as a laminate of two or more types. Additionally, the support base material constituting the second support sheet 12 may be subjected to surface treatment such as primer treatment, corona treatment, plasma treatment, or oxidation treatment on one or both sides as desired.

The contact surface of the second support sheet 12 with the resin composition layer 10 may or may not be subjected to a peeling treatment with a release agent.

As the release agent, it is preferable to use at least one selected from silicone-based release agents, alkyd-based release agents, fluorine-based release agents, long-chain alkyl-based release agents, olefin resin-based release agents, acrylic-based release agents, and rubber-based release agents.

In addition, from the viewpoint of suppressing the occurrence of lifting at the interface between the second support sheet 12 and the resin composition layer 10 and improving the handling properties during storage and handling of the resin sheet 1, It is preferable that the contact surface of the second support sheet 12 with the resin composition layer 10 is not subjected to a peeling treatment with a silicone-based release agent.

The thickness of the second support sheet 12 is not particularly limited, but is usually 20 μm or more and 250 μm or less.

4. Physical properties of resin sheet

In the resin sheet 1 according to this embodiment, the peeling force when peeling the first support sheet 11 from the resin composition layer 10 is set to F1, and the second support sheet 12 is set to the resin composition layer ( 10), when the peeling force at the time of peeling is F2, the F1 and the F2 are expressed in the following equation (1)

F1/F2>1 : (1)

It is desirable to satisfy. As a result, the second support sheet 12 can be easily peeled off from the resin composition layer 10 while the first support sheet 11 remains in the resin composition layer 10. Thereby, it becomes possible to effectively suppress the occurrence of fragments or cracks in the resin composition layer 10 accompanying the peeling operation.

The peeling force F1 when peeling the above-mentioned first support sheet 11 from the resin composition layer 10 is preferably 0.05 N/100 mm or more, and particularly preferably 0.1 N/100 mm or more. Additionally, the peeling force F1 is preferably 2.0 N/100 or less, and is particularly preferably 1.5 N/100 mm or less.

Moreover, the peeling force F2 when peeling the above-mentioned second support sheet 12 from the resin composition layer 10 is preferably 0.05 N/100 mm or more, and particularly preferably 0.1 N/100 mm or more. In addition, the peeling force F2 is preferably 2.0 N/100 mm or less, and particularly preferably 1.5 N/100 mm or less.

Since the above-mentioned peeling forces F1 and F2 are each in the above range, the interface between the resin composition layer 10 and the first support sheet 11, or the interface between the resin composition layer 10 and the second support sheet 12 The occurrence of lifting can be effectively suppressed.

In addition, the peeling force mentioned above was measured as follows. That is, for a test piece made by cutting the resin sheet 1 to 100 mm in width and 100 mm in length, in an environment of 23°C and 50% relative humidity, based on JIS K6854-3:1999, the peeling rate was 300 mm/min. By T-shaped peeling, the first support sheet 11 or the second support sheet 12 is peeled off, and the peeling force F1 or F2 can be obtained as the peeling force (N/100 mm) measured at that time.

5. Manufacturing method of resin sheet

The resin sheet 1 according to the present embodiment is not particularly limited, and for example, a coating solution containing the above-described resin composition and, if desired, additionally a solvent or dispersion medium is prepared, and the above-described second support sheet is prepared. (12) On top, by known application methods such as spin coat method, spray coat method, bar coat method, knife coat method, roll coat method, roll knife coat method, blade coat method, die coat method, and gravure coat method. The coating liquid is applied to form a coating film, and the coating film is dried to form the resin composition layer 10.

Here, from the viewpoint of adjusting the concentration of the above-mentioned volatile components in the resin composition layer 10 to the above-mentioned range, the drying temperature of the coating film is preferably set to 50°C or higher, and is preferably set to 60°C or higher. It is particularly preferable, and it is more preferable to set it to 70°C or higher. Additionally, the drying temperature is preferably 150°C or lower, particularly preferably 140°C or lower, and more preferably 130°C or lower. In addition, the drying time of the coating film is preferably 30 seconds or more from the same viewpoint. Additionally, the drying time is preferably 30 minutes or less. In addition, the solid content concentration of the coating liquid is preferably, for example, 30% by mass or more, and particularly preferably 35% by mass or more. Additionally, the solid content concentration is preferably 60% by mass or less, and particularly preferably 50% by mass or less.

Next, the surface of the formed resin composition layer 10 opposite to the second support sheet 12 and one side of the first support sheet 11 (if treated with a release agent, the peeling-treated surface). By laminating, the resin sheet 1 can be manufactured.

Examples of the solvent include toluene, ethyl acetate, methyl ethyl ketone, isobutyl alcohol, methyl isobutyl ketone, n-butanol, butyl acetate, 2-methoxypropanol, isobutyl acetate, tetrachloroethylene, ethylene glycol monomethyl ether, and methyl. Organic solvents such as butyl ketone, isopentyl alcohol, ethylene glycol monoethyl ether, N,N-dimethylformamide (DMF), ethylene glycol monoethyl ether acetate, turpentine oil, cyclohexanone, and ethylene glycol monobutyl ether. You can. Among these, it is preferable to use high boiling point solvents such as cyclohexanone and ethylene glycol monobutyl ether from the viewpoint of easy adjustment of the concentration of volatile components to the above-mentioned range, and especially from the viewpoint of versatility, solubility, etc. It is preferred to use hexanone.

[Semiconductor device]

The semiconductor device according to the present embodiment includes a cured layer formed by curing the resin composition layer 10 in the resin sheet 1 according to the present embodiment. The conditions for curing the resin composition layer 10 can be performed under conventionally known conditions. Typically, the heating temperature is preferably 100°C or more and 240°C or less, and the heating time is preferably 15 minutes or more and 300 minutes or less. In addition, curing of the resin composition layer 10 may be carried out stepwise by heat treatment multiple times. Here, the semiconductor device according to this embodiment may be provided with a hardened layer as a layer for sealing the electronic component, or may be provided with a hardened layer as an insulating film. The semiconductor device according to this embodiment is a semiconductor device manufactured by panel-level packaging, and specific examples thereof include a semiconductor package manufactured by panel-level fan-out packaging technology (FOPLP).

As described above, the resin sheet 1 according to the present embodiment has difficulty in causing lifting at the interface between the resin composition layer 10 and the first support sheet 11, and the resin composition layer has high vulnerability. It is said to have been improved. As a result, the resin sheet 1 becomes less likely to cause fragments or cracks in the resin composition layer during processing or transportation, and excellent handling properties are achieved. Therefore, the semiconductor device according to the present embodiment manufactured using the resin sheet 1 according to the present embodiment has good quality because it is manufactured using the resin sheet 1.

In addition, the resin sheet 1 according to the present embodiment is used as a sheet for encapsulating electronic components (resin sheet for encapsulation) or as a sheet for forming an insulating film in a method of manufacturing a semiconductor device by panel level packaging. It can be suitably used as a resin sheet for an interlayer insulating layer. In addition, the resin sheet 1 according to the present embodiment can be suitably used when refrigerated while protected by a support sheet, and more specifically, when refrigerated at 5°C or lower. there is. In addition, the resin sheet 1 according to the present embodiment can be suitably used in a semiconductor device manufacturing method in which a rewiring layer is formed on a cured layer formed by curing the resin composition layer 10.

In addition, the resin sheet 1 according to the present embodiment can be used even when the size of the resin sheet 1 is relatively large, such as when manufacturing a semiconductor package or the like by fan-out package technology (FOPLP). The occurrence of lifting at the interface between the composition layer 10 and the support sheet can be effectively suppressed.

Also from the above viewpoint, the semiconductor device according to the present embodiment manufactured using the resin sheet 1 according to the present embodiment has good quality due to being manufactured using the resin sheet 1. It becomes.

The embodiments described above are described to facilitate understanding of the present invention, and are not intended to limit the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents that fall within the technical scope of the present invention.

(Example)

Hereinafter, the present invention will be described in more detail by showing examples, test examples, etc., but the present invention is not limited in any way to the following test examples.

[Example 1]

5.1 parts by mass of bisphenol A-type phenoxy resin (manufactured by Mitsubishi Chemical Corporation, product name “jER1256”) as a thermoplastic resin (converted to solid content, the same applies hereinafter), and bisphenol A-type epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name “jER828”) as a thermosetting resin. ) 5.7 parts by mass, a biphenyl-type epoxy resin as a thermosetting resin (manufactured by Nippon Kayakusha, product name “NC-3000-L”), 5.7 parts by mass of a naphthalene-type epoxy resin as a thermosetting resin (manufactured by DIC Corporation, product name “HP-4700”) ") 4.1 parts by mass, 14.1 parts by mass of biphenyl type phenol (manufactured by Maywa Chemical Co., Ltd., product name "MEHC-7851-SS") as a thermosetting resin, and 2-ethyl-4-methylimida as an imidazole-based curing catalyst. 0.1 part by mass of sol (manufactured by Shikoku Chemicals, product name "2E4MZ", melting point about 40°C), and epoxysilane-treated silica filler as inorganic fine particles [silica filler (manufactured by Admatex Corporation, product name "SO-C2"), average particle size: 0.5 ㎛, maximum particle diameter: 2㎛, shape: spherical) on the surface using 3-glycidoxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical, product name “KBM-403”, minimum coverage area: 330㎡/g). [Processed product] 65 parts by mass were mixed in a 1:1 mixed solvent of cyclohexanone and methyl ethyl ketone to obtain a coating liquid of a resin composition with a solid content concentration of 40 mass%.

The coating solution obtained as described above was applied to a release film (manufactured by Lintec, product name "PET38AL-5") obtained by peeling one side of a polyethylene terephthalate film (Tg: 67°C) as the first support sheet with an alkyd-based release agent. , thickness: 38 μm) was applied to the peeling treated surface, and the obtained coating film was dried at 100° C. for 90 seconds to obtain a laminate of a resin composition layer with a thickness of 50 μm and the first support sheet.

Next, as the second support sheet, one side of the polyethylene terephthalate film was peeled off with an alkyd-based release agent, and the peeled surface of the release film (manufactured by Lintecha, product name “PET38X”, thickness: 38 μm) was treated with the above-mentioned peeling surface. By bonding the surfaces on the resin composition layer side of the laminate obtained as described above, a resin sheet in which the first support sheet, the resin composition layer, and the second support sheet are laminated in that order was obtained.

In addition, in the obtained resin sheet, the peeling force F1 when peeling the first support sheet from the resin composition layer and the peeling force F2 when peeling the second support sheet from the resin composition layer are expressed by the following formula (1)

F1/F2>1 : (1)

It was to satisfy the relationship.

[Examples 2 to 4]

A resin sheet was obtained in the same manner as in Example 1, except that the drying conditions for the coating film described above were changed as shown in Table 1.

[Comparative Example 1]

As a first support sheet, a release film (manufactured by Lintecha, product name “SP-PET382150”, thickness: 38 μm) obtained by peeling one side of a polyethylene terephthalate film with a silicone-based release agent was used, and as a second support sheet, A release film (manufactured by Lintec, product name "SP-PET381031", thickness: 38 ㎛) was used, in which one side of the polyethylene terephthalate film was treated with a silicone-based release agent, and the drying conditions for the above-mentioned coating film were as shown in Table 1. Except for the changes, a resin sheet was obtained in the same manner as in Example 1.

[Comparative Examples 2 and 3]

A resin sheet was obtained in the same manner as in Example 1, except that the drying conditions for the coating film described above were changed as shown in Table 1.

[Test Example 1] (Measurement of concentration of volatile components)

The resin sheets manufactured in the examples and comparative examples were cut into a size of 10 mm x 50 mm, and then the first support sheet and the second support sheet were peeled, and the resulting resin composition layer was used as a measurement sample. The measurement sample was sealed in a measurement vial, heated at 120°C for 30 minutes, and the generated gas was introduced into a gas chromatograph mass spectrometer (Shimadzu Seisakujo Co., Ltd., product name “GCMS-QP2010”), and the amount of generated gas was measured. was measured. This amount was taken as the concentration (ppm) of the volatile component. The results are shown in Table 1.

[Test Example 2] (Evaluation of tackiness)

The second support sheet was peeled from the resin sheet prepared in the examples and comparative examples, the exposed surface of the resin composition layer was touched with a finger, and the tackiness on the surface of the resin composition layer was evaluated based on the following criteria. The results are shown in Table 1.

Tag: The surface of the resin composition layer had a feeling of sticking to the finger.

No tag: The surface of the resin composition layer did not feel sticky to the finger.

[Test Example 3] (Evaluation of lifting during storage)

The resin sheets manufactured in Examples and Comparative Examples were stored in an environment at 5°C for one week, and then the occurrence of lifting at the interface between the resin composition layer and the support sheet was evaluated. The results are shown in Table 1.

A: No lifting occurred on both the interface between the resin composition layer and the first support sheet and the interface between the resin composition layer and the second support sheet.

B: Slight lifting occurred at either the interface between the resin composition layer and the first support sheet and the interface between the resin composition layer and the second support sheet, but the level was no problem in practical terms.

C: Lifting, which is a practical problem, occurred at both the interface between the resin composition layer and the first support sheet and the interface between the resin composition layer and the second support sheet.

[Test Example 4] (Evaluation of handling properties)

The second support sheet is peeled from the resin sheet prepared in the examples and comparative examples, and the exposed surface of the resin composition layer is laminated on a dummy substrate (500 mm × 400 mm), and then the first support sheet is formed from the resin composition layer. The sheet was peeled off. Next, after heating the resin composition layer at 100°C for 60 minutes, the resin composition layer was cured by further heating at 170°C for 60 minutes to form a cured layer. The handling properties of the resin sheet in this series of flows were evaluated based on the following standards. The results are shown in Table 1.

A: No fragments or cracks occurred in the resin composition layer.

B: Some fragments and cracks occurred in the resin composition layer.

C: No fragments or cracks occurred in the resin composition layer, but the surface of the resin composition layer became excessively sticky and swelling occurred in the cured layer.

D: At least one of the fragments and cracks at a level that poses a practical problem has occurred in the resin composition layer.

[Table 1]

As shown in Table 1, in the resin sheet according to the example, the occurrence of lifting during storage is suppressed, excellent storage suitability is achieved, and the occurrence of fragments and cracks in the resin composition layer is suppressed, Handling was excellent.

The resin sheet according to the present invention can be suitably used as a sheet for encapsulating electronic components or a sheet for forming an insulating film in a method of manufacturing a semiconductor device by panel level packaging.

1: Resin sheet
10: Resin composition layer
11: first support sheet
12: second support sheet

Claims (6)

In a method of manufacturing a semiconductor device by panel level packaging, a resin sheet used to encapsulate electronic components or form an insulating film, comprising:
The resin sheet includes a first support sheet, a resin composition layer laminated on one side of the first support sheet, and a second layer of the resin composition layer laminated on a side opposite to the first support sheet. Provided with a support sheet,
The resin composition layer is formed from a resin composition containing a thermosetting resin, a thermoplastic resin, and inorganic fine particles,
The content of the inorganic fine particles in the resin composition is 50% by mass or more,
The content of the thermoplastic resin in the resin composition is 30% by mass or less,
The contact surface of the first support sheet with the resin composition layer is not subjected to a peeling treatment with a silicone-based release agent,
The concentration of volatile components generated when the resin composition layer is heated at 120°C for 30 minutes, measured by gas chromatography mass spectrometry, is 100 ppm or more and 45,000 ppm or less,
When the peeling force when peeling the first support sheet from the resin composition layer is F1 and the peeling force when peeling the second support sheet from the resin composition layer is F2, the F1 and the F2 A, the following equation (1)
F1/F2>1 … … (One)
to meet
A resin sheet characterized in that. According to paragraph 1,
A resin sheet characterized in that the thermoplastic resin does not contain an acrylic resin. According to paragraph 1,
A resin sheet, characterized in that the surface of the first support sheet on the resin composition layer side is subjected to a peeling treatment with an alkyd-based release agent. According to paragraph 1,
A resin sheet characterized in that the first support sheet is provided with a support base material made of a resin having a glass transition temperature (Tg) of 50°C or higher. According to paragraph 1,
A resin sheet, wherein the surface of the second support sheet on the resin composition layer side is subjected to a release treatment with a release agent. A semiconductor device comprising a cured layer formed by curing the resin composition layer in the resin sheet according to any one of claims 1 to 5.

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