JP6668843B2 - 半導体装置および製造方法 - Google Patents
半導体装置および製造方法 Download PDFInfo
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- JP6668843B2 JP6668843B2 JP2016049900A JP2016049900A JP6668843B2 JP 6668843 B2 JP6668843 B2 JP 6668843B2 JP 2016049900 A JP2016049900 A JP 2016049900A JP 2016049900 A JP2016049900 A JP 2016049900A JP 6668843 B2 JP6668843 B2 JP 6668843B2
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- 239000004065 semiconductor Substances 0.000 title claims description 79
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000001257 hydrogen Substances 0.000 claims description 67
- 229910052739 hydrogen Inorganic materials 0.000 claims description 67
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 66
- 229910052751 metal Inorganic materials 0.000 claims description 59
- 239000002184 metal Substances 0.000 claims description 59
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 53
- 229910052710 silicon Inorganic materials 0.000 claims description 53
- 239000010703 silicon Substances 0.000 claims description 53
- 239000000758 substrate Substances 0.000 claims description 27
- 229910045601 alloy Inorganic materials 0.000 claims description 20
- 239000000956 alloy Substances 0.000 claims description 20
- 239000010936 titanium Substances 0.000 claims description 19
- 229910052719 titanium Inorganic materials 0.000 claims description 15
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 238000009826 distribution Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000003860 storage Methods 0.000 description 60
- 230000015572 biosynthetic process Effects 0.000 description 11
- 230000004888 barrier function Effects 0.000 description 9
- 238000005275 alloying Methods 0.000 description 7
- 150000004767 nitrides Chemical class 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 229910021332 silicide Inorganic materials 0.000 description 4
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 4
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 239000012300 argon atmosphere Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- -1 hydrogen ions Chemical class 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 229910021334 nickel silicide Inorganic materials 0.000 description 1
- RUFLMLWJRZAWLJ-UHFFFAOYSA-N nickel silicide Chemical compound [Ni]=[Si]=[Ni] RUFLMLWJRZAWLJ-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
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- H01L21/02104—Forming layers
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- H01L21/02518—Deposited layers
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Description
特許文献1 特開2015−109474号公報
Claims (11)
- 半導体基板と、
前記半導体基板の上方に形成され、水素吸蔵性を有する第1金属を含有する第1層と、
前記第1金属の層の上方に形成され、前記第1金属とは異なる第2金属を含有する第2層と、
前記第1層および前記第2層の間に形成され、シリコンを含有するSi含有層と、
前記Si含有層および前記第2層の間に形成された前記第1金属および前記第2金属の合金層と
を備える半導体装置。 - 前記第2層はシリコンを更に含有し、
前記Si含有層は、シリコン濃度が前記第2層よりも高い
請求項1に記載の半導体装置。 - 前記第2金属はアルミニウムである
請求項1または2に記載の半導体装置。 - 前記第1金属はチタンである
請求項1から3のいずれか一項に記載の半導体装置。 - 前記Si含有層の深さ方向におけるシリコンの濃度分布はピークを有し、前記ピークよりも前記第1層側に比べて、前記ピークよりも前記第2層側におけるシリコン濃度が緩やかに減少する
請求項1から4のいずれか一項に記載の半導体装置。 - 前記ピークの位置において前記シリコンの質量比が10%以上である
請求項5に記載の半導体装置。 - 前記Si含有層の厚みが、10nm以上、150nm以下である
請求項1から6のいずれか一項に記載の半導体装置。 - 前記第1層の厚みが10nm以上、1.0μm以下である
請求項1から7のいずれか一項に記載の半導体装置。 - 前記半導体基板の上方に形成されたゲート電極と、
前記ゲート電極を覆う絶縁膜と
を更に備え、
前記第1層は、前記ゲート電極と直接接触しないように前記絶縁膜の上方に形成される
請求項1から8のいずれか一項に記載の半導体装置。 - 半導体装置の製造方法であって、
半導体基板の上方に、水素吸蔵性を有する第1金属を含有する第1層を形成する第1層形成段階と、
前記第1金属の層の上方に、前記第1金属とは異なる第2金属を含有する第2層を形成する第2層形成段階と、
前記第1層および前記第2層の間に、シリコンを含有するSi含有層を形成するSi含有層形成段階と
を備え、
前記Si含有層形成段階では、前記Si含有層および前記第2層の間に、前記第1金属および前記第2金属の合金層を形成する
製造方法。 - 前記第2層形成段階では、シリコンを含む前記第2層を形成し、
前記Si含有層形成段階では、前記第2層に含まれるシリコンを偏析させて、前記Si含有層を形成する
請求項10に記載の製造方法。
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US15/421,366 US10090407B2 (en) | 2016-03-14 | 2017-01-31 | Semiconductor device and manufacturing method |
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WO2016114055A1 (ja) * | 2015-01-16 | 2016-07-21 | 富士電機株式会社 | 炭化珪素半導体装置および炭化珪素半導体装置の製造方法 |
RU2017133486A (ru) * | 2015-02-27 | 2019-03-27 | К-Фее Зюстем Гмбх | Порционная капсула с прикрепленным посредством термосварки фильтрующим элементом |
JP6862381B2 (ja) * | 2018-03-02 | 2021-04-21 | 株式会社東芝 | 半導体装置 |
US10998418B2 (en) * | 2019-05-16 | 2021-05-04 | Cree, Inc. | Power semiconductor devices having reflowed inter-metal dielectric layers |
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US6046490A (en) * | 1998-08-10 | 2000-04-04 | Matsushita Electronics Corporation | Semiconductor device having a capacitor dielectric element and wiring layers |
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