JP6660279B2 - フレキシブルデバイスの製造方法 - Google Patents

フレキシブルデバイスの製造方法 Download PDF

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Publication number
JP6660279B2
JP6660279B2 JP2016231491A JP2016231491A JP6660279B2 JP 6660279 B2 JP6660279 B2 JP 6660279B2 JP 2016231491 A JP2016231491 A JP 2016231491A JP 2016231491 A JP2016231491 A JP 2016231491A JP 6660279 B2 JP6660279 B2 JP 6660279B2
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support substrate
substrate
flexible
manufacturing
refractive index
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Japanese (ja)
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JP2018087921A (ja
JP2018087921A5 (https=
Inventor
隆成 藤森
隆成 藤森
加藤　祐一
祐一 加藤
木下　智豊
智豊 木下
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Joled Inc
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Joled Inc
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Priority to US15/603,406 priority patent/US10957722B2/en
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JP2016231491A 2016-05-26 2016-11-29 フレキシブルデバイスの製造方法 Active JP6660279B2 (ja)

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JP2016231491A JP6660279B2 (ja) 2016-11-29 2016-11-29 フレキシブルデバイスの製造方法
US15/603,406 US10957722B2 (en) 2016-05-26 2017-05-23 Method of manufacturing flexible device using multidirectional oblique irradiation of an interface between a support substrate and a flexible substrate

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Application Number Priority Date Filing Date Title
JP2016231491A JP6660279B2 (ja) 2016-11-29 2016-11-29 フレキシブルデバイスの製造方法

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JP2018087921A JP2018087921A (ja) 2018-06-07
JP2018087921A5 JP2018087921A5 (https=) 2019-02-28
JP6660279B2 true JP6660279B2 (ja) 2020-03-11

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020065856A1 (ja) * 2018-09-27 2020-04-02 シャープ株式会社 表示装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006349599A (ja) * 2005-06-20 2006-12-28 Pioneer Electronic Corp 透明基板検査装置及び検査方法
US7842583B2 (en) * 2007-12-27 2010-11-30 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor substrate and method for manufacturing semiconductor device
KR101774278B1 (ko) * 2011-07-18 2017-09-04 엘지디스플레이 주식회사 플렉서블 표시장치의 제조방법
CN107409455B (zh) * 2015-03-10 2019-04-12 夏普株式会社 薄膜元件装置的制造方法及其所使用的光照射装置

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