JP6644897B2 - 表面実装保護デバイス - Google Patents
表面実装保護デバイス Download PDFInfo
- Publication number
- JP6644897B2 JP6644897B2 JP2018538212A JP2018538212A JP6644897B2 JP 6644897 B2 JP6644897 B2 JP 6644897B2 JP 2018538212 A JP2018538212 A JP 2018538212A JP 2018538212 A JP2018538212 A JP 2018538212A JP 6644897 B2 JP6644897 B2 JP 6644897B2
- Authority
- JP
- Japan
- Prior art keywords
- base housing
- carrier tape
- terminals
- electronic component
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 claims description 41
- 230000008878 coupling Effects 0.000 claims description 16
- 238000010168 coupling process Methods 0.000 claims description 16
- 238000005859 coupling reaction Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 9
- 238000013459 approach Methods 0.000 description 13
- 238000003466 welding Methods 0.000 description 9
- JHJMZCXLJXRCHK-UHFFFAOYSA-N 1,2,3,4,5-pentachloro-6-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C(Cl)=C(Cl)C=2Cl)Cl)=C1 JHJMZCXLJXRCHK-UHFFFAOYSA-N 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/20—Bases for supporting the fuse; Separate parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/20—Bases for supporting the fuse; Separate parts thereof
- H01H85/203—Bases for supporting the fuse; Separate parts thereof for fuses with blade type terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10181—Fuse
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Description
Claims (18)
- デバイスを形成する方法であって、
ベース・ハウジングを供すること;
電子コンポーネントをベース・ハウジングに結合すること;
電子コンポーネントの上にカバーを形成すること;および
ベース・ハウジングに形成された凹部内に電子コンポーネントを挿入すること
を含み、
電子コンポーネントはベース・ハウジングの外面に沿って延在する一組の端子を含み、
カバーはベース・ハウジングに結合している、方法。 - デバイスを基材に結合することをさらに含む、請求項1に記載の方法。
- 電子コンポーネントの一組の端子をプリント回路基板に結合することをさらに含む、請求項1に記載の方法。
- 一組のコネクタを有するキャリア・テープを使用して、カバーをベース・ハウジングに結合することをさらに含む、請求項1に記載の方法。
- 一組のコネクタを非結合とした後に、キャリア・テープからデバイスを除くことをさらに含む、請求項4に記載の方法。
- ベース・ハウジングの底面に沿って一組の端子を形成することをさらに含む、請求項1に記載の方法。
- ベース・ハウジングの一対の対向する端壁に形成された対応する端子チャネルを通るように一組の端子を延在させることをさらに含む、請求項6に記載の方法。
- 表面実装デバイスを形成する方法であって、
ベース・ハウジングを供すること;
電子コンポーネントをベース・ハウジングに結合すること;
可融素子の上にカバーを形成すること;
電子コンポーネントをプリント回路基板に結合すること;および
ベース・ハウジングに形成された凹部内に電子コンポーネントを挿入すること
を含み、
電子コンポーネントは一組の端子の間に延在する可融素子を含み、
カバーがベース・ハウジングに結合しており、一組の端子がベース・ハウジングの外面に沿って延在する、
方法。 - 一組のコネクタを有するキャリア・テープを使用してカバーをベース・ハウジングに結合することをさらに含み、デバイスは一組のコネクタを非結合とすることによってキャリア・テープから取り外される、請求項8に記載の方法。
- キャリア・テープから複数のカバーを形成することをさらに含む、請求項9に記載の方法。
- ベース・ハウジングの底面に沿って一組の端子を形成することをさらに含む、請求項8に記載の方法。
- ベース・ハウジングの一対の対向する端壁に形成された対応する端子チャネルを通るように一組の端子を延在させることをさらに含む、請求項11に記載の方法。
- ベース・ハウジングの一対の対向する端壁の外面の周りに一組の端子をラップすることをさらに含む、請求項12に記載の方法。
- ベース・ハウジング;
ベース・ハウジングに結合している電子コンポーネント;および
可融性要素の上に配置されたカバー;
を含み、
電子コンポーネントは一対の端子の間に延在する可融素子を含み、一対の端子が基材に結合可能であり、電子コンポーネントはベース・ハウジングに形成された凹部内に配置されており、
カバーはベース・ハウジングに結合しており、一対の端子がベース・ハウジングの外面に沿って延在する、
表面実装デバイス。 - 基材がプリント回路基板である、請求項14に記載の表面実装デバイス。
- 一対の端子は、プリント回路基板に結合されている、請求項15に記載の表面実装デバイス。
- 一対の端子をプリント回路基板に電気的に接続する接続材料をさらに備える、請求項16に記載の表面実装デバイス。
- 一対の端子がベース・ハウジングの一対の対向する端壁の外面をラップする、請求項14に記載の表面実装デバイス。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662281269P | 2016-01-21 | 2016-01-21 | |
US62/281,269 | 2016-01-21 | ||
US15/410,440 US10283304B2 (en) | 2016-01-21 | 2017-01-19 | Surface mounted protection device |
US15/410,440 | 2017-01-19 | ||
PCT/US2017/014216 WO2017127597A1 (en) | 2016-01-21 | 2017-01-20 | Surface mounted protection device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019504504A JP2019504504A (ja) | 2019-02-14 |
JP6644897B2 true JP6644897B2 (ja) | 2020-02-12 |
Family
ID=59360662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018538212A Active JP6644897B2 (ja) | 2016-01-21 | 2017-01-20 | 表面実装保護デバイス |
Country Status (6)
Country | Link |
---|---|
US (2) | US10283304B2 (ja) |
EP (1) | EP3406013B1 (ja) |
JP (1) | JP6644897B2 (ja) |
KR (1) | KR102156062B1 (ja) |
CN (1) | CN109075567B (ja) |
WO (1) | WO2017127597A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10483070B1 (en) * | 2019-01-31 | 2019-11-19 | Littelfuse, Inc. | Fuses and methods of forming fuses |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5974650U (ja) * | 1982-11-11 | 1984-05-21 | 三王株式会社 | 温度ヒユ−ズ |
JPS6022538Y2 (ja) * | 1982-12-03 | 1985-07-04 | 三王株式会社 | チツプ型ヒユ−ズ |
US4618739A (en) | 1985-05-20 | 1986-10-21 | General Electric Company | Plastic chip carrier package |
US5727313A (en) * | 1992-05-11 | 1998-03-17 | Emerson Electric Co. | Method of manufacturing lid covers for containers and product |
JPH07101461A (ja) * | 1993-09-30 | 1995-04-18 | Yayoi Kk | エンボスキャリアテープ |
JP3877340B2 (ja) * | 1994-08-29 | 2007-02-07 | ローム株式会社 | 安全ヒューズ付パッケージ型固体電解コンデンサ |
JP3226001B2 (ja) * | 1995-04-18 | 2001-11-05 | 矢崎総業株式会社 | 連鎖状ヒューズリンクおよびその形成方法 |
JP2717076B2 (ja) * | 1995-08-30 | 1998-02-18 | エス・オー・シー株式会社 | 表面実装超小型電流ヒューズ |
JP3558651B2 (ja) * | 1996-10-17 | 2004-08-25 | 松下電器産業株式会社 | 部品収納体及びその部品収納体を用いた部品検査方法及び装置 |
DE19644026A1 (de) * | 1996-10-31 | 1998-05-07 | Wickmann Werke Gmbh | Elektrisches Sicherungselement und Verfahren zu dessen Herstellung |
US6078245A (en) * | 1998-12-17 | 2000-06-20 | Littelfuse, Inc. | Containment of tin diffusion bar |
US6657839B2 (en) * | 2000-08-25 | 2003-12-02 | Tyco Electronics Corporation | Protective relay |
TW518626B (en) * | 2001-08-02 | 2003-01-21 | Conquer Electronics Co Ltd | Manufacturing method of micro-fuse for industry and product of the same |
JP3741683B2 (ja) * | 2002-12-13 | 2006-02-01 | 三井金属鉱業株式会社 | 電子部品実装用フィルムキャリアテープの製造方法およびこの方法に使用できる鍍金装置 |
JP2006199300A (ja) * | 2005-01-18 | 2006-08-03 | Matsushita Electric Ind Co Ltd | 電子部品包装帯及びその製造方法 |
DE102005024321B8 (de) * | 2005-05-27 | 2012-10-04 | Infineon Technologies Ag | Absicherungsschaltung |
KR100652519B1 (ko) | 2005-07-18 | 2006-12-01 | 삼성전자주식회사 | 듀얼 금속층을 갖는 테이프 배선기판 및 그를 이용한 칩 온필름 패키지 |
TWI323906B (en) * | 2007-02-14 | 2010-04-21 | Besdon Technology Corp | Chip-type fuse and method of manufacturing the same |
KR100817091B1 (ko) * | 2007-03-02 | 2008-03-26 | 삼성전자주식회사 | 적층형 반도체 패키지 및 그 제조방법 |
KR20090049641A (ko) * | 2007-11-14 | 2009-05-19 | 삼성전자주식회사 | 커버 테이프 및 그를 구비하는 전자부품 포장용기 |
US8937524B2 (en) * | 2009-03-25 | 2015-01-20 | Littelfuse, Inc. | Solderless surface mount fuse |
US8430245B2 (en) * | 2010-03-24 | 2013-04-30 | Bi-Link, Inc. | Insert for tape and reel packaging |
US8629749B2 (en) * | 2010-11-30 | 2014-01-14 | Hung-Chih Chiu | Fuse assembly |
JP5386567B2 (ja) | 2011-11-15 | 2014-01-15 | 株式会社フジクラ | 撮像素子チップの実装方法、内視鏡の組立方法、撮像モジュール及び内視鏡 |
-
2017
- 2017-01-19 US US15/410,440 patent/US10283304B2/en active Active
- 2017-01-20 WO PCT/US2017/014216 patent/WO2017127597A1/en active Application Filing
- 2017-01-20 EP EP17741962.9A patent/EP3406013B1/en active Active
- 2017-01-20 JP JP2018538212A patent/JP6644897B2/ja active Active
- 2017-01-20 KR KR1020187022977A patent/KR102156062B1/ko active IP Right Grant
- 2017-01-20 CN CN201780018792.7A patent/CN109075567B/zh active Active
-
2019
- 2019-03-26 US US16/364,838 patent/US10790108B2/en active Active
Also Published As
Publication number | Publication date |
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JP2019504504A (ja) | 2019-02-14 |
CN109075567B (zh) | 2020-04-21 |
KR20180101499A (ko) | 2018-09-12 |
US20190221396A1 (en) | 2019-07-18 |
US10790108B2 (en) | 2020-09-29 |
WO2017127597A1 (en) | 2017-07-27 |
US20170213682A1 (en) | 2017-07-27 |
KR102156062B1 (ko) | 2020-09-15 |
US10283304B2 (en) | 2019-05-07 |
CN109075567A (zh) | 2018-12-21 |
EP3406013A4 (en) | 2019-09-04 |
EP3406013B1 (en) | 2023-07-05 |
EP3406013A1 (en) | 2018-11-28 |
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