JP6642092B2 - 検査装置及び検査方法 - Google Patents
検査装置及び検査方法 Download PDFInfo
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- 238000007689 inspection Methods 0.000 title claims description 61
- 238000000034 method Methods 0.000 title claims description 15
- 238000001514 detection method Methods 0.000 claims description 62
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- 239000002245 particle Substances 0.000 claims description 23
- 230000001678 irradiating effect Effects 0.000 claims description 9
- 230000035945 sensitivity Effects 0.000 claims description 9
- 238000009826 distribution Methods 0.000 claims description 6
- 238000003384 imaging method Methods 0.000 claims description 4
- 238000010894 electron beam technology Methods 0.000 description 23
- 238000010586 diagram Methods 0.000 description 12
- 238000003860 storage Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 6
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/261—Details
- H01J37/265—Controlling the tube; circuit arrangements adapted to a particular application not otherwise provided, e.g. bright-field-dark-field illumination
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/22—Optical or photographic arrangements associated with the tube
- H01J37/222—Image processing arrangements associated with the tube
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/244—Detectors; Associated components or circuits therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J61/00—Gas-discharge or vapour-discharge lamps
- H01J61/02—Details
- H01J61/24—Means for obtaining or maintaining the desired pressure within the vessel
- H01J61/28—Means for producing, introducing, or replenishing gas or vapour during operation of the lamp
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/04—Means for controlling the discharge
- H01J2237/043—Beam blanking
- H01J2237/0435—Multi-aperture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
- H01J2237/20278—Motorised movement
- H01J2237/20285—Motorised movement computer-controlled
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
- H01J2237/20292—Means for position and/or orientation registration
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/22—Treatment of data
- H01J2237/221—Image processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/24475—Scattered electron detectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/2448—Secondary particle detectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/2449—Detector devices with moving charges in electric or magnetic fields
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24592—Inspection and quality control of devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2813—Scanning microscopes characterised by the application
- H01J2237/2817—Pattern inspection
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- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
Description
101 電子源
102 照明レンズ
103 アパーチャマスク
104 レンズ
105 ウィーンフィルタ
106 対物レンズ
107 偏向器
108 加速電極
109 ステージ
110 基板
111 ステージ位置測定部
120 レンズ
121 偏向器
130 検出器
200 演算制御部
201 制御計算機
202 検出信号処理部
203 偏向制御回路
204 電位印加回路
211 参照画像生成部
212 比較部
220 記憶装置
Claims (4)
- 複数のエネルギービームを含むマルチビームを検査対象基板に照射する照射部と、
前記検査対象基板から放出される荷電粒子による複数の荷電粒子ビームが結像し、各荷電粒子ビームを電気信号として検出する検出器と、
検出された電気信号に基づいて再構成された前記検査対象基板に形成されたパターンの画像データと、参照画像データとを比較し、パターン検査を行う比較部と、
を備え、
前記検出器は、各荷電粒子ビームに対応した複数の検出素子を有し、前記検出素子のサイズは、前記検出器に結像する荷電粒子ビームの像のビームぼけを含めたサイズよりも大きく、
前記照射部は、前記複数のエネルギービームの一部のみを前記検査対象基板に照射し、前記検査対象基板に照射するエネルギービームを順次切り替えることを特徴とする検査装置。 - 前記検査対象基板は、連続移動するステージ上に載置されており、
前記照射部は、前記マルチビームの照射位置が前記ステージの移動に合わせて移動するように前記マルチビームを偏向し、
前記検出素子のサイズは、前記検出器に結像する荷電粒子ビームの像のビームぼけを含めたサイズに、前記マルチビームの照射位置の移動に伴う前記検出器上での荷電粒子ビームの結像位置の移動量を加算したサイズよりも大きいことを特徴とする請求項1に記載の検査装置。 - 前記複数のエネルギービームの強度の分布、又は前記複数の検出素子の感度の分布に基づいて、前記画像データを補正することを特徴とする請求項1又は2に記載の検査装置。
- 複数のエネルギービームを含むマルチビームを検査対象基板に照射する工程と、
前記検査対象基板から放出される荷電粒子による複数の荷電粒子ビームが結像する検出器を用いて、各荷電粒子ビームの電流量を検出する工程と、
検出された電流量に基づいて再構成された前記検査対象基板に形成されたパターンの画像データと、参照画像データとを比較し、パターン検査を行う工程と、
を備え、
前記検出器に設けられた、前記検出器に結像する荷電粒子ビームの像のビームぼけを含めたサイズよりもサイズの大きい複数の検出素子を用いて、前記電流量を検出し、
前記複数のエネルギービームの一部のみを前記検査対象基板に照射し、前記検査対象基板に照射するエネルギービームを順次切り替えることを特徴とする検査方法。
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JP2016031170A JP6642092B2 (ja) | 2016-02-22 | 2016-02-22 | 検査装置及び検査方法 |
US15/358,324 US9859096B2 (en) | 2016-02-22 | 2016-11-22 | Inspection apparatus and inspection method |
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JP6642092B2 true JP6642092B2 (ja) | 2020-02-05 |
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Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6966255B2 (ja) | 2017-08-10 | 2021-11-10 | 株式会社ニューフレアテクノロジー | 画像取得装置の光学系調整方法 |
SG11202004928PA (en) | 2017-12-31 | 2020-06-29 | Evertron Holdings Pte Ltd | Moisture control apparatus, moisture control method, program, storage medium, produced object, product, apparatus, and facility |
JP7074479B2 (ja) * | 2018-01-11 | 2022-05-24 | 株式会社ニューフレアテクノロジー | マルチビーム検査装置 |
JP2021526716A (ja) * | 2018-06-12 | 2021-10-07 | エーエスエムエル ネザーランズ ビー.ブイ. | マルチビーム検査装置を使用してサンプルをスキャンするためのシステム及び方法 |
CN109037093A (zh) * | 2018-07-26 | 2018-12-18 | 德淮半导体有限公司 | 扫描电子显微镜的污染检测方法 |
JP7241570B2 (ja) * | 2019-03-06 | 2023-03-17 | 株式会社ニューフレアテクノロジー | マルチ電子ビーム検査装置及びマルチ電子ビーム検査方法 |
JP7222821B2 (ja) * | 2019-06-14 | 2023-02-15 | 株式会社ニューフレアテクノロジー | マルチビーム検査装置 |
DE112019007521T5 (de) | 2019-09-20 | 2022-03-24 | Hitachi High-Tech Corporation | Mit einem strahl geladener teilchen arbeitende vorrichtung |
JP7388237B2 (ja) | 2020-02-20 | 2023-11-29 | 株式会社ニューフレアテクノロジー | マルチ荷電粒子ビーム描画方法及びマルチ荷電粒子ビーム描画装置 |
JP2022109735A (ja) | 2021-01-15 | 2022-07-28 | キオクシア株式会社 | 検査装置および検査方法 |
WO2023237225A1 (en) * | 2022-06-10 | 2023-12-14 | Carl Zeiss Multisem Gmbh | Multi-beam charged particle imaging system with improved imaging of secondary electron beamlets on a detector |
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JPH1073424A (ja) * | 1996-08-29 | 1998-03-17 | Nikon Corp | 欠陥検査装置 |
JP3490597B2 (ja) * | 1997-01-07 | 2004-01-26 | 株式会社東芝 | マスク検査装置 |
JPH1116967A (ja) | 1997-06-26 | 1999-01-22 | Hitachi Ltd | 試料検査装置 |
JPH1183753A (ja) | 1997-07-09 | 1999-03-26 | Toshiba Corp | 光学式基板検査装置 |
JP3455069B2 (ja) | 1997-07-23 | 2003-10-06 | 株式会社東芝 | パターン検査装置 |
JP2006153871A (ja) * | 2000-11-17 | 2006-06-15 | Ebara Corp | 基板検査方法、基板検査装置及び電子線装置 |
JP2003167061A (ja) | 2001-11-30 | 2003-06-13 | Ebara Corp | マルチビーム検出器、電子線装置、及び該装置を用いた半導体デバイス製造方法 |
JP2005339960A (ja) * | 2004-05-26 | 2005-12-08 | Ebara Corp | 対物レンズ、電子線装置及び欠陥検査方法 |
JP2006112913A (ja) * | 2004-10-14 | 2006-04-27 | Toshiba Corp | 欠陥検査装置 |
JP5227512B2 (ja) * | 2006-12-27 | 2013-07-03 | 株式会社日立ハイテクノロジーズ | 電子線応用装置 |
JP5103033B2 (ja) * | 2007-03-02 | 2012-12-19 | 株式会社日立ハイテクノロジーズ | 荷電粒子線応用装置 |
JP5572428B2 (ja) * | 2010-03-15 | 2014-08-13 | 株式会社日立ハイテクノロジーズ | 検査装置および検査方法 |
US8362425B2 (en) * | 2011-03-23 | 2013-01-29 | Kla-Tencor Corporation | Multiple-beam system for high-speed electron-beam inspection |
JP6684586B2 (ja) * | 2015-12-22 | 2020-04-22 | 株式会社ニューフレアテクノロジー | マルチ荷電粒子ビーム装置 |
JP2017151159A (ja) * | 2016-02-22 | 2017-08-31 | 株式会社ニューフレアテクノロジー | 検査装置及び検査方法 |
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