JP6639890B2 - 配線基板積層体及びその製造方法 - Google Patents
配線基板積層体及びその製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 172
- 239000002184 metal Substances 0.000 claims description 172
- 239000010410 layer Substances 0.000 claims description 92
- 239000000463 material Substances 0.000 claims description 87
- 239000004065 semiconductor Substances 0.000 claims description 51
- 239000000758 substrate Substances 0.000 claims description 34
- 229920005989 resin Polymers 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 32
- 238000005530 etching Methods 0.000 claims description 23
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- 238000010438 heat treatment Methods 0.000 claims description 13
- 238000003825 pressing Methods 0.000 claims description 9
- 239000011229 interlayer Substances 0.000 claims description 5
- 239000012783 reinforcing fiber Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 description 14
- 239000003822 epoxy resin Substances 0.000 description 12
- 229920000647 polyepoxide Polymers 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 9
- 229910044991 metal oxide Inorganic materials 0.000 description 9
- 150000004706 metal oxides Chemical group 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 150000004767 nitrides Chemical class 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- -1 for example Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000002585 base Substances 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 229910052582 BN Inorganic materials 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
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- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
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- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
本発明の配線基板積層体は、金属板と、その金属板上に直接積層された熱伝導性の絶縁シートと、その絶縁シート上に直接形成された複数の柱状金属体と、前記柱状金属体に対応する部分に複数の開口を有する配線基板と、前記絶縁シートと前記配線基板との間に介在し、熱硬化性樹脂の硬化物を含む絶縁層と、を含むことを特徴とする。
(1)前述の実施形態では、半導体素子がパッケージである場合の配線基板積層体の例を示したが、以下のようにベアッチップ又はチップ部品などのチップ状の半導体素子である場合にも使用できる。
10 金属板
14 柱状金属体
16 絶縁層
16’ 絶縁層形成材
16a 第一開口
19 リジッド基板
19’ 半硬化の絶縁層
19a 開口
20 配線パターン
20’ 金属層
20a 開口
21 マスク材
21a 第三開口
30 半導体素子
31 電極(リード)
32 電極(放熱板)
35 ソルダ
A 凸部
WB 配線基板
WB’ 配線基板の形成材料
LB 配線基板積層体
Claims (7)
- 金属板と、
その金属板上に直接積層された熱伝導性の絶縁シートと、
その絶縁シート上に直接形成された複数の柱状金属体と、
前記柱状金属体に対応する部分に複数の開口を有する配線基板と、
前記絶縁シートと前記配線基板との間に介在し、熱硬化性樹脂の硬化物を含む絶縁層と、を含み、
前記配線基板と前記柱状金属体との間には前記熱硬化性樹脂の硬化物が充填されていると共に、前記熱硬化性樹脂の硬化物の上面が平坦化されている配線基板積層体。 - 前記配線基板が、2層以上の配線層を有する多層配線基板である請求項1に記載の配線基板積層体。
- 前記配線基板が、2層以上の配線層を電気的に接続する層間接続構造を有する多層配線基板である請求項2に記載の配線基板積層体。
- パワー半導体素子の搭載用基板である請求項1〜3いずれかに記載の配線基板積層体。
- 金属板と、その金属板上に直接積層された熱伝導性の絶縁シートと、その絶縁シート上に直接形成された金属層とを備える積層体を用いて、前記金属層をエッチングして絶縁シート上に複数の柱状金属体を形成する工程と、
その柱状金属体に対応する部分に複数の開口を有する配線基板又はその形成材料と、前記絶縁シートとを、熱硬化性樹脂を含む絶縁層形成材を用いて、加熱加圧により積層一体化して、前記配線基板又はその形成材料と前記柱状金属体との間に前記熱硬化性樹脂が充填された状態とする工程と、
前記熱硬化性樹脂の凸部を除去して平坦化しつつ、前記柱状金属体の上面を露出させる工程と、
を含む配線基板積層体の製造方法。 - 前記絶縁層形成材が、補強繊維を含むものである請求項5に記載の配線基板積層体の製造方法。
- 前記配線基板が、2層以上の配線層を有する多層配線基板である請求項5又は6に記載の配線基板積層体の製造方法。
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JP6639890B2 true JP6639890B2 (ja) | 2020-02-05 |
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JPS62128596A (ja) * | 1985-11-30 | 1987-06-10 | 古河電気工業株式会社 | リジッド型多層プリント回路基板の製造方法 |
EP1480269A1 (en) * | 2003-05-13 | 2004-11-24 | Agilent Technologies Inc | Printed Circuit Board with improved cooling of electrical component |
JP2008091814A (ja) * | 2006-10-05 | 2008-04-17 | Taiyo Kogyo Co Ltd | 回路基板及び回路基板の製造方法 |
JP4600455B2 (ja) * | 2006-11-30 | 2010-12-15 | 東芝ライテック株式会社 | 照明装置 |
JP2012074425A (ja) * | 2010-09-28 | 2012-04-12 | Daikin Ind Ltd | パワーモジュール |
FR2969899B1 (fr) * | 2010-12-23 | 2012-12-21 | Valeo Sys Controle Moteur Sas | Circuit imprime a substrat metallique isole |
JP2013098185A (ja) * | 2011-10-27 | 2013-05-20 | Ain:Kk | 放熱板付き配線板およびその製造方法 |
JP5885630B2 (ja) * | 2012-09-21 | 2016-03-15 | 三菱電機株式会社 | プリント基板 |
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