JP6639082B2 - リソグラフィ装置、リソグラフィ方法、および物品製造方法 - Google Patents

リソグラフィ装置、リソグラフィ方法、および物品製造方法 Download PDF

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Publication number
JP6639082B2
JP6639082B2 JP2014231051A JP2014231051A JP6639082B2 JP 6639082 B2 JP6639082 B2 JP 6639082B2 JP 2014231051 A JP2014231051 A JP 2014231051A JP 2014231051 A JP2014231051 A JP 2014231051A JP 6639082 B2 JP6639082 B2 JP 6639082B2
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Japan
Prior art keywords
stage
axis
substrate
measurement
mark
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JP2014231051A
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Japanese (ja)
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JP2016096228A5 (enExample
JP2016096228A (ja
Inventor
一史 水元
一史 水元
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Canon Inc
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Canon Inc
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Priority to JP2014231051A priority Critical patent/JP6639082B2/ja
Priority to US14/935,761 priority patent/US10036967B2/en
Publication of JP2016096228A publication Critical patent/JP2016096228A/ja
Publication of JP2016096228A5 publication Critical patent/JP2016096228A5/ja
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046Strategy, e.g. mark, sensor or wavelength selection
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70775Position control, e.g. interferometers or encoders for determining the stage position

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2014231051A 2014-11-13 2014-11-13 リソグラフィ装置、リソグラフィ方法、および物品製造方法 Active JP6639082B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014231051A JP6639082B2 (ja) 2014-11-13 2014-11-13 リソグラフィ装置、リソグラフィ方法、および物品製造方法
US14/935,761 US10036967B2 (en) 2014-11-13 2015-11-09 Lithography apparatus, lithography method, and article manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014231051A JP6639082B2 (ja) 2014-11-13 2014-11-13 リソグラフィ装置、リソグラフィ方法、および物品製造方法

Publications (3)

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JP2016096228A JP2016096228A (ja) 2016-05-26
JP2016096228A5 JP2016096228A5 (enExample) 2017-12-28
JP6639082B2 true JP6639082B2 (ja) 2020-02-05

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JP2014231051A Active JP6639082B2 (ja) 2014-11-13 2014-11-13 リソグラフィ装置、リソグラフィ方法、および物品製造方法

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US (1) US10036967B2 (enExample)
JP (1) JP6639082B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109950133B (zh) * 2019-03-14 2021-07-27 北京大学深圳研究生院 一种便于识别的碳化硅外延片圆片制备方法
JP2023083824A (ja) * 2021-12-06 2023-06-16 キヤノン株式会社 検出装置、基板処理装置、及び物品の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2694868B2 (ja) * 1987-08-31 1997-12-24 株式会社ニコン 位置検出方法及び装置
JP3450580B2 (ja) 1996-03-26 2003-09-29 キヤノン株式会社 露光装置および露光方法
JPH10209029A (ja) * 1997-01-21 1998-08-07 Nikon Corp アライメント系を備える露光装置
JP2000156336A (ja) * 1998-11-20 2000-06-06 Nikon Corp アライメント方法及び露光装置
JP4434372B2 (ja) * 1999-09-09 2010-03-17 キヤノン株式会社 投影露光装置およびデバイス製造方法
JP2003092248A (ja) * 2001-09-17 2003-03-28 Canon Inc 位置検出装置、位置決め装置及びそれらの方法並びに露光装置及びデバイスの製造方法
DE10315086B4 (de) * 2003-04-02 2006-08-24 Infineon Technologies Ag Verfahren und Vorrichtung zum Ausrichten von Halbleiterwafern bei der Halbleiterherstellung
JP4449457B2 (ja) 2004-01-05 2010-04-14 株式会社ニコン 露光装置及び露光方法
TWI622084B (zh) * 2006-09-01 2018-04-21 Nikon Corp Mobile body driving method, moving body driving system, pattern forming method and device, exposure method and device, component manufacturing method, and correction method
JP5264406B2 (ja) * 2008-10-22 2013-08-14 キヤノン株式会社 露光装置、露光方法およびデバイスの製造方法

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US20160139515A1 (en) 2016-05-19
JP2016096228A (ja) 2016-05-26
US10036967B2 (en) 2018-07-31

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