JP6631911B2 - Light emitting module, lighting fixture, and method of manufacturing light emitting module - Google Patents

Description

  The present invention relates to a light emitting module including a substrate and a plurality of light emitting elements disposed on the substrate, and a lighting device including the light emitting module.

  2. Description of the Related Art Conventionally, for example, a ceiling light, which is a lighting device arranged on a ceiling, is known. For example, the conventional ceiling light described in Patent Literature 1 includes an appliance main body, an appliance attachment portion for attaching the appliance main body to a building material, a light source substrate and a circuit board supported by the appliance main body. A plurality of light emitting diodes (LEDs: Light Emitting Diodes) are mounted on the light source substrate. A plurality of circuit components constituting a lighting circuit for lighting each of the plurality of LEDs are mounted on the circuit board.

  The circuit board is arranged in a ring shape on the instrument body so as to surround the periphery of the instrument mounting portion. The light source board is arranged in a ring shape on the instrument body so as to surround the periphery of the circuit board.

JP 2012-146666 A

  When assembling the above-mentioned conventional ceiling light, first, after performing a positioning operation for positioning the light source board and the circuit board with respect to the appliance body, a wiring operation for connecting the light source board and the circuit board with a lead wire is performed. There is a need. Therefore, for example, it is difficult to improve the assembly efficiency of the ceiling light.

  Therefore, it is conceivable that the light source substrate and the circuit board are realized by a single board. In this case, the light emitting element and the circuit component have different components (such as the presence or absence of a lead wire) and heat resistance. Due to the difference, they are mounted on one substrate by different methods. That is, in this case, since the mounting of the light emitting element and the mounting of the circuit components are performed in different steps, it may be difficult to perform the subsequent step due to, for example, the work content of the previous step.

  The present invention is directed to a light-emitting module including a circuit component and a light-emitting element in consideration of the above-described conventional problems, a light-emitting module that can be efficiently manufactured, a method for manufacturing the same, and a lighting fixture including the light-emitting module. The purpose is to provide.

  A light-emitting module according to one embodiment of the present invention is a light-emitting module that is attached to a fixture main body of a lighting fixture, and is disposed on one of two surfaces in a thickness direction of the resin substrate in a plate shape. The first wiring, and a substrate having a second wiring disposed on the other of the two surfaces, and the substrate is disposed on a main surface that is a surface on which the first wiring is disposed, The semiconductor device includes a plurality of light emitting elements soldered to the first wiring, and one or more circuit components soldered to the second wiring, wherein a thickness of the resin base is greater than 1 mm.

  Further, a lighting device according to one embodiment of the present invention includes the light emitting module and a device main body to which the light emitting module is attached.

  A method for manufacturing a light-emitting module according to one embodiment of the present invention is a method for manufacturing a light-emitting module including a substrate, a plurality of light-emitting elements and one or more circuit components arranged on the substrate, and the thickness is less than 1 mm. A reflow step of soldering the plurality of light emitting elements to the substrate having a large resin base material by a reflow method; and a flow of soldering the one or more circuit components to the substrate by the flow method after the reflow step. And a step.

  ADVANTAGE OF THE INVENTION According to this invention, it is a light emitting module provided with a circuit component and a light emitting element, Comprising: The light emitting module which can be manufactured efficiently, its manufacturing method, and the lighting fixture provided with the light emitting module can be provided.

FIG. 1 is an exploded perspective view of the lighting fixture according to the embodiment. FIG. 2 is a plan view illustrating a schematic configuration of the light emitting module according to the embodiment. FIG. 3 is a partial cross-sectional view illustrating a configuration outline of the lighting fixture according to the embodiment. FIG. 4 is a cross-sectional view illustrating a schematic configuration of the light emitting module according to the embodiment. FIG. 5 is a cross-sectional view illustrating a mode of connecting the light emitting element and the circuit component to the substrate according to the embodiment. FIG. 6A is a first schematic diagram illustrating a procedure for disposing a light emitting element on a substrate according to the embodiment. FIG. 6B is a second schematic diagram illustrating a procedure for arranging the light emitting elements on the substrate according to the embodiment. FIG. 6C is a third schematic diagram illustrating a procedure for arranging the light emitting elements on the substrate according to the embodiment. FIG. 7A is a first schematic diagram illustrating a procedure for arranging circuit components on a board according to the embodiment. FIG. 7B is a second schematic diagram illustrating a procedure for arranging circuit components on the board according to the embodiment. FIG. 7C is a third schematic diagram illustrating a procedure for arranging circuit components on the board according to the embodiment. FIG. 8 is a plan view illustrating a schematic configuration of a light emitting module having a substrate having a shape close to a rectangle.

  Hereinafter, embodiments will be described with reference to the drawings. The embodiments and the embodiments described below show specific examples of the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangement positions of constituent elements, connection forms, and the like shown in the following embodiments are merely examples and do not limit the present invention. Therefore, among the components in the following embodiments, components that are not described in independent claims that represent the highest concept of the present invention are described as arbitrary components.

  Each drawing is a schematic diagram, and is not necessarily strictly illustrated. In each of the drawings, substantially the same components are denoted by the same reference numerals, and redundant description may be omitted or simplified in some cases.

(Embodiment)
Hereinafter, the lighting fixture 100 according to the embodiment will be described.

[Overall configuration of lighting equipment]
First, an overall configuration of a lighting fixture 100 according to an embodiment will be described with reference to FIGS. FIG. 1 is an exploded perspective view of a lighting fixture 100 according to the embodiment. FIG. 2 is a plan view illustrating a schematic configuration of the light emitting module 10 according to the embodiment. In FIG. 2, holes and the like penetrating the substrate 11 of the light emitting module 10 are indicated by dots so as to be easily distinguished from other elements. This is the same for FIG. 8 described later.

  FIG. 3 is a partial cross-sectional view schematically illustrating a configuration of lighting device 100 according to the embodiment. Note that FIG. 3 illustrates a cross section of a part of the lighting fixture 100 and a cross section at a position corresponding to the III-III cross section in FIG. 2.

  As shown in FIG. 1, a lighting device 100 according to the present embodiment is a ceiling light mounted on a ceiling 4, for example. 1 corresponds to the direction of the floor surface (not shown) facing the ceiling 4, and corresponds to the plus direction of the Z axis in FIGS. 2 and 3. That is, the lighting fixture 100 in FIG. 1 is illustrated in an upside down posture as compared with a normal use.

  Lighting fixture 100 according to the present embodiment includes fixture main body 106 and light emitting module 10 fixed to fixture main body 106. In the present embodiment, the lighting fixture 100 further includes a circuit cover 150, a light source cover 160, a lighting cover 140, and a fixture mounting portion 8.

[Instrument body]
As shown in FIG. 1, the appliance main body 106 is formed in a disk shape, and is formed by pressing a sheet metal such as an aluminum plate or a steel plate into a disk shape. A plurality of cover mounting portions 122 are arranged on the surface of the device main body 106 on the side where the light emitting module 10 and the like are disposed, at intervals in the circumferential direction of the device main body 106. For example, a white paint having a high reflectance is applied or a reflective metal material is deposited on a surface of the appliance main body 106 on which the light emitting module 10 and the like are arranged.

  As shown in FIG. 1, a circular opening is formed in the center of the instrument body 106, and a substantially cylindrical support 126 extending from the periphery of the opening toward the light emitting module 10 is formed. Have been. The support portion 126 is a member formed of, for example, a resin, and has a structure that can be fitted to the instrument mounting portion 8.

  Further, as shown in FIG. 1, the device main body 106 has a plurality of screw holes 134 and 135 for screwing the light emitting module 10, the light source cover 160, and the circuit cover 150 with the screws 66 to be attached to the device main body 106. Is formed.

[Instrument mounting part]
The device mounting portion 8 is attached to the support portion 126 by being inserted into the support portion 126 of the device main body 106. Further, the fixture mounting portion 8 is detachably attached to a ceiling-side attachment member 36 installed on the ceiling 4. In this way, the fixture body 8 is detachably attached to the ceiling-side attachment member 36, so that the fixture body 106 is detachably attached to the ceiling 4. Note that a cushion member (not shown) for suppressing wobble of the instrument body 106 is disposed between the instrument body 106 and the ceiling 4.

[Light emitting module]
As shown in FIGS. 1 to 3, the light emitting module 10 includes a substrate 11, a plurality of light emitting elements 20 arranged on the substrate 11, and one or more circuit components 80 arranged on the substrate 11.

  The substrate 11 has a circular outer shape (including a substantially circular shape) in plan view (when the substrate 11 is viewed from the thickness direction of the substrate 11), and a circular opening 12 is formed at the center. That is, the substrate 11 has an annular (doughnut) shape. The substrate 11 is a so-called printed board on which metal wiring is formed in a pattern. In the present embodiment, a resin substrate is used as the substrate 11. That is, the substrate 11 has a plate-shaped resin base material. Further, conductor patterns (metal wiring) are provided on both surfaces of the resin base material. That is, the substrate 11 is, for example, a type of substrate called a double-sided printed circuit board or a double-sided mounting substrate.

  Each of the plurality of light emitting elements 20 of the present embodiment is, for example, an LED element in which an LED chip is packaged. That is, the mounting structure of the light emitting module 10 is an SMD (Surface Mount Device) structure in which an LED element in which an LED chip is packaged is mounted on the substrate 11.

  Specifically, a plurality of light emitting elements 20 are arranged in a second area 13b which is an outer peripheral area of the first area 13a on the main surface 11a of the substrate 11, and the plurality of light emitting elements 20 are arranged on the main surface 11a. Are connected to the conductive pattern (metal wiring) provided by the solder.

  The plurality of light emitting elements 20 are arranged annularly so as to surround the first region 13a of the substrate 11, for example, as shown in FIG. Note that there is no particular limitation on the mode of electrical connection of the plurality of light emitting elements 20. For example, a plurality of groups (light emitting element groups) of n (n is an integer of 2 or more) light emitting elements 20 connected in series may be formed, and the plurality of light emitting element groups may be connected in parallel. Further, all the light emitting elements 20 arranged on the substrate 11 may be connected in series.

  The first region 13a, which is the region of the substrate 11 at the center in plan view (the peripheral portion of the opening 12), is a region where one or more circuit components 80 are arranged. The one or more circuit components 80 are components that constitute at least a part of an electric circuit used for the operation of the plurality of light emitting elements 20 (lighting, extinguishing, changing the dimming rate, and the like). In the present embodiment, a plurality of circuit components 80 are arranged in the first region 13a, and a power supply circuit 90 that supplies power for light emission to the plurality of light emitting elements 20 is configured by the plurality of circuit components 80. Have been. The plurality of light emitting elements 20 are arranged in a second area 13b on the outer periphery of the first area 13a in which the plurality of circuit components 80 (the power supply circuit 90) are arranged.

  The power supply circuit 90 converts AC power supplied via, for example, a cable (not shown) extended from the instrument body 106 to DC power suitable for light emission of the plurality of light emitting elements 20 and supplies the DC power. Thereby, the plurality of light emitting elements 20 emit light.

  Each of the plurality of circuit components 80 configuring the power supply circuit 90 includes, for example, a capacitance element such as an electrolytic capacitor or a ceramic capacitor, a resistance element, a coil element, a choke coil (choke transformer), a noise filter, and a diode or an integrated circuit element. And the like.

  Each of these circuit components 80 has, for example, a main body 80a and a lead wire 80b extending from the main body 80a. In the present embodiment, the circuit component 80 is arranged on the substrate 11 by soldering a pair of lead wires 80b penetrating the substrate 11 on the back surface 11b side of the substrate as shown in FIG. That is, as shown in FIG. 3, a solder 85 for connecting the lead wire and the metal wiring exists on the back surface 11b of the substrate 11.

  In addition, a circuit component 80 (not shown) may be arranged in the first region 13 a on the back surface 11 b of the substrate 11. In this case, the circuit component 80 arranged on the back surface 11 b constitutes a part of the power supply circuit 90. May be.

  The details of the configuration of the substrate 11 and the manner of connecting the light emitting element 20 and the circuit component 80 to the substrate 11 will be described later with reference to FIGS. 4 to 7C.

  Further, the boundary between the first region 13a and the second region 13b, which is represented by a dashed-dotted circle in FIG. 2, does not need to be visible on the substrate 11, and the shape needs to be circular. There is no. For example, in plan view, a boundary between the first region 13a and the second region 13b may be defined by a virtual line circumscribing the power supply circuit 90 including the plurality of circuit components 80.

  As shown in FIGS. 1 to 3, the light emitting module 10 configured as described above is mounted on the main body of the device by screws 66 that penetrate each of the four notch-shaped mounting portions 16 provided on the peripheral edge of the substrate 11. Fixed to 106. Specifically, the device main body 106 has a substrate supporting portion 132 forming a plane, and the light emitting module 10 is mounted on the device so that the back surface 11b of the substrate 11 is along the substrate supporting portion 132 as shown in FIG. It is fixed to the main body 106.

  Note that the mounting portion 16 does not need to be formed in a notched shape in the substrate 11. For example, a through hole formed in a peripheral portion of the substrate 11 may be provided in the substrate 11 as the mounting portion 16. .

  Further, the substrate 11 has four through holes 17 through which screws 66 for fixing the light emitting module 10 to the instrument body 106 together with a circuit cover 150 and a light source cover 160 to be described later are formed. That is, in the present embodiment, the light emitting module 10 is fixed to the device main body 106 by a total of eight screws 66.

[Circuit cover]
As shown in FIGS. 1 and 3, the circuit cover 150 is a member that covers the power supply circuit 90 (one or more circuit components 80) disposed in the first region 13a of the substrate 11. The circuit cover 150 is made of a material, such as metal, which has noncombustibility and reflects light emitted from the light emitting module 10 in the direction of the lighting cover 140. The circuit cover 150 is formed in a donut shape, and is supported by the main surface 11 a of the substrate 11 so as to surround the support portion 126 and cover the power supply circuit 90.

  In the present embodiment, the circuit cover 150 is attached to the instrument body 106 together with the light source cover 160 and the light emitting module 10 by screws 66 as shown in FIG. In FIG. 1, only one dashed line connecting one screw 66 drawn above the circuit cover 150 to the screw hole 135 of the instrument body 106 is shown, but in the present embodiment, The circuit cover 150, the light source cover 160, the light emitting module 10, and the instrument body 106 are fastened together by the four screws 66. The light emitting module 10 has four through holes 17 through which the screws 66 that pass through the circuit cover 150 and the light source cover 160 pass.

[Light source cover]
As shown in FIGS. 1 and 3, the light source cover 160 is a member that covers the plurality of light emitting elements 20 of the light emitting module 10 and is formed of a translucent (for example, transparent) resin or the like. The light source cover 160 is formed in a donut shape, surrounds the periphery of the circuit cover 150, and is supported on the main surface 11a of the light emitting module 10 in a state of covering a plurality of light emitting elements 20 arranged in a ring. Have been. Note that the light source cover 160 may have a function of diffusing light emitted from each of the plurality of light emitting elements 20, and may be arranged mainly to protect the plurality of light emitting elements 20.

  Further, the light source cover 160 is fixed to the instrument main body 106 by the four screws 66 penetrating the circuit cover 150 as described above.

  The order of the circuit cover 150 and the light source cover 160 fixed to the device main body 106 together with the light emitting module 10 by the plurality of screws 66 in the height direction (Z-axis direction) is not particularly limited. For example, a plurality of elements such as the light source cover 160 are screwed into a screw hole 134 or 135 of the instrument main body 106 by screwing a shaft portion of the screw 66 that passes through the light source cover 160, the circuit cover 150, and the substrate 11 in this order. May be tightened.

[Lighting cover]
The lighting cover 140 is a member that covers the side of the device main body 106 to which the light emitting module 10 and the like are attached, and is formed of a resin having a light transmitting property. The illumination cover 140 is made of, for example, a milky white resin, and can diffuse light from each light emitting element 20 and emit the light to the outside. A plurality of projections (not shown) are formed in an opening (not shown) of the lighting cover 140. By engaging the plurality of projections with the plurality of cover mounting portions 122 provided on the instrument body 106, the illumination cover 140 is detachably attached to the instrument body 106.

[Details of substrate]
Next, with reference to FIGS. 4 to 7C, details of a configuration of the substrate 11 included in the light emitting module 10 and a mode of connection of the light emitting element 20 and the circuit component 80 to the substrate 11 will be described.

  FIG. 4 is a cross-sectional view illustrating a configuration outline of the light-emitting module 10 according to the embodiment, and FIG. 5 is a cross-sectional view illustrating a mode of connection of the light-emitting element 20 and the circuit component 80 to the substrate 11 according to the embodiment. It is. In FIG. 4, the light emitting module 10 is illustrated in a simplified manner so that the configuration of the light emitting module 10 can be easily understood.

  As shown in FIGS. 4 and 5, in the present embodiment, a plurality of light emitting elements 20 and a plurality of circuit components 80 are arranged on main surface 11 a of substrate 11. Specifically, each of the plurality of light emitting elements 20 is electrically connected to the substrate 11 via a metal wiring provided on the main surface 11a of the substrate 11. Further, each of the plurality of circuit components 80 has a main body portion 80a disposed on the main surface 11a side of the substrate 11 and is electrically connected to the substrate 11 via metal wiring provided on a back surface 11b of the substrate. I have.

  More specifically, the substrate 11 has a plate-shaped resin base 11c and a metal wiring (first wiring 18a) arranged on one of the two surfaces in the thickness direction of the resin base 11c (the upper surface in FIG. 5). And a metal wiring (second wiring 18b) arranged on the other surface (the lower surface in FIG. 5) of the two surfaces. Each of the first wiring 18a and the second wiring 18b is realized by, for example, a copper foil pattern-formed on the resin base material 11c.

  Further, in the present embodiment, both surfaces of the resin base material 11c are left on the resist 19 except for regions of the first wiring 18a and the second wiring 18b which are connected to the light emitting element 20, the circuit component 80, or other conductive members. Covered by Thus, by covering the first wiring 18a and the second wiring 18b with the resist 19, for example, the insulating property (dielectric strength) of the substrate 11 can be improved. Further, the oxidation of the first wiring 18a and the second wiring 18b is suppressed.

  Further, the resist 19 may be made of a material having reflectivity so as to efficiently reflect light traveling from each light emitting element 20 toward the substrate 11. For example, the resist 19 may be a white resist made of a white resin material containing a white pigment (titania, silica, or the like) so as to have a high reflectance. Thereby, for example, the light extraction efficiency of the light emitting module 10 is improved.

  The light emitting element 20 is surface-mounted on the substrate 11 having the above structure, for example, as shown in FIG. That is, the light emitting element 20 has, for example, a pair of electrodes 21 (represented by thick lines in FIG. 5) provided on the bottom surface, and these electrodes 21 are formed by metal wiring (provided on the main surface 11 a of the substrate 11). It is soldered to the first wiring 18a).

  The circuit component 80 has a plurality of (two in FIG. 5) lead wires 80b, and each of the plurality of lead wires 80b is inserted into a lead hole 11d formed in the substrate 11, and the back surface of the substrate 11 11b is soldered to the metal wiring (second wiring 18b). That is, the circuit component 80 is arranged on the substrate 11 by a technique called through-hole mounting or insertion mounting, for example.

  Here, in the present embodiment, the main surface 11a of the substrate 11 is a surface of the substrate 11 on the side where the first wiring 18a is disposed, and the back surface 11b of the substrate 11 is disposed on the side where the second wiring 18b of the substrate 11 is disposed. It can be defined that the side is the side on the side that was performed.

  As described above, in the present embodiment, the light emitting element 20 and the circuit component 80 are arranged on one substrate 11 by different techniques. This is because the light emitting element 20 and the circuit component 80 are different from each other in the configuration (such as the presence or absence of a lead wire) as a component and the heat resistance. Therefore, in the light emitting module 10 according to the present embodiment, the arrangement of the light emitting elements 20 on the substrate 11 and the arrangement of the circuit components 80 on the substrate 11 are performed in different steps.

  Hereinafter, with reference to FIG. 6A to FIG. 6C and FIG. 7A to FIG. 7C, a procedure for arranging the light emitting element 20 and the circuit component 80 on the substrate 11 (a part of the manufacturing method of the light emitting module 10) will be described.

  6A to 6C are schematic diagrams illustrating a procedure for disposing the light emitting element 20 on the substrate 11 according to the embodiment, and FIGS. 7A to 7C are diagrams illustrating how the circuit component 80 is mounted on the substrate 11 according to the embodiment. It is a schematic diagram which shows the procedure of arrangement.

  When a plurality of light emitting elements 20 and a plurality of circuit components 80 are arranged on the substrate 11 in the manufacturing process of the light emitting module 10 according to the present embodiment, first, the steps shown in FIGS. 6A to 6C are executed.

  That is, as shown in FIG. 6A, a solder 84 for connecting the pair of electrodes 21 of the light emitting element 20 to the first wiring 18a is applied to each position of the substrate 11 where the plurality of light emitting elements 20 are to be arranged. Is done. The solder 84 is, for example, called “cream solder” and is in a paste state at the time of application. As a method of applying the solder 84 to the substrate 11, for example, screen printing using a mask and a squeegee is adopted.

  Thereafter, as shown in FIG. 6B, the light emitting element 20 is mounted on the substrate 11 by the component mounter such that each of the pair of electrodes 21 of the light emitting element 20 comes into contact with the solder 84. Further, as shown in FIG. 6C, the substrate 11 is carried into a reflow furnace, heated by, for example, about 180 ° C. to 240 ° C. for about 4 minutes, and then cooled. As a result, the solder 84 is melted, and the pair of electrodes 21 of each light emitting element 20 is soldered to the first wiring 18a. More specifically, for example, the substrate 11 is heated (preheated) by heat of about 180 ° C. to 200 ° C. for about 2 minutes. Thereafter, the substrate 11 is heated by heat of about 220 ° C. to 260 ° C. for about 1 minute, so that each light emitting element 20 is connected to the first wiring 18a provided on the main surface 11a by the solder 84.

  Here, in the step (reflow step) shown in FIG. 6C, since the substrate 11 is placed in a high-temperature environment for a long time as described above, the circuit component 80 having lower heat resistance than the light emitting element 20 has a lower resistance than the light emitting element 20. Also needs to be arranged on the substrate 11 later.

  In addition, the substrate 11 itself is heated in the reflow process, so that the substrate 11 is warped as shown in FIG. 6C, for example. That is, when the plurality of circuit components 80 are mounted on the board 11, the board 11 is warped due to being heated.

  When the board 11 is warped, the larger the amount of warping, the more the circuit component 80 is mounted on the board 11 (more specifically, the lead wire 80b of the circuit component 80 is inserted into a lead hole 11d at a predetermined position on the board 11). It is difficult to accurately mount the circuit component 80 on the substrate 11 so that the substrate is inserted.

  Factors that cause the substrate 11 to warp due to heating include the difference in the coefficient of thermal expansion of the material forming the substrate 11 (the resin base 11c, the first wiring 18a, the second wiring 18b, and the resist 19), and the resin base 11c. Differences in the amount or distribution of the metal wiring formed on both sides of the resin base material 11c are exemplified. In addition, shrinkage of the solder 84 on the substrate 11 immediately after heating and melting due to subsequent cooling is also a factor that causes the substrate 11 to warp.

  Specifically, the plurality of light emitting elements 20 are fixed to the substrate 11 by the solder 84 in a state where materials having different thermal expansion coefficients (the resin base material 11c and the metal wiring, etc.) are expanded by heating. It is estimated that warpage remains. That is, when the plurality of light emitting elements 20 are fixed by the solder 84 in a state where the substrate 11 is warped by being heated, and subsequently cooled, the substrate 11 cannot return to the original shape. It is considered to be the main cause of warpage.

  When disposing a plurality of light-emitting elements 20 and a power supply circuit 90 (one or more circuit components 80) on one substrate 11 which is a base of the light-emitting module 10, the inventors of the present invention emit light as described above. In the course of the manufacturing process of the module 10, attention has been paid to the problem that the substrate 11 is warped.

  Furthermore, the inventors of the present application have conducted intensive studies to solve this problem, and as a result, have obtained the following conclusions regarding the thickness T (see FIG. 5) of the resin base material 11c.

  That is, there is a negative correlation between the thickness T of the resin base material 11c and the amount of warpage of the substrate 11, and when the thickness T of the resin base material 11c is larger than 1 mm, It has been concluded that the mounting of the circuit component 80 by the component mounter (mounting on the substrate 11) is realistic.

  Specifically, similarly to the above reflow step, in a reflow furnace, heat of about 180 ° C. to 240 ° C. for about 4 minutes is applied to a resin base material having a base material thickness of 1.6 mm and a length and width of about 250 mm. An experiment was carried out on a substrate having the same. Further, the amount of warpage of the substrate was measured. The amount of warpage of the substrate is defined, for example, as the maximum amount of the gap between the substrate and the horizontal surface when the substrate is laid on the horizontal surface. For example, in FIG. 6C, the amount of warpage of the substrate 11 is “W”.

  Here, as a substrate having a resin base material, a glass composite substrate and a glass epoxy substrate are exemplified. The glass composite substrate is a substrate having, as a base material, a plate formed by impregnating an epoxy resin into an aggregate of glass fibers obtained by mixing a glass cloth and a glass nonwoven fabric and performing a thermosetting treatment. For example, a CEM3 substrate having CEM3 (Composite epoxy material-3) as a base material is an example of a glass composite substrate. The CEM 3 is a plate-like material obtained by impregnating an epoxy resin into a glass fiber aggregate in which a glass cloth is used for the outermost layer and a glass non-woven fabric is used for the center layer instead of the glass cloth, and subjected to a thermosetting treatment.

  The glass epoxy substrate is, for example, a substrate having FR4 (Frame Retardant Type 4) as a base material. FR4 is a plate made by impregnating an epoxy resin into a glass fiber cloth and performing a thermosetting treatment.

  Each of the glass composite substrate and the glass epoxy substrate is an example of a substrate having a resin base material mainly containing glass fiber and epoxy resin.

  In this experiment, a plurality of types of glass composite substrates each having a substrate thickness of 1.6 mm were heated in a reflow furnace as described above, and as a result, the measured amount of warpage was 1.5 mm to 2.0 mm. It was about.

  More specifically, in the case of a high heat radiation glass composite substrate having a thickness of 1.6 mm, the amount of warpage after heating was about 1.5 mm. Note that the high heat dissipation glass composite substrate is a type of glass composite substrate and has a base material including a filler (alumina particles or the like) having a higher thermal conductivity than an epoxy resin, for example.

  As a result of examining the mounting of the circuit component by the component mounter on the substrate having a warp of about 1.5 mm to 2.0 mm due to the heating, a mounting error (mounting error) may occur. Yes, but it can be adopted as a practical matter.

  In addition, since the amount of warpage of a substrate having a resin base material such as a glass composite substrate is considered to have a negative correlation with the thickness (more specifically, it is inversely proportional), for example, the thickness is reduced to half (0.8 mm). When the glass composite substrate is heated under the same conditions, the amount of warpage is about 3.0 to 4.0 mm. In this case, it is not realistic to mount circuit components on the heated substrate by using a component mounter. In other words, when the substrate is used as a component of a light emitting module, the yield (the ratio of a substrate on which a plurality of circuit components are appropriately mounted without mounting errors in a component mounter) is an impractical numerical value. It is inferred that

  Furthermore, for example, from the viewpoint of efficiently conducting the heat generated by the plurality of light emitting elements 20 to the appliance body 106 via the substrate 11, the smaller the thickness of the substrate 11 (the thinner the substrate 11), the more advantageous.

  As a result of such experimental results and examinations based on the experiences of the inventors, the inventors of the present application have found that the thickness T (see FIG. 5) of the substrate 11 of the light emitting module 10 according to the present embodiment is larger than 1 mm. It was concluded that the substrate 11 having the resin substrate 11c should be employed.

  In the present embodiment, the plurality of light emitting elements 20 are arranged on the substrate 11 having the resin base material 11c having the thickness T (T> 1 mm) selected for the above-described reason by the procedure shown in FIGS. 6A to 6C. Thereafter, the plurality of circuit components 80 are arranged on the substrate 11 according to the procedure shown in FIGS. 7A to 7C.

  That is, as shown in FIG. 7A, the circuit component 80 is mounted on each of the predetermined positions of the substrate 11 where the lead holes 11d (see FIG. 5) are formed, using a component mounter. Specifically, the circuit component 80 is placed on the main surface 11a of the substrate 11 so that the lead wire 80b of the circuit component 80 is inserted into a lead hole 11d (see FIG. 5) provided in the substrate 11. .

  Thereafter, as shown in FIG. 7B, the substrate 11 is moved such that the back surface 11b of the substrate 11 is in contact with the liquid solder 85 jetted in the solder bath 180. As a result, as shown in FIG. 7C, the plurality of lead wires 80b of each of the plurality of circuit components 80 and the second wiring 18b (see FIG. 5) provided on the back surface 11b of the substrate 11 are connected by the solder 85. Is done. As described above, in the present embodiment, the circuit component 80 is soldered to the substrate 11 by a flow method. That is, in the present embodiment, when manufacturing the light emitting module 10, a reflow step is performed to arrange the plurality of light emitting elements 20 on the substrate 11, and thereafter, a process for arranging the plurality of circuit components 80 on the substrate 11 is performed. A flow step is performed.

[Effects]
As described above, the light emitting module 10 according to the present embodiment is the light emitting module 10 attached to the fixture main body 106 of the lighting fixture 100, and includes the substrate 11, the plurality of light emitting elements 20, and one or more circuit components. 80. The substrate 11 has a plate-shaped resin base material 11c, a first wiring 18a disposed on one of the two surfaces in the thickness direction of the resin base material 11c, and is disposed on the other of the two surfaces. The second wiring 18b. The plurality of light emitting elements 20 are arranged on the main surface 11a of the substrate 11, and are soldered to the first wiring 18a. The one or more circuit components 80 are soldered to the second wiring 18b. In this configuration, the thickness of the resin base 11c of the substrate 11 is larger than 1 mm.

  According to the above-described configuration, the light-emitting element 20 and the circuit component 80 having different configurations (such as the presence or absence of a lead wire) and heat resistance from each other can be arranged on one substrate 11 using an automatic machine. it can.

  Specifically, the light emitting element 20 can be soldered to the substrate 11 by a reflow process using a reflow furnace or the like. Further, the circuit component 80 mounted on the substrate 11 by the component mounter can be soldered to the substrate 11 by a flow process using a solder tank 180 or the like.

  Further, as described above, when the manufacturing process of the light emitting module 10 includes a reflow process and a flow process, the substrate 11 on which the one or more circuit components 80 are arranged cannot be heated in a reflow furnace. The steps are executed in the order of the flow steps. In this case, although the substrate 11 is warped by the heating in the reflow step, the warpage of the substrate 11 is suppressed because the thickness of the resin base material 11c is larger than 1 mm. Therefore, after that, it is substantially possible to mount the circuit component 80 on the substrate 11 by the component mounter.

  In addition, a plurality of light emitting elements 20 that emit light used for illumination and one or more circuit components 80 used for operation of the plurality of light emitting elements 20 can be arranged on one substrate 11. . Therefore, for example, effects such as reduction in the number of parts of the lighting fixture 100 and facilitation of assembly can be obtained.

  As described above, the light emitting module 10 according to the present embodiment is a light emitting module 10 including the circuit component 80 and the light emitting element 20, and is a light emitting module 10 that can be efficiently manufactured.

  Furthermore, since the warpage of the substrate 11 is suppressed, when the substrate 11 (the light emitting module 10) is mounted on the device main body 106, the warp of the substrate 11 is corrected by the screws 66 and brought into surface contact with the device main body 106. It will be easier. As a result, the back surface 11b of the substrate 11 corresponding to the arrangement region (second region 13b) of the plurality of light emitting elements 20 can be brought into surface contact with the appliance body 106, thereby improving heat dissipation.

  Note that, since it is considered that the greater the thickness of the resin base material 11c, the more the warpage due to heat is suppressed, the thickness of the resin base material 11c is preferably, for example, 1.2 mm or more. Further, more preferably, the thickness of the resin base material 11c is, for example, 1.6 mm or more. Further, the heat from the plurality of light emitting elements 20 is efficiently conducted to the instrument body 106 via the resin base material 11c, and the back surface 11b of the substrate 11 is closely attached to the instrument body 106 by the screws 66. In consideration of suppressing the repulsive force, the thickness of the resin base material 11c is preferably, for example, 2.0 mm or less.

  The lighting fixture 100 according to the present embodiment includes a light emitting module 10 and a fixture main body 106 to which the light emitting module 10 is attached. As described above, the light emitting module 10 can be manufactured efficiently, and thus the lighting fixture 100 including the light emitting module 10 can also be manufactured efficiently.

  Further, a method for manufacturing the light emitting module 10 according to the present embodiment will be described as follows. That is, this is a method for manufacturing the light-emitting module 10 including the substrate 11, the plurality of light-emitting elements 20 and one or more circuit components 80 arranged on the substrate 11, and includes a reflow step and a flow step. In the reflow process, the plurality of light emitting elements 20 are soldered to the substrate 11 having the resin base 11c having a thickness larger than 1 mm by a reflow method. In the flow step, after the reflow step, one or more circuit components 80 are soldered to the substrate 11 by a flow method.

  According to this manufacturing method, a plurality of light emitting elements 20 and one or more circuit components 80 can be arranged on one substrate 11 using an automatic machine such as a component mounting machine. That is, the manufacture of the light emitting module 10 and the manufacturing of the lighting fixture 100 including the light emitting module 10 are efficiently performed.

  Further, in the present embodiment, when the substrate 11 is viewed in a plan view, the plurality of light emitting elements 20 are arranged in the second area 13b which is an outer peripheral area of the first area 13a in which one or more circuit components 80 are arranged. Have been.

  According to this configuration, a region where a plurality of light emitting elements 20 are arranged and a region where one or more circuit components 80 are arranged are separated. Therefore, for example, the operation for arranging the plurality of light emitting elements 20 on the substrate 11 and the operation for arranging one or more circuit components 80 on the substrate 11 can be performed efficiently.

  In addition, since the plurality of light emitting elements 20 are arranged in an area around the area where the one or more circuit components 80 are arranged on the substrate 11, for example, illumination light emitted from the plurality of light emitting elements 20 is emitted. The possibility that light is shielded by one or more circuit components 80 is reduced.

  Further, in the present embodiment, the plurality of light emitting elements 20 are arranged annularly so as to surround one or more circuit components 80, for example, as shown in FIG.

  According to this configuration, for example, as shown in FIG. 2, one or more circuit components 80 are arranged in a central portion (a peripheral portion of the opening 12) in plan view of the substrate 11. That is, when the substrate 11 is warped as shown in FIG. 6C, the one or more circuit components 80 are placed in an area where the vertical displacement from the normal position (the displacement in the Z-axis direction in FIG. 6C) is relatively small. Is arranged. Therefore, for example, when a circuit component is mounted on the substrate 11 by the component mounter on the substrate 11 after the reflow process, the possibility of a mounting error is further reduced.

  In the present embodiment, each of the one or more circuit components 80 has a main body 80a and a lead wire 80b extending from the main body 80a. The main body portion 80a is disposed on the main surface 11a side of the substrate 11, and the lead wire 80b is soldered to the second wiring 18b while penetrating the substrate 11 (for example, see FIG. 5).

  According to this configuration, for example, as shown in FIG. 7A, when one or more circuit components 80 are mounted on the substrate 11, the circuit components 80 are mounted on the substrate 11 from the side of the main surface 11a on which the plurality of light emitting elements 20 are arranged. be able to. Thus, for example, when the circuit component 80 is mounted on the substrate 11 using a component mounter, the substrate 11 can be mounted easily and stably using the flat surface of the back surface 11b of the substrate 11. it can.

  In the present embodiment, one or more circuit components 80 included in the light emitting module 10 are electrically connected to the plurality of light emitting elements 20, and the one or more circuit components 80 connect the plurality of light emitting elements 20 to each other. A power supply circuit 90 for supplying power for light emission is configured.

  Therefore, for example, as compared with the case where the power supply circuit 90 is formed on a substrate separate from the substrate 11 on which the plurality of light emitting elements 20 are arranged, the number of parts of the lighting fixture 100 is reduced, and the lighting fixture 100 is easy to assemble. The effect of improvement of the effect is obtained.

  Further, in the present embodiment, the resin base 11c of the substrate 11 includes glass fiber and epoxy resin as main materials.

  Specifically, a glass composite substrate or a glass epoxy substrate is employed as the substrate 11 provided in the light emitting module 10. Therefore, for example, the light emitting module 10 of the present embodiment can be configured using a glass composite substrate or a glass epoxy substrate that is generally distributed and easily available and has a thickness greater than 1 mm.

  In addition, since the resin base material 11c contains relatively high-strength glass fiber, for example, a substrate having a base material formed by impregnating paper with resin (paper phenol substrate, paper epoxy substrate, or the like) It has the characteristic of being less likely to warp as compared with. That is, it can be said that the substrate 11 according to the present embodiment preferably has the resin base material 11c, and the resin base material 11c preferably includes glass fiber and epoxy resin as main materials.

  More preferably, the substrate 11 is a high heat radiation glass composite substrate having a resin base material 11c containing a filler having a higher thermal conductivity than epoxy resin.

  In addition, since the power supply circuit 90 (one or more circuit components 80) is arranged on the substrate 11 in addition to the plurality of light emitting elements 20, the area in a plan view is relatively large, and the weight is relatively large. Heavier. Therefore, for example, it is conceivable that the possibility of occurrence of damage such as cracks or chips in the substrate 11 increases. However, when the substrate 11 is a substrate having a base material containing glass fiber and epoxy resin, damage such as cracking or chipping occurs due to elasticity (stickiness) derived from resin or high strength derived from glass fiber. Be suppressed.

(Other embodiments)
Although the present invention has been described based on the embodiments, the present invention is not limited to the above embodiments.

  For example, the shape of the substrate 11 is not limited to the shape shown in FIG. The substrate 11 may have, for example, an outer shape close to a rectangle.

  FIG. 8 is a plan view showing a schematic configuration of a light emitting module 10a having a substrate 14 having a shape close to a rectangle.

  The light emitting module 10a shown in FIG. 8 includes a substrate 14 having a shape close to a rectangle, which is different from the substrate 11 in the above-described embodiment and the like, in which the outer shape is formed of a straight line. However, the light emitting module 10a has the other configuration in common with the light emitting module 10 according to the above embodiment, for example.

  That is, the light emitting module 10a includes the substrate 14, the plurality of light emitting elements 20, and one or more circuit components 80. The substrate 14 includes a plate-shaped resin base, a first wiring disposed on one of two surfaces in a thickness direction of the resin base, and a second wiring disposed on the other of the two surfaces. Having. The plurality of light emitting elements 20 are arranged on the main surface 14a of the substrate 14, and are soldered to the first wiring. One or more circuit components 80 are soldered to the second wiring. Further, the thickness of the resin base material of the substrate 14 is larger than 1 mm.

  As described above, the light emitting module 10a has a feature that the resin base material is larger than 1 mm, similarly to the substrate 11 in the above-described embodiment and the like, so that the plurality of light emitting elements 20 are arranged on the substrate 11. The warpage of the substrate 14 caused by heating in the reflow step is suppressed. As a result, it becomes practically possible to mount the circuit component 80 on the warped substrate 11 using the component mounter.

  Further, since the outer shape of the substrate 14 is close to a rectangle, for example, when a plurality of substrates 14 are manufactured by cutting a material of a predetermined size, the substrate 14 is compared with a case where the circular substrate 11 is manufactured. The production increases the number of sheets that can be produced or reduces the amount of wasted material.

  In FIG. 6C and FIGS. 7A to 7B, both ends of the substrate 11 are warped so as to lift toward the main surface 11 a on which the plurality of light emitting elements 20 are arranged. , And is not limited to a particular direction and position. For example, opposite to the substrate 11 shown in FIG. 6C or the like, both ends of the substrate 11 may be warped so as to be lowered toward the back surface 11b. Even in this case, the warpage of the substrate 11 is suppressed because the thickness of the resin base material 11c is larger than 1 mm. Thus, it is substantially possible to mount the circuit component 80 on the warped substrate 11 using the component mounter.

  Further, the one or more circuit components 80 arranged on the substrate 11 may constitute an electric circuit (electronic circuit) of a type different from the power supply circuit 90. For example, a control circuit that performs dimming control or toning control on the plurality of light emitting elements 20 according to a signal transmitted from the outside of the lighting fixture 100 may be configured by the one or more circuit components 80.

  In addition, when the lighting fixture 100 includes a sensor (a human sensor, an illuminance sensor, a sound sensor, or the like) used for controlling lighting, extinguishing, dimming, or toning of the light emitting module 10, the operation of the sensor is controlled. The control circuit may be configured by at least a part of the one or more circuit components 80.

  When the lighting fixture 100 includes a sensor, the lighting fixture 100 may include a camera that captures an image of a predetermined range based on a detection result of the sensor. For example, when the lighting fixture 100 includes a human sensor, the human sensor can detect a person, cause the light emitting module 10 to emit light, and image the person with a camera.

  Moreover, the lighting fixture 100 may include a speaker that outputs sound received by the lighting fixture 100 by wire or wirelessly. In this case, for example, the speaker may be controlled so that sound is output from the speaker in synchronization with the lighting of the light emitting module 10.

  In the above-described embodiment and the modification, the LED element in which the LED chip is packaged is illustrated as the light emitting element 20. However, other types of solid state light emitting devices such as a semiconductor light emitting device such as a semiconductor laser or an EL device such as an organic EL (Electro Luminescence) or an inorganic EL may be employed as the light emitting device 20.

  In addition, a form obtained by applying various modifications that can be made by a person skilled in the art to the above-described embodiment and its supplementary matters, and components and functions in each embodiment and its supplementary matters without departing from the spirit of the present invention An embodiment realized by arbitrarily combining is included in the present invention.

10, 10a Light emitting module 11, 14 Substrate 11a, 14a Main surface 11b Back surface 11c Resin base material 13a First region 13b Second region 18a First wiring 18b Second wiring 20 Light emitting element 80 Circuit component 80a Main body 80b Lead wire 90 Power supply Circuit 100 Lighting fixture 106 Fixture body

Claims (7)

A light emitting module attached to a lighting device main body,
A board having a plate-shaped resin substrate, a first wiring disposed on one of two surfaces in a thickness direction of the resin substrate, and a second wiring disposed on the other surface of the two surfaces When,
A plurality of light emitting elements that are arranged on a main surface of the substrate, which is a surface on the side where the first wiring is arranged, and are soldered to the first wiring,
Comprising the second wiring and one or more circuit components soldered,
The thickness of the resin substrate is much larger than the 1 mm,
When the substrate is viewed in a plan view, the plurality of light emitting elements are arranged in a second area that is an outer peripheral area of the first area where the one or more circuit components are arranged,
The light emitting module , wherein the substrate has an opening formed in a central part of the substrate and inside the first region . Wherein the plurality of light emitting elements, the light emitting module of claim 1, wherein are arranged in an annular shape so as to surround the one or more circuit components. Each of the one or more circuit components has a main body and a lead wire extending from the main body,
The main body is disposed on the main surface side of the substrate,
The lead wire is in a state of penetrating the substrate, the light emitting module according to claim 1 or 2, wherein is the second wiring and soldering. The one or more circuit components are electrically connected to the plurality of light emitting elements, and the one or more circuit components form a power supply circuit that supplies power for light emission to the plurality of light emitting elements. The light emitting module according to any one of claims 1 to 3 . The light emitting module according to any one of claims 1 to 4 , wherein the resin base material includes glass fiber and an epoxy resin as main materials. A light emitting module according to any one of claims 1 to 5 ,
A lighting device comprising: a device main body to which the light emitting module is attached. A method for manufacturing a light emitting module comprising a substrate and a plurality of light emitting elements and one or more circuit components arranged on the substrate,
A reflow step of soldering the plurality of light emitting elements to the substrate having a resin base material having a thickness greater than 1 mm by a reflow method;
After the reflow step, a flow step of soldering the one or more circuit components having lower heat resistance than the plurality of light emitting elements to the substrate by a flow method.

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