JP7018575B2 - lighting equipment - Google Patents

Description

The present invention relates to a luminaire in general, and more particularly to a luminaire including a light emitting element.

Conventionally, a lighting fixture to be mounted on a mounted portion (hanging ceiling) provided on the ceiling has been proposed (see, for example, Patent Document 1). The lighting fixture of Patent Document 1 includes a fixture main body, a cylindrical fixture mounting portion, a fixture main body fixing member, and a light source portion. The instrument mounting portion is provided in a through hole formed in the central portion of the instrument body. The instrument main body fixing member is fixed inside the instrument mounting portion, and can be fixed to the mounted portion fixing member provided in the mounted portion. The light source portion is provided around the fixture mounting portion and is provided on the side of the fixture body opposite to the mounted portion.

The light source unit includes a circuit board supported by the instrument body and a power supply unit cover that covers the power supply unit of the circuit board. The circuit board is formed in a planar shape so as to bypass the fixture mounting portion, and is supported on the surface of the fixture body.

On the surface of the circuit board opposite to the instrument main body, the power supply section is provided in an annular shape in a region close to the instrument mounting portion. On the surface of the circuit board, the light emitting portion of the LED is provided in an annular shape in a region far from the fixture mounting portion.

The power supply cover is formed in a substantially dome shape. The power supply cover is provided with an outer peripheral portion on the surface of the circuit board at the boundary between the power supply portion and the light emitting portion.

Japanese Unexamined Patent Publication No. 2016-103373

The power supply unit cover (power supply cover) is provided so as to cover the electronic components of the power supply unit (power supply unit) provided inside the substrate rather than the LED (light emitting element). Therefore, there is a possibility that a part of the irradiation light of the light emitting element is blocked by the power supply cover and the illuminance is lowered.

The present invention has been made in view of the above reasons, and an object of the present invention is to provide a lighting fixture capable of suppressing a decrease in illuminance.

The lighting fixture according to one aspect of the present invention includes a plurality of light emitting elements, a power supply unit, a substrate, a fixture main body, and a power supply cover. The power supply unit has a plurality of first electronic components and a plurality of second electronic components, and supplies electric power to the plurality of light emitting elements. The substrate has a first surface and a second surface opposite to the first surface. In the substrate, the plurality of first electronic components are arranged in a first region on the first surface, and the plurality of light emitting elements are arranged in a second region outside the first region on the first surface. The second electronic component is arranged on the second surface. The substrate is attached to the instrument body so that the second surface faces each other. The power supply cover covers all of the plurality of first electronic components arranged on the substrate and does not cover the plurality of light emitting elements. The plurality of first electronic components are surface mount components. The height dimension of the first electronic component having the largest height dimension among the plurality of first electronic components is larger than the height dimension of the second electronic component having the largest height dimension among the plurality of second electronic components. small. The power supply cover is made of a non-translucent material.

The lighting fixture of the present invention has the effect of suppressing a decrease in illuminance.

FIG. 1 is an exploded perspective view of a lighting fixture according to an embodiment of the present invention. FIG. 2A is a top view of the substrate of the lighting fixture of the same. FIG. 2B is a bottom view of the substrate of the lighting fixture of the same. FIG. 3 is an enlarged cross-sectional view of a main part of the same lighting fixture with the light source cover and gloves removed.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the embodiments described below are merely one of the various embodiments of the present invention. The following embodiments can be variously modified according to the design and the like as long as the object of the present invention can be achieved. It should be noted that each figure described in the following embodiments is a schematic diagram, and the dimensional ratio of each component does not necessarily reflect the actual dimensional ratio.

(Embodiment)
The lighting fixture 1 of the present embodiment will be described with reference to FIGS. 1 to 3. The luminaire 1 of the present embodiment is a ceiling light attached to the ceiling 9. The lighting fixture 1 includes a fixture main body 2, a substrate 3, a plurality of light emitting elements 4, a power supply unit 5, a power supply cover 6, a light source cover 7, and a glove 8. In the following description, the ceiling 9 side is upward and the floor side is downward with respect to the lighting fixture 1 attached to the ceiling 9. However, the installation direction of the lighting fixture 1 is not limited to the above direction.

A hook ceiling rosette 91 is provided on the ceiling 9. The hook ceiling rosette 91 is a power socket that supports the luminaire 1 and supplies electric power to the luminaire 1.

The luminaire 1 includes a columnar adapter 11 that is electrically and mechanically connected to the hook ceiling rosette 91. The adapter 11 is provided with two hooking claws 111 provided so as to be able to advance and retreat from a part of the outer peripheral surface. The two hooking claws 111 project in opposite directions from the outer peripheral surface of the adapter 11.

The instrument body 2 is made of a metal plate (for example, a steel plate or the like). The instrument main body 2 is formed in an substantially disk shape, and has a support base 21, a storage recess 22, and a through hole 23. The support base 21 is formed in a truncated cone shape and projects downward from the lower surface of the instrument main body 2. The substrate 3 is attached to the lower surface 211 of the support base 21. The storage recess 22 is formed in the shape of a truncated cone, and is formed upward from the lower end of the support 21. A plurality of second electronic components 52 among the plurality of first electronic components 51 and the plurality of second electronic components 52 included in the power supply unit 5 are stored in the storage recess 22. The through hole 23 is formed at the upper end of the storage recess 22. The through hole 23 is formed in a circular shape and penetrates in the vertical direction. The adapter 11 is passed through the through hole 23. The instrument main body 2, the support base 21, the storage recess 22, and the through hole 23 are formed so that their outer shapes are concentric when viewed from the vertical direction.

The luminaire 1 further includes a holder 12 and a protective cover 13.

The holder 12 has a tubular body 121 and a flange 122, and is attached to the lower surface of the instrument main body 2. The tubular body 121 is formed in a cylindrical shape and has a circular through hole 123 penetrating in the vertical direction. The through hole 23 of the instrument main body 2 and the through hole 123 of the tubular body 121 have substantially the same diameter. The flange 122 is formed at the upper end of the tubular body 121. The flange 122 is formed with a hole through which a screw for attaching the holder 12 to the instrument main body 2 is passed. The holder 12 is attached to the instrument body 2 so that the through hole 123 of the tubular body 121 is substantially concentric with the through hole 23 of the instrument body 2.

In order to attach the instrument body 2 to the ceiling 9, the operator may push up the instrument body 2 toward the ceiling 9 so that the adapter 11 passes through the through hole 23 of the instrument body 2. As a result, the hooking claw 111 of the adapter 11 is hooked on the lower end of the tubular body 121 of the holder 12, and the instrument main body 2 is attached to the ceiling 9.

Further, an elastic member 202 having elasticity is provided on the upper surface of the instrument main body 2. The elastic member 202 is made of, for example, an ester-based polyurethane foam. Further, the elastic member 202 is formed in a rectangular parallelepiped shape, for example. In the present embodiment, three elastic members 202 are provided on the upper surface of the instrument main body 2 at substantially equal intervals along the edge of the upper surface of the instrument main body 2. When the instrument body 2 is attached to the ceiling 9, the elastic member 202 is sandwiched between the ceiling 9 and the instrument body 2 and compressed. As a result, rattling, rotation, and the like of the instrument main body 2 are suppressed.

The protective cover 13 has a tubular body 131 and a flange 132, and is provided so as to surround the holder 12. The tubular body 131 is formed in a cylindrical shape and has a circular through hole 133 penetrating in the vertical direction. The inner diameter of the cylinder 131 is slightly larger than the outer diameter of the cylinder 121. Further, the vertical dimension of the tubular body 131 is longer than the vertical dimension of the tubular body 121. The flange 132 is formed at the upper end of the tubular body 131. The protective cover 13 is provided on the lower side of the holder 12 so that the cylinder 131 surrounds the outer peripheral surface of the cylinder 121 of the holder 12. The protective cover 13 encloses the outer peripheral surface of the adapter 11 so that only the lower surface of the adapter 11 projecting to the lower side of the holder 12 is exposed while the instrument main body 2 is attached to the ceiling 9. Protect.

The substrate 3 is attached to the lower surface 211 of the support base 21 of the instrument main body 2 with, for example, a screw or the like. In the present embodiment, the lower surface will be described as the first surface 31, and the upper surface will be described as the second surface 32. That is, the substrate 3 is attached to the instrument main body 2 in a state where the second surface 32 faces the lower surface 211 of the support base 21 of the instrument main body 2 in the vertical direction.

The substrate 3 is made of, for example, a glass cloth base material epoxy resin substrate. The substrate 3 is formed in a rectangular shape with four corners cut out, and a substantially circular through hole 33 penetrating in the vertical direction is formed in a substantially central portion. The diameter of the through hole 33 is slightly larger than the outer diameter of the tubular body 131 of the protective cover 13, and the protective cover 13 is passed through the through hole 33. In the present embodiment, the side of the substrate 3 near the through hole 33 is referred to as the inside, and the side far from the through hole 33 is referred to as the outside.

The substrate 3 is a so-called printed wiring board, and integrally has a conductor constituting a film-shaped wiring path. In the present embodiment, the substrate 3 is a single-sided substrate, and a conductor is provided only on the first surface 31 side. A plurality of light emitting elements 4 which are light sources, a plurality of first electronic components 51 included in a power supply unit 5 for supplying electric power to the plurality of light emitting elements 4, and a plurality of second electronic components 52 are mounted on the substrate 3. ing. That is, the plurality of light emitting elements 4, the plurality of first electronic components 51, and the plurality of second electronic components 52 are electrically and mechanically connected to the conductor of the substrate 3 by soldering.

FIG. 2A shows a top view of the substrate 3 in which a plurality of light emitting elements 4, a plurality of first electronic components 51, and a plurality of second electronic components 52 are mounted, and FIG. 2B shows a bottom view.

Each of the plurality of light emitting elements 4 is an LED (Light Emitting Diode), and is arranged on the first surface 31 (lower surface) of the substrate 3. Specifically, the plurality of light emitting elements 4 are arranged in the second region S2 on the first surface 31 of the substrate 3. The second region S2 is a substantially annular region along the outer edge of the substrate 3 on the first surface 31 of the substrate 3. In FIG. 2B, the inner edge of the second region S2 is schematically represented by a alternate long and short dash line. The plurality of light emitting elements 4 are arranged in two rows (double) concentrically in the second region S2. The plurality of light emitting elements 4 are arranged at equal intervals in each row. The term "equally spaced" here does not have to be exactly the same, and the intervals may vary within a predetermined range. The light emitting element 4 is not limited to the LED, and may be an organic EL (Electro Luminescence) or the like.

Each of the plurality of light emitting elements 4 is a surface mount type LED, and includes an LED chip, a rectangular parallelepiped package for accommodating the LED chip, and an electrode exposed from the package. The plurality of light emitting elements 4 are surface-mounted so that the electrodes are electrically connected to the pad electrodes which are a part of the conductor exposed from the resist layer provided on the surface of the substrate 3. The plurality of light emitting elements 4 are connected in series by being mounted on the substrate 3. By mounting the plurality of light emitting elements 4 on the substrate 3, a load circuit in which electric power is supplied from the power supply unit 5 is realized in the printed circuit. By mounting the plurality of light emitting elements 4 on the substrate 3, the conductor of the substrate 3 may be formed so as to be connected in series and parallel.

The emission color of the light emitting element 4 includes, for example, white, a light bulb color, and the like. The emission colors of the plurality of light emitting elements 4 may be the same color as each other, or for example, white and light bulb colors may be mixed.

The power supply unit 5 has a plurality of first electronic components 51 and a plurality of second electronic components 52, and converts AC power supplied from a commercial power source into DC power and supplies the AC power to the plurality of light emitting elements 4. It is configured as follows. By mounting the plurality of first electronic components 51 and the plurality of second electronic components 52 on the substrate 3, a power supply circuit for supplying electric power to the load circuit is realized in the printed circuit. The power supply circuit includes, for example, a power factor conversion circuit, a step-down DC / DC conversion circuit, and the like.

The plurality of first electronic components 51 are arranged on the first surface 31 (lower surface) of the substrate 3. Specifically, the plurality of first electronic components 51 are arranged in the first region S1 on the first surface 31 of the substrate 3. The first region S1 is a substantially annular region along the edge of the through hole 33 on the first surface 31 of the substrate 3, and is inside the second region S2. In FIG. 2B, the outer edge of the first region S1 is schematically represented by a alternate long and short dash line.

The plurality of first electronic components 51 are surface mount components (SMD: Surface Mount Device), and include, for example, chip-type circuit elements (resistors, capacitors, inductors, diodes, etc.), IC components (IC: Integrated Circuit), and the like. It has been. The plurality of first electronic components 51 are surface-mounted so that the electrodes are electrically connected to the pad electrodes which are a part of the conductor exposed from the resist layer provided on the surface of the substrate 3.

The plurality of second electronic components 52 are arranged on the second surface 32 (upper surface) of the substrate 3. Specifically, the plurality of second electronic components 52 are arranged in the third region S3 on the second surface 32 of the substrate 3. The third region S3 is a substantially annular region along the edge of the through hole 33 on the second surface 32 of the substrate 3. In FIG. 2A, the outer edge of the third region S3 is schematically represented by a alternate long and short dash line.

The plurality of second electronic components 52 are lead-type electronic components having radial leads, axial leads, and the like, and include, for example, electrolytic capacitors, winding inductors, ceramic resistors, diodes, fuses, varistor, and the like. The plurality of second electronic components 52 are mounted on the substrate 3 by through-hole mounting. That is, the leads of the second electronic component 52 arranged on the second surface 32 of the substrate 3 pass through the through holes formed in the substrate 3, and are electrically connected to the conductor by soldering on the first surface 31 side of the substrate 3. Connected to. The plurality of second electronic components 52 include electronic components (for example, a winding type inductor) that generate a larger amount of heat than the first electronic component 51.

Further, the plurality of second electronic components 52 include a power connector 521 to which one end of the power cable is connected. In FIGS. 1 and 3, the power cable is not shown. The substrate 3 has a recess 34 formed in a part of the edge of the through hole 33. The recess 34 is formed in a substantially rectangular shape and is continuous with the through hole 33. The power cable passes through the recess 34 of the substrate 3 and the recess formed at the lower end of the tubular body 131 of the protective cover 13, and one end thereof is connected to the power connector 521 provided on the second surface 32 of the substrate 3, and the like. The ends are connected to the power connector 112 provided on the lower surface of the adapter 11. As a result, the power supply unit 5 is supplied with AC power from the commercial power supply via the power cable and the adapter 11.

In the present embodiment, all of the plurality of electronic components (including the plurality of light emitting elements 4 and the plurality of first electronic components 51) arranged on the first surface 31 of the substrate 3 are surface-mounted on the substrate 3. It is a mounting component. Further, all of the plurality of electronic components (including the plurality of second electronic components 52) arranged on the second surface 32 of the substrate 3 are lead-type electronic components mounted through holes on the substrate 3.

Here, the vertical dimension of the plurality of first electronic components 51 and the plurality of second electronic components 52 in a state of being mounted on the substrate 3 is defined as a height dimension. The height dimension of the plurality of first electronic components 51 is smaller than the height dimension of the plurality of second electronic components 52. Specifically, the height dimension of the first electronic component 51 having the largest height dimension among the plurality of first electronic components 51 is defined as H1. Let H2 be the height dimension of the second electronic component 52 having the largest height dimension among the plurality of second electronic components 52. The height dimension H1 is smaller than the height dimension H2 (H1 <H2). Further, the average value of the height dimensions of the plurality of first electronic components 51 is smaller than the average value of the height dimensions of the plurality of second electronic components 52. It is preferable that all the height dimensions of the plurality of first electronic components 51 are smaller than all the height dimensions of the plurality of second electronic components 52, but the plurality of second electronic components 52 include the first electronic component. A second electronic component 52 having a height dimension smaller than 51 may be included. For example, the plurality of second electronic components 52 have a height dimension larger than that of the first electronic component 51 (for example, a surface mount type winding inductor) having a relatively large height dimension among the plurality of first electronic components 51. A small second electronic component 52 (eg, an axial diode or the like) may be included.

In FIG. 2A, in order to explain the positional relationship between the second region S2, the first region S1, and the third region S3, the outer edge of the first region S1 and the inner edge of the second region S2 on the first surface 31 of the substrate 3 Is schematically represented by a broken line. As shown in FIG. 2A, when the substrate 3 is viewed from the thickness direction (vertical direction), the outer edge of the third region S3 on the second surface 32 of the substrate 3 is on the first surface 31 of the substrate 3. It is inside the outer edge of the first region S1. That is, the third region S3 is a region farther from the second region S2 than the first region S1. Therefore, the second electronic component 52 is arranged at a position farther from the light emitting element 4 than the first electronic component 51. Specifically, the distance between the second electronic component 52 arranged on the outermost side of the substrate 3 among the plurality of second electronic components 52 and the light emitting element 4 closest to the second electronic component 52 is L2. do. The distance between the first electronic component 51 arranged on the outermost side of the substrate 3 among the plurality of first electronic components 51 and the light emitting element 4 closest to the first electronic component 51 is defined as L1. The distance L2 is longer than the distance L1 (L2> L1). That is, the second electronic component 52 and the light emitting element 4, which generate a relatively large amount of heat as compared with the first electronic component 51, are arranged apart from each other.

Further, a nightlight and an infrared light receiving element are mounted on the substrate 3. The nightlight and the infrared light receiving element are arranged in the first region S1 on the first surface 31 of the substrate 3. The nightlight is a surface-mounted LED, which is surface-mounted on the substrate 3. The nightlight is turned on by the electric power supplied from the power supply unit 5. The infrared light receiving element is a surface mount type electronic component and can receive an infrared signal transmitted from an infrared remote controller. The power supply unit 5 controls the lighting state (lighting, extinguishing, dimming, etc.) of the plurality of light emitting elements 4 according to the command included in the infrared signal received by the infrared light receiving element. Further, the power supply unit 5 controls the lighting state (on / off) of the nightlight according to the command included in the infrared signal received by the infrared light receiving element.

A case 601 is provided on the first surface 31 of the substrate 3 so as to surround the nightlight and the infrared light receiving element mounted on the substrate 3. The case 601 has a circular through hole 602 penetrating in the vertical direction, and is made of a synthetic resin that blocks visible light. The case 601 is provided so that the nightlight and the infrared light receiving element are located in the through hole 602. As a result, the incident of light from the plurality of light emitting elements 4 to the infrared light receiving elements is suppressed. The nightlight and the infrared light receiving element are not indispensable for the lighting fixture 1, and may be omitted.

The power supply cover 6 is made of a metal plate (for example, a steel plate or the like), and is formed in a substantially truncated cone shape (bowl shape) having an open upper surface. In the power supply cover 6, the flange 61 formed at the upper end thereof faces the region between the first region S1 and the second region S2 of the substrate 3, and lowers the plurality of first electronic components 51 mounted on the substrate 3. It is provided on the first surface 31 side of the substrate 3 so as to cover it from the side (see FIG. 3). FIG. 3 is a cross-sectional view of the lighting fixture 1 that is parallel to the vertical direction through the central portion of the through hole 33 of the substrate 3. In FIG. 3, the adapter 11, the light source cover 7, and the glove 8 are not shown. The power supply cover 6 may be configured such that the flange 61 is omitted and the upper end portion of the power supply cover 6 is located between the plurality of light emitting elements 4 and the plurality of first electronic components 51.

Further, the power supply cover 6 has a circular through hole 62 formed in a substantially central portion of the lower surface thereof. The diameter of the through hole 62 is substantially the same as the inner diameter of the tubular body 131 of the protective cover 13, and exposes the lower surface of the adapter 11. Further, the power supply cover 6 is formed with a substantially rectangular recess 63 so as to avoid the case 601. Therefore, the nightlight and the infrared light receiving element surrounded by the case 601 are exposed from the power supply cover 6.

The light source cover 7 has an annular base 71 and a plurality of lenses 72. The plurality of lenses 72 are formed in a hemispherical shape and are formed so as to project from the lower surface of the base 71. The plurality of lenses 72 are arranged in two rows (double) concentrically so as to have a one-to-one correspondence with the plurality of light emitting elements 4 mounted on the substrate 3. The light source cover 7 is provided under the substrate 3 so that each lens 72 covers the light emitting element 4. The base 71 and the plurality of lenses 72 are integrally formed of glass or a translucent synthetic resin (for example, acrylic resin, polycarbonate resin, etc.). Further, the light source cover 7 has a light receiving portion cover 73 protruding from the inner edge of the base 71. The light receiving portion cover 73 covers the through hole 602 of the case 601 from below.

The glove 8 is made of a translucent synthetic resin, and is formed in a flat dome shape with an open upper surface. A plurality of (three in FIG. 1) attachments 201 for holding the glove 8 are provided on the lower surface of the instrument main body 2. The three fixtures 201 are provided on the lower surface of the instrument main body 2 at substantially equal intervals in the circumferential direction. The glove 8 is detachably attached to the instrument main body 2 via three attachments 201.

Next, the advantages of the lighting fixture 1 of the present embodiment will be described.

As shown in FIGS. 2A, 2B, and 3, a plurality of light emitting elements 4 are arranged in the second region S2 on the first surface 31 of the substrate 3, and a plurality of first electronic components 51 are arranged in the first region S1. .. Further, a plurality of second electronic components 52 are arranged in the third region S3 on the second surface 32 of the substrate 3. The plurality of first electronic components 51 are covered with a power supply cover 6.

Here, the lighting fixture of the comparative example will be described. In the lighting fixture of the comparative example, a plurality of first electronic components and a plurality of second electronic components are arranged on the same plane, and these are covered with a power supply cover. In the lighting fixture of this comparative example, the height dimension (vertical dimension) of the power supply cover is set so that the power supply cover does not come into contact with the plurality of second electronic components. Need to be even larger than.

On the other hand, in the luminaire 1 of the present embodiment, the plurality of first electronic components 51, which are surface mount components having a relatively small height dimension, are arranged on the same first surface 31 as the plurality of light emitting elements 4. Further, the plurality of second electronic components 52 having a relatively large height dimension are arranged on the second surface 32 on the side opposite to the first surface 31. Therefore, the height dimension of the power supply cover 6 that covers only the plurality of first electronic components 51 having a relatively small height dimension is the power supply of the comparative example that covers both the plurality of first electronic components and the plurality of second electronic components. It can be made lower than the height dimension of the cover. That is, the height dimension of the power supply cover 6 can be reduced. As a result, the amount of light blocked by the power supply cover 6 among the irradiation lights of the plurality of light emitting elements 4 is reduced, so that when the luminaire 1 is viewed from below, the central portion is suppressed from appearing darker than the outer peripheral portion. Therefore, it is possible to suppress a decrease in illuminance.

Further, in the lighting fixture 1 of the present embodiment, the infrared light receiving element is a surface mount component, is arranged on the first surface 31 of the substrate 3, and is a through hole 602 of the case 601 fitted in the recess 63 of the power supply cover 6. It is surrounded by the inner peripheral surface of. As described above, since the height dimension of the power supply cover 6 can be reduced, the height dimension of the case 601 can also be reduced. As a result, it is possible to suppress the infrared signal transmitted from the remote controller from being blocked by the case 601 and to expand the receivable range of the infrared signal in the infrared light receiving element.

Further, in the lighting fixture 1 of the present embodiment, the nightlight is composed of a surface mount type LED. Therefore, the nightlight can be a common component with the light emitting element 4 which is the main light source, and the cost of the luminaire 1 can be reduced.

Further, in the lighting fixture 1 of the present embodiment, the substrate 3 is composed of a single-sided substrate. Therefore, it is possible to reduce the cost of the luminaire 1 as compared with the case where the substrate 3 is composed of a double-sided substrate in which conductors are provided on the first surface 31 side and the second surface 32 side.

The substrate 3 may be composed of a double-sided substrate, and surface mount type electronic components may be arranged on the second surface 32. Further, a copper foil may be provided on the second surface 32 side of the substrate 3. It is preferable that the copper foil is provided on the second surface 32 side (upper side) opposite to the substrate 3 with respect to the second region S2. With this copper foil, the heat generated from the plurality of light emitting elements 4 can be dissipated, and the temperature rise can be suppressed. Further, the copper foil makes it possible to suppress the warp of the substrate 3.

Further, in the lighting fixture 1 of the present embodiment, in the plan view of the substrate 3, the third region S3 is a region inside the substrate 3 rather than the first region S1, and the second region S2 rather than the first region S1. It is a remote area. That is, the second electronic component 52, which generates a relatively large amount of heat, and the light emitting element 4 are arranged at separate positions. Therefore, the thermal interference between the light emitting element 4 and the second electronic component 52 is suppressed, and the temperature rise of the luminaire 1 can be suppressed. Further, since the light emitting element 4 and the second electronic component 52 are arranged on opposite surfaces with the substrate 3 interposed therebetween, thermal interference between the light emitting element 4 and the second electronic component 52 is further suppressed, and the lighting fixture is lit. It is possible to further suppress the temperature rise of 1. The third region S3 may include a region outside the first region S1.

<Summary>
The lighting fixture 1 according to the first aspect of the present embodiment includes a plurality of light emitting elements 4, a power supply unit 5, a substrate 3, a fixture main body 2, and a power supply cover 6. The power supply unit 5 has a plurality of first electronic components 51 and a plurality of second electronic components 52, and supplies electric power to the plurality of light emitting elements 4. The substrate 3 has a first surface 31 and a second surface 32 opposite to the first surface 31. In the substrate 3, a plurality of first electronic components 51 are arranged in the first region S1 on the first surface 31, and a plurality of light emitting elements 4 are arranged in the second region S2 outside the first region S1 on the first surface 31. The second electronic component 52 is arranged on the second surface 32. The substrate 3 is attached to the instrument main body 2 so that the second surface 32 faces each other. The power supply cover 6 covers a plurality of first electronic components 51 arranged on the substrate 3. The plurality of first electronic components 51 are surface mount components.

With the above configuration, the height dimension of the power supply cover 6 can be reduced, and the amount of light blocked by the power supply cover 6 among the irradiation lights of the plurality of light emitting elements 4 is reduced to suppress the decrease in illuminance. Is possible.

Further, in the lighting fixture 1 according to the second aspect, in the first aspect, the substrate 3 is preferably a single-sided substrate having a conductor only on the first surface 31 side. The plurality of second electronic components 52 are lead-type electronic components, and are preferably electrically connected to the conductor by through-hole mounting.

With the above configuration, since the substrate 3 is composed of a single-sided substrate, it is possible to reduce the cost of the luminaire 1 as compared with the case where the substrate 3 is composed of a double-sided substrate.

Further, in the lighting fixture 1 according to the third aspect, in the first or second aspect, it is preferable that the plurality of second electronic components 52 are arranged in the third region S3 on the second surface 32. In the plan view of the substrate 3, the outer edge of the third region S3 is preferably inside the outer edge of the first region S1.

With the above configuration, since the second electronic component 52 having a relatively large heat generation amount and the light emitting element 4 are arranged at separate positions, thermal interference between the light emitting element 4 and the second electronic component 52 is suppressed, and the lighting fixture 1 It is possible to suppress the temperature rise of.

1 Lighting equipment 2 Equipment body 3 Board 31 First surface 32 Second surface 4 Light emitting element 5 Power supply unit 51 First electronic component 52 Second electronic component 6 Power supply cover S1 First area S2 Second area S3 Third area

Claims (3)

With multiple light emitting elements
A power supply unit having a plurality of first electronic components and a plurality of second electronic components and supplying electric power to the plurality of light emitting elements.
It has a first surface and a second surface opposite to the first surface, and the plurality of first electronic components are arranged in the first region of the first surface, more than the first region of the first surface. A substrate in which the plurality of light emitting elements are arranged in the outer second region and the second electronic component is arranged on the second surface.
The instrument body to which the substrate is mounted so that the second surface faces each other,
A power supply cover that covers all of the plurality of first electronic components arranged on the substrate and does not cover the plurality of light emitting elements is provided.
The plurality of first electronic components are surface mount components, and are surface mount components.
The height dimension of the first electronic component having the largest height dimension among the plurality of first electronic components is larger than the height dimension of the second electronic component having the largest height dimension among the plurality of second electronic components. small,
The power supply cover is a luminaire characterized in that it is made of a material having no translucency. The substrate is a single-sided substrate having a conductor only on the first surface side.
The luminaire according to claim 1, wherein the plurality of second electronic components are lead-type electronic components and are electrically connected to the conductor by mounting through holes. The plurality of second electronic components are arranged in a third region on the second surface.
The plurality of second electronic components include electronic components having a larger calorific value than the plurality of first electronic components.
The luminaire according to claim 1 or 2, wherein the outer edge of the third region is inside the outer edge of the first region in a plan view of the substrate.

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