JP6628759B2 - プリコート用はんだ組成物およびプリント配線基板の製造方法 - Google Patents

プリコート用はんだ組成物およびプリント配線基板の製造方法 Download PDF

Info

Publication number
JP6628759B2
JP6628759B2 JP2017067124A JP2017067124A JP6628759B2 JP 6628759 B2 JP6628759 B2 JP 6628759B2 JP 2017067124 A JP2017067124 A JP 2017067124A JP 2017067124 A JP2017067124 A JP 2017067124A JP 6628759 B2 JP6628759 B2 JP 6628759B2
Authority
JP
Japan
Prior art keywords
solder
mass
composition
component
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017067124A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018167297A (ja
Inventor
紀成 飯島
紀成 飯島
瞳 木村
瞳 木村
拓生 原
拓生 原
悠希 酒井
悠希 酒井
正訓 柴▲崎▼
正訓 柴▲崎▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
Original Assignee
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Priority to JP2017067124A priority Critical patent/JP6628759B2/ja
Priority to TW107107869A priority patent/TWI781148B/zh
Priority to KR1020180029140A priority patent/KR102455841B1/ko
Priority to CN201810297135.7A priority patent/CN108687463B/zh
Publication of JP2018167297A publication Critical patent/JP2018167297A/ja
Application granted granted Critical
Publication of JP6628759B2 publication Critical patent/JP6628759B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2017067124A 2017-03-30 2017-03-30 プリコート用はんだ組成物およびプリント配線基板の製造方法 Active JP6628759B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017067124A JP6628759B2 (ja) 2017-03-30 2017-03-30 プリコート用はんだ組成物およびプリント配線基板の製造方法
TW107107869A TWI781148B (zh) 2017-03-30 2018-03-08 預敷層用焊料組合物及印刷配線基板之製造方法
KR1020180029140A KR102455841B1 (ko) 2017-03-30 2018-03-13 프리코팅용 땜납 조성물 및 프린트 배선기판의 제조방법
CN201810297135.7A CN108687463B (zh) 2017-03-30 2018-03-30 预涂层用焊料组合物、印刷布线基板的制造方法、焊料组合物及电子基板的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017067124A JP6628759B2 (ja) 2017-03-30 2017-03-30 プリコート用はんだ組成物およびプリント配線基板の製造方法

Publications (2)

Publication Number Publication Date
JP2018167297A JP2018167297A (ja) 2018-11-01
JP6628759B2 true JP6628759B2 (ja) 2020-01-15

Family

ID=63864915

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017067124A Active JP6628759B2 (ja) 2017-03-30 2017-03-30 プリコート用はんだ組成物およびプリント配線基板の製造方法

Country Status (3)

Country Link
JP (1) JP6628759B2 (zh)
KR (1) KR102455841B1 (zh)
TW (1) TWI781148B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6826061B2 (ja) * 2018-02-09 2021-02-03 株式会社タムラ製作所 はんだ組成物および電子基板の製造方法
TWI690947B (zh) * 2018-11-30 2020-04-11 台灣愛司帝科技股份有限公司 導電物質的布局方法、布局結構及包含其之ｌｅｄ顯示器
JP6795778B1 (ja) 2020-03-30 2020-12-02 千住金属工業株式会社 フラックス、フラックスを用いたやに入りはんだ、フラックスを用いたフラックスコートはんだ、およびはんだ付け方法
JP6928295B1 (ja) 2020-10-02 2021-09-01 千住金属工業株式会社 フラックス及びソルダペースト
CN114161030A (zh) * 2021-11-25 2022-03-11 苏州优诺电子材料科技有限公司 一种无铅水洗低温焊接锡膏助焊剂

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002086292A (ja) * 2000-02-08 2002-03-26 Showa Denko Kk ハンダペースト
JP2003010996A (ja) * 2001-06-27 2003-01-15 Nippon Filler Metals Co Ltd 鉛フリーソルダペースト
JP2005152999A (ja) * 2003-11-28 2005-06-16 Tamura Kaken Co Ltd ソルダーペースト組成物
JP4385061B2 (ja) * 2006-08-28 2009-12-16 ハリマ化成株式会社 はんだペースト組成物およびその用途
JP6136690B2 (ja) * 2012-08-01 2017-05-31 三菱マテリアル株式会社 ハンダペースト
JP6569905B2 (ja) * 2014-11-21 2019-09-04 荒川化学工業株式会社 スクリーン印刷用フラックス
EP3263272B1 (en) * 2015-02-27 2020-04-01 Senju Metal Industry Co., Ltd. Flux

Also Published As

Publication number Publication date
TWI781148B (zh) 2022-10-21
KR20180111529A (ko) 2018-10-11
TW201840724A (zh) 2018-11-16
JP2018167297A (ja) 2018-11-01
KR102455841B1 (ko) 2022-10-18

Similar Documents

Publication Publication Date Title
JP6310894B2 (ja) はんだ組成物および電子基板の製造方法
JP6628759B2 (ja) プリコート用はんだ組成物およびプリント配線基板の製造方法
JP6370327B2 (ja) ジェットディスペンサー用はんだ組成物
JP6402213B2 (ja) はんだ組成物および電子基板
JP6383768B2 (ja) はんだ組成物および電子基板の製造方法
JP6310893B2 (ja) フラックス組成物、はんだ組成物、および電子基板の製造方法
JP6138846B2 (ja) はんだ組成物およびそれを用いた電子基板の製造方法
JP6913064B2 (ja) はんだ組成物および電子基板の製造方法
JP6635986B2 (ja) はんだ組成物および電子基板
JP5916674B2 (ja) ジェットディスペンサー用はんだ組成物
JP6713027B2 (ja) はんだ組成物および電子基板
TWI704024B (zh) 助焊劑組成物及焊料膏組成物
JP6293514B2 (ja) はんだ組成物およびプリント配線基板の製造方法
JP6300771B2 (ja) フラックス組成物、はんだ組成物および電子基板の製造方法
JP6895213B2 (ja) はんだ組成物および電子基板の製造方法
JP6402148B2 (ja) はんだ組成物および電子基板
CN109290701B (zh) 焊料组合物、电子基板及电子基板的制造方法
JP2020055035A (ja) はんだ組成物および電子基板
JP6826059B2 (ja) フラックス組成物、はんだ組成物および電子基板
JP7361481B2 (ja) はんだ組成物および電子基板の製造方法
CN108687463B (zh) 预涂层用焊料组合物、印刷布线基板的制造方法、焊料组合物及电子基板的制造方法
JP2022054100A (ja) はんだ組成物および電子基板
JP6259795B2 (ja) はんだ組成物および電子基板の製造方法
JP6383587B2 (ja) フラックス組成物、はんだ組成物、および電子基板の製造方法
JP7503604B2 (ja) はんだ組成物および電子基板の製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20180417

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20190325

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190409

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190604

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20191119

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20191203

R150 Certificate of patent or registration of utility model

Ref document number: 6628759

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150