JP6627875B2 - Pattern drawing apparatus and pattern drawing method - Google Patents

Description

  The present invention relates to a pattern drawing apparatus and a pattern drawing method for drawing a pattern by scanning a spot light of a beam irradiated on an irradiation object.

  As disclosed in Japanese Patent Application Laid-Open No. 2004-117865, in a laser scanning device (color laser printer) that draws an image on a photoconductor by scanning with a laser beam, a plurality of laser beams are scanned using one polygon mirror. 2. Description of the Related Art There is known a technique of scanning each of them and drawing an image along a plurality of scanning lines.

  Japanese Patent Application Laid-Open No. 2004-117865 discloses that a scanning line generated by a plurality of laser beams deflected and scanned by different reflecting surfaces of one polygon mirror is separated in a sub-scanning direction which is a moving direction of an irradiation object. There is disclosed a tandem laser scanning device which is arranged in parallel. In the case of the laser scanning device disclosed in Japanese Patent Application Laid-Open No. 2004-117865, the maximum dimension of an image that can be drawn on an irradiation target (such as a photosensitive drum) in the scanning line direction (main scanning direction) is the length of one scanning line. It will be decided by that. Therefore, in order to increase the size of a drawable image in the main scanning direction, it is necessary to increase the size of a scanning optical system (such as a lens and a mirror) after the polygon mirror so that the scanning line becomes longer. On the other hand, in an exposure apparatus which draws and exposes a high-definition pattern for an electronic circuit having a minimum line width of about several μm to 20 μm by scanning with a spot light, the dimension (diameter) of the spot light is reduced to a fraction of the minimum line width. In addition to (１ ／ to ４), it is necessary to control the intensity modulation of the spot light according to the data of the drawing pattern with high accuracy and high speed in synchronization with the spot light projection position on the scanning line. However, if one scanning line generated by the deflection scanning of the beam by the polygon mirror is lengthened, the scanning line arrangement accuracy required for high-definition pattern drawing is increased due to the enlargement of the scanning optical system after the polygon mirror. It is difficult to maintain stable optical performance.

According to a first aspect of the present invention, while a subject to be irradiated, which is a flexible and long sheet substrate, is sub-scanned in the longitudinal direction, a spot light whose intensity is modulated based on drawing data is irradiated to the longitudinal direction of the subject. A pattern drawing apparatus that draws a pattern in accordance with the drawing data on the irradiation target by performing main scanning along a scanning line extending in a width direction orthogonal to a direction, wherein a rotation axis is used for the main scanning. A rotating polygonal mirror that rotates around the first mirror, a first light guiding optical system that projects a first beam from the first direction toward the rotating polygonal mirror, and a second light guiding optical system that projects the second beam from the first direction. A second light guide optical system for projecting from the direction toward the rotating polygon mirror, and condensing the first beam reflected by the rotating polygon mirror and projecting the first beam as a first spot light on a first scanning line. A first projection optical system, and a light reflected by the rotating polygon mirror. A second projection optical system for condensing a second beam and projecting it as a second spot light on a second scanning line, wherein each scanning length of the first scanning line and the second scanning line is provided. And the first projection optical system is set such that the first scanning line and the second scanning line are set separately in the main scanning direction at intervals equal to or less than the scanning length. And the second projection optical system.

According to a second aspect of the present invention, an object to be irradiated, which is a flexible and long sheet substrate, is sub-scanned in the longitudinal direction, and a spot light whose intensity is modulated based on drawing data is irradiated in the longitudinal direction of the object. A pattern writing method for writing a pattern corresponding to the writing data on the irradiation target by performing main scanning along a scanning line extending in a width direction orthogonal to a direction, wherein a first beam is emitted in a first direction. Projecting from a second direction to the rotating polygonal mirror, projecting a second beam from the second direction different from the first direction toward the rotating polygonal mirror, and impinging on a different reflection surface of the rotating polygonal mirror. Deflecting and scanning the first beam and the second beam reflected by the rotation of the rotary polygon mirror, and condensing the first beam reflected by the rotary polygon mirror into a first beam. Scan line as spot light And condensing the second beam reflected by the rotating polygon mirror and projecting the second beam as a second spot light on a second scanning line, wherein the first scanning line And the respective scanning lengths of the second scanning line are set to be the same, and the first scanning line and the second scanning line are separately set in the main scanning direction at intervals equal to or less than the scanning length. Have been.

FIG. 1 is a diagram illustrating a schematic configuration of a device manufacturing system including an exposure apparatus that performs an exposure process on a substrate according to a first embodiment. FIG. 2 is a diagram showing an arrangement relationship of a plurality of drawing units shown in FIG. 1 and an arrangement relationship of drawing lines of each drawing unit installed on an irradiation surface of a substrate. FIG. 4 is a diagram illustrating a layout relationship of drawing lines of each drawing unit when edges of drawing lines adjacent in the main scanning direction are made to coincide with each other. FIG. 7 is a diagram illustrating a layout relationship of drawing lines of each drawing unit in a case where ends of drawing lines adjacent in the scanning direction are overlapped by a fixed length. FIG. 2 is a configuration diagram of the drawing unit illustrated in FIG. 1 as viewed from a −Yt (−Y) direction side. FIG. 6 is a configuration diagram of the drawing unit shown in FIG. 5 as viewed from the + Zt direction side. FIG. 6 is a diagram illustrating an optical path of a beam transmitted through the optical element and the collimator lens illustrated in FIG. 5 and incident on the reflection mirror as viewed from the + Zt direction side. FIG. 5 is a diagram illustrating an optical path of a beam incident on the reflection mirror of the drawing unit from the reflection mirror as viewed from the + Xt direction side. FIG. 6 is a diagram illustrating an arrangement relationship between a reflection mirror as a reflection member and a condenser lens in the drawing unit illustrated in FIG. 5 in an XtZt plane. FIG. 10 is a diagram illustrating an arrangement relationship between a reflection mirror as a reflection member and a condenser lens illustrated in FIG. 9 in an XtYt plane. FIG. 11A shows a state in which the reflection direction of a beam incident parallel to a reflection mirror as a reflection member changes when the entire drawing unit shown in FIG. 5 is rotated around a rotation center axis by a predetermined angle. FIG. 11B is a diagram viewed from the + Zt direction side, and FIG. 11B is a diagram illustrating a change in the position of the beam on the reflecting mirror serving as a reflecting member when the entire drawing unit shown in FIG. FIG. FIG. 9 is a diagram when a beam scanning system using a polygon mirror according to a first modification of the first embodiment is viewed from the + Zt direction side. FIG. 13 is a diagram when the beam scanning system of FIG. 12 is viewed from the + Xt direction side. FIG. 13 is a diagram when an optical path of a beam incident on and reflected from a polygon mirror according to Modification 2 of the first embodiment is viewed from the + Zt direction side. FIG. 15 is a diagram when the beam scanning system of FIG. 14 is viewed from the + Xt direction side. FIG. 16A is a diagram when the beam scanning system by the polygon mirror according to the fourth modification of the first embodiment is viewed from the + Zt direction side, and FIG. 16B is a diagram when the beam scanning system of FIG. 16A is viewed from the −Xt direction side. FIG. FIG. 9 is a diagram illustrating a configuration of a part of a drawing unit according to a second embodiment. It is a block diagram of the drawing unit Ub of 3rd Embodiment seen from the -Yt (-Y) direction side. FIG. 19 is a view of the configuration on the + Zt side from the polygon mirror in the drawing unit shown in FIG. 18 when viewed in the + Xt direction. FIG. 19 is a diagram of the configuration of the drawing unit shown in FIG. 18 on the −Zt direction side from the polygon mirror as viewed from the + Zt direction side. An example is shown in which an exposure region as an electronic device formation region formed on a substrate is divided into six in the Y (Yt) direction, and each of a plurality of stripe-shaped divided regions is drawn with six drawing lines. . FIG. 14 is a diagram illustrating an example of an arrangement angle of a reflection mirror provided after the Fθ lens according to the third embodiment. FIG. 3 is a diagram illustrating an example of a configuration of a beam distribution system for distributing two beams provided from the light source device 14 illustrated in FIG. 1 to each of four drawing units illustrated in FIG. 2. It is a figure explaining the deflection state of the beam between the polygon mirror and the subsequent reflection mirror of the drawing unit by a 4th embodiment. 25 is a graph illustrating characteristics of an example of the dependency of the reflectance on the incident angle in the polygon mirror and the reflection mirror in FIG. 24. FIG. 3 is a diagram illustrating a configuration of a control system including an acousto-optic modulator (AOM) for adjusting a change in beam intensity due to the incident angle dependence of the reflectance of the reflection mirror. FIG. 27 is a time chart illustrating an example of a waveform and timing of a signal of each unit in the control system of FIG. 26.

  Preferred embodiments of a pattern drawing apparatus and a pattern drawing method according to aspects of the present invention will be described below in detail with reference to the accompanying drawings. Note that aspects of the present invention are not limited to these embodiments, and include various modifications or improvements. That is, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same, and the components described below can be appropriately combined. In addition, various omissions, substitutions, or changes of the components can be made without departing from the spirit of the present invention.

[First Embodiment]
FIG. 1 is a diagram illustrating a schematic configuration of a device manufacturing system 10 including an exposure apparatus EX that performs an exposure process on a substrate (object to be irradiated) P according to the first embodiment. In the following description, an XYZ orthogonal coordinate system in which the gravitational direction is the Z direction is set, and the X direction, the Y direction, and the Z direction are described according to the arrows shown in the drawings unless otherwise specified.

  The device manufacturing system 10 includes, for example, a manufacturing line for manufacturing a flexible display as an electronic device, a film-shaped touch panel, a film-shaped color filter for a liquid crystal display panel, or a flexible wiring sheet to which electronic components are soldered. It is a constructed manufacturing system. The following description is based on the premise that a flexible display is used as an electronic device. Examples of the flexible display include an organic EL display and a liquid crystal display. The device manufacturing system 10 sends out a substrate P from a supply roll (not shown) in which a flexible sheet-like (film-like) substrate (sheet substrate) P is wound into a roll, and performs various processes on the sent substrate P. Is continuously wound, and the substrate P after various kinds of processing is wound up by a recovery roll (not shown), that is, a so-called roll-to-roll type structure. The substrate P has a band-like shape in which the moving direction of the substrate P is a longitudinal direction (long) and the width direction is a short direction (short). The substrate P sent from the supply roll is sequentially subjected to various processes by a process device PR1, an exposure device (pattern drawing device, beam scanning device) EX, a process device PR2, and the like, and is wound by the collection roll. .

  The X direction is a direction (transport direction) from the process device PR1 to the process device PR2 via the exposure device EX in the horizontal plane. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P. The Z direction is a direction (upward direction) orthogonal to the X direction and the Y direction, and is parallel to the direction in which gravity acts.

  As the substrate P, for example, a resin film or a foil (foil) made of metal or alloy such as stainless steel is used. As the material of the resin film, for example, polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, and vinyl acetate resin Among them, one containing at least one or more may be used. The thickness and rigidity (Young's modulus) of the substrate P may be in a range that does not cause folds or irreversible wrinkles due to buckling of the substrate P when passing through the transport path of the exposure apparatus EX. As a base material of the substrate P, a film such as PET (polyethylene terephthalate) or PEN (polyethylene naphthalate) having a thickness of about 25 μm to 200 μm is a typical example of a suitable sheet substrate.

  Since the substrate P may receive heat in each processing performed in the process device PR1, the exposure device EX, and the process device PR2, it is preferable to select a substrate P of a material whose coefficient of thermal expansion is not significantly large. For example, a thermal expansion coefficient can be suppressed by mixing an inorganic filler with a resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, alumina, silicon oxide, or the like. Further, the substrate P may be a single-layered body of ultra-thin glass having a thickness of about 100 μm manufactured by a float method or the like, or a laminated body in which the above-described resin film, foil, and the like are bonded to this ultra-thin glass. It may be.

  By the way, the flexibility of the substrate P means a property that the substrate P can be bent without being sheared or broken even when a force of its own weight is applied to the substrate P. . In addition, the property of being bent by the force of its own weight is also included in the flexibility. In addition, the degree of flexibility changes according to the material, size and thickness of the substrate P, the layer structure formed on the substrate P, the environment such as temperature and humidity, and the like. In any case, when the substrate P is correctly wound around a member for changing the transfer direction such as various transfer rollers and a rotating drum provided in a transfer path in the device manufacturing system 10 according to the first embodiment, If the substrate P can be smoothly transported without being bent and creased or broken (breaking or cracking), it can be said that the substrate P is in the range of flexibility.

  The process apparatus PR1 performs a pre-process on the substrate P to be exposed by the exposure apparatus EX. The process device PR1 sends the substrate P that has been subjected to the process in the preceding process to the exposure device EX. The substrate P sent to the exposure apparatus EX is a substrate (photosensitive substrate) P on the surface of which a photosensitive functional layer (photosensitive layer, photosensitive layer) is formed by the processing in the preceding step.

  This photosensitive functional layer is applied as a solution on the substrate P and dried to form a layer (film). A typical example of the photosensitive functional layer is a photoresist, but a photosensitive silane coupling agent (SAM) is used as a material that does not require a development process, in which lyophilicity of a portion exposed to ultraviolet rays is modified. Alternatively, there is a photosensitive reducing agent or the like in which a plating reducing group is exposed in a portion irradiated with ultraviolet rays. When a photosensitive silane coupling agent is used as the photosensitive functional layer, the pattern portion exposed to ultraviolet light on the substrate P is modified from lyophobic to lyophilic. Therefore, by selectively applying a conductive ink (an ink containing conductive nanoparticles such as silver or copper) or a liquid containing a semiconductor material on the lyophilic portion, a thin film transistor (TFT), etc. , A pattern layer serving as an electrode, a semiconductor, an insulation, or a wiring for connection can be formed. When a photosensitive reducing agent is used as the photosensitive functional layer, a plating reducing group is exposed on a pattern portion of the substrate P exposed to ultraviolet light. Therefore, after exposure, the substrate P is immediately immersed in a plating solution containing palladium ions or the like for a certain period of time, whereby a pattern layer of palladium is formed (deposited). Such a plating process is an additive process, but in addition, when the etching process as a subtractive process is premised, the substrate P sent to the exposure apparatus EX uses a base material such as PET or the like. PEN may be used in which a metallic thin film such as aluminum (Al) or copper (Cu) is entirely or selectively deposited on the surface, and a photoresist layer is further laminated thereon.

  In the first embodiment, the exposure apparatus EX is a direct-write type exposure apparatus that does not use a mask, that is, a so-called raster scan type exposure apparatus. The exposure apparatus EX irradiates an irradiated surface (photosensitive surface) of the substrate P supplied from the process apparatus PR1 with a light pattern corresponding to a predetermined pattern such as a display circuit or a wiring. As will be described later in detail, the exposure apparatus EX transfers the spot light SP of the exposure beam LB onto the substrate P (the irradiation surface of the substrate P) while transporting the substrate P in the + X direction (sub-scanning direction). In (upper), the intensity of the spot light SP is modulated (on / off) at high speed according to the pattern data (drawing data) while performing one-dimensional scanning (main scanning) in a predetermined scanning direction (Y direction). Thus, a light pattern corresponding to a predetermined pattern such as a display circuit or a wiring is drawn and exposed on the irradiated surface of the substrate P. That is, in the sub-scanning of the substrate P and the main scanning of the spot light SP, the spot light SP is relatively two-dimensionally scanned on the irradiated surface of the substrate P, and a predetermined pattern is drawn and exposed on the substrate P. . The exposure apparatus EX repeatedly performs pattern exposure for an electronic device on the substrate P. Since the substrate P is transported along the transport direction (+ X direction), the pattern is exposed by the exposure apparatus EX. A plurality of exposure regions W are provided at predetermined intervals along the longitudinal direction of the substrate P (see FIG. 2). Since an electronic device is formed in this exposure region W, the exposure region W is also an electronic device formation region. In addition, since the electronic device is configured by overlapping a plurality of pattern layers (layers on which patterns are formed), a pattern corresponding to each layer is exposed by the exposure apparatus EX.

  The process device PR2 performs a post-process (for example, a plating process or a development / etching process) on the substrate P exposed by the exposure device EX. A pattern layer of the device is formed on the substrate P by the processing in the subsequent process.

  As described above, since the electronic device is configured by overlapping a plurality of pattern layers, one pattern layer is generated through at least each processing of the device manufacturing system 10. Therefore, in order to generate an electronic device, each process of the device manufacturing system 10 as shown in FIG. 1 must be performed at least twice. Therefore, the pattern layer can be laminated by mounting the collection roll on which the substrate P is wound up as a supply roll in another device manufacturing system 10. By repeating such an operation, an electronic device is formed. Therefore, the processed substrate P is in a state in which a plurality of electronic devices are arranged along the longitudinal direction of the substrate P at predetermined intervals. That is, the substrate P is a substrate for multi-panning.

  The collection roll that has collected the substrate P formed in a state in which the electronic devices are connected may be mounted on a dicing device (not shown). The dicing apparatus to which the collection roll is attached divides (dices) the processed substrate P into electronic devices to make a plurality of single-wafer electronic devices. The dimensions of the substrate P are, for example, about 10 cm to 2 m in the width direction (shorter direction) and 10 m or more in the length direction (longer direction). Note that the dimensions of the substrate P are not limited to the dimensions described above.

  Next, the exposure apparatus EX will be described in detail. The exposure apparatus EX is stored in a temperature control chamber ECV. The temperature control chamber ECV keeps the inside at a predetermined temperature and a predetermined humidity, thereby suppressing a shape change due to the temperature of the substrate P conveyed inside, and is generated due to the hygroscopicity of the substrate P and the conveyance. The humidity is set in consideration of static electricity charging and the like. The temperature control chamber ECV is arranged on the installation surface E of the manufacturing factory via the passive or active vibration isolation units SU1 and SU2. The anti-vibration units SU1 and SU2 reduce vibration from the installation surface E. The installation surface E may be a surface on an installation base (pedestal) laid exclusively on the floor of a factory, or may be a floor. The exposure apparatus EX includes at least a substrate transport mechanism 12, a light source device 14, an exposure head 16, a control device 18, and alignment microscopes AMa (AMa1 to AMa4) and AMb (AMb1 to AMb4).

  The substrate transport mechanism 12 transports the substrate P transported from the process device PR1 to the process device PR2 at a predetermined speed. The substrate transport mechanism 12 defines a transport path of the substrate P transported in the exposure apparatus EX. The substrate transport mechanism 12 includes an edge position controller EPC, a driving roller R1, a tension adjusting roller RT1, a rotary drum (cylindrical drum stage) DR1, and a tension adjusting roller RT2 in order from the upstream side (−X direction side) of the substrate P in the transport direction. , A rotary drum (cylindrical drum stage) DR2, a tension adjusting roller RT3, and a driving roller R2.

  The edge position controller EPC adjusts the position of the substrate P conveyed from the process device PR1 in the width direction (the Y direction and the shorter direction of the substrate P). In other words, the edge position controller EPC sets the position at the edge (edge) in the width direction of the substrate P, which is being conveyed in a state where a predetermined tension is applied, at ± 10 to several tens μm to the target position. The substrate P is moved in the width direction so as to fall within the range (allowable range), and the position of the substrate P in the width direction is adjusted. The edge position controller EPC includes a roller on which the substrate P is stretched in a state where a predetermined tension is applied, and an edge sensor (edge detection unit) (not shown) for detecting a position of an edge (edge) in the width direction of the substrate P. And The edge position controller EPC adjusts the position of the substrate P in the width direction by moving the roller of the edge position controller EPC in the Y direction based on the detection signal detected by the edge sensor. The drive roller (nip roller) R1 rotates while holding the front and back surfaces of the substrate P conveyed from the edge position controller EPC, and conveys the substrate P toward the rotating drum DR1. The edge position controller EPC adjusts the position of the substrate P in the width direction such that the long direction of the substrate P conveyed to the rotary drum DR1 is orthogonal to the center axis AXo1 of the rotary drum DR1. The substrate P transported from the driving roller R1 is guided over the rotary drum DR1 after being stretched over the tension adjusting roller RT1.

  The rotating drum (first rotating drum) DR1 has a central axis (first central axis) AXo1 extending in the Y direction and intersecting the direction in which gravity acts, and a cylindrical outer peripheral surface having a constant radius from the central axis AXo1. And The rotary drum DR1 supports the part of the substrate P by bending it in a cylindrical shape in the longitudinal direction along the outer peripheral surface (circumferential surface), and rotates the substrate P about the central axis AXo1 to move the substrate P by + X. Transport in the direction. The rotating drum DR1 supports the substrate P from a surface (rear surface) opposite to the surface on which the photosensitive surface is formed, on the opposite side (+ Z direction side) to the direction in which gravity acts. The rotating drum DR1 supports, on its circumferential surface, a region (portion) on the substrate P on which the spot light of the beam from each of the drawing units U1, U2, U5, and U6 of the exposure head 16 described later is projected. On both sides of the rotating drum DR1 in the Y direction, there are provided shafts Sft1 supported by annular bearings so that the rotating drum DR1 rotates around the central axis AXo1. The shaft Sft1 rotates around the central axis AXo1 when a rotation torque from a rotation drive source (not shown) (not shown) controlled by the controller 18 is applied. For convenience, a plane including the central axis AXo1 and parallel to the YZ plane is referred to as a central plane Poc1.

  The substrate P carried out from the rotary drum DR1 is wound around the tension adjusting roller RT2, and then guided to the rotary drum DR2 provided downstream (on the + X direction side) of the rotary drum DR1. The rotating drum (second rotating drum) DR2 has the same configuration as the rotating drum DR1. In other words, the rotary drum DR2 has a central axis (second central axis) AXo2 extending in the Y direction and intersecting the direction in which gravity acts, and a cylindrical outer peripheral surface having a constant radius from the central axis AXo2. The rotary drum DR2 follows the outer peripheral surface (circumferential surface) and supports a part of the substrate P by curving it in a cylindrical shape in the longitudinal direction while rotating about the central axis AXo2 to move the substrate P by + X. Transport in the direction. The rotating drum DR2 supports the substrate P from the back side on the side opposite to the direction in which gravity acts (+ Z direction side). The rotating drum DR2 supports, on its circumferential surface, a region (portion) on the substrate P on which the spot light of a drawing beam from each of the drawing units U3 and U4 of the exposure head 16 described later is projected. The rotating drum DR2 is also provided with a shaft Sft2. The shaft Sft2 is rotated around a central axis AXo2 by receiving a rotation torque from a rotation drive source (for example, a motor or a reduction mechanism) (not shown) controlled by the control device 18. The central axis AXo1 of the rotary drum DR1 and the central axis AXo2 of the rotary drum DR2 are in a parallel state. For convenience, a plane including the central axis AXo2 and parallel to the YZ plane is referred to as a central plane Poc2.

  The substrate P unloaded from the rotary drum DR2 is guided over the tension adjusting roller RT2, and then guided by the drive roller R2. The drive roller (nip roller) R2 rotates while holding both the front and back surfaces of the substrate P, and transports the substrate P toward the process device PR2, similarly to the drive roller R1. The tension adjusting rollers RT1 to RT3 are urged in the −Z direction, and apply a predetermined tension to the substrate P wound and supported on the rotating drums DR1 and DR2 in the longitudinal direction. Thereby, the tension in the longitudinal direction applied to the substrate P on the rotating drums DR1 and DR2 is stabilized within a predetermined range. The control device 18 rotates the drive rollers R1 and R2 by controlling a rotation drive source (not shown) (for example, a motor or a speed reducer).

  The light source device 14 has a light source (pulse light source) and emits a pulsed beam (pulse light, laser) LB to each of the drawing units U1 to U6. This beam LB is ultraviolet light having a peak wavelength in a wavelength band of 370 nm or less, and the emission frequency of the beam LB is Fs. The light source device 14 emits and emits the beam LB at the emission frequency Fs under the control of the control device 18.

  The exposure head 16 includes a plurality of drawing units U (U1 to U6) on which the beam LB from the light source device 14 is incident. The exposure head 16 draws a pattern on a part of the substrate P supported on the circumferential surfaces of the rotary drums DR1 and DR2 by a plurality of drawing units U (U1 to U6). The exposure head 16 is a so-called multi-beam type exposure head having a plurality of drawing units U (U1 to U6) having the same configuration. The drawing units U1, U5, U2, and U6 are provided above the rotary drum DR1, and the drawing units U3 and U4 are provided above the rotary drum DR2. The drawing units U1 and U5 are arranged on the upstream side (−X direction side) in the transport direction of the substrate P with respect to the center plane Poc1, and are arranged at predetermined intervals along the Y direction. The drawing units U2 and U6 are arranged on the downstream side (+ X direction side) in the transport direction of the substrate P with respect to the center plane Poc1, and are arranged at predetermined intervals along the Y direction. The drawing unit U3 is arranged on the upstream side (−X direction side) in the transport direction of the substrate P with respect to the center plane Poc2. The drawing unit U4 is arranged on the downstream side (+ X direction side) in the transport direction of the substrate P with respect to the center plane Poc2. The drawing units U1 and U5 and the drawing units U2 and U6 are provided symmetrically with respect to the center plane Poc1, and the drawing units U3 and U4 are provided symmetrically with respect to the center plane Poc2.

  Each of the drawing units U (U1 to U6) converges each of the two beams LB sent from the light source device 14 on the illuminated surface of the substrate P and projects it on the illuminated surface (photosensitive surface) of the substrate P. While scanning, the two spot lights SP converged on the irradiation surface of the substrate P are one-dimensionally scanned along two predetermined drawing lines (scanning lines) SLa and SLb. Although the configuration of the drawing unit U will be described later in detail, in the first embodiment, one drawing unit U includes one rotating polygon mirror (beam deflector, light deflecting member) and two An fθ lens system (scanning optical system) is provided, and one drawing unit U (U1 to U6) forms a scanning line by the spot light SP at each of two different places on the substrate P. Therefore, two beams LB are sent from the light source device 14 to each of the drawing units U. Note that the beam LB from the light source device 14 is split into a plurality of beams LB via a beam distribution system including a not-shown reflecting mirror, a beam splitter, and the like, and each of the drawing units U (U1 to U6) It is assumed that two beams LB are incident.

  Each drawing unit U (U1 to U6) applies two beams LB to the substrate such that the two beams LB travel toward the central axis AXo1 of the rotary drum DR1 or the central axis AXo2 of the rotary drum DR2 on the XZ plane. Irradiate toward P. Accordingly, the optical path (beam center axis) of the two beams LB traveling from each of the drawing units U (U1 to U6) to the two drawing lines SLa and SLb on the substrate P is irradiated on the substrate P in the XZ plane. It is parallel to the surface normal. In the first embodiment, the optical path (beam center axis) of the beam LB traveling from the drawing units U1 and U5 toward the rotary drum DR1 is set so that the angle with respect to the center plane Poc1 is -θ1. I have. The optical path (beam center axis) of the beam LB traveling from the drawing units U2 and U6 toward the rotary drum DR2 is set so that the angle with respect to the center plane Poc1 is + θ1. The optical path (beam center axis) of the beam LB traveling from the drawing unit U3 toward the rotary drum DR2 is set so that the angle with respect to the center plane Poc2 is -θ1. The optical path (beam center axis) of the beam LB traveling from the drawing unit U4 toward the rotating drum DR2 is set so that the angle with respect to the center plane Poc2 is + θ1. Each of the drawing units U (U1 to U6) is configured such that the beam LB irradiating the two drawing lines SLa and SLb is perpendicular to the irradiated surface of the substrate P in a plane parallel to the YZ plane. The beam LB is irradiated toward the substrate P. That is, the beam LB projected on the substrate P is scanned in a telecentric state in the main scanning direction of the spot light SP on the irradiated surface.

  The plurality of drawing units U (U1 to U6) are arranged in a predetermined arrangement relationship as shown in FIG. The two drawing lines SLa and SLb of each drawing unit U (U1 to U6) extend in the main scanning direction, that is, the Y direction, and have the same position on the irradiated surface of the substrate P in the sub-scanning direction (X direction). And are arranged shifted in the main scanning direction (Y direction). That is, the drawing lines SLa and SLb of the respective drawing units U (U1 to U6) are arranged in parallel with a distance only in the main scanning direction (Y direction). Further, the scanning lengths (lengths) of the drawing lines SLa and SLb are set to be the same, and the drawing lines SLa and SLb are set so as to be separated from each other by an interval equal to or less than the scanning length in the main scanning direction. I have.

  The plurality of drawing units U (U1 to U6) are arranged such that the drawing lines SLa and SLb of the plurality of drawing units U (U1 to U6) are in the Y direction (the width direction of the substrate P, the main scanning direction) as shown in FIG. Are arranged so as to be joined without being separated from each other. Each of the drawing units U (U1 to U6) adjusts the inclination of the drawing lines (scanning lines) SLa and SLb in the XY plane around the rotation center axis AXr, for example, within a range of ± 1.5 degrees. Micro-rotation is possible with a resolution of μrad. The rotation center axis AXr is defined as the center point (middle point) of a line segment connecting the middle point of the drawing line (first scanning line) SLa and the middle point of the drawing line (second scanning line) SLb. Is an axis that passes perpendicular to. The extension of the axis intersects the central axis AXo1 of the rotary drum DR1 in FIG. 1 or the central axis AXo2 of the rotary drum DR2. In the first embodiment, the drawing line SLa and the drawing line SLb of each drawing unit U (U1 to U6) are located at the same position in the sub-scanning direction and are separated from each other in the main scanning direction. Therefore, the rotation center axis AXr is arranged on a straight line passing through the drawing lines SLa and SLb, and is arranged at the center point of the gap between the drawing line SLa and the drawing line SLb.

  When the drawing units U (U1 to U6) rotate (rotate) around the rotation center axis AXr even with a very small amount, the drawing lines SLa and SLb on which the spot light SP of the beam LB is scanned also rotate accordingly. It rotates (rotates) around AXr. As a result, when the drawing units U (U1 to U6) rotate by a certain angle, the drawing lines SLa and SLb correspondingly rotate the drawing lines SLa and SLb by a certain angle with respect to the Y direction (Y axis) about the rotation center axis AXr. Will only lean. Each of the drawing units U (U1 to U6) is rotated around a rotation center axis AXr by a drive mechanism (not shown) having high responsiveness including an actuator under the control of the control device 18.

  Note that two drawing lines SLa and SLb of the drawing unit U1 may be represented by SL1a and SL1b, and similarly, two drawing lines SLa and SLb of the drawing units U2 to U6 may be represented by SL2a, SL2b to SL6a and SL6b. . The drawing lines SLa and SLb may be collectively simply referred to as a drawing line SL.

  As shown in FIG. 2, each of the drawing units U (U1 to U6) shares a scanning area so that the plurality of drawing units U (U1 to U6) cover the entire width of the exposure area W in the width direction. ing. Thereby, each drawing unit U (U1 to U6) can draw a pattern for each of a plurality of regions divided in the width direction of the substrate P. For example, assuming that the scanning length (length) of the drawing line SL is about 20 to 40 mm, by arranging a total of six drawing units U in the Y direction, the width in the Y direction that can be drawn is about 240 to 480 mm. Spreading. The length (scanning length) of each drawing line SL (SL1a, SL1b to SL6a, SL6b) is basically the same. In other words, the scanning distance of the spot light SP of the beam LB scanned along each of the plurality of drawing lines SL (SL1a, SL1b to SL6a, SL6b) is basically the same. When it is desired to increase the width of the exposure region W, the length of the drawing line SL (SLa, SLb) itself can be increased or the number of drawing units U arranged in the Y direction can be increased.

  The drawing lines SL1a, SL1b, SL2a, SL2b, SL5a, SL5b, SL6a, SL6b are located on the irradiated surface of the substrate P supported by the rotating drum DR1. The drawing lines SL1a, SL1b, SL2a, SL2b, SL5a, SL5b, SL6a, SL6b are arranged in two rows in the circumferential direction of the rotary drum DR1 with the center plane Poc1 interposed therebetween. The drawing lines SL1a, SL1b, SL5a, and SL5b are located on the irradiated surface of the substrate P on the upstream side (−X direction side) in the transport direction of the substrate P with respect to the center plane Poc1. The drawing lines SL2a, SL2b, SL6a, and SL6b are located on the surface to be irradiated on the substrate P on the downstream side (+ X direction side) in the transport direction of the substrate P with respect to the center plane Poc1.

  The drawing lines SL3a, SL3b, SL4a, SL4b are located on the irradiated surface of the substrate P supported by the rotating drum DR2. The drawing lines SL3a, SL3b, SL4a, and SL4b are arranged in two rows in the circumferential direction of the rotary drum DR2 with the center plane Poc2 interposed therebetween. The drawing lines SL3a and SL3b are located on the irradiated surface of the substrate P on the upstream side (−X direction side) in the transport direction of the substrate P with respect to the center plane Poc2. The drawing lines SL4a and SL4b are located on the irradiated surface of the substrate P on the downstream side (+ X direction side) in the transport direction of the substrate P with respect to the center plane Poc2. The drawing lines SLa1, SL1b to SL6a, SL6b are substantially parallel to the width direction of the substrate P, that is, the central axes AXo1, AXo2 of the rotating drums DR1, DR2.

  The odd-numbered drawing lines SL1a, SL1b, SL3a, SL3b, SL5a, and SL5b are linearly spaced at a predetermined interval in the Y direction (the width direction of the substrate P) along the width direction (the scanning direction) of the substrate P. Are located. Similarly, the even-numbered drawing lines SL2a, SL2b, SL4a, SL4b, SL6a, and SL6b are arranged on a straight line at a predetermined interval in the Y direction along the width direction of the substrate P. At this time, the drawing line SL1b is arranged between the drawing line SL2a and the drawing line SL2b in the Y direction. The drawing line SL3a is arranged between the drawing line SL2b and the drawing line SL4a in the Y direction. The drawing line SL3b is arranged between the drawing line SL4a and the drawing line SL4b in the Y direction. The drawing line SL5a is arranged between the drawing line SL4b and the drawing line SL6a in the Y direction. The drawing line SL5b is arranged between the drawing line SL6a and the drawing line SL6b in the Y direction. That is, in the drawing line SL, the pattern to be drawn is Y in the order of SL1a, SL2a, SL1b, SL2b, SL3a, SL4a, SL3b, SL4b, SL5a, SL6a, SL5b, and SL6b in the Y direction. It is arranged to be joined at the ends in the directions.

  The scanning direction of the spot light SP of the beam LB scanned along each of the odd-numbered drawing lines SL1a, SL1b, SL3a, SL3b, SL5a, and SL5b is a one-dimensional direction, and is the same direction (+ Y direction). It has become. The scanning direction of the spot light SP of the beam LB scanned along each of the even-numbered drawing lines SL2a, SL2b, SL4a, SL4b, SL6a, and SL6b is a one-dimensional direction, and is the same direction (−Y direction). ). The scanning direction (+ Y direction) of the spot light SP of the beam LB scanned along the odd-numbered drawing lines SL1a, SL1b, SL3a, SL3b, SL5a, and SL5b, and the even-numbered drawing lines SL2a, SL2b, SL4a, and SL4b. , SL6a and SL6b are opposite to each other in the scanning direction (−Y direction) of the spot light SP of the beam LB scanned along the scanning direction. As a result, the pattern drawn at the drawing start positions (positions of the drawing start points) of the drawing lines SL1b, SL3a, SL3b, SL5a, and SL5b and the drawing start positions of the drawing lines SL2a, SL2b, SL4a, SL4b, and SL6a are joined. Are combined. The drawing is performed at the drawing end positions (positions of drawing end points) of the drawing lines SL1a, SL1b, SL3a, SL3b, SL5a, and SL5b, and the drawing end positions of the drawing lines SL2a, SL2b, SL4a, SL4b, SL6a, and SL6b. Patterns are spliced. In the initial state, the odd-numbered drawing lines SL1a, SL1b, SL5a, and SL5b located on the straight line and the even-numbered drawing lines SL2a, SL2b, SL6a, and SL6b located on the straight line are in the transport direction of the substrate P. They are spaced apart by a certain length (interval length) along (the circumferential direction of the rotary drum DR1). Similarly, in the initial state, the odd-numbered drawing lines SL3a and SL3b located on the straight line and the even-numbered drawing lines SL4a and SL4b located on the straight line are in the transport direction of the substrate P (the circumferential direction of the rotary drum DR2). ) Are spaced apart by a fixed length (interval length).

  The width (dimension in the X direction) of the drawing line SL is a thickness corresponding to the size (diameter) φ of the spot light SP. For example, when the effective size φ of the spot light SP is 3 μm, the width of the drawing line SL is also 3 μm. The spot light SP may be projected along the drawing line SL so as to overlap by a predetermined length (for example, half the effective size φ of the spot light SP). The ends of the drawing lines SL adjacent to each other in the scanning direction (for example, the drawing end point of the drawing line SL1a and the drawing end point of the drawing line SL2a) have a predetermined length (for example, the size φ of the spot light SP). (Half), and may overlap in the Y direction.

  FIG. 3 is a diagram showing an arrangement relationship of the drawing lines SLa and SLb of each drawing unit U when the ends of the drawing lines SL adjacent in the main scanning direction are made to coincide (adjacent). As shown in FIG. 3, the scanning lengths of the drawing lines SLa and SLb of the drawing unit U and the distance (gap) between the drawing line SLa and the drawing line SLb of the drawing unit U in the Y direction are Lo. Therefore, the drawing lines SLa, SLb of the drawing units U1, U3, U5 and the drawing lines SLa, SLb of the drawing units U2, U4, U6 which are opposed to each other are drawn by the drawing lines SL adjacent to each other in the main scanning direction. Can be arranged adjacent to each other in the main scanning direction. Note that the rotation center axis AXr of the drawing unit U is set so as to pass through the center point of the separation distance Lo between the drawing lines SLa and SLb.

  FIG. 4 is a diagram showing an arrangement relationship of the drawing lines SLa and SLb of each drawing unit U when the ends of the drawing lines SL adjacent in the scanning direction are overlapped by α / 2 (constant length). As shown in FIG. 4, the scanning length of the drawing lines SLa and SLb is Lo, and the distance (gap) between the drawing line SLa and the drawing line SLb of the drawing unit U in the Y direction is Lo-α. Therefore, the drawing lines SLa, SLb of the drawing units U1, U3, U5 and the drawing lines SLa, SLb of the drawing units U2, U4, U6 that are opposed to each other are drawn at the ends of the drawing lines SL adjacent to each other in the main scanning direction. Are superimposed at α / 2 in the main scanning direction. Note that the rotation center axis AXr of the drawing unit U is set so as to pass through the center point of the separation distance Lo-α between the drawing lines SLa and SLb.

  The control device 18 shown in FIG. 1 controls each part of the exposure apparatus EX. The control device 18 includes a computer, a recording medium on which a program is recorded, and the like, and functions as the control device 18 of the first embodiment when the computer executes the program. The alignment microscopes AMa (AMa1 to AMa4) and AMb (AMb1 to AMb4) shown in FIG. 1 are for detecting alignment marks MK (MK1 to MK4) formed on the substrate P shown in FIG. . The plurality of alignment microscopes AMa (AMa1 to AMa4) are provided along the Y direction. Similarly, a plurality of alignment microscopes AMb (AMb1 to AMb4) are also provided along the Y direction. The alignment marks MK (MK1 to MK4) are reference marks for relatively aligning (aligning) the pattern drawn in the exposure area W on the irradiated surface of the substrate P with the substrate P. The alignment microscopes AMa (AMa1 to AMa4) detect the alignment marks MK (MK1 to MK4) on the substrate P supported on the circumferential surface of the rotating drum DR1. The alignment microscope AMa (AMa1 to AMa4) moves the substrate P more than the position (drawing lines SL1a, SL1b, SL5a, SL5b) of the spot light SP of the beam LB emitted from the drawing units U1 and 5 onto the irradiation surface of the substrate P. Is provided on the upstream side (−X direction side) in the transport direction. Further, the alignment microscope AMb (AMb1 to AMb4) detects the alignment mark MK (MK1 to MK4) on the substrate P supported on the circumferential surface of the rotating drum DR2. The alignment microscope AMb (AMb1 to AMb4) is located upstream of the position of the spot light SP of the beam LB (drawing lines SL3a and SL3b) emitted from the drawing unit U3 onto the irradiation surface of the substrate P in the transport direction of the substrate P. (−X direction side).

  The alignment microscopes AMa (AMa1 to AMa4) and AMb (AMb1 to AMb4) have a light source (not shown) for projecting illumination light for alignment onto the substrate P and an image sensor (CCD, CMOS, etc.) for imaging the reflected light. . The imaging signals captured by the alignment microscopes AMa (AMa1 to AMa4) and AMb (AMb1 to AMb4) are sent to the control device 18. The alignment microscopes AMa (AMa1 to AMa4) and AMb (AMb1 to AMb4) image the alignment marks MK (MK1 to MK4) existing in an observation area (not shown). The observation areas of the alignment microscopes AMa (AMa1 to AMa4) and AMb (AMb1 to AMb4) are provided along the Y direction, and are arranged according to the positions of the alignment marks MK (MK1 to MK4) in the Y direction. I have. Therefore, the alignment microscopes AMa1 and AMb1 can image the alignment mark MK1, and similarly, the alignment microscopes AMa2 to AMa4 and AMb2 to AMb4 can image the alignment marks MK2 to MK4. The size of the observation area on the irradiated surface of the substrate P is set according to the size of the alignment marks MK (MK1 to MK4) and the alignment accuracy (position measurement accuracy). It is. The control device 18 detects the position of the alignment mark MK based on the imaging signals from the alignment microscopes AMa (AMa1 to AMa4) and AMb (AMb1 to AMb4). Note that the illumination light for alignment is light in a wavelength range having little sensitivity to the photosensitive functional layer of the substrate P, for example, light having a wavelength of about 500 nm to 800 nm. In addition, since the imaging devices of the alignment microscopes AMa and AMb need to image the alignment mark MK while the substrate P is moving, a high-speed shutter time (such as a charge accumulation time) according to the transport speed of the substrate P is required. (Imaging time).

  Next, the configuration of the drawing unit U will be described. Since each drawing unit U has the same configuration, in the first embodiment, the drawing unit U2 will be described as an example. Hereinafter, in the description of the drawing unit U, an orthogonal coordinate system XtYtZt is set in order to specify the arrangement of each member and beam in the drawing unit U. The Yt axis of the rectangular coordinate system XtYtZt is set parallel to the Y axis of the rectangular coordinate system XYZ, and the rectangular coordinate system XtYtZt is set to be inclined at a fixed angle around the Y axis with respect to the rectangular coordinate system XYZ.

  FIG. 5 is a configuration diagram of the drawing unit U2 viewed from the −Yt (−Y) direction side, and FIG. 6 is a configuration diagram of the drawing unit U2 viewed from the + Zt direction side. Of the two beams LB incident on the drawing unit U2, one beam LB is represented by LBa, and the other beam LB is represented by LBb. The spot light SP of the beam (first beam) LBa may be represented by SPa, and the spot light SP of the beam (second beam) LBb may be represented by SPb. The spot light (first spot light) SPa scans on the drawing line SL2a (SLa), and the spot light (second spot light) SPb scans on the drawing line SL2b (SLb).

  In FIG. 6, the spot lights SPa and SPb are indicated by dots thicker than the drawing lines SL2a and SL2b for easy understanding. 5 and 6, the direction parallel to the rotation center axis AXr is defined as the Zt direction, and the substrate P is on a plane orthogonal to the Zt direction, and the substrate P is transferred from the process apparatus PR1 to the process apparatus PR2 via the exposure apparatus EX. Is defined as an Xt direction, and a direction orthogonal to the Xt direction on a plane orthogonal to the Zt direction is defined as a Yt direction. That is, the three-dimensional coordinates of Xt, Yt, and Zt in FIGS. 5 and 6 are obtained by converting the three-dimensional coordinates of X, Y, and Z in FIG. 1 so that the Z-axis direction about the Y-axis is parallel to the rotation center axis AXr. These are three-dimensional coordinates rotated as follows.

  The drawing unit U2 includes a reflection mirror M1, a condenser lens CD, a triangular reflection mirror M2, reflection mirrors M3a and M3b, shift optical members (shift optical plates) SRa and SRb, beam shaping optical systems BFa and BFb, a reflection mirror M4, and a cylindrical mirror. The optical system includes a lens CY1, a reflection mirror M5, a polygon mirror PM, reflection mirrors M6a and M6b, fθ lenses FTa and FTb, reflection mirrors M7a and M7b, and cylindrical lenses CY2a and CY2b. These optical systems (reflection mirror M1, condensing lens CD, etc.) are integrally formed as a single drawing unit U2 in a highly rigid housing. That is, the drawing unit U2 integrally holds these optical systems. For the optical system in which the two beams LBa and LBb are both incident, reference numerals are simply attached, and each of the two beams LBa and LBb is separately incident and provided as a pair with respect to the two beams LBa and LBb. Regarding the optical system, a and b are added after the reference numerals. Briefly, an optical system to which only the beam LBa is incident is denoted by a after the reference numeral, and an optical system to which only the beam LBb is incident is denoted by b after the reference numeral.

  As shown in FIG. 5, two beams LBa and LBb from the light source device 14 are transmitted through two optical elements AOMa and AOMb, and two collimating lenses CLa and CLb, and then reflected by a reflection mirror M8. The light enters the drawing unit U2 in a state parallel to the Zt axis. The two beams LBa and LBb that have entered the drawing unit U2 enter the reflection mirror M1 along the rotation center axis AXr of the drawing unit U2 on the XtZt plane. FIG. 7 is a diagram showing the optical paths of the beams LBa and LBb passing through the optical elements AOMa and AOMb and the collimating lenses CLa and CLb and entering the reflection mirror M8 as viewed from the + Zt direction, and FIG. 8 is a drawing from the reflection mirror M8. FIG. 9 is a diagram illustrating the optical paths of beams LBa and LBb incident on the reflection mirror M1 of the unit U2 as viewed from the + Xt direction side. 7 and 8 also show a three-dimensional coordinate system of Xt, Yt, and Zt.

  The optical elements AOMa and AOMb have transparency to the beams LBa and LBb, and are acousto-optic modulators (AOM: Acousto-Optic Modulator). The optical elements AOMa and AOMb use ultrasonic waves (high-frequency signals) to diffract the incident beams LBa and LBb at a diffraction angle corresponding to the frequency of the high-frequency, and change the optical paths of the beams LBa and LBb, that is, the traveling directions. Change. The optical elements AOMa and AOMb turn on and off the generation of diffracted light (first-order diffraction beam) obtained by diffracting the incident beams LBa and LBb in accordance with on / off of the drive signal (high-frequency signal) from the control device 18. .

  When the drive signal (high-frequency signal) from the control device 18 is off, the optical element AOMa transmits the incident beam LBa without diffracting it. Therefore, when the drive signal is off, the beam LBa transmitted through the optical element AOMa is incident on an absorber (not shown) without being incident on the collimating lens CLa and the reflecting mirror M8. This means that the intensity of the spot light SPa projected on the irradiated surface of the substrate P is modulated to a low level (zero). On the other hand, when the optical element AOMa is turned on by a drive signal (high-frequency signal) from the control device 18, it generates a first-order diffracted beam obtained by diffracting the incident beam LBa. Therefore, when the drive signal is on, the first-order diffracted beam deflected by the optical element AOMa (for the sake of simplicity, the beam LBa from the optical element AOMa) passes through the collimating lens CLa. The light enters the reflection mirror M8. This means that the intensity of the spot light SPa projected on the irradiated surface of the substrate P is modulated to a high level.

  Similarly, the optical element AOMb transmits the incident beam LBb without diffracting it when the drive signal (high-frequency signal) from the control device 18 is off, so that the beam LBb transmitted through the optical element AOMb is Without incident on the collimating lens CLb and the reflecting mirror M8. This means that the intensity of the spot light SPb projected on the irradiated surface of the substrate P is modulated to a low level (zero). On the other hand, when the optical element AOMb is turned on by a drive signal (high-frequency signal) from the control device 18, the incident beam LBb is diffracted, so that the beam LBb (first-order diffracted beam) deflected by the optical element AOMb Enters the reflection mirror M8 after passing through the collimating lens CLb. This means that the intensity of the spot light SPb projected on the irradiated surface of the substrate P is modulated to a high level. The control device 18 turns on / off the driving signal applied to the optical element AOMa at high speed based on the pattern data (bitmap) of the pattern drawn by the drawing line SL2a, and controls the pattern drawn by the drawing line SL2b. The drive signal applied to the optical element AOMb is turned on / off at high speed based on the pattern data. That is, the intensity of the spot light SPa, SPb is modulated into a high level and a low level according to the pattern data. The beams LBa and LBb incident on the optical elements AOMa and AOMb are condensed so as to form a beam waist in the optical elements AOMa and AOMb. , LBb (first-order diffracted beams) are divergent lights, and the collimating lenses CLa and CLb convert the divergent lights into parallel light beams having a predetermined beam diameter.

  The reflection mirror M8 reflects the incident beams LBa and LBb in the −Zt direction and guides the beams LBa and LBb to the reflection mirror (reflection member) M1 of the drawing unit U2. The beams LBa and LBb reflected by the reflection mirror M8 enter the reflection mirror M1 of the drawing unit U2 so as to be symmetric with respect to the rotation center axis AXr. At this time, the beams LBa and LBb may or may not intersect on the reflection mirror M1. FIGS. 6 and 8 show an example in which the beams LBa and LBb intersect at the position of the rotation center axis AXr on the reflection mirror M1. That is, the beams LBa and LBb are incident on the reflection mirror M1 at a certain angle with respect to the rotation center axis AXr. In the first embodiment, the beams LBa and LBb are incident on the reflection mirror M1 along the Yt (Y) direction so as to be symmetric with respect to the rotation center axis AXr. The beams LBa and LBb may be designed to be incident on the reflection mirror M1 in parallel so as to be symmetric with respect to the rotation center axis AXr.

  Returning to the description of FIGS. 5 and 6, the reflecting mirror M1 reflects the incident beams LBa and LBb in the + Xt direction. The beams LBa and LBb (each a parallel light beam) reflected by the reflection mirror M1 are separated from each other at a constant opening angle in the XtYt plane as shown in FIG. The condenser lens CD is a lens that makes the respective central axes of the beams LBa and LBb from the reflection mirror M1 parallel to each other in the XtYt plane and condenses each of the beams LBa and LBb at a predetermined focal position. Although the function of the condenser lens CD will be described later, the front focal position of the condenser lens CD is set so as to be on or near the reflection surface of the reflection mirror M1. The triangular reflection mirror M2 reflects the beam LBa transmitted through the condenser lens CD at 90 degrees toward the −Yt (−Y) direction and guides the beam LBa to the reflection mirror M3a, and also converts the beam LBb transmitted through the condenser lens CD into + Yt ( In the + Y) direction, the light is reflected at 90 degrees and guided to the reflection mirror M3b.

  The reflecting mirror M3a reflects the incident beam LBa at 90 degrees in the + Xt direction. The beam LBa reflected by the reflection mirror M3a passes through the shift optical member (first shift optical member formed of a parallel plate) SRa and the beam shaping optical system BFa, and is incident on the reflection mirror M4. The reflecting mirror M3b reflects the incident beam LBb at 90 degrees in the + Xt direction. The beam LBb reflected by the reflection mirror M3b passes through a shift optical member (a second shift optical member made of a parallel plate) SRb and a beam shaping optical system BFb, and is incident on the reflection mirror M4. By the triangular reflection mirror M2 and the reflection mirrors M3a and M3b, the distance in the Yt direction of each central axis of the beams LBa and LBb transmitted through the condenser lens CD is increased. The shift optical members SRa and SRb adjust the center positions of the beams LBa and LBb in a plane (YtZt plane) orthogonal to the traveling direction of the beams LBa and LBb. The shift optical members SRa and SRb have two quartz parallel plates parallel to the YtZt plane, one of the parallel plates can be tilted around the Yt axis, and the other parallel plate is tilted around the Zt axis. It is possible. By tilting these two parallel plates around the Yt axis and the Zt axis, respectively, the center position of the beams LBa and LBb is shifted two-dimensionally by a minute amount on the YtZt plane orthogonal to the traveling direction of the beams LBa and LBb. I do. These two parallel plates are driven by an actuator (drive unit) (not shown) under the control of the control device 18. The beam shaping optical systems BFa and BFb are optical systems that shape the beams LBa and LBb. For example, the beam shaping optical systems BFa and BFb shape the diameters of the beams LBa and LBb condensed by the condensing lens CD to have a predetermined diameter. .

  The reflection mirror M4 reflects the beams LBa and LBb from the beam shaping optical systems BFa and BFb in the -Zt direction as shown in FIG. The beams LBa and LBb reflected by the reflection mirror M4 pass through the first cylindrical lens CY1 and enter the reflection mirror M5. The reflection mirror M5 reflects the beams LBa and LBb from the reflection mirror M4 in the −Xt direction and makes the beams LBa and LBb incident on different reflection surfaces RP of the polygon mirror PM. The beam LBa is incident on the first reflection surface RP of the polygon mirror PM from the first direction, and the beam LBb is incident on another second reflection surface RP of the polygon mirror PM from a second direction different from the first direction. I do.

  The polygon mirror PM reflects the incident beams LBa and LBb toward the fθ lenses FTa and FTb. The polygon mirror PM deflects and reflects the incident beams LBa and LBb to scan the spot light SPa and SPb of the beams LBa and LBb on the irradiation surface of the substrate P. Thus, the beams LBa and LBb are one-dimensionally deflected and scanned in a plane parallel to the XtYt plane by the rotation of the polygon mirror PM. Specifically, the polygon mirror PM is a rotary polygon mirror having a rotation axis AXp extending in the Zt-axis direction and a plurality of reflection surfaces RP arranged around the rotation axis AXp so as to surround the rotation axis AXp. In the first embodiment, the polygon mirror PM is a rotating polygon mirror having eight reflecting surfaces RP parallel to the Zt axis and having a regular octagonal shape. By rotating the polygon mirror PM in a predetermined rotation direction about the rotation axis AXp, the reflection angles of the pulsed beams LBa and LBb applied to the reflection surface RP can be changed continuously. As a result, the directions of reflection of the beams LBa and LBb are deflected by each of the first reflection surface RP and the second reflection surface RP, and the spot light SPa of the beams LBa and LBb applied to the substrate P on the surface to be irradiated. SPb can be scanned in the main scanning direction.

  Since one reflection surface RP of the polygon mirror PM deflects and scans both the beams LBa and LBb, it can scan the spot lights SPa and SPb along the drawing lines SL2a and SL2b. Therefore, in one rotation of the polygon mirror PM, the number of scans of the spot lights SPa and SPb along the drawing lines SL2a and SL2b on the irradiation surface of the substrate P is eight at maximum, which is the same as the number of the reflection surfaces RP. . The polygon mirror PM is rotated at a constant speed by a polygon driving unit including a motor and the like. The rotation of the polygon mirror PM is controlled by the controller 18 by the polygon driving unit.

  The lengths of the drawing lines SL2a and SL2b are, for example, 30 mm, and the spot lights SPa and SPb are applied to the drawing lines SL2a and SL2b while emitting 3 μm spot lights SPa and SPb in a pulsed manner so as to overlap each other by 1.5 μm. In the case of irradiating the irradiation surface of the substrate P along the surface, the number of spot lights SP (pulse emission number) irradiated in one scan is 20000 (30 mm / 1.5 μm). If the scanning time of the spot lights SPa and SPb along the drawing lines SL2a and SL2b is 200 μsec, the pulsed spot light SP must be irradiated 20,000 times during this time. , Fs ≧ 20,000 times / 200 μsec = 100 MHz.

  The first cylindrical lens CY1 converges the incident beams LBa and LBb on the reflection surface RP of the polygon mirror PM in the non-scanning direction (Zt direction) orthogonal to the scanning direction (rotation direction) by the polygon mirror PM. When the reflecting surface RP is inclined with respect to the Zt direction by a first cylindrical lens CY1 whose main line is parallel to the Yt direction and second cylindrical lenses CY2a and CY2b described later (the XtYt plane method). Even if there is an inclination of the reflection surface RP with respect to the Zt axis which is a line), the influence can be suppressed. For example, the irradiation position of the spot lights SPa, SPb (drawing lines SL2a, SL2b) of the beams LBa, LBb irradiated on the irradiation surface of the substrate P is caused by a slight inclination error for each reflection surface RP of the polygon mirror PM. The displacement in the Xt direction can be suppressed.

  More specifically, the polygon mirror PM reflects the incident beam LBa in the −Yt (−Y) direction and guides it to the reflection mirror M6a. The polygon mirror PM reflects the incident beam LBb in the + Yt (+ Y) direction and guides it to the reflection mirror M6b. The reflection mirror M6a reflects the incident beam LBa in the −Xt direction side and guides it to the fθ lens FTa having the optical axis AXfa extending in the Xt axis direction. The reflection mirror M6b reflects the incident beam LBb in the −Xt direction and guides it to the fθ lens FTb having the optical axis AXfb (parallel to the optical axis AXfa) extending in the Xt-axis direction.

  The fθ (f-θ) lenses FTa and FTb reflect the beams LBa and LBb from the polygon mirror PM reflected by the reflection mirrors M6a and M6b so as to be parallel to the optical axes AXfa and AXfb on the XtYt plane. , M7b. The reflection mirror M7a reflects the incident beam LBa in the -Zt direction toward the irradiation surface of the substrate P, and the reflection mirror M7b reflects the incident beam LBb in the -Zt direction toward the irradiation surface of the substrate P. I do. The beam LBa reflected by the reflection mirror M7a passes through the second cylindrical lens CY2a and is projected on the surface to be irradiated on the substrate P, and the beam LBb reflected by the reflection mirror M7b passes through the second cylindrical lens CY2b. The light is projected on the surface to be irradiated on the substrate P. By the fθ lens FTa and the second cylindrical lens CY2a whose generating line is parallel to the Yt direction, the effective diameter of the beam LBa projected on the substrate P on the irradiated surface of the substrate P is about several μm (for example, , 3 μm). Similarly, the effective diameter of the beam LBb projected on the substrate P is several μm on the irradiated surface of the substrate P by the fθ lens FTb and the second cylindrical lens CY2b whose generating line is parallel to the Yt direction. The light is converged to a minute (eg, 3 μm) minute spot light SPb. The spot lights SPa and SPb projected on the irradiation surface of the substrate P are simultaneously moved along the drawing lines SL2a and SL2b extending in the main scanning direction (Yt direction and Y direction) by one rotation of the polygon mirror PM. Dimensionally scanned.

  The incident angle θ of the beam to the fθ lenses FTa and FTb (the angle with respect to the optical axis) changes according to the rotation angle (θ / 2) of the polygon mirror PM. lens FTa projects the spot light SPa of the beam LBa at an image height position on the irradiated surface of the substrate P in proportion to the incident angle of the beam LBa. Similarly, the fθ lens FTb projects the spot light SPb of the beam LBb at an image height position on the irradiated surface of the substrate P in proportion to the incident angle of the beam LBb. Assuming that the focal length is f and the image height position is y, the fθ lenses FTa and FTb have a relationship (distortion) of y = f × θ. Therefore, the fθ lenses FTa and FTb allow the spot light beams SPa and SPb of the beams LBa and LBb to be accurately scanned at a constant speed in the Yt direction (Y direction). When the angles of incidence θ of the beams LBa and LBb on the fθ lenses FTa and FTb are 0 degrees, the beams LBa and LBb incident on the fθ lenses FTa and FTb travel along the optical axes AXfa and AXfb.

  The above condenser lens CD, triangular reflection mirror M2, reflection mirror M3a, shift optical member SRa, beam shaping optical system BFa, reflection mirror M4, first cylindrical lens CY1, and reflection mirror M5 transmit the beam LBa to the first. It functions as a first light guide optical system 20 that guides the polygon mirror PM from the direction. The condenser lens CD, the triangular reflection mirror M2, the reflection mirror M3b, the shift optical member SRb, the beam shaping optical system BFb, the reflection mirror M4, the first cylindrical lens CY1, and the reflection mirror M5 transmit the beam LBb to the first beam. It functions as a second light guide optical system 22 that guides the polygon mirror PM from a second direction different from the direction. The condensing lens CD, the triangular reflecting mirror M2, the reflecting mirror M4, the first cylindrical lens CY1, and the reflecting mirror M5 are members common to the first light guiding optical system 20 and the second light guiding optical system 22. However, at least a part of these members may be provided separately in the first light guide optical system 20 and the second light guide optical system 22. The reflection mirror M6a, the fθ lens FTa, the reflection mirror M7a, and the second cylindrical lens CY2a converge the beam LBa reflected by the polygon mirror PM and form a spot light SPa on the drawing line SL2a (SLa). It functions as the first projection optical system 24 that performs projection. Similarly, the reflection mirror M6b, the fθ lens FTb, the reflection mirror M7b, and the second cylindrical lens CY2b converge the beam LBb reflected by the polygon mirror PM and form a spot light SPb on the drawing line SL2b (SLb). Function as a second projection optical system 26 that projects light to The first projection optical system 24 and the second projection optical system 26 are arranged such that the drawing lines SLa and SLb are at the same position in the sub-scanning direction and are separated in the main scanning direction. Further, the first projection optical system 24 and the second projection optical system 26 are arranged so that the drawing lines SLa and SLb are separated from each other by an interval equal to or less than the scanning length in the main scanning direction.

  In the case of the first embodiment, even when the beams LBa and LBb are incident on the reflection mirror M1 at a position where the rotation center axis AXr passes, the beams LBa and LBb are not aligned with the rotation center axis AXr. Instead of being incident on the reflection mirror M1 in parallel, the light is incident on the reflection mirror M1 (or in the vicinity thereof) with a certain inclination with respect to the rotation center axis AXr as shown in FIG. Therefore, when the entire drawing unit U2 rotates around the rotation center axis AXr, the incident angles of the beams LBa and LBb with respect to the reflection mirror M1 relatively change. As a result, the direction of reflection of the beams LBa and LBb reflected by the reflection mirror M1 in the drawing unit U2 changes two-dimensionally in accordance with the rotation of the drawing unit U2 about the rotation center axis AXr.

  FIGS. 9 and 10 show the drawing unit U2 of the beam LBa in the initial position state where the drawing unit U2 is not rotated around the rotation center axis AXr and in the state where the drawing unit U2 is rotated by Δθz from the initial position. It is a figure which exaggerates and shows the change of the reflection direction (change of a beam course) in the inside. 9 shows the arrangement relationship between the reflection mirror (reflection member) M1 and the condenser lens CD in the XtZt plane, and FIG. 10 shows the arrangement relation between the reflection mirror M1 and the condenser lens CD in the XtYt plane. It was seen in. The principle that the reflection direction of the beam LBb in the drawing unit U2 changes when the drawing unit U2 rotates around the rotation center axis AXr is the same as that for the beam LBa, and therefore only the beam LBa will be described. Here, the optical axis AXc of the condenser lens CD is set so as to intersect with the rotation center axis AXr on the reflection surface (set at 45 ° with respect to the XtYt plane) of the reflection mirror M1. The reflection surface of the reflection mirror M1 is set at the position of the focal distance fa. Further, the beams LBa and LBb diverge after being converged to have a beam waist (minimum diameter) on a plane Pcd (rear focal plane) at the position of the rear focal distance fb of the condenser lens CD. 9 and 10, the beam LBa-1 indicated by a solid line is a beam in the initial position state where the entire drawing unit U2 is not rotating, that is, when the drawing line SL2a is in a state parallel to the Yt (Y) direction. LBa is shown. A beam LBa-2 indicated by a two-dot chain line indicates the beam LBa when the entire drawing unit U2 is rotated by Δθz around the rotation center axis AXr.

  When the drawing unit U2 rotates around the rotation center axis AXr, the relative incident angle of the beam LBa (LBb) on the reflection surface of the reflection mirror M1 changes. As shown in FIG. 10, assuming that the beam LBa projected on the reflecting surface of the reflecting mirror M8 immediately before the reflecting mirror M1 is LBa (M8), as is clear from the beam orientation state of FIG. Of the beam LBa and the beam LBa (M8) projected on the XtYt plane are separated from each other in a direction parallel to the Yt axis in the initial position state. When the entire drawing unit U2 is rotated (inclined) by the angle Δθz from the initial position state, the position of the beam LBa (M8) on the reflection mirror M8 is relatively shifted in the Xt direction corresponding to the angle Δθz when viewed from the reflection mirror M1. (Actually, rotation about the rotation center axis AXr).

  Therefore, the optical path (center line) of the beam LBa-1 reflected by the reflection mirror M1 in the initial position state becomes the beam LBa-2 after the entire drawing unit U2 rotates by the angle Δθz, and becomes the beam LBa-2 in the XtYt plane. Lean. In FIG. 10, the intersection angle in the XtYt plane between the center line of the beam LBa-1 and the optical axis AXc of the condenser lens CD in the initial position state is the same as the center line of the beam LBa shown in FIG. It coincides with the intersection angle of the rotation center axis AXr in the YtZt plane. Therefore, the convergence position BW1 in the rear focal plane Pcd of the beam LBa-1 in the initial position state is the convergence position of the beam LBa-2 in the rear focal plane Pcd after the rotation of the entire drawing unit U2 by the angle Δθz. BW2 is displaced (parallel shifted) by ΔYh in the Yt direction. The positional deviation amount ΔYh is uniquely obtained from the angle Δθz by a geometrical relational expression of ΔYh = fy (Δθz). The center lines of the beam LBa-1 and the beam LBa-2 traveling from the condenser lens CD toward the rear focal plane Pcd are both parallel to the optical axis AXc.

  On the other hand, as shown in an exaggerated manner in FIG. 9, when the orientation state of the beam LBa-2 after rotating the entire drawing unit U2 from the initial position state by the angle Δθz is viewed in the XtZt plane, the reflection mirror M1 Since the center line of the incident beam LBa is tilted in the Yt direction with respect to the rotation center axis AXr, the beam LBa-2 from the reflection mirror M1 after the rotation of the angle Δθz is changed to the beam LBa-1 ( The laser beam advances at an angle in the Zt axis direction with respect to the optical axis AXc) and enters the condenser lens CD. Therefore, the convergence position BW1 in the rear focal plane Pcd of the beam LBa-1 in the initial position state is the convergence position of the beam LBa-2 in the rear focal plane Pcd after the rotation of the entire drawing unit U2 by the angle Δθz. BW2 is displaced (parallel shifted) by ΔZh in the Zt direction. The positional deviation amount ΔZh is uniquely determined from the angle Δθz by a geometrical relational expression of ΔZh = fz (Δθz). In the configuration of the first embodiment, the displacement ΔZh in the Zt-axis direction is larger than the displacement ΔYh in the Yt-axis direction. The above operation is the same for the beam LBb. The position of the beam LBb-2 in the rear focal plane Pcd converged by the condenser lens CD after the entire drawing unit U2 is rotated by the angle Δθz is initially set. The position of the beam LBb-1 in the rear focal plane Pcd in the position state is shifted in the Yt direction and the Zt direction.

  As described above, in the first embodiment, by providing the condenser lens CD such that the reflection surface of the reflection mirror M1 comes to the position of the front focal length fa, the beam LBa− emitted from the condenser lens CD is provided. 2 (LBb-2) and the center line of the beam LBa-1 (LBb-1) can always be made parallel. Therefore, by adjusting the inclination of the shift optical members SRa and SRb disposed after the condenser lens CD, the displacement amounts ΔYh and ΔZh of the beams LBa and LBb generated after the entire drawing unit U2 is rotated by the angle Δθz become zero. To be corrected. Thus, the two beams LBa and LBb can be correctly transmitted to the subsequent optical system along the optical path in the initial position state. The tilt adjustment of the shift optical members SRa and SRb is performed by using a geometrical relational expression such as a relation table between the angle Δθz and the tilt adjustment amount created in advance based on ΔYh = fy (Δθz) and ΔZh = fz (Δθz). By using it, it can be executed at high speed. Thus, even when the entire drawing unit U2 rotates, the beams LBa and LBb can be made incident on an appropriate position on the reflection surface RP of the polygon mirror PM.

  If the beams LBa and LBb from the reflection mirror M8 can be made incident on the reflection mirror M1 coaxially with the rotation center axis AXr, the beams LBa and LBb are rotated by the rotation of the drawing unit U about the rotation center axis AXr. Does not change with respect to the reflection mirror M1. Therefore, in the drawing unit U, the reflection directions of the beams LBa and LBb reflected by the reflection mirror M1 do not change due to the rotation of the drawing unit U. One method of spatially separating the two beams LBa and LBb in the drawing unit U2 after the reflection mirror M1 while making the two beams LBa and LBb incident on the reflection mirror M1 coaxial is to use a polarization after the reflection mirror M1. A beam splitter or the like is arranged, a beam LBa and a beam LBb whose polarization states are orthogonal to each other are coaxially combined, incident on the reflection mirror M1, and a polarization splitting is performed by the polarization beam splitter or the like.

  9 and 10, beams LBa and LBb (parallel light beams) having a constant inclination with respect to the rotation center axis AXr and being symmetric with respect to the rotation center axis AXr are reflected by the reflection mirror M1. Although the case where the light is incident on the same position has been described as an example, two beams LBa and LBb (parallel light beams) that are symmetric in the Yt direction with respect to the rotation center axis AXr and are oriented parallel to the rotation center axis AXr. ) Is incident on the reflection mirror M1. FIG. 11A shows that when the entire drawing unit U2 is rotated around the rotation center axis AXr by an angle (predetermined angle) Δθz, the reflection directions of the beams LBa and LBb incident on the reflection mirror (reflection member) M1 are changed. FIG. 11B is an exaggerated view showing the change from the + Zt direction side. FIG. 11B shows the change in the position of the beams LBa and LBb on the reflection mirror M1 when the entire drawing unit U2 is rotated by the angle Δθz. It is the figure seen from the traveling direction side (+ Xt direction side) of LBb.

  In FIG. 11A, since the rectangular coordinate system XtYtZt is set for the drawing unit U2, the rectangular coordinate system XtYtZt after the entire drawing unit U2 is rotated by the angle Δθz is indicated by a broken line. It is inclined about the Zt axis by the angle Δθz. Therefore, when the drawing unit U2 is in the initial position state in which it is not rotated, the main scanning direction (Yt direction) of the spot light SP along the drawing line SL2 is parallel to the Y direction, but the whole drawing unit U2 is not rotated. When the drawing unit U2 rotates by the angle Δθz, the main scanning direction (Yt direction) of the spot light SP along the drawing line SL2 of the drawing unit U2 after the rotation is inclined with respect to the Y direction. Also, as shown in FIGS. 11A and 11B, a line that is set to extend in the Xt direction at an intermediate position between the two beams LBa and LBb in the Yt direction and that is orthogonal to the rotation center axis AXr is defined as the center axis AXt. The central axis AXt corresponds to the optical axis AXc of the condenser lens CD in FIGS. Further, when the two beams LBa and LBb reflected by the reflecting mirror M1 are made to travel in parallel with the central axis AXt as shown in FIGS. 11A and 11B, the condensing lens CD described with reference to FIGS. , And are individually provided in the optical path of each of the two beams LBa and LBb.

  In FIG. 11A, the reflection mirror M1 shown by a solid line indicates the reflection mirror M1 when the drawing unit U2 is not rotated, that is, when the drawing lines SL2a and SL2b are in a state parallel to the Y direction. I have. The beams LBa-1 and LBb-1 indicated by solid lines indicate the incident position on the reflecting mirror M1 in the initial position state, and the beams LBa and LBb reflected in the Xt-axis direction by the reflecting mirror M1. ing. Further, the reflection mirror M1 'indicated by a two-dot chain line exaggerates the arrangement of the reflection mirror M1 when the drawing unit U2 is rotated by the angle ?? z. Further, beams LBa-2 and LBb-2 indicated by two-dot chain lines indicate beams LBa and LBb reflected by the reflection mirror M1 'when the drawing unit U2 is rotated by the angle ?? z.

  When the drawing unit U2 rotates, in the XtYt plane, the reflection directions of the beams LBa-2 and LBb-2 reflected by the reflection mirror M1 'also rotate according to the rotation of the drawing unit U2. Further, the relative position (particularly, the position in the Zt direction) at which the beams LBa and LBb are incident on the reflection mirror M1 is changed by the rotation of the drawing unit U2. 11), the center lines of the beams LBa-2 and LBb-2 reflected by the reflection mirror M1 ′ are parallel to the central axis AXt, but are positioned so as to rotate about the central axis AXt as shown in FIG. 11B. Change.

  As shown in FIG. 11B, when the drawing unit U2 is in the initial position state, the beams LBa-1 and LBb-1 reflected by the reflection mirror M1 are separated from the central axis AXt by a certain distance in the ± Yt (Y) direction. Are located in parallel. However, when the drawing unit U2 rotates by the angle Δθz, the beam LBa-2 reflected by the reflection mirror M1 moves in the −Zt direction and the + Yt direction so as to draw an arc around the central axis AXt. The beam LBb-2 reflected by the reflection mirror M1 moves in the + Zt direction and the -Yt direction. Therefore, the respective optical paths of the two beams LBa and LBb passing through the respective optical members after the reflecting mirror M1 are different from the optical paths in the initial position state, and the beams LBa, LBb cannot be incident.

  However, in the first embodiment, since the shift optical members SRa and SRb are provided after the reflection mirror M1, the center lines of the beams LBa and LBb are set in the Yt direction and the Zt direction within the plane Pv. The direction can be adjusted two-dimensionally. Therefore, even when the entire drawing unit U2 rotates, the drawing unit U does not rotate along the optical paths of the beams LBa and LBb after the shift optical members SRa and SRb in the drawing unit U2. Correction (adjustment) to a correct optical path in the initial position state is possible. Thus, the beams LBa and LBb can be made incident on an appropriate position on the reflection surface RP of the polygon mirror PM.

  In addition, since the interval between the center lines of the beams LBa and LBb reflected by the reflecting mirror M1 in the Yt direction within the XtYt plane is increased by the triangular reflecting mirror M2 and the reflecting mirrors M3a and M3b, the reflecting mirror M1 of the drawing unit U2 is enlarged. , The distance between the center lines of the two beams LBa and LBb incident on the drawing unit U2 (reflection mirror M1) can be made closer to the rotation center axis AXr. As a result, even when the drawing unit Ub rotates, the amount of change in the position of the center lines of the beams LBa and LBb within the plane Pv due to the rotation can be suppressed.

  By the way, the control device 18 determines the inclination (inclination) of the exposure region W based on the position of the alignment mark MK (MK1 to MK4) detected using the alignment microscopes AMa (AMa1 to AMa4) and AMb (AMb1 to AMb4). Distortion (deformation) can be detected. The inclination (inclination) and distortion of the exposure region W are, for example, such that the long direction of the substrate P wound and transported around the rotating drums DR1 and DR2 is inclined or distorted with respect to the central axes AXo1 and AXo2. As a result, the exposure region W may be inclined or distorted. Further, even when the substrate P wound and conveyed around the rotating drums DR1 and DR2 is not inclined or distorted, the substrate P is inclined (inclined) when the lower pattern layer is formed. Alternatively, the exposure region W itself may be distorted due to being distorted and conveyed. In addition, the substrate P itself may be deformed linearly or non-linearly due to a thermal effect applied to the substrate P in the previous process.

  For this reason, the control device 18 sets the drawing units U1, U2, U5, and U6 at the center of rotation in accordance with the inclination (inclination) or distortion of the whole or a part of the exposure region W detected using the alignment microscope AMa (AMa1 to AMb4). Rotate around the axis AXr. Further, the control device 18 moves the drawing units U3 and U4 around the rotation center axis AXr according to the inclination (inclination) or distortion of the whole or a part of the exposure region W detected using the alignment microscope AMb (AMb1 to AMb4). Rotate. At this time, the control device 18 also drives the shift optical members SRa and SRb according to the rotation angles of the drawing units U (U1 to U6).

  Specifically, for example, since the substrate P wound and transported around the rotary drums DR1 and DR2 is inclined (inclined) or distorted, drawing is performed according to the inclination (inclination) and distortion. The predetermined pattern also needs to be inclined or distorted. As another example, when a predetermined pattern is newly superimposed on a lower layer pattern and drawn, the predetermined pattern to be drawn is also inclined according to the inclination or distortion of the whole or part of the lower layer pattern. It needs to be distorted or distorted. Therefore, in order to tilt or distort a predetermined pattern to be drawn, the control device 18 individually rotates the drawing units U (U1 to U6) to tilt the drawing lines SLa and SLb with respect to the Y direction.

  As described above, in the first embodiment, the drawing unit U scans the spot lights SPa and SPb of the beams LBa and LBb along the drawing lines SLa and SLb using one polygon mirror PM. The first projection optical system 24 and the second projection optical system 26 are arranged such that the drawing lines SLa and SLb are at the same position on the substrate P in the sub-scanning direction and are separated from each other in the main scanning direction. And placed. Further, the rotation of the drawing unit U is moved to a position between the two drawing lines SLa and SLb in the main scanning direction, preferably to a position where the midpoint position of each of the drawing lines SLa and SLb in the main scanning direction is bisected. Set the center axis.

  Thus, even when the drawing unit U is rotated, it is possible to suppress an increase in the positional deviation of the drawing lines SLa and SLb on the substrate P, where the drawing units U scan the spot lights SPa and SPb of the beams LBa and LBb. , The inclination of the drawing lines SLa and SLb can be easily adjusted. Conversely, in Japanese Patent Application Laid-Open No. 2004-117865, in which a plurality of scanning lines are provided at the same position in the main scanning direction and separated from each other in the sub-scanning direction, the inclination of the plurality of scanning lines is reduced by rotating the laser scanning device. When the adjustment is performed, the scanning line moves so as to draw an arc around the rotation center position of the laser scanning device. Therefore, as the scanning line is farther from the rotation center position, the displacement of the scanning line on the irradiation object due to the rotation of the laser scanning device increases. That is, in the first embodiment, the drawing lines SLa and SLb are set at the same position in the sub-scanning direction and are separated from each other in the main scanning direction. The displacement on the substrate P can be prevented from becoming unnecessarily large. Further, since the scanning length of the drawing line SL can be shortened, it is possible to stably maintain the scanning line arrangement accuracy and optical performance required for high-detail pattern drawing.

  The first projection optical system 24 and the first projection optical system 24 are configured such that the respective scanning lengths of the drawing lines SLa and SLb are set to be the same, and the drawing lines SLa and SLb are separately set at intervals equal to or less than the scanning length in the main scanning direction. The second projection optical system 26 is arranged. Thus, the drawing lines SLa and SLb of each drawing unit U can be spliced in the main scanning direction by the plurality of drawing units U, and the positions of the drawing lines SLa and SLb of each drawing unit U on the substrate P The displacement can be suppressed from increasing, and the inclination of the drawing lines SLa and SLb can be easily adjusted.

  The rotation center axis AXr of the drawing unit U passes perpendicularly to the substrate P through the center point of a line connecting the midpoints of the drawing lines SLa and SLb of the drawing unit U. This makes it possible to easily adjust the inclination of the drawing lines SLa and SLb while minimizing the displacement of the drawing lines SLa and SLb due to the rotation of the drawing unit U.

  The beams LBa and LBb from the light source device 14 enter the drawing unit U so as to be symmetric with respect to the rotation center axis AXr. In addition, it is possible to suppress the displacement of the center lines of the beams LBa and LBb passing through the inside of the drawing unit U from increasing.

  The drawing unit U includes a reflection mirror M1 that reflects the incident beams LBa and LBb and guides the beams LBa and LBb to the first light guide optical system 20 and the second light guide optical system 22, at a position where the rotation center axis AXr passes. Accordingly, even when the drawing unit U is rotated, the beams LBa and LBb from the light source device 14 first enter the reflection mirror M1 in the drawing unit U, and thus the beams LBa and LBa are placed on the drawing lines SLa and SLb. , LBb spot light SPa, SPb.

  The first light guide optical system 20 includes a shift optical member SRa that shifts the position of the beam LBa reflected from the reflection mirror M1 on a plane that intersects with the traveling direction of the beam LBa. , A shift optical member SRb for shifting the position of the beam LBb reflected from the reflection mirror M1 on a plane intersecting the traveling direction of the beam LBb. Thus, even when the drawing unit U rotates, the beams LBa and LBb can be made incident on the polygon mirror PM through an appropriate optical path in the drawing unit U. Therefore, due to the rotation of the drawing unit U, the spot light SPa, SPb is not irradiated onto the irradiation surface of the substrate P, or the spot light SPa, SPb is projected at a position deviated from the drawing lines SLa, SLb after the inclination adjustment. It is possible to suppress the occurrence of a problem such as slippage.

  The plurality of drawing units U are arranged such that the respective drawing lines SLa and SLb are joined (joined) along the main scanning direction (the width direction of the substrate P). Thereby, a drawable range in the width direction of the substrate P can be expanded.

  Of the plurality of drawing units U, the drawing lines SLa and SLb of a predetermined number of drawing units U are located on the substrate P supported on the outer peripheral surface of the rotary drum DR1, and the drawing lines SLa and SLb of the remaining drawing units are rotated. The plurality of drawing units U are arranged so as to be located on the substrate P supported on the outer peripheral surface of the drum DR2. Accordingly, it is not necessary to arrange all the drawing units U for one rotating drum DR, and the degree of freedom of arrangement of the drawing units U is improved. Note that three or more rotating drums DR may be provided, and one or more drawing units U may be arranged for each of the three or more rotating drums DR.

  The drawing lines SLa and SLb (drawing units) are rotated (tilted) in order to tilt a predetermined pattern to be drawn on the irradiated surface of the substrate P. This makes it possible to change the shape of a predetermined pattern to be drawn according to the transfer state of the substrate P and the shape of the exposure region W of the substrate P. In addition, when a new predetermined pattern is superimposed and drawn on a lower layer pattern formed in advance on the irradiation surface of the substrate P, when the whole or a part of the lower layer pattern is tilted or nonlinear deformation occurs. The drawing lines SLa and SLb can be rotated (inclined) based on the measurement result. Thereby, the overlay accuracy with respect to the pattern formed in the lower layer is improved.

  Although the drawing lines SLa and SLb of each drawing unit U (U1 to U6) are arranged at the same position in the sub-scanning direction, they may be arranged at different positions in the sub-scanning direction. The point is that the drawing lines SLa and SLb need only be separated from each other in the main scanning direction. Even in this case, the rotation center axis AXr connects a point set between the midpoint of the drawing line SLa and the midpoint of the drawing line SLb, or connects each midpoint of the drawing line SLa and the drawing line SLb. Since the center point set on the line segment passes perpendicularly to the irradiated surface of the substrate P, the displacement of the drawing lines SLa and SLb due to the rotation of the drawing unit U can be reduced.

  Further, in the first embodiment, since the main scanning of the spot lights SPa and SPb along each of the two drawing lines SLa and SLb is performed by one polygon mirror PM, as shown in FIG. Even when the twelve drawing lines SL1a to SL6a and SL1b to SL6b are set corresponding to the exposure area W on the substrate P having a large width in the Y direction, the number of polygon mirrors PM is only half, that is, six. Therefore, vibration and noise (wind noise) generated due to high-speed rotation (for example, 20,000 rpm or more) of the polygon mirror PM can be suppressed.

[Modification of First Embodiment]
The first embodiment can be modified as follows.

  (Modification 1) FIG. 12 is a diagram when the beam scanning system by the polygon mirror PM in Modification 1 of the first embodiment is viewed from the + Zt direction side, and FIG. 13 is a beam scanning system of FIG. FIG. 4 is a diagram when viewed from the + Xt direction side. The same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof will not be repeated. Only the portions different from those in the first embodiment will be described. The polygon mirror PM of the first modification is also a regular octagon having eight reflecting surfaces RPa to RPh as shown in FIG. And the reflection surface RPe, and the reflection surface RPc and the reflection surface RPg) are parallel to each other.

  As shown in FIG. 13, the reflection mirror M4a reflects a beam LBa that passes through the beam shaping optical system BFa and travels in the + Xt direction in the −Zt direction. The beam LBa reflected in the −Zt direction by the reflecting mirror M4a passes through the first cylindrical lens CY1a whose generating line is set in parallel with the Xt axis, and then enters the reflecting mirror M5a. The reflection mirror M5a reflects the incident beam LBa in the + Yt direction and guides the beam LBa to the first reflection surface RPc of the polygon mirror PM. As shown in FIG. 12, the polygon mirror PM reflects the incident beam LBa toward the reflection mirror M5a (−Yt direction side) and guides it to the reflection mirror M6a. As described in the first embodiment, the reflection mirror M6a reflects the incident beam LBa in the −Xt direction and guides the beam LBa to the fθ lens FTa. Similarly, the reflection mirror M4b reflects the beam LBb that passes through the beam shaping optical system BFb and travels in the + X direction in the −Zt direction. The beam LBb reflected in the −Zt direction by the reflection mirror M4b passes through the first cylindrical lens CY1b whose generating line is set in parallel with the Xt axis, and then enters the reflection mirror M5b. The reflection mirror M5b reflects the incident beam LBb in the −Yt direction and guides the beam LBb to the second reflection surface RPg of the polygon mirror PM. The polygon mirror PM reflects the incident beam LBb to the reflection mirror M5b side (+ Yt direction side) and guides it to the reflection mirror M6b. The reflection mirror M6b reflects the incident beam LBb in the -Xt direction and guides it to the fθ lens FTb, as described in the first embodiment. The reflection mirrors M6a and M6b are arranged at the same position in the Zt direction. The reflection mirror M5a is disposed on the −Zt direction side of the reflection mirror M6a, and the reflection mirror M5b is disposed on the + Zt direction side of the reflection mirror M6b. The reflection mirrors M5a and M5b and the reflection mirrors M6a and M6b are provided at substantially the same position in the Xt direction. That is, the reflection mirrors M5a and M5b and the reflection mirrors M6a and M6b are provided along the Yt direction.

  The reflection mirrors M4a and M4b are provided instead of the reflection mirror M4 of the first embodiment, and have the same function as the reflection mirror M4. Further, the first cylindrical lenses CY1a and CY1b are provided in place of the first cylindrical lens CY1 of the first embodiment, and have the same function as the first cylindrical lens CY1. That is, the cylindrical lenses CY1a and CY1b converge the incident beams LBa and LBb on the reflection surface RP of the polygon mirror PM in the non-scanning direction (Zt direction) orthogonal to the scanning direction (rotation direction) by the polygon mirror PM. Similarly, the reflection mirrors M5a and M5b are provided instead of the reflection mirror M5 of the first embodiment, and have the same function as the reflection mirror M5. As described above, the reflection mirror M4, the first cylindrical lens CY1, and the reflection mirror M5 of the first embodiment are separately provided by the first light guide optical system 20 and the second light guide optical system 22, respectively. The provided mirror mirrors M4a and M4b, the first cylindrical lenses CY1a and CY1b, and the mirrors M5a and M5b.

  The distance in the Yt direction of the beams LBa and LBb incident on the reflection mirrors M4a and M4b in the XtYt plane is determined by the triangular reflection mirror M2 and the reflection mirrors M3a and M3b shown in FIG. Is enlarged so as to be larger than the dimension (diameter) of the first embodiment.

  In the first modification, as shown in FIG. 13, the entire polygon mirror PM is tilted so that the rotation axis AXp of the polygon mirror PM is inclined by a certain angle θy (less than 45 °) in the Yt direction from a state parallel to the Zt axis. Place it at an angle. Therefore, of the respective reflecting surfaces RP of the polygon mirror PM, the reflecting surfaces RPc and RPg positioned so as to face each of the reflecting mirrors M6a and M6b during rotation are inclined at a fixed angle θy in the Yt direction with respect to the Zt axis. Will do. FIGS. 12 and 13 show a state at the moment when the reflection surface RPc of such a polygon mirror PM and the reflection surface RPg facing the reflection surface RPc with the rotation axis AXp therebetween are both parallel to the Xt axis. . At this time, the beams LBa and LBb incident on the reflection surfaces RPc and RPg of the polygon mirror PM as viewed from the Xt direction orthogonal to the rotation axis AXp are incident on the respective reflection surfaces RPc and RPg at an oblique angle of incidence θy. The reflection positions of the beams LBa and LBb by the polygon mirror PM can be set at the same height position in the Zt direction. That is, the positions of the reflection mirrors M6a and M6b in the Zt direction can be made the same. Further, the respective center lines (traveling directions) of the beams LBa and LBb reflected by the polygon mirror PM and directed to the reflection mirrors M6a and M6b can be set in parallel with the XtYt plane. Accordingly, the positions of the first projection optical system 24 and the second projection optical system 26 in the Zt direction can be set to the same position, and the drawing lines SLa and SLb on the irradiation surface of the substrate P can be easily arranged in a straight line. Become.

  Note that, as shown in FIG. 13, the polygon mirror PM is inclined by the angle θy, and each of the beams LBa and LBb is projected from the Yt direction onto each of two parallel reflecting surfaces RPc and RPg of the polygon mirror PM. When the height of the projection position of the beam LBb on the reflection surface RPc and the projection position of the beam LBb on the reflection surface RPg are aligned in the Zt direction, if the inclination angle θy is increased, the rotation angle AXp direction of the reflection surfaces RPa to RPh is increased. The height dimension also needs to be increased. In the case of the first modification, when the inclination angle θy of the polygon mirror PM is increased, the arrangement of the reflection mirrors M5a, M5b, M6a, M6b, etc. becomes easy, but the rotation axis AXp direction of the reflection surfaces RPa to RPh of the polygon mirror PM. Is increased, and the mass of the polygon mirror PM is increased. Therefore, when giving priority to reducing the mass of the polygon mirror PM for speeding up the rotation, the projection position of the beam LBa on the reflection surface RPc and the projection position of the beam LBb on the reflection surface RPg in the Zt direction. And may be different.

  13, the beams LBa and LBb incident on the reflecting surfaces RPc and RPg contributing to the drawing of the polygon mirror PM when viewed from the Xt direction orthogonal to the rotation axis AXp are used as YtZt surfaces with respect to the reflecting surfaces RPc and RPg. When the beam LBa, LBb is incident obliquely, the incident direction and the reflection direction of the beams LBa, LBb can be made different in the rotation axis AXp direction or the Zt direction. Thereby, when the polygon mirror PM is viewed from the rotation axis AXp direction or the Zt direction (the state of FIG. 12), the beams LBa and LBb are made to be incident on the reflection surfaces RPc and RPg contributing to the drawing so as to be substantially orthogonal. Can be. That is, when viewed in the XtYt plane, the extension of each center line AXs of the beams LBa and LBb reflected by the reflection mirrors M5a and M5b and directed to the reflection surfaces RPc and RPg of the polygon mirror PM is equal to the rotation axis of the polygon mirror PM. AXp can be set.

  With this configuration, when viewed in the XtYt plane, the beams LBa and LBb reflected on each of the reflection surfaces RPc and RPg contributing to the drawing of the polygon mirror PM have a fixed angle range θs around the center line AXs. Are guided to the first projection optical system 24 (specifically, the fθ lens FTa) and the second projection optical system 26 (specifically, the fθ lens FTb). Therefore, when viewed from the rotation axis AXp direction or the Zt direction, for one scanning of the spot lights SPa and SPb along the drawing lines SLa and SLb, one spot is continuously formed on one reflection surface RP (RPc, RPg). The effective reflection angle range (θs) of the incident pulsed beams LBa and LBb can be sorted into a uniform angle range (± θs / 2) centered on the center line AXs. Thereby, the optical performance (aberration characteristics, focus characteristics, spot quality, etc.) and the uniform velocity of the beams LBa, LBb and the spot lights SPa, SPb scanned by the polygon mirror PM are improved, and the scanning accuracy is improved.

  (Modification 2) FIG. 14 is a diagram when the beam scanning system by the polygon mirror PMa in Modification 2 of the first embodiment is viewed from the + Zt direction side, and FIG. 15 is a beam scanning system of FIG. FIG. 4 is a diagram when viewed from the + Xt direction side. The same components as those of the first modification of the first embodiment are denoted by the same reference numerals, and only different portions will be described. The reflection mirrors M5a and M5b are located at the same position in the Zt direction, and are located on the + Zt direction side of the reflection mirrors M6a and 6b. The reflection mirrors M5a and M5b and the reflection mirrors M6a and M6b are provided at substantially the same position in the Xt direction.

  In the second modification, the rotation axis AXp of the polygon mirror PMa having eight reflection surfaces RPa to RPh is made parallel to the Zt axis, and each reflection surface RPa to RPh of the polygon mirror PMa is inclined by an angle θy with respect to the rotation axis AXp. It was formed so that. FIGS. 14 and 15 show that the first reflection surface RPc of such a polygon mirror PMa and the second reflection surface RPg facing the reflection surface RPc with the rotation axis AXp interposed therebetween are both parallel to the Xt axis. Shows the state at the moment. Then, as shown in FIG. 15, when viewed from the Xt direction orthogonal to the rotation axis AXp, each of the beam LBa toward the reflection surface RPc and the beam LBb toward the reflection surface RPg of the polygon mirror PM is inclined with respect to the reflection surfaces RPc and RPg. When the projection is performed from above (in the + Zt direction), the reflection positions of the beams LBa and LBb on the respective reflection surfaces RPc and RPg can be set in a plane parallel to the XtYt surface, that is, at the same height position in the Zt direction. That is, the positions of the center lines of the beams LBa and LBb reflected by the polygon mirror PM in the Zt direction can be made the same. Thus, similarly to the first modification of the first embodiment, the positions of the first projection optical system 24 and the second projection optical system 26 in the Zt direction can be set to the same position, and the substrate P can be irradiated. Drawing lines SLa and SLb on the surface can be easily arranged on a straight line.

  In addition, when viewed from the Xt direction, the beams LBa and LBb incident on each of two reflecting surfaces RP (for example, RPc and RPg) facing each other across the rotation axis AXp among the reflecting surfaces RPa to RPh of the polygon mirror PMa are reflected. Since the light is incident obliquely in the Z direction with respect to the plane RP, when viewed in the YtZt plane, the incident angle direction and the reflected angle direction of the beams LBa and LBb are changed in the rotation axis AXp direction (Zt direction) as shown in FIG. ) Can be separated by an angle 2θy. Accordingly, when the polygon mirror PMa is viewed from the direction of the rotation axis AXp (Zt direction), the incident direction and the reflection direction of each of the beams LBa and LBb can be made the same direction as shown in FIG. As a result, the beams LBa and LBb from the reflection mirrors M5a and M5b reflected by the polygon mirror PMa enter the reflection mirrors M6a and M6b without returning to the reflection mirrors M5a and M5b.

  Also in Modification 2, similarly to Modification 1 of FIG. 12, the beams LBa and LBb reflected on the reflection surfaces RPc and RPg contributing to the drawing of the polygon mirror PMa are constant around the center line AXs. Is guided to the first projection optical system 24 (specifically, the fθ lens FTa) and the second projection optical system 26 (specifically, the fθ lens FTb) while being deflected and scanned in the angle range θs. Therefore, the effective reflection angles of the pulsed beams LBa, LBb continuously incident on one reflection surface RP (RPc, RPg) for one scanning of the spot light along the drawing lines SLa, SLb. The range (θs) can be assigned to a uniform angle range (± θs / 2) centered on the center line AXs. This improves the optical performance (aberration characteristics, focus characteristics, spot quality, etc.) and uniform velocity of the beams LBa, LBb and the spot lights SPa, SPb scanned by the polygon mirror PMa, and improves the scanning accuracy.

  (Modification 3) In Modification 1 of the first embodiment, the rotation axis AXp of the polygon mirror PM is inclined by an angle θy in the Yz direction with respect to the Zt axis. In Modification 2, the polygon mirror PMa Is made parallel to the Zt axis, and the reflection surfaces RPa to RPh of the polygon mirror PMa are formed so as to be inclined by an angle θy with respect to the Zt axis. However, the arrangement of the polygon mirror PM and the configuration of each reflection surface RP (RPa to RPh) are not limited to the first and second modifications. For example, by using the polygon mirror PM having the configuration as in the first embodiment, an obliquely upward direction with respect to a plane (parallel to the XtYt plane) perpendicular to each reflecting surface RP (parallel to the Zt axis and the rotation axis AXp). The beam LB may be incident from (or from below). Thus, when the polygon mirror PM is viewed from the direction of the rotation axis AXp of the polygon mirror PM, in a state where the respective reflection surfaces RP are positioned so that the beams LBa and LBb are vertically incident, the incident direction and the reflection direction of the beams LBa and LBb are set. Can be made the same, and the incident direction and the reflection direction of the beams LBa and LBb can be shifted in the direction of the rotation axis AXp (Zt axis). Therefore, the polygon mirror PM divides the beams LBa and LBb reflected by each of the two reflecting surfaces RP into a certain angular range θs around the center line AXs (allocation of an angle ± θs / 2 around the center line AXs). And can be guided to the first projection optical system 24 (specifically, the fθ lens FTa) and the second projection optical system 26 (specifically, the fθ lens FTb). As described above, even in the case of the third modification, similarly to the first and second modifications of the first embodiment, the optics of the beams LBa and LBb and the spot lights SPa and SPb scanned by the polygon mirror PM. Performance (aberration characteristics, focus characteristics, spot quality, etc.) and uniformity are improved, and scanning accuracy is improved.

  (Modification 4) As in Modification 3, the rotation axis AXp is parallel to the Zt axis, and each of the reflection surfaces RPa to RPh also uses a regular octagonal polygon mirror PM parallel to the rotation axis AXp. As in each of Modifications 1 to 3, the incident directions of the beams LBa and LBb incident on the reflection surface RP of the polygon mirror PM contributing to the drawing are made the same as the reflection direction when viewed in the XtYt plane. As another configuration, as shown in FIGS. 16A and 16B, a polarizing beam splitter PBS (PBSa, PBSb) may be used. FIG. 16A is a diagram when the beam scanning system by the polygon mirror PM according to the fourth modification of the first embodiment is viewed from the + Zt direction side, and FIG. 16B is a diagram in which the beam scanning system of FIG. FIG. The same members as those described in the first embodiment and Modifications 1 and 2 are denoted by the same reference numerals, and only different portions will be described.

  As shown in FIGS. 16A and 16B, in the fourth modification, a rectangular parallelepiped polarizing beam splitter PBSa having a beam incident / outgoing surface parallel to each of the XtYt surface and the XtZt surface is provided between the polygon mirror PM and the reflecting mirror M6a. A rectangular parallelepiped polarizing beam splitter PBSb is disposed between the polygon mirror PM and the reflection mirror M6b, and has a beam incident / outgoing surface parallel to each of the XtYt surface and the XtZt surface. The polarization splitting surfaces of the polarization beam splitters PBSa and PBSb are set to be inclined at 45 ° with respect to both the XtYt plane and the XtZt plane. Further, a quarter-wave plate QPa is provided between the polarization beam splitter PBSa and the polygon mirror PM, and a quarter-wave plate QPb is provided between the polarization beam splitter PBSb and the polygon mirror PM.

  In the above configuration, the beam LBa modulated by the optical element (acousto-optic modulation element) AOMa (see FIGS. 5 and 7) is, as shown in FIG. 16B, a first cylindrical lens whose generating line is parallel to the Xt axis. The light converges in the Yt direction by the CY1a and is incident on the polarization beam splitter PBSa from the + Zt direction side in parallel with the Zt axis. If the beam LBa is linearly S-polarized, the beam LBa is mostly reflected on the polarization splitting surface of the polarization beam splitter PBSa, passes through the quarter-wave plate QPa, becomes circularly polarized light, and travels toward the polygon mirror PM. When the rotation angle position of the polygon mirror PM falls within a range of an angle ± θs / 2 from a state in which one reflection surface PRc contributing to drawing by the beam LBa is parallel to the XtZt plane, as shown in FIG. The beam LBa transmitted through the wavelength plate QPa is reflected by the reflection surface PRc, passes through the 波長 wavelength plate QPa again, becomes linear P-polarized light, and returns to the polarization beam splitter PBSa. Therefore, most of the beam LBa reflected by the reflection surface PRc passes through the polarization splitting surface of the polarization beam splitter PBSa and travels toward the reflection mirror M6a.

  Similarly, the beam LBb modulated by the optical element (acousto-optic modulation element) AOMb (see FIGS. 5 and 7) is transmitted by the first cylindrical lens CY1b whose generating line is parallel to the Xt axis, as shown in FIG. 16B. In a state converged in the Yt direction, the light is incident on the polarization beam splitter PBSb from the + Zt direction side in parallel with the Zt axis. Assuming that the beam LBb is linear S-polarized light, the beam LBb is mostly reflected on the polarization splitting surface of the polarization beam splitter PBSb, passes through the quarter-wave plate QPb, becomes circularly polarized light, and travels toward the polygon mirror PM. When the rotation angle position of the polygon mirror PM falls within a range of an angle ± θs / 2 from a state in which one reflection surface PRg contributing to drawing by the beam LBb is parallel to the XtZt plane as shown in FIG. The beam LBb that has passed through the four-wavelength plate QPb is reflected by the reflection surface PRg, passes through the quarter-wavelength plate QPb again, becomes linear P-polarized light, and returns to the polarization beam splitter PBSb. Therefore, most of the beam LBb reflected by the reflection surface PRg passes through the polarization splitting surface of the polarization beam splitter PBSb and travels to the reflection mirror M6b.

  With the above configuration, each of the beam LBa reflected by the reflection mirror M6a and the beam LBb reflected by the reflection mirror M6b is scanned within a plane parallel to the XtYt plane and within the angle range θs. The extension of the optical axis AXfa of the first projection optical system 24 (specifically, the fθ lens FTa) disposed after the reflection mirror M6a is bent by 90 ° by the reflection mirror M6a, and An extension of the optical axis AXfb of the second projection optical system 26 (specifically, the fθ lens FTb) intersecting with the rotation axis AXp and disposed after the reflection mirror M6b is bent by 90 ° by the reflection mirror M6b. Is disposed so as to intersect with the rotation axis AXp of the polygon mirror PM. Therefore, also in the fourth modification, the polygon mirror PM converts the beams LBa and LBb reflected on each of the two reflection surfaces (for example, RPc and RPg) into a certain angle range θs (light beam) about the optical axes AXfa and AXfb. The light can be deflected at an angle ± θs / 2 around the axes AXfa and AXfb) and guided to the first projection optical system 24 (fθ lens FTa) and the second projection optical system 26 (fθ lens FTb). As described above, even in the case of Modification 4, the optical performance (aberration characteristics, focus characteristics, spot quality, etc.) and the uniform velocity of the beams LBa and LBb and the spot lights SPa and SPb scanned by the polygon mirror PM are improved. And the scanning accuracy is improved. Further, similarly to the first embodiment and the first to third modifications thereof, in the fourth modification as well, each of the two beams LBa and LBb is generated by the polarization scanning of the two beams LBa and LBb by one polygon mirror PM. The drawing lines SLa and SLb have a length that can maintain linearity with an accuracy corresponding to the fineness (minimum line width) of the pattern to be drawn and the effective dimension (diameter) of the spot light SPa and SPb, for example, 30. It can be set to about 80 mm.

  In the fourth modification, the beams LBa and LBb deflected and scanned by the polygon mirror PM are polarized within an effective angle range θs corresponding to the lengths of the drawing lines SLa and SLb, as shown in FIG. 16A. The light enters the beam splitters PBSa and PBSb. Therefore, the extinction ratio, which is the degree of separation between P-polarized light and S-polarized light of the polarization beam splitters PBSa and PBSb, is set to be maximum over the angle range θs or more. As an example of such polarization beam splitters PBSa and PBSb, a laminated film of a hafnium oxide (HfO2) film and a silicon dioxide (SiO2) film repeatedly on a polarization separation surface is disclosed in WO 2014/073535 pamphlet. Have been.

[Second embodiment]
FIG. 17 is a diagram illustrating a partial configuration of the drawing unit Ua according to the second embodiment. Since each drawing unit Ua has the same configuration, also in the second embodiment, the drawing unit Ua2 that scans the spot lights SPa and SPb along the drawing lines SL2a and SL2b will be described as an example. The same components as those in the first embodiment are denoted by the same reference numerals. In addition, only different points from the first embodiment will be described.

  In the second embodiment, the polygon mirror PM is provided such that the rotation axis AXp extends in the Xt axis direction, and the fθ lenses FTa and FTb are provided such that the optical axes AXfa and AXfb extend in the Zt axis direction. Has been. Of the eight reflecting surfaces RP of the polygon mirror PM, two reflecting surfaces RP (reflecting surfaces RPb and RPh in FIG. 17) forming an angle of 90 ° with each other in the YtZt plane have beams traveling in the −Zt axis direction. LBa and LBb enter. The first reflecting surface RP (here, RPh) of the polygon mirror PM reflects the beam LBa incident from the first direction in the −Yt direction and guides the beam LBa to the reflecting mirror M6a. The beam LBa reflected by the reflection mirror M6a travels in the −Zt direction, passes through the fθ lens FTa and the cylindrical lens CY2a, and then enters the substrate P. By the fθ lens FTa and the cylindrical lens CY2a, the beam LBa incident on the substrate P becomes a spot light SPa on the irradiated surface of the substrate P. The second reflection surface RP (here, RPb) of the polygon mirror PM reflects the beam LBb incident from the second direction different from the first direction in the + Yt direction side and guides the beam LBb to the reflection mirror M6b. The beam LBb reflected by the reflection mirror M6a travels in the −Zt direction, passes through the fθ lens FTb and the cylindrical lens CY2b, and then enters the substrate P. By the fθ lens FTb and the cylindrical lens CY2b, the beam LBb incident on the substrate P becomes a spot light SPb on the irradiated surface of the substrate P. The spot lights SPa and SPb projected on the irradiation surface of the substrate P scan the drawing lines SL2a and SL2b at a constant speed by rotation of the polygon mirror PM.

  As described above, the polygon mirror PM is provided so that the rotation axis AXp extends in the Xt axis direction, and the fθ lenses FTa and FTb are provided so that the optical axes AXfa and AXfb extend in the Zt axis direction. As in the embodiment, it is not necessary to provide the reflection mirrors M7a and M7b that reflect the beams LBa and LBb passing through the fθ lenses FTa and FTb and traveling in the −Xt direction in the −Z direction. Even with such a configuration, the same effect as that of the first embodiment can be obtained.

  In the second embodiment, the reflection mirror M6a, the fθ lens FTa, and the cylindrical lens CY2a function as the first projection optical system 24a, and the reflection mirror M6a, the fθ lens FTb, and the cylindrical lens CY2b are used. It functions as the second projection optical system 26a. The drawing unit Ua according to the second embodiment is also rotatable around the rotation center axis AXr, and the rotation center axis AXr is a line connecting the middle point of the drawing line SL2a and the middle point of the drawing line SL2b. The light passes through the center point of the minute and perpendicularly to the irradiated surface of the substrate P.

  Further, in the second embodiment, although not particularly shown, instead of the first light guide optical system 20 and the second light guide optical system 22 of the first embodiment, a light source device 14 A first light guide optical system and a second light guide optical system that guide the beams LBa and LBb to the polygon mirror PM are arranged such that the beams LBa and LBb advance in the −Z direction and enter the polygon mirror PM.

  As described in the third modified example of the first embodiment, the beam LB is inclined obliquely to the direction intersecting with the rotation direction of the reflection surface RP (the direction in which the rotation axis AXp of the polygon mirror PM extends). , The incident direction and the reflected direction of the beams LBa and LBb can be shifted in the direction of the rotation axis AXp. Therefore, an effect similar to that of the third modification of the first embodiment can be obtained.

  Further, as described in the first modification of the first embodiment, when viewed from a direction orthogonal to the rotation axis AXp, the polygon mirror PM tilts the rotation axis AXp of the polygon mirror PM with respect to the Xt direction. You may let it. Further, the polygon mirror PMa described in the second modification of the first embodiment may be used. That is, the rotation axis AXp of the polygon mirror PM in FIG. 17 is made parallel to the Xt axis, and each reflection surface RP (RPa to RPh) of the polygon mirror PM is shifted from the state parallel to the rotation axis AXp by an angle θy as shown in FIG. It may be formed so as to be inclined. Accordingly, the beams LBa and LBb that are incident on the respective reflection surfaces RP (RPa to RPh) of the polygon mirror PM as viewed from a direction orthogonal to the rotation axis AXp are obliquely incident on the respective reflection surfaces RP, thereby obtaining the first first light. The same effects as those of the first and second modifications of the embodiment can be obtained.

[Third Embodiment]
FIG. 18 is a diagram illustrating the configuration of the drawing unit Ub according to the third embodiment viewed from the −Yt (−Y) direction side, and FIG. 19 is a diagram illustrating the configuration of the drawing unit Ub on the + Zt side from the polygon mirror PMb when viewed in the + Xt direction. FIG. 20 is a diagram of the configuration of the drawing unit Ub on the −Zt direction side from the polygon mirror PMb as viewed from the + Zt direction side. The same components as those in the first embodiment are denoted by the same reference numerals. In addition, only different points from the first embodiment will be described.

  As shown in FIG. 19, the drawing unit Ub includes a triangular reflecting mirror (right-angle mirror) M10 having ridges parallel to the Xt axis, reflecting mirrors M11a and M11b, shift optical members SRa and SRb, and a cylindrical lens having a generating line parallel to the Xt axis. CY1a, CY1b, polygon mirror PMb of eight reflecting surfaces RP, reflecting mirrors M12a, M12b, reflecting mirrors M13a, M13b, reflecting mirrors M14a, M14b, fθ lenses FTa, FTb, reflecting mirrors M15a, M15b, and a generating line with the Yt axis. The optical system includes parallel cylindrical lenses CY2a and CY2b. Optical members provided as a pair for the two beams LBa and LBb are denoted by a and b after the reference numerals.

  As shown in FIG. 19, the two beams LBa and LBb (both are parallel light beams) from the light source device 14 are arranged in parallel with the rotation center axis AXr therebetween and proceed in the −Zt direction, and the triangular reflection mirror of the drawing unit Ub Light is incident on separate reflection surfaces M10a and M10b sandwiching the ridge line of M10. The beams LBa and LBb are incident on the respective reflecting surfaces M10a and M10b of the triangular reflecting mirror M10 of the drawing unit Ub so as to be symmetric in the Yt direction with respect to the rotation center axis AXr parallel to the Zt axis. The reflecting surface M10a of the triangular reflecting mirror M10 reflects the beam LBa in the −Yt direction and guides it to the reflecting mirror M11a, and the reflecting surface M10b of the triangular reflecting mirror M10 reflects the beam LBb in the + Yt direction and guides the beam LBb to the reflecting mirror M11b. . The beam LBa reflected by the reflection mirror M11a travels in the −Zt direction, passes through the shift optical member SRa and the cylindrical lens CY1a, and then enters the reflection surface RP (for example, the reflection surface RPa) of the polygon mirror PMb. The beam LBb reflected by the reflection mirror M11b travels in the −Zt direction, passes through the shift optical member SRb and the cylindrical lens CY1b, and then enters the reflection surface RP (for example, the reflection surface RPe) of the polygon mirror PMb. The reflection surface RPa and the reflection surface RPe of the polygon mirror PMb are symmetrically positioned with respect to the rotation axis AXp of the polygon mirror PMb.

  In the third embodiment, as shown in FIG. 20, the rotation axis AXp of the polygon mirror PMb is set to be coaxial with the rotation center axis AXr. The triangular reflection mirror M10 and the reflection mirrors M11a and M11b (see FIG. 19) increase the distance in the Yt direction between the respective center lines of the beams LBa and LBb incident on the polygon mirror PMb. Accordingly, the distance between the optical axes of the beams LBa and LBb incident on the drawing unit Ub can be shortened, and the beams LBa and LBb incident on the drawing unit Ub (triangular reflection mirror M10) approach the rotation center axis AXr. be able to. As a result, even when the entire drawing unit Ub rotates, it is possible to suppress the position of each center line of the beams LBa and LBb from being largely changed in the drawing unit Ub due to the rotation. Changes in the positions of the center lines of the beams LBa and LBb due to the rotation of the drawing unit Ub are corrected by shift optical members SRa and SRb that function in the same manner as in the first embodiment.

  The reflecting surface M10a of the triangular reflecting mirror M10, the reflecting mirror M11a, the shift optical member SRa, and the cylindrical lens CY1a guide the beam LBa toward the first reflecting surface RP (RPa) of the polygon mirror PMb. It functions as the optical optical system 20b. The reflecting surface M10b, the reflecting mirror M11b, the shift optical member SRb, and the cylindrical lens CY1b of the triangular reflecting mirror M10 transmit the beam LBb to the second reflecting surface RP (RPe) different from the first reflecting surface of the polygon mirror PMb. Function as a second light guiding optical system 22b that guides the light toward the second light guiding optical system 22b. Note that each of the reflection surfaces M10a and M10b of the triangular reflection mirror M10 may be a plane mirror provided separately in the first light guide optical system 20b and the second light guide optical system 22b. Note that the cylindrical lens CY1a (similarly for CY1b) has a refracting power that converges the incident beam LBa (LBb) as a parallel light beam only in the Yt direction, so that it is located on the reflection surface RPa (reflection surface RPe) of the polygon mirror PMb. , Xt directions are projected in a slit shape.

  The polygon mirror PMb according to the third embodiment has a regular octagonal shape as shown in FIG. 20 when viewed in the XtYt plane, and has eight reflection surfaces RPa to RPh formed therearound (FIG. 19). Each of RPa to RPe is formed so as to be inclined by 45 degrees with respect to the rotation axis AXp (rotation center axis AXr). That is, the polygon mirror PMb has a shape such that a regular octagonal pyramid whose bottom surface is a regular octagon and each of the eight side surfaces is inclined at 45 degrees with respect to the center line is cut out at an appropriate thickness in the center line direction. Therefore, each reflecting surface (RPa to RPh) of the polygon mirror PMb reflects the beam LBa traveling in the −Zt direction at right angles to the −Yt direction side and guides it to the reflection mirror M12a, and directs the beam LBb traveling in the −Zt direction to the + Y direction. The light is reflected at right angles to the side and guided to the reflection mirror M12b. Therefore, as in the second modification of the first embodiment, the polygon mirror PMb uses, for example, the beams LBa and LBb reflected by, for example, the reflecting surfaces RPa and RPe among the eight reflecting surfaces RPa to RPh to each of the center lines. AXs (coaxial with the respective optical axes AXfa and AXfb of the two fθ lenses FTa and FTb) can be reflected in a certain angular range θs. Thereby, the optical performance, scanning linearity, and constant velocity of the spot lights SPa, SPb of the beams LBa, LBb by the polygon mirror PMb are improved, and the scanning accuracy (drawing accuracy) is improved.

  As shown in FIGS. 18 and 20, the beam LBa from the polygon mirror PMb (for example, the reflection surface RPa) reflected in the −Xt direction by the reflection mirror M12a is guided to the fθ lens FTa via the reflection mirrors M13a and M14a. I will be. Similarly, the beam LBb from the polygon mirror PMb (for example, the reflection surface RPe) reflected in the + Xt direction by the reflection mirror M12b is guided to the fθ lens FTb via the reflection mirrors M13b and M14b. The reflecting mirror M13a reflects the beam LBa traveling in the −Xt direction from the reflecting mirror M12a in the −Zt direction at the bending position p13a, and the reflecting mirror M14a reflects the beam LBa from the reflecting mirror M13a in the + Xt direction at the bending position p14a. To the fθ lens FTa. The reflecting mirror M13b reflects the beam LBb traveling in the + Xt direction from the reflecting mirror M12b in the -Zt direction at the bending position p13b, and the reflecting mirror M14b reflects the beam LBb from the reflecting mirror M13a in the -Xt direction at the bending position p14b. To the fθ lens FTb. Although not shown in FIG. 20, the beam LBa incident on the fθ lens FTa via the reflection mirrors M12a, M13a, and M14a is a substantially parallel light beam when viewed in the XtYt plane due to the action of the cylindrical lens CY1a. When viewed in the XtZt plane, it is a divergent light beam as shown in FIG.

  The beam LBa that passes through the fθ lens FTa (the optical axis AXfa is parallel to the Xt axis) and travels in the + Xt direction is reflected in the telecentric state by the reflecting mirror M15a in the −Zt direction, passes through the cylindrical lens CY2a, and then passes through the substrate P Is projected as a circular spot light SPa on the surface to be irradiated. Similarly, the beam LBb passing through the fθ lens FTb (the optical axis AXfb is parallel to the Xt axis) and traveling in the −Xt direction is reflected in the −Zt direction by the reflecting mirror M15b in a telecentric state, and has passed through the cylindrical lens CY2b. Thereafter, the light is projected as a circular spot light SPb on the irradiated surface of the substrate P. By the fθ lens FTa and the cylindrical lens CY2a, the beam LBa projected on the substrate P is converged as a minute spot light SPa on the irradiated surface of the substrate P. Similarly, the beam LBb projected on the substrate P is converged as a minute spot light SPb on the irradiation surface of the substrate P by the fθ lens FTb and the cylindrical lens CY2b. By the rotation of one polygon mirror PMb, the two spot lights SPa and SPb projected on the irradiation surface of the substrate P are simultaneously one-dimensionally scanned on the drawing lines SLa and SLb. In the case of the configuration of the third embodiment, the two spot lights SPa and SPb scan and move in opposite directions along the drawing lines SLa and SLb. Then, as shown in FIG. 20, when the polygon mirror PMb is rotated clockwise in the XtYt plane, the end of the drawing line SLa, which becomes a joint in the Yt direction of the drawing pattern, in the + Yt direction and the −Yt direction of the drawing line SLb. The end portions are set to be the scanning end positions of the spot lights SPa and SPb, respectively. Conversely, when the polygon mirror PMb is rotated counterclockwise in the XtYt plane, the end of the drawing line SLa, which is a joint in the Yt direction of the drawing pattern, in the + Yt direction, and the end of the drawing line SLb in the -Yt direction, Are set to be the scanning start positions of the spot lights SPa and SPb, respectively.

  In the above configuration, the reflection mirrors M12a, M13a, M14a, M15a, the fθ lens FTa, and the cylindrical lens CY2a converge the beam LBa reflected and deflected by the polygon mirror PMb to be drawn as spot light SPa. It functions as a first projection optical system 24b that projects onto SLa. The reflection mirrors M12b, M13b, M14b, M15b, the fθ lens FTb, and the cylindrical lens CY2b converge the beam LBb reflected and deflected by the polygon mirror PMb to be spot light SPb on the drawing line SLb. It functions as a second projection optical system 26b for projection.

  As shown in FIGS. 18 and 20, in the third embodiment, the optical path length from the reflection surface RP of the polygon mirror PMb to the fθ lenses FTa and FTb is equal to the length of the reflection mirrors M12a to M14a and M12b to M14b. Therefore, fθ lenses FTa and FTb having long focal lengths on the beam incident side can be used as the fθ lenses FTa and FTb. In general, the reflection surface of the polygon mirror PM (PMa, PMb is the same) is disposed at or near the position (pupil position) of the focal length fs on the beam incident side of the telecentric fθ lens FTa (FTb). Therefore, assuming that the length of the drawing line SLa (SLb) on the irradiated surface is Lss and the deflection angle range of the beam incident on the fθ lens at that time is θs, Ls ≒ fs · sin (θs ). Therefore, when the length Lss of the drawing line SLa (SLb) is set to a constant value, if an fθ lens having a long focal length fs is used, the deflection angle range θs can be correspondingly reduced. This means that the rotation angle range θs / 2 of the polygon mirror PM (PMa, PMb) contributing to one scan of the spot light SPa (SPb) along the drawing line SLa (SLb) becomes smaller, It has the advantage of speeding up.

  In the drawing unit Ub according to the third embodiment, as shown in FIG. 20, the drawing line SLa and the drawing line SLb on which the spot light SPa and the spot light SPb are scanned are separated from each other in the sub-scanning direction. The drawing line SLa and the drawing line SLb are set so as to be shifted in the Yt direction so that the ends are adjacent or partially overlapped in the main scanning direction. In other words, the drawing lines SLa and SLb are arranged so as to be separated in the sub-scanning direction (the direction of transport of the substrate P) in a parallel state, and to be continuous without any gap in the main scanning direction. Therefore, when a plurality of such drawing units Ub are arranged, for example, they are arranged as shown in FIG.

  FIG. 21 corresponds to FIG. 2 and divides an exposure region W as an electronic device formation region formed on the substrate P into six in the Y (Yt) direction, and forms a plurality of stripe-like divided regions WS1 to WS6. Are drawn by using six drawing lines SL1a, SL1b, SL2a, SL2b, SL3a, and SL3b. Here, the two drawing lines SL1a and SL1b by the first drawing unit Ub1 having the same configuration as the drawing unit Ub as shown in FIGS. 18 to 20 have patterns in the divided areas WS1 and WS2 adjacent to each other in the Y direction. Set to draw. Similarly, two drawing lines SL2a and SL2b by the second drawing unit Ub2 having the same configuration as the drawing unit Ub are set so as to draw a pattern in the divided areas WS3 and WS4 adjacent to each other in the Y direction, respectively. The two drawing lines SL3a and SL3b by the third drawing unit Ub3 having the same configuration as those described above are set so as to draw patterns in the divided areas WS5 and WS6 adjacent to each other in the Y direction. The joint STa between the divided areas WS1 and WS2, the joint STb between the divided areas WS2 and WS3, the joint STc between the divided areas WS3 and WS4, the joint STd between the divided areas WS4 and WS5, and the joint STe between the divided areas WS5 and WS6. Then, the positions of the drawing lines in the Y direction and the positions of the respective drawing lines are set so that the ends of the six drawing lines SL1a,. The drawing magnification is precisely adjusted.

  As described above, in the third embodiment, the two drawing lines SLa and SLb where the spot lights SPa and SPb are scanned by the drawing units Ub (Ub1 to Ub3) are separated from each other in the sub-scanning direction, and The ends are set to be adjacent or partially overlapped in the main scanning direction. Even in this case, the rotation center axis AXr when the whole drawing unit Ub is slightly rotated passes perpendicularly to the substrate P through the center point of a line connecting the middle points of the two drawing lines SLa and SLb. Can be set as follows. Therefore, even when the entire drawing unit Ub is rotated around the rotation center axis AXr in order to obtain high overlay accuracy, the two drawing lines SLa on which the spot light SPa and SPb are scanned by the drawing unit Ub. , SLb on the substrate P can be suppressed from becoming large, so that the inclination of the drawing lines SLa and SLb (the inclination with respect to the Y axis in the irradiated surface) can be easily adjusted while performing highly accurate pattern drawing. can do.

  In each of the above embodiments (including modified examples), the drawing lines SL of the plurality of drawing units U, Ua, and Ub all have the same scan length, but the scan lengths may be different. In this case, the scanning length of the drawing line SL may be made different between the drawing units U, Ua, and Ub, or the scanning length of the drawing lines SLa and SLb may be changed in the same drawing unit U, Ua, and Ub. You may make it different. Further, the rotation center axis AXr passes through the center point of a line connecting the middle points of the drawing lines SLa and SLb of the drawing units U, Ua and Ub perpendicularly to the substrate P. May be set on a line segment that is perpendicular to the drawing line and that connects the midpoints of the drawing lines SLa and SLb.

  In the case of the third actual embodiment described above, since the pattern is drawn on the irradiation surface of the substrate P supported in the longitudinal direction as a cylindrical surface by the rotating drums DR1 and DR2 as in the first embodiment. As shown in FIG. 22, the extension of the optical axis AXfa (AXfb) bent by the reflection mirror M15a (M15b) after the fθ lens FTa (FTb) of the drawing unit Ub is attached to the rotating drum DR1 or DR2. The inclination of the reflection mirror M15a (M15b) in the XZ plane is set to an angle other than 45 degrees so as to be directed to the central axis (rotation central axis) AXo1 or AXo2, and the cylindrical lens CY2a (CY2b) is also inclined. What is necessary is just to incline and arrange with respect to XY plane so that it may correspond to optical axis AXfa (AXfb). When the substrate P is supported flat in parallel with the XY plane, for example, a transfer device disclosed in WO 2013/150677 can be used. Further, in order to support the substrate P by bending it into a cylindrical shape in the longitudinal direction, a large number of fine gas ejection holes (and a large number of fine suction holes) are formed on the surface curved into a cylindrical shape. A pad member (substrate support holder) that supports the back side with a gas bearing in a non-contact or low friction state may be used instead of the rotating drums DR1 and DR2. Also, in the first and second embodiments and their modifications, the substrate P disclosed in WO 2013/150677 is parallel to the XY plane instead of the rotating drums DR1 and DR2. A transfer device that supports the substrate P flat and may use the above-described pad member (substrate support holder) that supports the back surface of the substrate P in a non-contact or low-friction state by a gas bearing.

[Modification of First to Third Embodiments]
The first to third embodiments can be modified as follows.

(Modification 1) FIG. 23 shows a beam LB (two beams LBa, LBb) provided from the light source device 14 shown in FIG. 1 as, for example, four drawing units U1, U2, It is a figure showing an example of composition of a beam distribution system for distributing to each of U5 and U6. This beam distribution system is applicable not only to the first embodiment, but also to any of the drawing apparatuses according to the second and third embodiments and their modifications.

  The light source device 14 outputs a laser beam LS that outputs a high-intensity ultraviolet laser beam (continuous light or pulsed light), and converts the beam from the laser light source LS into a parallel light beam having a predetermined diameter (for example, a diameter of several mm). A beam expander BX, a first beam splitter (half mirror) BS1 that divides a parallel light beam into two, and a mirror MR1 are provided. The beam reflected by the beam splitter BS1 is incident on the second beam splitter BS2a as the beam LBa, and the beam transmitted through the beam splitter BS1 is reflected by the mirror MR1 and is incident on the second beam splitter BS2b as the beam LBb. I do. The division ratio of the beam splitter BS1 is 1: 1, and the light intensities (illuminance) of the beams LBa and LBb are substantially equal. The beam LBa incident on the beam splitter BS2a and the beam LBb incident on the beam splitter BS2b are further divided into two with an equal intensity ratio.

  Among the beams LBa incident on the beam splitter BS2a, the beam LBa transmitted through the beam splitter BS2a is incident on a third beam splitter BS3a (having a division ratio of 1: 1). Among the beams LBb that have entered the beam splitter BS2b, the beam LBb that has passed through the beam splitter BS2b enters a third beam splitter BS3b (having a division ratio of 1: 1). The two beams LBa and LBb reflected by each of the beam splitters BS3a and BS3b are parallel to each other across the rotation center axis AXr of the drawing unit U1, and correspond to the corresponding optical elements AOMa and AOMb (see FIG. 5 and the like). To the drawing unit U1. The two beams LBa and LBb transmitted through the beam splitters BS3a and BS3b are reflected by the mirrors MR2a and MR2b, respectively, and then become parallel to each other with the rotation center axis AXr of the drawing unit U2 interposed therebetween. To the drawing unit U2 via the optical elements AOMa and AOMb.

  Further, the beam LBa reflected by the previous beam splitter BS2a is incident on a fourth beam splitter BS4a (division ratio is 1: 1), and the beam LBb reflected by the previous beam splitter BS2b is a fourth beam. The light enters the splitter BS4b (the division ratio is 1: 1). The two beams LBa and LBb reflected by each of the beam splitters BS4a and BS4b are parallel to each other across the rotation center axis AXr of the drawing unit U5, and are drawn through the corresponding optical elements AOMa and AOMb. Head for. Then, the two beams LBa and LBb transmitted through the beam splitters BS4a and BS4b are reflected by the mirrors MR3a and MR3b, respectively, and then become parallel to each other with the rotation center axis AXr of the drawing unit U6 interposed therebetween. To the drawing unit U6 via the optical elements AOMa and AOMb. With the above configuration, the beams LBa and LBb distributed to each of the four drawing units U1, U2 and U5 are set to have substantially the same light intensity.

  By the way, the laser light source in the light source device 14 may be any of a solid-state laser and a gas laser as long as it emits a high-intensity beam having an ultraviolet wavelength. As a solid-state laser, a fiber laser light source that amplifies an infrared wavelength beam (several hundred MHz pulse light) from a semiconductor laser diode with a fiber amplifier and then emits it as an ultraviolet wavelength beam (pulse light) with a wavelength conversion element. When used, a high-power ultraviolet beam can be obtained in spite of a relatively compact housing, and it becomes easy to incorporate the exposure apparatus (drawing apparatus) EX into the main body. Furthermore, in the above-described first to third embodiments and each of the modifications, the drawing unit U (Ua, Ub) that can turn around the rotation center axis AXr in the exposure apparatus EX main body includes: Although a drawing light source is not provided, each drawing unit U (Ua) is used when a pattern drawing (exposure) can be sufficiently performed with the intensity of a beam from a semiconductor laser diode (LD) or a light emitting diode (LED). , Ub) may be provided with an LD or LED for supplying the beams LBa, LBb. However, since the temperature of the light source unit using the LD or LED rises considerably during the pattern drawing operation, a temperature adjusting mechanism such as heat insulation and cooling of the light source unit in the drawing unit U (Ua, Ub) is provided. It is necessary to keep the temperature change of the whole drawing unit U (Ua, Ub) small. In this case, optical elements AOMa and AOMb as shown in FIG. 5 are also provided in each drawing unit U (Ua, Ub).

  (Modification 2) In the above-described first to third embodiments and their modifications, the polygon mirror PM (PMa, PMb) arranges eight reflecting surfaces at 45-degree intervals around the rotation axis AXp. Although the octahedron (or octagonal pyramid shape) was used, the number of reflecting surfaces may be any number, and three to six, nine, ten, twelve, fifteen, sixteen, eighteen, A polygon mirror of 20 planes or the like can be used similarly. In general, even with a polygon having the same diameter, if the number of reflection surfaces increases, the windage loss decreases, so that it is possible to rotate the polygon at a higher speed. Although illustration and explanation are omitted in the first to third embodiments and their respective modifications, two beams LBa reflected by each of the different reflection surfaces of the polygon mirror PM (PMa, PMb), An origin sensor that outputs an origin signal at a timing when LBb has a reflection direction corresponding to the scanning start points of the spot lights SPa and SPb on the drawing lines (scan lines) SLa and SLb, respectively, is a polygon mirror PM (PMa). , PMb). Management of the scanning positions of the spot lights SPa and SPb along the drawing lines SLa and SLb (offset setting, etc.) and timing of intensity modulation of the spot lights SPa and SPb based on the pattern data (On / Off of the optical elements AOMa and AOMb). Are controlled based on the origin signal and a clock signal corresponding to the scanning speed of the spot lights SPa and SPb.

[Fourth Embodiment]
In the first to third embodiments and their modifications, the polygon mirrors PM (PMa, PMb) are provided in the optical path from the polygon mirror PM (PMa, PMb) to the fθ lenses FTa, FTb. The plane on which the reflected beams LBa and LBb are deflected (the planes parallel to the XtYt plane in the embodiments of FIGS. 5 and 6, the embodiments of FIGS. 12 to 16 and the embodiments of FIGS. 18 to 20, In the embodiment of FIG. 17, reflection mirrors M6a and M6b or M12a and M12b for bending the beams LBa and LBb are provided within a plane parallel to the YtZt plane. When the beam LB (LBa, LBb) from the light source device 14 is in the ultraviolet wavelength range longer than about 240 nm, the reflection surfaces of the polygon mirror PM (PMa, PMb) and each reflection mirror are made of glass or ceramic base material. An aluminum layer having a high reflectance is deposited on the surface, and a dielectric thin film (single layer or plural layers) for oxidation prevention or the like is further deposited thereon. In the case of the polygon mirror PM, a base material itself is formed and processed from aluminum, and a portion serving as a reflection surface is optically polished, and then a dielectric thin film (single layer or plural layers) is deposited on the surface. In the polygon mirrors PM (PMa, PMb) and the reflection mirrors M6a, M6b, M12a, M12b having such a structure of the reflection surface, the incident angles of the beams LBa, LBb incident on the reflection surface are the main scanning beams. When the beams LBa and LBb have polarization characteristics, the intensity of the reflected beam tends to change according to the change in the incident angle, that is, when the beams LBa and LBb have polarization characteristics, In some cases, the influence of the reflectance on the incident angle cannot be ignored.

  FIG. 24 is a diagram for explaining the incident angle and the reflection angle of the beam LBa projected on each of the polygon mirror PM and the reflection mirror M6a described in FIG. 17 in the YtZt plane. The situation described with reference to FIG. 24 can similarly occur in other embodiments (FIGS. 5, 6, 12 to 16, 18 to 20). In FIG. 24, when the angle θo of one reflection surface RPh of the polygon mirror PM in the YtZt plane is 45 °, the beam LBa incident parallel to the Zt axis is reflected by the reflection surface RPh so as to be parallel to the Yt axis. After that, it is bent at 90 ° by the reflection mirror M6a, and advances coaxially with the optical axis AXfa of the subsequent fθ lens FTa. Assuming that the polygon mirror PM is rotating clockwise in FIG. 24, the effective scanning start point of the spot light SPa along the drawing line SL2a (SLa) is determined by setting the reflection surface RPh at an angle within the YtZt plane. This is the time when θo−Δθa, and the end point of the effective scanning of the spot light SPa is when the reflection surface RPh becomes the angle θo + Δθa in the YtZt plane. Therefore, the deflection angle range of the beam LBa reflected by the reflection surface RPh of the polygon mirror PM toward the reflection mirror M6a with respect to the optical axis AXfa is ± 2Δθa. When the deflection angle of the beam LBa with respect to the optical axis AXfa is + 2Δθa, the incident angle θm1 of the beam LBa projected on the reflection surface of the reflection mirror M6a is θm1 = 45 ° −2Δθa, and the deflection angle of the beam LBa with respect to the optical axis AXfa is At −2Δθa, the incident angle θm2 of the beam LBa projected on the reflection surface of the reflection mirror M6a is θm2 = 45 ° + 2Δθa.

  Here, the effect of a change in the incident angle of the beam LBa on the reflection mirror M6a will be described with reference to FIG. FIG. 25 is a graph illustrating an incident angle dependence characteristic CV1 of the reflectance observed when a beam having a polarization characteristic in an ultraviolet wavelength range is incident on a reflecting surface composed of an aluminum layer and a dielectric thin film. Where the vertical axis represents the reflectance (%) of the reflecting surface, and the horizontal axis represents the angle of incidence (degree) of the beam on the reflecting surface. Generally, when a beam is projected on the reflecting surface at an incident angle of 0 ° (that is, normal incidence), the reflectance becomes maximum. In the case of the characteristic CV1 in FIG. 25, the maximum reflectance is about 90%. When the incident angle is around 45 °, the reflectivity is about 87%. However, as the incident angle is further increased, the reflectivity decreases greatly. When the reflectance of each reflection surface (RPh) of the polygon mirror PM is the same as the characteristic CV1, as shown in FIG. 24, the incident angle of the beam LBa incident on the reflection surface RPh of the polygon mirror PM is about 45 °. And changes within a range of ± Δθa. Here, assuming that the maximum deflection angle range ± 2Δθa of the beam LBa incident on the fθ lens system FTa for scanning the drawing line SLa is ± 15 ° around the optical axis AXfa, Δθa is 7.5 °. Therefore, the incident angle of the beam LBa on the reflection surface RPh of the polygon mirror PM changes in a range of 37.5 ° to 52.5 ° around 45 °. On the characteristic CV1, the reflectance at an incident angle of 37.5 ° is about 88%, and the reflectance at an incident angle of 52.5 ° is about 85.5%.

  From the above, when the beam LBa reflected by the polygon mirror PM is directly incident on the fθ lens system FTa, the intensity of the spot light SPa at the scanning start point on the drawing line SLa and the intensity of the spot light SPa at the scanning end point are determined. The difference between the strength and the characteristic CV1 is 88% -85.5% = 2.5%. This means that, based on the intensity of the spot light SPa near the center of the drawing line SLa, an intensity error of ± 1.25% occurs at both ends of the drawing line SLa. When the photosensitive functional layer formed on the substrate P is a photoresist or a dry film, the allowable range of the intensity unevenness of the spot light SP during the main scanning is said to be about ± 2%, and ± 1.25%. Any intensity error (unevenness) is acceptable.

  However, as shown in FIG. 24, even after the polygon mirror PM, there is a reflection mirror M6a whose incident angle changes greatly due to deflection for the main scanning of the beam LBa, so that the intensity of the spot light SPa projected on the substrate P is increased. Causes a larger intensity error in the main scanning direction. As described above, the incident angle of the beam LBa incident on the reflection mirror M6a changes between θm1 and θm2. When Δθa is 7.5 °, θm1 = 45 ° −15 ° = 30 ° and θm2 = 45 ° + 15 ° = 60 °. If the incident angle dependence of the reflectance of the reflecting mirror M6a is the same as the characteristic CV1 in FIG. 25, the incident angle of the beam LBa to the reflecting mirror M6a is θm1 at the scanning start point of the spot light SPa on the drawing line SLa. = 30 °, the reflectance of the reflection mirror M6a at that angle of incidence is about 88.5%. Accordingly, the product of the polygon mirror PM and the reflectance 88% on the reflection surface RPh gives a total reflectance of 77.9% (88% × 88.5%) at the scanning start point of the spot light SPa. At the scan end point of the spot light SPa on the drawing line SLa, the angle of incidence of the beam LBa on the reflection mirror M6a is θm2 = 60 °, so that the reflectance of the reflection mirror M6a at that angle of incidence is about 81%. It becomes. Therefore, by the product of the reflectance of the polygon mirror PM and the reflectance on the reflection surface RPh of 85.5%, the reflectance at the scanning end point of the spot light SPa is 69.3% (85.5% × 81%) in total. . From the above, the incident angle dependence of the total reflectance on the reflection surface of the polygon mirror PM and the reflection surface of the reflection mirror M6a is as shown by the characteristic CV2 in FIG. When the angle of incidence of the beam LBa on both the reflecting surface of the polygon mirror PM and the reflecting surface of the reflecting mirror M6a is 45 °, the total reflectance is about 75.7% (87% × 87%).

  As described above, the reflection mirror M6a (M6b, M12a, and M12b is also the same) has a surface on which the beam LBa (LBb) reflected by the polygon mirror PM is deflected (parallel to the YtZt surface in the embodiment of FIG. Since the embodiment has a reflecting surface orthogonal to the XtYt plane), the incident angle of the beam LBa (LBb) changes greatly. In the case of the characteristic CV2 in FIG. 25, the intensity of the spot light SPa (SPb) is Then, an error of about 8.6% occurs between the scanning start point and the scanning end point. This value is not always within the allowable range, and it is desirable to provide some correction (adjustment) mechanism if necessary. The characteristic CV1 shown in FIG. 25 is an example, and when the reflection surface of the reflection mirror is formed of a dielectric multilayer film, the rate of change (inclination) of the reflectance with respect to the incident angle may be further increased. . Therefore, the reflectance CV1 of each of the polygon mirror PM and the reflection mirror M6a (M6b) actually used is obtained in advance by experiment, simulation, or the like, and the scanning position of the spot light SPa (SPb) on the drawing line SLa (SLb) is determined. The tendency (intensity unevenness, inclination, etc.) of the change of the beam intensity with respect to is obtained in advance.

  If the tendency of the change in the beam intensity is more than the allowable range, the dimming in which the transmittance in the main scanning direction changes continuously or stepwise in the beam optical path after the reflection mirrors M6a, M6b, M12a, and M12b. By providing a filter (ND filter) plate, it is possible to optically suppress or correct the tendency of intensity change (intensity unevenness, inclination, etc.) with respect to the scanning position of the spot light SPa (SPb) on the substrate P. The neutral density filter plate can be disposed in the optical path between the reflection mirrors M6a and M6b (M12a and M12b) and the fθ lens systems FTa and FTb, or in the optical path between the fθ lens systems FTa and FTb and the substrate P. In the optical path after the fθ lens systems FTa and FTb, the second cylindrical lenses CY2a and CY2b having a size so as to cover the drawing lines SLa and SLb and having a plano-convex shape are provided. , CY2b may be provided with a neutral density filter plate. Further, as shown in FIGS. 5, 18, and 22, the reflection mirrors M7a, M7b, M15a, and M15b that bend the scanning beams LBa and LBb emitted from the fθ lens systems FTa and FTb so as to be perpendicularly incident on the substrate P are provided. If provided, a thin film that continuously or stepwise changes the reflectance of the reflecting mirrors M7a, M7b, M15a, and M15b in the main scanning direction is deposited on the reflecting surface, or thin glass having a thickness of 0.1 mm or less is used. , The intensity unevenness of the spot light SPa (SPb) with respect to the main scanning position may be optically adjusted (corrected).

  The correction of the tendency (intensity unevenness, inclination, etc.) of the intensity change with respect to the scanning position of the spot light SPa (SPb) can also be performed by an electric correction mechanism. FIG. 26 shows an optical element provided as shown in FIGS. 5 and 7 for turning on / off the beam before entering the polygon mirror PM (PMa, PMb) of the drawing unit based on the drawing data. FIG. 3 is a block diagram showing an example of a control system of AOMa and AOMb (acousto-optic modulation element, intensity adjustment member). In FIG. 26, a drive circuit 100 outputs a high-frequency drive signal Sdv for on / off to an optical element AOMa (AOMb). Here, the OFF state of the optical element AOMa (AOMb) means that the high-frequency drive signal Sdv is not applied to the optical element AOMa (AOMb), and the beam LB from the light source device 14 is transmitted as it is as the zero-order beam LBu. In the ON state, the high-frequency drive signal Sdv is applied to the optical element AOMa (AOMb), and the first-order diffracted light of the beam LB from the light source device 14 is deflected at a predetermined diffraction angle as a beam LBa (LBb). Outputting. The diffraction angle is determined by the frequency (for example, 80 MHz) of the drive signal Sdv (high-frequency signal). Further, when the amplitude of the drive signal Sdv is changed, the diffraction efficiency changes, and the intensity of the beam LBa (LBb) as the first-order diffracted light can be adjusted.

  The drive circuit 100 stores a high-frequency signal from a high-frequency oscillator SF having a constant frequency and a stable amplitude and a memory that stores drawing data (pattern data) in a bitmap format in which one pixel is associated with one bit. A drawing bit signal CLT and a control signal DE, which are read bit-serial in units, are input. The drive circuit 100 outputs the high-frequency signal from the high-frequency oscillator SF as the drive signal Sdv while the drawing bit signal CLT is the logical value “1”, and outputs the high-frequency signal from the driving signal Sdv while the drawing bit signal CLT is the logical value “0”. Prohibit sending. Further, in the drive circuit 100, a power amplifier that varies the amplitude of the high-frequency signal from the high-frequency oscillator SF in accordance with the control signal DE is provided. The control signal DE is an analog or digital signal, and is, for example, a value indicating a gain (gain) of a power amplifier. Here, the control signal DE is an analog signal.

  Here, how to adjust the intensity of the beam LBa (LBb) during the pattern drawing operation in which the spot light SPa (SPb) is scanned along the drawing line SLa (SLb) using the time chart of FIG. I do. In FIG. 27, the origin signal generates a pulse waveform immediately before the scanning of the spot light SPa (SPb) on the substrate P is started by rotating the reflection surface of the polygon mirror PM to a predetermined angular position. Therefore, when the polygon mirror PM has eight reflecting surfaces, the pulse waveform of the origin signal is generated eight times during one rotation of the polygon mirror PM. After a certain delay time Tsq from the generation of the pulse waveform of the origin signal, a drawing ON signal (logical value “1”) is generated, and a drawing bit signal CLT is applied to the drive circuit 100 to generate a beam LBa (LBb). Pattern drawing is started. At this time, the value (analog voltage) of the control signal DE increases from the value Ra when the drawing ON signal becomes the logical value “1”, and the drawing ON signal changes from the logical value “1” to “0”. It changes with the characteristic CCv that reaches the value Rb at the time. In FIG. 27, when the value of the control signal DE is Ro, the gain of the power amplifier in the drive circuit 100 is set to an initial value (for example, 10 times). In the case of FIG. 27, since Ra <Ro <Rb, the gain of the power amplifier is set lower than the initial value near the scanning start point on the drawing line SLa where the drawing ON signal rises to “1”. Therefore, the intensity of the spot light SPa (SPb) projected on the substrate P becomes smaller than the initial value. Further, near the scanning end point on the drawing line SLa where the drawing ON signal drops to “0”, the gain of the power amplifier is set higher than the initial value, so that the spot light SPa (SPb) projected on the substrate P Is greater than the initial value. As a result, it is possible to electrically adjust (correct) intensity unevenness generated according to the position of the spot light SPa (SPb) in the main scanning direction.

  Such a waveform of the control signal DE can be generated by a simple time constant circuit (such as an integrating circuit) that inputs a drawing ON signal and an origin signal. Although the characteristic CCv of the control signal DE changes linearly in FIG. 27, it may be changed non-linearly by an appropriate filter circuit. When the control signal DE is given by digital information instead of an analog waveform, the power amplifier may be modified so that the gain of the power amplifier can be changed by the digital value of the control signal DE.

  As described with reference to FIGS. 26 and 27, the amplitude of the high-frequency drive signal Sdv applied to the optical element AOMa (AOMb) is changed to adjust the intensity of the beam LBa (LBb) projected on the substrate P. The dynamic adjustment mechanism is also effective when adjusting the relative intensity difference between the beams projected on the substrate P from each of the plurality of drawing units. Note that the mechanism for electrically adjusting the intensity of the beam LBa (LBb) adjusts the emission luminance itself of the light source when the light source device 14 is a semiconductor laser light source that generates a laser beam in the ultraviolet wavelength range or a high-brightness LED light source. It is also feasible.

  As shown in FIGS. 5, 6, and 17, the two beams LBa and LBb whose reflection surfaces are directed toward the polygon mirror PM having eight reflection surfaces are parallel to each other, and the reflection of the polygon mirror PM is performed. When the beams LBa and LBb are reflected by each of the reflecting surfaces having a 90 ° relationship with each other, the spot light SPa by the beam LBa and the spot light SPb by the beam LBb scan the substrate P at the same timing. I do. However, when the beam LB from one light source device 14 is divided into the beams LBa and LBb in a time-division manner as disclosed in International Publication WO2015 / 166910 pamphlet, the main scanning by the spot light SPa and the spot light It is necessary to set so that main scanning by SPb is not executed at the same timing. A simple embodiment for this purpose is to use a polygon mirror PM having nine reflecting surfaces in the configurations shown in FIGS. 5, 6, and 17. In the case of a nine-surface polygon mirror, for example, when the beam LBa is incident on the center of one reflection surface in the rotation direction, the other beam LBb is between the reflection surfaces of the nine surface polygon mirrors. (Edge). That is, by changing the number of reflection surfaces, it is possible to shift the timing between the main scanning by the spot light SPa and the main scanning by the spot light SPb. In the configuration shown in FIG. 5, FIG. 6, and FIG. 17, when the timing of the main scanning by the spot light SPa and the timing of the main scanning by the spot light SPb are shifted while the polygon mirror PM having eight surfaces remains, the polygon mirror PM is used. The beam LBa and the beam LBb directed to are changed from a state parallel to each other to a state not parallel.

Claims (12)

A scan that extends a spot light whose intensity is modulated based on drawing data in a width direction orthogonal to the longitudinal direction of the irradiated object while sub-scanning the irradiated object which is a flexible long sheet substrate in the longitudinal direction. A pattern drawing device that draws a pattern according to the drawing data on the irradiation target by performing main scanning along a line,
A rotating polygon mirror that rotates around a rotation axis for the main scanning,
A first light guide optical system for projecting a first beam from a first direction toward the rotary polygon mirror;
A second light guide optical system that projects a second beam from the second direction different from the first direction toward the rotating polygon mirror;
A first projection optical system that collects the first beam reflected by the rotating polygon mirror and projects the first beam as a first spot light on a first scanning line;
A second projection optical system that condenses the second beam reflected by the rotating polygon mirror and projects the second beam on a second scanning line as a second spot light;
With
The scan lengths of the first scan line and the second scan line are set to be the same, and the first scan line and the second scan line are less than or equal to the scan length in the main scan direction. A pattern drawing apparatus, wherein the first projection optical system and the second projection optical system are arranged so as to be set separately at intervals. The pattern drawing apparatus according to claim 1 ,
The first projection optical system and the second projection optical system are configured such that the first scanning line and the second scanning line are at the same position on the irradiation target in the sub-scanning direction. A pattern drawing device that is arranged. It is a pattern drawing apparatus of Claim 1 or 2 , Comprising:
The rotating polygon mirror has a plurality of reflecting surfaces arranged to surround the rotation axis,
The first light guide optical system may be configured to change an incident direction of the first beam projected on a first reflecting surface among a plurality of reflecting surfaces of the rotating polygon mirror with respect to a direction in which the rotation axis extends. Provided to be different from a reflection direction of the first beam reflected by the reflection surface,
The second light guide optical system is configured to change an incident direction of the second beam projected on a second reflecting surface different from the first reflecting surface among the plurality of reflecting surfaces of the rotating polygon mirror, by using the rotation axis. A pattern writing apparatus provided so as to be different from the direction in which the second beam is reflected by the second reflection surface in the direction in which the second beam extends. A pattern writing apparatus according to any one of claims 1 to 3
The rotating polygon mirror, the first light guide optical system, the second light guide optical system, the first projection optical system, and the second projection optical system are integrally formed as one rotatable drawing unit. Formed,
The rotation center axis of the drawing unit is configured to pass through a point on a line segment connecting the midpoint of the first scanning line and the midpoint of the second scanning line perpendicularly to the irradiation object. The pattern drawing device to be set. The pattern drawing apparatus according to claim 4 , wherein
The pattern writing apparatus, wherein the first beam and the second beam are incident on the writing unit so as to be symmetric with respect to the rotation center axis. It is a pattern drawing apparatus of Claim 5 , Comprising:
The pattern writing apparatus, wherein the writing unit includes a reflecting member that reflects the incident first beam and the second beam to guide the light to the first light guide optical system and the second light guide optical system. It is a pattern drawing apparatus of Claim 5 or 6 , Comprising:
The first light guide optical system includes a first shift optical member that shifts a position of the first beam reflected from the reflection member in a plane that intersects with a traveling direction of the first beam,
The second light guide optical system includes a second shift optical member that shifts a position of the second beam reflected from the reflection member in a plane that intersects with a traveling direction of the second beam. Drawing device. The pattern drawing apparatus according to any one of claims 4 to 7 ,
A plurality of drawing units are provided,
Each of the plurality of the rendering units are placed such that each of said first scan line and the second scanning line is mated joint along the width direction of the irradiation object, the pattern writing apparatus. It is a pattern drawing apparatus of Claim 8 , Comprising:
A first central axis extending in a width direction orthogonal to a longitudinal direction of the irradiation target; and a cylindrical outer peripheral surface having a constant radius from the first central axis, the irradiation target following the outer peripheral surface. A first rotating drum that sub-scans the illuminated object by rotating the axis around the first central axis and transporting the illuminated object while supporting a part of the illuminated object while bending and supporting a part of the illuminated object;
A second central axis provided on the downstream side in the transport direction of the first rotary drum and extending in a width direction orthogonal to a longitudinal direction of the irradiation target; and a cylindrical outer peripheral surface having a constant radius from the second central axis. Having, while supporting a part of the irradiation object in the longitudinal direction following the outer peripheral surface and supporting the irradiation object, rotating the second irradiation center about the second central axis to convey the irradiation object, A second rotating drum for sub-scanning the irradiation object;
With
Among the plurality of drawing units, the first scanning lines and the second scanning lines of a predetermined number of the drawing units are located on the irradiation target supported on the outer peripheral surface of the first rotating drum, The plurality of drawing units are arranged such that the first scanning lines and the second scanning lines of the remaining drawing units are located on the irradiation target supported on the outer peripheral surface of the second rotating drum. Is a pattern drawing device. A scan that extends a spot light whose intensity is modulated based on drawing data in a width direction orthogonal to the longitudinal direction of the irradiated object while sub-scanning the irradiated object which is a flexible long sheet substrate in the longitudinal direction. A pattern drawing method for drawing a pattern according to the drawing data on the irradiation object by performing main scanning along a line,
Projecting a first beam from a first direction toward a rotating polygon mirror;
Projecting a second beam from the second direction different from the first direction toward the rotating polygon mirror;
Deflecting and scanning the first beam and the second beam that are incident on and reflected from different reflecting surfaces of the rotary polygon mirror by rotating the rotary polygon mirror;
Condensing the first beam reflected by the rotating polygon mirror and projecting the first beam as a first spot light on a first scanning line;
Condensing the second beam reflected by the rotating polygon mirror and projecting it as a second spot light on a second scanning line;
Including
The scan lengths of the first scan line and the second scan line are set to be the same, and the first scan line and the second scan line are less than or equal to the scan length in the main scan direction. A pattern drawing method that is set separately at intervals. The pattern drawing method according to claim 10 , wherein
The first scanning line centering on a rotation center axis that passes through a point on a line segment connecting the midpoint of the first scanning line and the midpoint of the second scanning line perpendicularly to the irradiation target; A pattern drawing method, comprising: rotating a scanning line and the second scanning line. The pattern drawing method according to claim 11, wherein
The pattern drawing method, wherein the first beam and the second beam are incident on the rotary polygon mirror from a direction symmetric with respect to the rotation center axis.

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