JP6626501B2 - 熱成形可能な導電性インクおよびコーティングならびに熱成形デバイスの製造プロセス - Google Patents
熱成形可能な導電性インクおよびコーティングならびに熱成形デバイスの製造プロセス Download PDFInfo
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- JP6626501B2 JP6626501B2 JP2017519849A JP2017519849A JP6626501B2 JP 6626501 B2 JP6626501 B2 JP 6626501B2 JP 2017519849 A JP2017519849 A JP 2017519849A JP 2017519849 A JP2017519849 A JP 2017519849A JP 6626501 B2 JP6626501 B2 JP 6626501B2
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- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 239000006254 rheological additive Substances 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 229940116351 sebacate Drugs 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 229920006163 vinyl copolymer Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000001018 xanthene dye Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
- C09D11/40—Ink-sets specially adapted for multi-colour inkjet printing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Laminated Bodies (AREA)
- Paints Or Removers (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
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| US201462063643P | 2014-10-14 | 2014-10-14 | |
| US62/063,643 | 2014-10-14 | ||
| PCT/US2015/052808 WO2016060838A1 (en) | 2014-10-14 | 2015-09-29 | Thermoformable conductive inks and coatings and a process for fabrication of a thermoformed device |
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| JP2017538247A JP2017538247A (ja) | 2017-12-21 |
| JP2017538247A5 JP2017538247A5 (enExample) | 2018-09-13 |
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| CN (1) | CN107077909B (enExample) |
| WO (1) | WO2016060838A1 (enExample) |
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| KR102543985B1 (ko) * | 2015-10-27 | 2023-06-14 | 삼성전자주식회사 | 전도막 및 이를 포함하는 전자 소자 |
| US10359929B2 (en) * | 2015-11-09 | 2019-07-23 | Analog Devices, Inc. | Slider and gesture recognition using capacitive sensing |
| FR3052594B1 (fr) | 2016-06-10 | 2018-11-23 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif a piste electriquement conductrice et procede de fabrication du dispositif |
| KR102529070B1 (ko) * | 2016-10-25 | 2023-05-08 | 이2아이피 테크놀로지스 아이엔씨. | 인쇄 전자 |
| FR3061800B1 (fr) * | 2017-01-12 | 2019-05-31 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif comprenant un substrat apte a etre thermoforme sur lequel est agence un organe electriquement conducteur |
| CN110832039A (zh) * | 2017-05-15 | 2020-02-21 | 阿尔法装配解决方案公司 | 电介质油墨组合物 |
| US20190060583A1 (en) | 2017-08-22 | 2019-02-28 | Jabil Circuit, Inc. | Apparatus, system and method of providing a conformable heater system |
| US11304263B2 (en) * | 2017-08-29 | 2022-04-12 | Jabil Inc. | Apparatus, system and method of providing a conformable heater in wearables |
| WO2019039511A1 (ja) * | 2017-08-24 | 2019-02-28 | 東洋紡株式会社 | 導電性ペースト、伸縮性導体およびそれを用いた電子部品、衣服型電子機器 |
| FR3074087B1 (fr) * | 2017-11-30 | 2021-01-01 | Commissariat Energie Atomique | Procede pour fabriquer un objet thermoforme metallise |
| CN111511848B (zh) * | 2017-12-20 | 2023-05-16 | 3M创新有限公司 | 低介电常数可固化油墨组合物 |
| JP6521138B1 (ja) * | 2018-04-19 | 2019-05-29 | 東洋インキＳｃホールディングス株式会社 | 成形フィルム用導電性組成物、成形フィルム、成形体およびその製造方法 |
| GB2573752B (en) * | 2018-05-11 | 2022-12-07 | Tangi0 Ltd | Sensor device and method |
| TWI788358B (zh) * | 2018-05-29 | 2023-01-01 | 林世智 | 具有靜電印製導電線路之電路板之製作 |
| TWI853828B (zh) * | 2018-08-07 | 2024-09-01 | 加拿大國家研究委員會 | 包覆成型的印刷電子零件和其製造方法 |
| TWI658765B (zh) * | 2018-09-28 | 2019-05-01 | 正美企業股份有限公司 | 導電線路結構及使用其的被動式無線感測裝置 |
| CN112840002A (zh) * | 2018-10-30 | 2021-05-25 | 汉高知识产权控股有限责任公司 | 导电油墨组合物 |
| US11261341B2 (en) * | 2019-05-07 | 2022-03-01 | Xerox Corporation | Conductive ink composition and article of manufacture made therefrom |
| CN111423793A (zh) * | 2020-04-26 | 2020-07-17 | 常州市碳索新材料科技有限公司 | 一种石墨烯改性超耐候粉末涂料及其制备方法 |
| CN111681804A (zh) * | 2020-06-09 | 2020-09-18 | 上海三屹电子科技有限公司 | 一种模内电子技术(ime)用导电浆料及其制备方法 |
| CH717619A1 (de) * | 2020-07-07 | 2022-01-14 | Daetwyler Schweiz Ag | Verfahren zum Herstellen einer elastomeren Komponente, die eine gedruckte Struktur umfasst, und elastomere Komponente. |
| KR102212462B1 (ko) * | 2020-11-04 | 2021-02-08 | (주)범민케미칼 | Tpu를 이용한 친환경 동분항균필름 |
| CN112961540A (zh) * | 2021-03-31 | 2021-06-15 | 上海宝银电子材料有限公司 | 一种移印工艺用导电油墨及其制备方法 |
| CN113932699A (zh) * | 2021-09-23 | 2022-01-14 | 浦江荣达量具有限公司 | 一种数显卡尺容栅传感器制造工艺 |
| KR102705943B1 (ko) * | 2021-11-25 | 2024-09-11 | 티에스엠카본 주식회사 | 그래핀 제조 방법 |
| CN114410148B (zh) * | 2021-12-22 | 2023-03-24 | 广州亦盛环保科技有限公司 | 一种低温热固可4d热弯拉伸成型油墨及其制备方法 |
| WO2024015547A1 (en) | 2022-07-15 | 2024-01-18 | Sun Chemical Corporation | Uv curable thermoformable conductive ink and dielectric ink |
Family Cites Families (23)
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|---|---|---|---|---|
| JPS62177885A (ja) * | 1986-01-31 | 1987-08-04 | 日本写真印刷株式会社 | ヒ−タ−回路を有する成型品およびその製造方法 |
| US5141777A (en) * | 1990-05-02 | 1992-08-25 | Advanced Products, Inc. | Highly conductive polymer thick film compositions |
| US5855706A (en) | 1992-04-21 | 1999-01-05 | Branson Ultrasonics Corporation | Simultaneous amplitude and force profiling during ultrasonic welding of thermoplastic workpieces |
| US5744557A (en) | 1993-06-16 | 1998-04-28 | Minnesota Mining And Manufacturing Company | Energy-curable cyanate/ethylenically unsaturated compositions |
| US5631311A (en) * | 1994-08-18 | 1997-05-20 | E. I. Du Pont De Nemours And Company | Transparent static dissipative formulations for coatings |
| GB2359556B (en) | 1999-11-19 | 2003-08-20 | Sericol Ltd | An ink for decoration of substrates such as polycarbonate |
| US7200009B2 (en) * | 2003-07-01 | 2007-04-03 | Nokia Corporation | Integrated electromechanical arrangement and method of production |
| WO2006108165A2 (en) | 2005-04-06 | 2006-10-12 | Ohmcraft, Inc. | Conductive ink with nanotubes |
| US7486280B2 (en) | 2005-08-04 | 2009-02-03 | Uniplas Enterprises Pte, Ltd. | Contoured capacitive touch control panel |
| TWI450054B (zh) * | 2005-09-20 | 2014-08-21 | Mitsubishi Rayon Co | 碳粉用聚酯樹脂、其製造方法以及碳粉 |
| GB2435472A (en) | 2006-02-23 | 2007-08-29 | 3M Innovative Properties Co | Method for forming an article having a decorative surface |
| EP2078738A4 (en) * | 2006-11-02 | 2011-07-20 | Toyo Ink Mfg Co | CONDUCTIVE INK, CONDUCTIVE CIRCUIT AND CONTACT-FREE MEDIA |
| JP4986976B2 (ja) | 2007-12-20 | 2012-07-25 | キヤノン株式会社 | 画像処理装置、画像形成装置および画像処理方法 |
| US20110095090A1 (en) | 2008-05-20 | 2011-04-28 | Hewlett-Packard Development Company L.P | Radio Frequency Indentification Device Molded into a Product Part |
| WO2010115173A1 (en) | 2009-04-03 | 2010-10-07 | Vorbeck Materials Corp | Polymer compositions containing graphene sheets and graphite |
| WO2011072717A1 (de) | 2009-12-15 | 2011-06-23 | Novelty Group Limited | Autorisierungssystem, abgleicheinrichtung und verfahren zur autorisierung eines subjekts |
| EP2338664A1 (de) | 2009-12-23 | 2011-06-29 | Bayer MaterialScience AG | Verfahren zur Herstellung eines verformten Folienteils aus thermoplastischem Kunststoff |
| RU2555182C2 (ru) * | 2011-04-26 | 2015-07-10 | Рикох Компани, Лтд. | Проявляющий электростатическое изображение тонер, устройство формирования изображений, способ формирования изображений и технологический картридж |
| US9030837B2 (en) | 2011-06-10 | 2015-05-12 | Scott Moncrieff | Injection molded control panel with in-molded decorated plastic film that includes an internal connector |
| JP2013028115A (ja) * | 2011-07-29 | 2013-02-07 | Toda Kogyo Corp | 成型物の製造方法及び成型物 |
| US8692131B2 (en) | 2011-09-20 | 2014-04-08 | E I Du Pont De Nemours And Company | Thermoformable polymer thick film silver conductor and its use in capacitive switch circuits |
| EP2644664B1 (en) | 2012-03-29 | 2015-07-29 | Fujifilm Corporation | Actinic radiation-curing type ink composition, inkjet recording method, decorative sheet, decorative sheet molded product, process for producing in-mold molded article, and in-mold molded article |
| US9190188B2 (en) * | 2013-06-13 | 2015-11-17 | E I Du Pont De Nemours And Company | Photonic sintering of polymer thick film copper conductor compositions |
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| US10544317B2 (en) | 2020-01-28 |
| US20170298242A1 (en) | 2017-10-19 |
| EP3207545A1 (en) | 2017-08-23 |
| WO2016060838A1 (en) | 2016-04-21 |
| EP3207545B1 (en) | 2021-09-01 |
| KR20170067768A (ko) | 2017-06-16 |
| CN107077909A (zh) | 2017-08-18 |
| KR102495221B1 (ko) | 2023-02-01 |
| EP3207545A4 (en) | 2018-03-14 |
| JP2017538247A (ja) | 2017-12-21 |
| CN107077909B (zh) | 2019-08-23 |
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