JP6618159B2 - 発熱部材 - Google Patents
発熱部材 Download PDFInfo
- Publication number
- JP6618159B2 JP6618159B2 JP2018523654A JP2018523654A JP6618159B2 JP 6618159 B2 JP6618159 B2 JP 6618159B2 JP 2018523654 A JP2018523654 A JP 2018523654A JP 2018523654 A JP2018523654 A JP 2018523654A JP 6618159 B2 JP6618159 B2 JP 6618159B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- film heater
- insulating layer
- temperature
- volume resistivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 230000020169 heat generation Effects 0.000 title 1
- 239000010409 thin film Substances 0.000 claims description 161
- 239000000463 material Substances 0.000 claims description 46
- 238000005507 spraying Methods 0.000 claims description 34
- 239000000919 ceramic Substances 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 16
- 239000010410 layer Substances 0.000 description 82
- 239000010936 titanium Substances 0.000 description 64
- 239000010408 film Substances 0.000 description 44
- 238000000034 method Methods 0.000 description 43
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 40
- 235000012431 wafers Nutrition 0.000 description 35
- 239000000843 powder Substances 0.000 description 32
- 238000007750 plasma spraying Methods 0.000 description 29
- 238000007751 thermal spraying Methods 0.000 description 28
- 238000000576 coating method Methods 0.000 description 27
- 239000011248 coating agent Substances 0.000 description 25
- 239000002994 raw material Substances 0.000 description 25
- 229910010413 TiO 2 Inorganic materials 0.000 description 20
- 238000001816 cooling Methods 0.000 description 15
- 210000002381 plasma Anatomy 0.000 description 15
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 15
- 239000000758 substrate Substances 0.000 description 14
- 239000007921 spray Substances 0.000 description 13
- 239000007789 gas Substances 0.000 description 12
- 229910052721 tungsten Inorganic materials 0.000 description 12
- 239000010937 tungsten Substances 0.000 description 12
- 229910052782 aluminium Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 10
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000011812 mixed powder Substances 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 229910052574 oxide ceramic Inorganic materials 0.000 description 4
- 239000011224 oxide ceramic Substances 0.000 description 4
- 125000004430 oxygen atom Chemical group O* 0.000 description 4
- 239000003507 refrigerant Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910001069 Ti alloy Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 2
- 229910002077 partially stabilized zirconia Inorganic materials 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910001930 tungsten oxide Inorganic materials 0.000 description 2
- 229910001233 yttria-stabilized zirconia Inorganic materials 0.000 description 2
- 229910016569 AlF 3 Inorganic materials 0.000 description 1
- 229910016036 BaF 2 Inorganic materials 0.000 description 1
- 229910004261 CaF 2 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- -1 YF 3 Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010285 flame spraying Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Inorganic materials [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
- H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
- H05B3/746—Protection, e.g. overheat cutoff, hot plate indicator
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
- H05B3/748—Resistive heating elements, i.e. heating elements exposed to the air, e.g. coil wire heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
Description
図1は、本発明の一形態に係る発熱部材の基本的構成を表す斜視模式図である。図1に示す発熱部材11は以下のようにして作製することができる。
1回目:室温から300℃まで昇温し3時間保持。その後室温になるまで放置。
2回目:室温から300℃まで昇温し3時間保持。その後室温になるまで放置。
3回目:室温から300℃まで昇温し3時間保持。その後室温になるまで放置。
4回目:室温から300℃まで昇温し3時間保持。その後室温になるまで放置。
5回目:室温から300℃まで昇温し18時間保持。その後室温になるまで放置。
6回目:室温から300℃まで昇温し70時間保持。その後室温になるまで放置。
1回目:室温から300℃まで昇温し3時間保持。その後室温になるまで放置。
2回目:室温から300℃まで昇温し7時間保持。その後室温になるまで放置。
3回目:室温から300℃まで昇温し20時間保持。その後室温になるまで放置。
4回目:室温から300℃まで昇温し70時間保持。その後室温になるまで放置。
図7は本発明の一形態に係る発熱部材が適用されたプラズマ処理装置の断面模式図である。図7のようにプラズマ処理装置の真空チャンバー20内には、ウェハ27を保持するための静電チャック25が設けられており、図示しない搬送アームなどによってウェハ27が真空チャンバー20の内外へ出し入れされるようになっている。真空チャンバー20には、ガス導入装置22や、上部電極28などが設置されている。静電チャック25は下部電極を内蔵しており、この下部電極と上部電極28に高周波電源29が接続されている。下部電極と上部電極28の間に高周波をかけると、導入された処理ガスがプラズマ化され、発生したプラズマのイオンがウェハ27に引き込まれることでエッチングが行われ、その際、ウェハ27の温度が上昇する。ウェハ27の周囲には、ウェハ27の外縁部付近においてもエッチングの効果が低下しないようにフォーカスリング26が配置されている。ウェハ27の下方には、ウェハ27の温度を一定に保つための第1薄膜ヒータ部23aが設置されている。フォーカスリング26の下方には、フォーカスリング26の温度を一定に保つための第2薄膜ヒータ部23bが設置されている。
好ましい。
12 基材部
13 薄膜ヒータ部
14 絶縁層
15、16 リード線
19a、19b 端子
20 真空チャンバー
22 ガス導入装置
23a 第1薄膜ヒータ部
23b 第2薄膜ヒータ部
23d 内側ヒータ部
23f 外側ヒータ部
25 静電チャック
26 フォーカスリング
27 ウェハ
28 上部電極
29 高周波電源
32 基台部
33 第1絶縁層
35 第2絶縁層
36 電極部
37 誘電層
38 被覆層
39 ガス孔
40 第1給電ピン
41 第2給電ピン
42 冷却路
43 第3給電ピン
t 厚み
s 線幅(幅)
d 線間距離
Claims (6)
- 基材部と、この基材部上に形成された薄膜ヒータ部とを備え、
前記薄膜ヒータ部は、TixOy(但し、0<y/x<2.0を満たす。)を含む溶射皮膜からなり、
前記溶射皮膜は、Ti x1 O y1 (但し、0<y1/x1<1.5を満たす。)及びTi x2 O y2 (但し、1.5≦y2/x2≦2.0を満たす。)を含むことを特徴とする発熱部材。 - 前記溶射皮膜中、Tix1Oy1(但し、0<y1/x1<1.5を満たす。)の質量比の合計値は、Tix2Oy2(但し、1.5≦y2/x2≦2.0を満たす。)の質量比の合計値よりも大きいことを特徴とする請求項1に記載の発熱部材。
- 前記薄膜ヒータ部の幅は、1〜20mmであることを特徴とする請求項1又は2に記載の発熱部材。
- 前記薄膜ヒータ部の厚みは、30〜1000μmであることを特徴とする請求項1〜3のいずれかに記載の発熱部材。
- 前記薄膜ヒータ部の線間距離は、0.5〜50mmであることを特徴とする請求項1〜4のいずれかに記載の発熱部材。
- 前記薄膜ヒータ部の上にセラミックス絶縁層を有することを特徴とする請求項1〜5のいずれかに記載の発熱部材。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016120806 | 2016-06-17 | ||
JP2016120806 | 2016-06-17 | ||
PCT/JP2017/020545 WO2017217251A1 (ja) | 2016-06-17 | 2017-06-02 | 発熱部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017217251A1 JPWO2017217251A1 (ja) | 2019-01-31 |
JP6618159B2 true JP6618159B2 (ja) | 2019-12-11 |
Family
ID=60664051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018523654A Active JP6618159B2 (ja) | 2016-06-17 | 2017-06-02 | 発熱部材 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11272579B2 (ja) |
JP (1) | JP6618159B2 (ja) |
KR (1) | KR20190029589A (ja) |
CN (1) | CN109315021A (ja) |
TW (1) | TWI705156B (ja) |
WO (1) | WO2017217251A1 (ja) |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4194022A (en) * | 1977-07-25 | 1980-03-18 | Ppg Industries, Inc. | Transparent, colorless, electrically conductive coating |
US4422917A (en) * | 1980-09-10 | 1983-12-27 | Imi Marston Limited | Electrode material, electrode and electrochemical cell |
JPS5994394A (ja) | 1982-11-19 | 1984-05-31 | 株式会社日立製作所 | セラミツク発熱体 |
US4912286A (en) * | 1988-08-16 | 1990-03-27 | Ebonex Technologies Inc. | Electrical conductors formed of sub-oxides of titanium |
JP2971369B2 (ja) | 1995-08-31 | 1999-11-02 | トーカロ株式会社 | 静電チャック部材およびその製造方法 |
KR20020073158A (ko) | 1999-06-09 | 2002-09-19 | 이비덴 가부시키가이샤 | 세라믹히터 및 그 제조방법 |
JP4545896B2 (ja) | 2000-07-19 | 2010-09-15 | 日本発條株式会社 | ヒータユニット及びその製造方法 |
JP4749971B2 (ja) | 2006-08-10 | 2011-08-17 | 太平洋セメント株式会社 | セラミックスヒーターおよびその製造方法 |
JP2009170509A (ja) | 2008-01-11 | 2009-07-30 | Hitachi High-Technologies Corp | ヒータ内蔵静電チャックを備えたプラズマ処理装置 |
US20150264747A1 (en) * | 2008-05-30 | 2015-09-17 | Thermoceramix, Inc. | Radiant heating using heater coatings |
US8551609B2 (en) | 2010-04-27 | 2013-10-08 | Ppg Industries Ohio, Inc. | Method of depositing niobium doped titania film on a substrate and the coated substrate made thereby |
DE102011000502A1 (de) * | 2011-02-04 | 2012-08-09 | Solibro Gmbh | Abscheidevorrichtung und Verfahren zur Herstellung eines Tiegels hierfür |
JP5994394B2 (ja) | 2012-05-31 | 2016-09-21 | Jfeスチール株式会社 | 鋼板の識別装置及び識別方法 |
DE102012209936A1 (de) * | 2012-06-13 | 2013-12-19 | Webasto Ag | Elektrische Heizeinrichtung für ein Kraftfahrzeug |
JP6442296B2 (ja) | 2014-06-24 | 2018-12-19 | 東京エレクトロン株式会社 | 載置台及びプラズマ処理装置 |
CA2968797A1 (en) * | 2014-11-26 | 2016-06-02 | Regal Ware, Inc. | Thermally sprayed resistive heaters and uses thereof |
-
2017
- 2017-06-02 JP JP2018523654A patent/JP6618159B2/ja active Active
- 2017-06-02 WO PCT/JP2017/020545 patent/WO2017217251A1/ja active Application Filing
- 2017-06-02 TW TW106118210A patent/TWI705156B/zh active
- 2017-06-02 US US16/310,797 patent/US11272579B2/en active Active
- 2017-06-02 KR KR1020197001286A patent/KR20190029589A/ko not_active Application Discontinuation
- 2017-06-02 CN CN201780036285.6A patent/CN109315021A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2017217251A1 (ja) | 2017-12-21 |
TW201809320A (zh) | 2018-03-16 |
US20190327790A1 (en) | 2019-10-24 |
KR20190029589A (ko) | 2019-03-20 |
CN109315021A (zh) | 2019-02-05 |
TWI705156B (zh) | 2020-09-21 |
US11272579B2 (en) | 2022-03-08 |
JPWO2017217251A1 (ja) | 2019-01-31 |
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