JP6615211B2 - プラスチック部品をメタライズするプロセス - Google Patents
プラスチック部品をメタライズするプロセス Download PDFInfo
- Publication number
- JP6615211B2 JP6615211B2 JP2017542341A JP2017542341A JP6615211B2 JP 6615211 B2 JP6615211 B2 JP 6615211B2 JP 2017542341 A JP2017542341 A JP 2017542341A JP 2017542341 A JP2017542341 A JP 2017542341A JP 6615211 B2 JP6615211 B2 JP 6615211B2
- Authority
- JP
- Japan
- Prior art keywords
- metallization
- support
- plastic
- solution
- inhibitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title claims description 60
- 229920003023 plastic Polymers 0.000 title claims description 42
- 239000004033 plastic Substances 0.000 title claims description 42
- 238000001465 metallisation Methods 0.000 claims description 57
- 239000000243 solution Substances 0.000 claims description 50
- 239000003112 inhibitor Substances 0.000 claims description 34
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 29
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid group Chemical group S(O)(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 22
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 17
- 230000004913 activation Effects 0.000 claims description 16
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 14
- 230000003647 oxidation Effects 0.000 claims description 13
- 238000007254 oxidation reaction Methods 0.000 claims description 13
- 238000005234 chemical deposition Methods 0.000 claims description 12
- 150000003573 thiols Chemical class 0.000 claims description 12
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 claims description 10
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 10
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 9
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 8
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 7
- 150000003568 thioethers Chemical class 0.000 claims description 7
- 238000004070 electrodeposition Methods 0.000 claims description 6
- 230000001629 suppression Effects 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 5
- 235000010265 sodium sulphite Nutrition 0.000 claims description 5
- 125000000335 thiazolyl group Chemical group 0.000 claims description 5
- 230000003197 catalytic effect Effects 0.000 claims description 4
- 239000003153 chemical reaction reagent Substances 0.000 claims description 3
- 230000000873 masking effect Effects 0.000 claims description 3
- 239000002923 metal particle Substances 0.000 claims description 3
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- 108010010803 Gelatin Proteins 0.000 claims description 2
- 229920002472 Starch Polymers 0.000 claims description 2
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- 235000011852 gelatine desserts Nutrition 0.000 claims description 2
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- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 claims 1
- 230000002708 enhancing effect Effects 0.000 claims 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 36
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- 229910052763 palladium Inorganic materials 0.000 description 16
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- -1 iodate ions Chemical class 0.000 description 9
- 229920000515 polycarbonate Polymers 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
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- 239000012994 photoredox catalyst Substances 0.000 description 8
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- 230000001590 oxidative effect Effects 0.000 description 7
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- JYLNVJYYQQXNEK-UHFFFAOYSA-N 3-amino-2-(4-chlorophenyl)-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(CN)C1=CC=C(Cl)C=C1 JYLNVJYYQQXNEK-UHFFFAOYSA-N 0.000 description 6
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- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 5
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- 150000002500 ions Chemical class 0.000 description 5
- 238000011282 treatment Methods 0.000 description 5
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 4
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical class OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 4
- 229920012485 Plasticized Polyvinyl chloride Polymers 0.000 description 4
- 235000011114 ammonium hydroxide Nutrition 0.000 description 4
- 239000001768 carboxy methyl cellulose Substances 0.000 description 4
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- 239000003638 chemical reducing agent Substances 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
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- 239000000084 colloidal system Substances 0.000 description 4
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- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 3
- 229910002651 NO3 Inorganic materials 0.000 description 3
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 231100000614 poison Toxicity 0.000 description 3
- 239000012279 sodium borohydride Substances 0.000 description 3
- 229910000033 sodium borohydride Inorganic materials 0.000 description 3
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- XTEGARKTQYYJKE-UHFFFAOYSA-M Chlorate Chemical compound [O-]Cl(=O)=O XTEGARKTQYYJKE-UHFFFAOYSA-M 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229920002125 Sokalan® Polymers 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 2
- 239000002537 cosmetic Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 150000002739 metals Chemical group 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000002574 poison Substances 0.000 description 2
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- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PEOOQVDIOJQJHW-UHFFFAOYSA-N (2-chloro-1,3-thiazol-5-yl)methanol Chemical compound OCC1=CN=C(Cl)S1 PEOOQVDIOJQJHW-UHFFFAOYSA-N 0.000 description 1
- NFSJJHVWUGRIHQ-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound [CH2]COCCOCCOC(C)=O NFSJJHVWUGRIHQ-UHFFFAOYSA-N 0.000 description 1
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- FHVDTGUDJYJELY-UHFFFAOYSA-N 6-{[2-carboxy-4,5-dihydroxy-6-(phosphanyloxy)oxan-3-yl]oxy}-4,5-dihydroxy-3-phosphanyloxane-2-carboxylic acid Chemical compound O1C(C(O)=O)C(P)C(O)C(O)C1OC1C(C(O)=O)OC(OP)C(O)C1O FHVDTGUDJYJELY-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
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- 241000195493 Cryptophyta Species 0.000 description 1
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- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 239000012855 volatile organic compound Substances 0.000 description 1
- UHVMMEOXYDMDKI-JKYCWFKZSA-L zinc;1-(5-cyanopyridin-2-yl)-3-[(1s,2s)-2-(6-fluoro-2-hydroxy-3-propanoylphenyl)cyclopropyl]urea;diacetate Chemical compound [Zn+2].CC([O-])=O.CC([O-])=O.CCC(=O)C1=CC=C(F)C([C@H]2[C@H](C2)NC(=O)NC=2N=CC(=CC=2)C#N)=C1O UHVMMEOXYDMDKI-JKYCWFKZSA-L 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0025—Applying surface layers, e.g. coatings, decorative layers, printed layers, to articles during shaping, e.g. in-mould printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
- C23C18/1628—Specific elements or parts of the apparatus
- C23C18/163—Supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Chemically Coating (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
・ 次の段階での試料のぬれ性を向上させるための試料の調製および洗浄、
・ 40〜70℃でクロム(VI)を含む硫酸浴を通常使用する、後続の金属付着を促進する微小粗さを表面に生成可能にする試料の酸化侵食(光沢仕上げ)、
・ 例えば、ヒドラジンなどの還元剤を使用したクロム(III)を与える還元による、(後続で使用される触媒の毒を構成する)過剰なクロム(VI)の中和、
・ Cl-イオンにより中和されたSn2+イオンのケーシングにより取り囲まれたPd/Snコアを示す粒子であって、プラスチックの表面に存在するミクロ孔内へ拡散し、その中で化学的に吸着され、後続の化学的堆積反応に触媒作用を及ぼすことが可能な粒子から形成された通常はパラジウム/スズコロイドである触媒の堆積による表面の活性化、
・ Sn(IV)イオンを与えるようにSn(II)イオンを酸化し、吸着されたパラジウム粒子を解放することを可能にする、浴中、特に硫酸浴中への試料の浸漬による促進、
・ 吸着されたPd/Snシード上へ、次いで試料の全表面への金属イオンの還元を可能にする次亜リン酸ナトリウムなどの還元剤を含む金属(例えば銅またはニッケル)塩水溶液中への試料の浸漬による金属層の化学的堆積、
・ このように得られた金属層の、電解ルートによる厚み増大、
を備える。
本発明によれば、「プラスチック部品」は、表面が非導電性プラスチック(ポリマー)から構成された物体を意味すると理解される。これらの物体は、全体が非導電性ポリマーの1つまたは複数の層から構成されることができ、または、非導電性ポリマーの1つまたは複数の層で被覆された金属および/またはガラス状材料および/または導電性ポリマーから構成されることができる。
a) メタライズされる部品をサポートに取り付け、
b) 部品を洗浄、特に脱脂し、
c) 該部品の表面を酸化し、
d) 該部品の表面を活性化し、
e) 任意選択的に、該表面への金属の化学的堆積、
f) 金属の電解堆積、
の組み合わせを備える。
実施例1:クロム(パラジウムなしの活性化)を使用するメタライゼーションプロセス
ABSから作成されたコントロール部品をPVCから作成された通常のサポートに取り付けることにより、メタライズされる試料を調製する。脱脂後、試料(サポート+部品)を、40g/Lのメルカプトベンゾチアゾール、100mL/Lの硫酸(95%)および25g/Lのカルボキシメチルセルロースを含有する浴中に、20分間、配置する。浴は、40℃に温度調節する。試料はその後、400g/Lの硫酸および400g/Lのクロム酸を含む65℃にした光沢仕上げ浴中に10分間、浸漬し、次いで10g/Lのヒドラジン溶液に浸漬する。それはその後、浴中で30ppmのパラジウム濃度を得るのに十分な量のPd/Snコロイドを含む30℃に維持された触媒浴中に浸漬し、次いで、硫酸に基づく50℃の促進浴中に浸漬する。その後、部品の表面に0.3μmの堆積物が得られるまで、ニッケルの化学的堆積を、10g/Lの硫酸ニッケル、10g/Lの次亜リン酸ナトリウム、50g/Lの33%アンモニア水溶液を含む水溶液中で実行する。サポートのメタライゼーションは観察されない。
ABSから作成された部品と、ABS/PC領域およびPC領域両方を示す2材料部品とを、可塑化されたPVCから作成されたサポートに取り付ける。脱脂後、組み立て品は、8g/Lのメルカプトベンゾチアゾール、100mL/Lのリン酸(85%)および25g/Lのカルボキシメチルセルロースを含有する溶液中に15分間、浸漬する。浴は、40℃に調節する。すすぎ後、組み立て品は、過マンガン酸ナトリウムおよびリン酸を含む光沢仕上げ浴中に、10分間、浸漬する。すすぎ後、組み立て品は、硫酸銅五水和物およびアンモニア水を含む活性化浴中に5分間、浸漬し、新たなすすぎ後、水素化ホウ素ナトリウムおよび水酸化ナトリウムを含有する還元溶液中に浸漬する。仕上げするために、組み立て品は、銅、EDTA、水酸化ナトリウムおよびホルムアルデヒド(Rohm&HaasからのCircuposit 3350−1)を含む化学的銅めっき浴中に浸漬する。
ABSから作成された部品と、ABS/PC領域およびPC領域両方を示す2材料部品とを、可塑化されたPVCから作成されたサポートに取り付ける。脱脂後、組み立て品は、12g/Lの(2−クロロ−1,3−チアゾール−5−イル)メタノール、100mL/Lのリン酸(85%)および25g/Lのカルボキシメチルセルロースを含有する溶液中に15分間、浸漬する。浴は、40℃に調節する。すすぎ後、組み立て品は、過マンガン酸ナトリウムおよびリン酸を含む光沢仕上げ浴中に、10分間、浸漬する。すすぎ後、組み立て品は、250mL/Lの塩酸と、38mL/Lのパラジウムおよび塩化スズの混合物(Rohm&HaasからのCatalyst 9F)とを含む、パラジウムでの活性化のための浴中に3分間、浸漬する。新たなすすぎ後、組み立て品は、硫酸に基づく「促進」浴中に浸漬する。
ABSから作成された部品と、ABS/PC領域およびPC領域両方を示す2材料部品とを、可塑化されたPVCから作成されたサポートに取り付ける。脱脂後、組み立て品は、過マンガン酸ナトリウムおよびリン酸を含む光沢仕上げ浴中に、10分間、浸漬する。すすぎ後、組み立て品は、硫酸銅五水和物およびアンモニア水を含む活性化浴中に5分間、浸漬し、新たなすすぎ後、水素化ホウ素ナトリウムおよび水酸化ナトリウムを含有する還元溶液中に浸漬する。仕上げするために、組み立て品は、銅、EDTA、水酸化ナトリウムおよびホルムアルデヒド(Rohm&HaasからのCircuposit 3350−1)を含む化学的銅めっき浴中に浸漬する。
ABSから作成された部品と、ABS/PC領域およびPC領域両方を示す2材料部品とを、可塑化されたPVCから作成されたサポートに取り付ける。脱脂後、組み立て品は、過マンガン酸ナトリウムおよびリン酸を含む光沢仕上げ浴中に、10分間、浸漬する。すすぎ後、組み立て品は、250mL/Lの塩酸と、38mL/Lのパラジウムおよび塩化スズの混合物(Rohm&HaasからのCatalyst 9F)とを含む、パラジウムでの活性化のための浴中に3分間、浸漬する。新たなすすぎ後、組み立て品は、硫酸に基づく「促進」中に浸漬する。
メタライゼーション抑制剤の性質を変更しながら、実施例2に記載した実施要綱を再現した。試験したさまざまな抑制剤について得られた結果を以下の表にまとめる。
Claims (7)
- メタライゼーションプロセスにかけられる少なくとも1つのプラスチック部品のサポートのメタライゼーションを防止する方法であって、サポートは、部品の表面を形成するプラスチックとは異なる、1つまたは複数の可塑剤と混合されたポリ(塩化ビニル)から形成されたプラスチックから形成され、またはそのような異なるプラスチックで被覆され、該方法は、
該部品の表面の酸化、
部品の表面での触媒金属の粒子の生成による、酸化された表面の活性化、および
活性化された表面への金属の化学的および/または電気化学的堆積の連続した段階
を備えており、該方法は、酸化段階の前に該サポートおよび該部品を、亜硫酸ナトリウム、チオ尿素、チオール、チオエーテル、少なくとも1つのチオールおよび/または1つのチアゾリル基を有する化合物、およびそれらの混合物から選択される少なくとも1つのメタライゼーション抑制剤を含む抑制溶液と接触させる段階を備えており、抑制溶液は、部品を形成するプラスチックより抑制溶液に対する大きな親和性を示す材料を使用して保護する部分をマスキングした後、部品と接触させるか、または、部品の表面は、多重射出成形により得られた領域であって、異なる材料から形成された少なくとも2つの領域を備えることを特徴とする、プラスチック部品のサポートのメタライゼーションを防止する方法。 - 抑制溶液は、0.5〜6のpHを有することを特徴とする請求項1記載の方法。
- 抑制溶液は付加的に、pH調整剤を含むことを特徴とする請求項2記載の方法。
- pH調整剤は、硫酸、塩酸およびリン酸から選択されることを特徴とする請求項3記載の方法。
- 抑制溶液は付加的に、粘性を高める試薬を含むことを特徴とする請求項1〜4のいずれか1つに記載の方法。
- 粘性を高める試薬は、セルロース誘導体、ゼラチン、藻抽出物、合成ポリマー、デンプンおよびその誘導体、ガラクトマンナン、およびそれらの混合物から選択されることを特徴とする請求項5記載の方法。
- サポートと組み合わされたプラスチック部品の選択的メタライゼーションのプロセスであって、該プロセスは、
六価クロムを使用しない該部品の表面の酸化、
部品の表面での触媒金属の粒子の生成による、酸化された表面の活性化、および
活性化された表面への金属の化学的および/または電気化学的堆積の連続した段階を備えており、該プロセスは、酸化段階の前に該部品を、亜硫酸ナトリウム、チオ尿素、チオール、チオエーテル、少なくとも1つのチオールおよび/または1つのチアゾリル基を有する化合物、およびそれらの混合物から選択される少なくとも1つのメタライゼーション抑制剤を含む抑制溶液と接触させる段階を備えており、抑制溶液は、部品を形成するプラスチックより抑制溶液に対する大きな親和性を示す材料を使用して、保護する部分をマスキングした後、部品と接触させるか、または、部品の表面は、多重射出成形により得られた領域であって、異なる材料から形成された少なくとも2つの領域を備えることを特徴する、サポートと組み合わされたプラスチック部品の選択的メタライゼーションのプロセス。
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FR1460644A FR3027923B1 (fr) | 2014-11-04 | 2014-11-04 | Procede de metallisation de pieces plastiques |
PCT/FR2015/052753 WO2016071598A1 (fr) | 2014-11-04 | 2015-10-13 | Procede de metallisation de pieces plastiques |
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FR3027923B1 (fr) | 2014-11-04 | 2023-04-28 | Pegastech | Procede de metallisation de pieces plastiques |
EP3059277B2 (en) | 2015-02-23 | 2022-03-30 | MacDermid Enthone Inc. | Inhibitor composition for racks when using chrome free etches in a plating on plastics process |
KR102065822B1 (ko) | 2017-06-27 | 2020-02-11 | 주식회사 엘지화학 | 절연 저항 산출 시스템 및 방법 |
CN110900959B (zh) * | 2019-12-16 | 2020-12-11 | 温州新国余机械科技有限公司 | 一种带有气体净化结构的环保型注塑机 |
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US3443988A (en) * | 1965-05-06 | 1969-05-13 | Photocircuits Corp | Printed circuits,work holders and method of preventing electroless metal deposition |
SE332214B (ja) * | 1968-07-12 | 1971-02-01 | Gylling & Co | |
US3592744A (en) * | 1968-12-02 | 1971-07-13 | Macdermid Inc | Method of preventing rack plating in continuous plating cycle for nonconductive articles |
US3619243A (en) * | 1970-02-17 | 1971-11-09 | Enthone | No rerack metal plating of electrically nonconductive articles |
US3775121A (en) * | 1972-08-09 | 1973-11-27 | Western Electric Co | Method of selectively depositing a metal on a surface of a substrate |
JPS6077994A (ja) * | 1983-10-06 | 1985-05-02 | Asahi Chem Ind Co Ltd | プラスチツクのメツキ方法 |
JPS62247077A (ja) * | 1986-04-21 | 1987-10-28 | Seiko Epson Corp | 時計用プラスチツクケ−スのメツキ方法 |
US4748104A (en) * | 1986-11-10 | 1988-05-31 | Macdermid, Incorporated | Selective metallization process and additive method for manufactured printed circuit boards |
US5084145A (en) * | 1989-04-27 | 1992-01-28 | Sumitomo Metal Industries, Ltd. | Method for manufacturing one-sided electroplated steel sheet |
JPH0772358B2 (ja) * | 1989-04-27 | 1995-08-02 | 住友金属工業株式会社 | 片面電気めっき鋼板の製造方法 |
JP2007092111A (ja) * | 2005-09-28 | 2007-04-12 | Okuno Chem Ind Co Ltd | めっき析出阻害用組成物 |
US20090239079A1 (en) * | 2008-03-18 | 2009-09-24 | Mark Wojtaszek | Process for Preventing Plating on a Portion of a Molded Plastic Part |
EP2639332A1 (de) * | 2012-03-15 | 2013-09-18 | Atotech Deutschland GmbH | Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen |
US20150233011A1 (en) † | 2014-02-19 | 2015-08-20 | Macdermid Acumen, Inc. | Treatment for Electroplating Racks to Avoid Rack Metallization |
US9506150B2 (en) † | 2014-10-13 | 2016-11-29 | Rohm And Haas Electronic Materials Llc | Metallization inhibitors for plastisol coated plating tools |
FR3027923B1 (fr) | 2014-11-04 | 2023-04-28 | Pegastech | Procede de metallisation de pieces plastiques |
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CN107075684B (zh) | 2019-08-30 |
BR112017007857A2 (pt) | 2017-12-26 |
FR3027923A1 (fr) | 2016-05-06 |
CA2966578A1 (en) | 2016-05-12 |
KR20170081172A (ko) | 2017-07-11 |
ES2732698T5 (es) | 2023-01-30 |
EP3215653A1 (fr) | 2017-09-13 |
WO2016071598A1 (fr) | 2016-05-12 |
ES2732698T3 (es) | 2019-11-25 |
BR112017007857B1 (pt) | 2022-06-28 |
CN107075684A (zh) | 2017-08-18 |
KR102486306B1 (ko) | 2023-01-06 |
CA2966578C (en) | 2022-11-22 |
PT3215653T (pt) | 2019-07-12 |
FR3027923B1 (fr) | 2023-04-28 |
EP3215653B1 (fr) | 2019-04-03 |
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JP2017534769A (ja) | 2017-11-24 |
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