JP6576094B2 - Ｌｅｄ発光装置 - Google Patents

Ｌｅｄ発光装置 Download PDF

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Publication number
JP6576094B2
JP6576094B2 JP2015097651A JP2015097651A JP6576094B2 JP 6576094 B2 JP6576094 B2 JP 6576094B2 JP 2015097651 A JP2015097651 A JP 2015097651A JP 2015097651 A JP2015097651 A JP 2015097651A JP 6576094 B2 JP6576094 B2 JP 6576094B2
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JP
Japan
Prior art keywords
led element
substrate
led
emitting device
electrically connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015097651A
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English (en)
Japanese (ja)
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JP2016021554A (ja
JP2016021554A5 (https=
Inventor
俊之 水野
俊之 水野
一哉 石原
一哉 石原
昭 渡辺
昭 渡辺
康生 中西
康生 中西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
Original Assignee
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Electronics Co Ltd, Citizen Watch Co Ltd filed Critical Citizen Electronics Co Ltd
Priority to JP2015097651A priority Critical patent/JP6576094B2/ja
Priority to US14/739,343 priority patent/US10020291B2/en
Priority to CN201510334043.8A priority patent/CN105221940A/zh
Publication of JP2016021554A publication Critical patent/JP2016021554A/ja
Publication of JP2016021554A5 publication Critical patent/JP2016021554A5/ja
Application granted granted Critical
Publication of JP6576094B2 publication Critical patent/JP6576094B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
JP2015097651A 2014-06-16 2015-05-12 Ｌｅｄ発光装置 Active JP6576094B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2015097651A JP6576094B2 (ja) 2014-06-16 2015-05-12 Ｌｅｄ発光装置
US14/739,343 US10020291B2 (en) 2014-06-16 2015-06-15 LED light emitting device
CN201510334043.8A CN105221940A (zh) 2014-06-16 2015-06-16 Led发光装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014123269 2014-06-16
JP2014123269 2014-06-16
JP2015097651A JP6576094B2 (ja) 2014-06-16 2015-05-12 Ｌｅｄ発光装置

Publications (3)

Publication Number Publication Date
JP2016021554A JP2016021554A (ja) 2016-02-04
JP2016021554A5 JP2016021554A5 (https=) 2018-06-21
JP6576094B2 true JP6576094B2 (ja) 2019-09-18

Family

ID=54836811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015097651A Active JP6576094B2 (ja) 2014-06-16 2015-05-12 Ｌｅｄ発光装置

Country Status (3)

Country Link
US (1) US10020291B2 (https=)
JP (1) JP6576094B2 (https=)
CN (1) CN105221940A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108266693A (zh) * 2018-01-23 2018-07-10 苏州晶品新材料股份有限公司 一种雨雾透光增强型led光源
JP6799627B2 (ja) * 2018-02-26 2020-12-16 山東捷潤弘光電科技有限公司 Ｒｇｂ−ｌｅｄパッケージモジュール及びそのディスプレイ
CN110828614B (zh) * 2019-11-22 2024-03-26 苏州晟成光伏设备有限公司 一种叠瓦电池片归正机构及其工作方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3217322B2 (ja) * 1999-02-18 2001-10-09 日亜化学工業株式会社 チップ部品型発光素子
JP2005158910A (ja) * 2003-11-25 2005-06-16 Stanley Electric Co Ltd 多色発光素子混色装置
JP2006114854A (ja) * 2004-10-18 2006-04-27 Sharp Corp 半導体発光装置、液晶表示装置用のバックライト装置
JP2006237282A (ja) 2005-02-25 2006-09-07 Sanyo Electric Co Ltd 発光ダイオード光源
JP2007207834A (ja) 2006-01-31 2007-08-16 Sanyo Electric Co Ltd 発光ダイオード光源
JP2008041290A (ja) * 2006-08-02 2008-02-21 Akita Denshi Systems:Kk 照明装置及びその製造方法
JP4689637B2 (ja) * 2007-03-23 2011-05-25 シャープ株式会社 半導体発光装置
JP5161504B2 (ja) 2007-07-12 2013-03-13 ローム株式会社 半導体発光装置
US8421093B2 (en) * 2007-07-13 2013-04-16 Rohm Co., Ltd. LED module and LED dot matrix display
JP5349811B2 (ja) * 2008-02-06 2013-11-20 シャープ株式会社 半導体発光装置
JP5416975B2 (ja) * 2008-03-11 2014-02-12 ローム株式会社 半導体発光装置
US10431567B2 (en) * 2010-11-03 2019-10-01 Cree, Inc. White ceramic LED package
JP5010716B2 (ja) 2010-01-29 2012-08-29 株式会社東芝 Ｌｅｄパッケージ
JP5507330B2 (ja) * 2010-04-27 2014-05-28 ローム株式会社 Ｌｅｄモジュール
JP2012114311A (ja) * 2010-11-26 2012-06-14 Toshiba Corp Ｌｅｄモジュール
JP2012119376A (ja) 2010-11-29 2012-06-21 Toshiba Corp Ｌｅｄパッケージ
JP2012119476A (ja) * 2010-11-30 2012-06-21 Sharp Corp Ｌｅｄデバイスおよびそれを備えた光学ユニット
US8610140B2 (en) * 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
KR101823506B1 (ko) * 2011-06-29 2018-01-30 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛
JP2013026510A (ja) 2011-07-22 2013-02-04 Rohm Co Ltd Ｌｅｄモジュールおよびｌｅｄモジュールの実装構造
TW201318147A (zh) * 2011-10-26 2013-05-01 華夏光股份有限公司 發光二極體陣列
CN102810621B (zh) * 2012-07-25 2016-07-06 深圳市中庆微科技开发有限公司 一种支架与led灯及其模组

Also Published As

Publication number Publication date
CN105221940A (zh) 2016-01-06
JP2016021554A (ja) 2016-02-04
US20150364451A1 (en) 2015-12-17
US10020291B2 (en) 2018-07-10

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