CN101552268A - 发光二极管模块 - Google Patents
发光二极管模块 Download PDFInfo
- Publication number
- CN101552268A CN101552268A CNA2009101116837A CN200910111683A CN101552268A CN 101552268 A CN101552268 A CN 101552268A CN A2009101116837 A CNA2009101116837 A CN A2009101116837A CN 200910111683 A CN200910111683 A CN 200910111683A CN 101552268 A CN101552268 A CN 101552268A
- Authority
- CN
- China
- Prior art keywords
- led
- light
- emitting diode
- encapsulation
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 239000013078 crystal Substances 0.000 claims description 45
- 238000005538 encapsulation Methods 0.000 claims description 41
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 29
- 239000002245 particle Substances 0.000 claims description 21
- 230000000694 effects Effects 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- AXDJCCTWPBKUKL-UHFFFAOYSA-N 4-[(4-aminophenyl)-(4-imino-3-methylcyclohexa-2,5-dien-1-ylidene)methyl]aniline;hydron;chloride Chemical compound Cl.C1=CC(=N)C(C)=CC1=C(C=1C=CC(N)=CC=1)C1=CC=C(N)C=C1 AXDJCCTWPBKUKL-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101116837A CN101552268B (zh) | 2009-05-07 | 2009-05-07 | 发光二极管模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101116837A CN101552268B (zh) | 2009-05-07 | 2009-05-07 | 发光二极管模块 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101552268A true CN101552268A (zh) | 2009-10-07 |
CN101552268B CN101552268B (zh) | 2012-06-27 |
Family
ID=41156378
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009101116837A Expired - Fee Related CN101552268B (zh) | 2009-05-07 | 2009-05-07 | 发光二极管模块 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101552268B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102496613A (zh) * | 2011-12-14 | 2012-06-13 | 南京中电熊猫液晶显示科技有限公司 | Led封装和包括该led封装的背光模组 |
CN102859730A (zh) * | 2010-04-27 | 2013-01-02 | 罗姆股份有限公司 | Led模块 |
CN103201783A (zh) * | 2010-11-10 | 2013-07-10 | Nec卡西欧移动通信株式会社 | 电子设备 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102290409B (zh) * | 2003-04-01 | 2014-01-15 | 夏普株式会社 | 发光装置 |
JP2006024794A (ja) * | 2004-07-08 | 2006-01-26 | Sanyo Electric Co Ltd | フルカラー発光ダイオード装置 |
JP2008130909A (ja) * | 2006-11-22 | 2008-06-05 | Matsushita Electric Works Ltd | 発光ダイオードを用いた光源 |
-
2009
- 2009-05-07 CN CN2009101116837A patent/CN101552268B/zh not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102859730A (zh) * | 2010-04-27 | 2013-01-02 | 罗姆股份有限公司 | Led模块 |
CN102859730B (zh) * | 2010-04-27 | 2015-08-26 | 罗姆股份有限公司 | Led模块 |
CN103201783A (zh) * | 2010-11-10 | 2013-07-10 | Nec卡西欧移动通信株式会社 | 电子设备 |
CN103201783B (zh) * | 2010-11-10 | 2016-08-10 | 日本电气株式会社 | 电子设备 |
US9459003B2 (en) | 2010-11-10 | 2016-10-04 | Nec Corporation | Electronic equipment |
CN102496613A (zh) * | 2011-12-14 | 2012-06-13 | 南京中电熊猫液晶显示科技有限公司 | Led封装和包括该led封装的背光模组 |
Also Published As
Publication number | Publication date |
---|---|
CN101552268B (zh) | 2012-06-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Free format text: FORMER OWNER: CHINA PROJECTION TUBE CO., LTD. Effective date: 20130604 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20130604 Address after: 350015 No. 1 Xingye Road, Mawei Science Park, Fujian, Fuzhou Patentee after: Fuzhou Huaying Video & Telecom Co., Ltd. Address before: 350015 No. 1 Xingye Road, Mawei Science Park, Fujian, Fuzhou Patentee before: Fuzhou Huaying Video & Telecom Co., Ltd. Patentee before: Chunghwa Picture Tubes Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120627 Termination date: 20200507 |
|
CF01 | Termination of patent right due to non-payment of annual fee |