JP6563674B2 - コーティング基板及びコーティング基板のカッティング方法 - Google Patents

コーティング基板及びコーティング基板のカッティング方法 Download PDF

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Publication number
JP6563674B2
JP6563674B2 JP2015084703A JP2015084703A JP6563674B2 JP 6563674 B2 JP6563674 B2 JP 6563674B2 JP 2015084703 A JP2015084703 A JP 2015084703A JP 2015084703 A JP2015084703 A JP 2015084703A JP 6563674 B2 JP6563674 B2 JP 6563674B2
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JP
Japan
Prior art keywords
absorption
barrier layer
sapphire
sapphire substrate
molten
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2015084703A
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English (en)
Japanese (ja)
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JP2015205344A (ja
Inventor
エム リー マイケル
エム リー マイケル
ジェイ リヒター アンソニー
ジェイ リヒター アンソニー
サン ユーレイ
サン ユーレイ
エイ モリーナ ラウル
エイ モリーナ ラウル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apple Inc
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Apple Inc
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Publication date
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Publication of JP2015205344A publication Critical patent/JP2015205344A/ja
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Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/009—Working by laser beam, e.g. welding, cutting or boring using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles
    • B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
    • B23K26/147—Features outside the nozzle for feeding the fluid stream towards the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles ; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/54—Glass

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP2015084703A 2014-04-18 2015-04-17 コーティング基板及びコーティング基板のカッティング方法 Expired - Fee Related JP6563674B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201461981637P 2014-04-18 2014-04-18
US61/981,637 2014-04-18
US14/575,754 2014-12-18
US14/575,754 US10537963B2 (en) 2014-04-18 2014-12-18 Coated substrate and process for cutting a coated substrate

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2017048598A Division JP2017114761A (ja) 2014-04-18 2017-03-14 コーティング基板及びコーティング基板のカッティング方法

Publications (2)

Publication Number Publication Date
JP2015205344A JP2015205344A (ja) 2015-11-19
JP6563674B2 true JP6563674B2 (ja) 2019-08-21

Family

ID=54321205

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015084703A Expired - Fee Related JP6563674B2 (ja) 2014-04-18 2015-04-17 コーティング基板及びコーティング基板のカッティング方法
JP2017048598A Pending JP2017114761A (ja) 2014-04-18 2017-03-14 コーティング基板及びコーティング基板のカッティング方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2017048598A Pending JP2017114761A (ja) 2014-04-18 2017-03-14 コーティング基板及びコーティング基板のカッティング方法

Country Status (3)

Country Link
US (1) US10537963B2 (https=)
JP (2) JP6563674B2 (https=)
CN (1) CN105033456B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106808091B (zh) * 2015-11-27 2018-12-07 南京魔迪多维数码科技有限公司 针对二维和三维脆性材料基板进行加工的激光系统
EP3606309B1 (en) * 2017-03-30 2023-09-06 FUJIFILM Corporation Electromagnetic wave absorber and method for producing electromagnetic wave absorber
CN110560923A (zh) * 2019-08-23 2019-12-13 福建华清电子材料科技有限公司 一种氮化铝陶瓷激光加工工艺
CN113031325B (zh) * 2021-03-09 2022-10-11 厦门天马微电子有限公司 异形显示面板及显示装置
CN114131182A (zh) * 2021-12-21 2022-03-04 苏州沃特维自动化系统有限公司 一种散热膜辅助激光切割电池片结构及其工艺

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JPS52111097A (en) * 1976-03-13 1977-09-17 Toshiba Corp Laser processing method
JPS55151351A (en) 1979-05-16 1980-11-25 Mitsubishi Electric Corp Cutting method of semiconductor chip
JPS62183984A (ja) * 1986-02-07 1987-08-12 Nippon Kokan Kk <Nkk> レ−ザ−クラツデイング方法
US5178725A (en) * 1990-04-04 1993-01-12 Mitsubishi Denki Kabushiki Kaisha Method for working ceramic material
JP2682230B2 (ja) 1990-11-14 1997-11-26 三菱電機株式会社 レーザ加工方法
US20020072252A1 (en) * 2000-09-05 2002-06-13 Hideharu Nakajima Process for production of thin film semiconductor thin film, semiconductor device, process for production of semiconductor thin film, and apparatus for production of semiconductor thin film
JP2004042140A (ja) * 2002-07-12 2004-02-12 Hitachi Zosen Corp 薄膜除去方法及び装置
JP4471632B2 (ja) * 2003-11-18 2010-06-02 株式会社ディスコ ウエーハの加工方法
US20050156353A1 (en) * 2004-01-15 2005-07-21 Watts Michael P. Method to improve the flow rate of imprinting material
JP4683989B2 (ja) 2004-04-20 2011-05-18 昭和電工株式会社 化合物半導体発光素子ウェハーの製造方法
US7700413B2 (en) * 2004-04-20 2010-04-20 Showa Denko K.K. Production method of compound semiconductor light-emitting device wafer
US20060032841A1 (en) * 2004-08-10 2006-02-16 Tan Kee C Forming features in printhead components
JP4854061B2 (ja) * 2005-01-14 2012-01-11 日東電工株式会社 レーザー加工品の製造方法及びレーザー加工用保護シート
JP2006231628A (ja) * 2005-02-23 2006-09-07 Murata Mfg Co Ltd セラミックグリーンシートの加工方法
WO2008114470A1 (ja) * 2007-03-16 2008-09-25 Sharp Kabushiki Kaisha プラスチック基板の切断方法、及びプラスチック基板の切断装置
FR2935916B1 (fr) * 2008-09-12 2011-08-26 Air Liquide Procede et installation de coupage laser avec modification du facteur de qualite du faisceau laser
JP2013006200A (ja) 2011-06-27 2013-01-10 Disco Corp レーザ加工装置
EP2564999A1 (en) * 2011-08-31 2013-03-06 Asahi Glass Company, Limited A method of generating a high quality hole or recess or well in a substrate
CN103645818A (zh) * 2013-11-26 2014-03-19 浙江上城科技有限公司 一种蓝宝石触摸屏及其制备方法

Also Published As

Publication number Publication date
CN105033456A (zh) 2015-11-11
JP2015205344A (ja) 2015-11-19
US20150298251A1 (en) 2015-10-22
CN105033456B (zh) 2018-04-27
JP2017114761A (ja) 2017-06-29
US10537963B2 (en) 2020-01-21

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