JP6542464B2 - 剥離装置 - Google Patents
剥離装置 Download PDFInfo
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- JP6542464B2 JP6542464B2 JP2018507402A JP2018507402A JP6542464B2 JP 6542464 B2 JP6542464 B2 JP 6542464B2 JP 2018507402 A JP2018507402 A JP 2018507402A JP 2018507402 A JP2018507402 A JP 2018507402A JP 6542464 B2 JP6542464 B2 JP 6542464B2
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- 230000001681 protective effect Effects 0.000 claims description 122
- 239000000853 adhesive Substances 0.000 claims description 29
- 230000001070 adhesive effect Effects 0.000 claims description 28
- 238000001179 sorption measurement Methods 0.000 claims description 23
- 239000004065 semiconductor Substances 0.000 description 14
- 239000000758 substrate Substances 0.000 description 9
- 239000002390 adhesive tape Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
- B65H29/54—Article strippers, e.g. for stripping from advancing elements
- B65H29/56—Article strippers, e.g. for stripping from advancing elements for stripping from elements or machines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
- B65H29/24—Delivering or advancing articles from machines; Advancing articles to or into piles by air blast or suction apparatus
- B65H29/241—Suction devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H41/00—Machines for separating superposed webs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Die Bonding (AREA)
Description
Claims (3)
- ワークに貼り付けられた接着部材から、当該接着部材の表面を保護する保護フィルムを剥離する剥離装置であって、
前記接着部材に貼着された保護フィルムの表面の端部近傍に面状に接触する当接面と、前記当接面内に設けられるとともに前記保護フィルムを吸着する吸着孔と、を備えたコレットと、
前記コレットを、前記ワークに対して移動させる移動機構と、
を備え、前記吸着孔で保護フィルムを吸着した状態で、前記コレットと前記ワークとを離間させることで、前記保護フィルムを、前記接着部材から剥離し、
前記当接面は、当該当接面の外側端部より内側端部が低くなるように、前記吸着のリークを生じない範囲で、前記ワークの表面に対して、傾いており、
前記当接面の前記外側端部と前記内側端部との高さの差が前記保護フィルムに対する沈み込み量に収まる範囲である、
ことを特徴とする剥離装置。 - 請求項1に記載の剥離装置であって、
前記当接面の面積は、前記保護フィルムよりも小さい、ことを特徴とする剥離装置。 - ワークに貼り付けられた接着部材から、当該接着部材の表面を保護する保護フィルムを剥離する剥離装置であって、
前記接着部材に貼着された保護フィルムの表面に面状に接触する当接面と、前記当接面内に設けられるとともに前記保護フィルムを吸着する吸着孔と、を備えたコレットと、
前記コレットを、前記ワークに対して移動させる移動機構と、
を備え、前記吸着孔で保護フィルムを吸着した状態で、前記コレットと前記ワークとを離間させることで、前記保護フィルムを、前記接着部材から剥離し、
前記当接面は、前記保護フィルムの端部近傍であって、前記ワークの搬送方向と略直交する方向の端部近傍に当接する、ことを特徴とする剥離装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016058221 | 2016-03-23 | ||
JP2016058221 | 2016-03-23 | ||
PCT/JP2017/011674 WO2017164294A1 (ja) | 2016-03-23 | 2017-03-23 | 剥離装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017164294A1 JPWO2017164294A1 (ja) | 2019-01-17 |
JP6542464B2 true JP6542464B2 (ja) | 2019-07-10 |
Family
ID=59899514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018507402A Active JP6542464B2 (ja) | 2016-03-23 | 2017-03-23 | 剥離装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20210197543A1 (ja) |
JP (1) | JP6542464B2 (ja) |
KR (1) | KR102106379B1 (ja) |
CN (1) | CN109155274B (ja) |
SG (1) | SG11201900544PA (ja) |
TW (1) | TWI659846B (ja) |
WO (1) | WO2017164294A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110641131B (zh) * | 2018-06-26 | 2023-10-03 | 紫石能源有限公司 | 膜片分离设备及膜片分离方法 |
JP7382265B2 (ja) * | 2020-03-27 | 2023-11-16 | 株式会社ジャパンディスプレイ | 一時保持用部材、及び表示装置の製造方法 |
CN114084453A (zh) * | 2021-11-26 | 2022-02-25 | 深圳市深科达智能装备股份有限公司 | 搬运撕膜机构及胶带贴附设备 |
CN114678640B (zh) * | 2022-05-09 | 2023-11-24 | 苏州威达智科技股份有限公司 | 一种壳体粘贴密封装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1027836A (ja) * | 1996-07-11 | 1998-01-27 | Sony Corp | 半導体装置の製造方法および半導体製造装置 |
JP2001199624A (ja) | 2000-01-20 | 2001-07-24 | Dainippon Printing Co Ltd | 保護フィルム剥離装置およびその方法 |
KR100383265B1 (ko) * | 2001-01-17 | 2003-05-09 | 삼성전자주식회사 | 웨이퍼 보호 테이프 제거용 반도체 제조장치 |
US6800008B2 (en) * | 2001-10-09 | 2004-10-05 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for removing film and method for manufacturing display panel |
JP4490345B2 (ja) * | 2005-08-04 | 2010-06-23 | 共同印刷株式会社 | 保護シート剥離装置 |
JP4524241B2 (ja) * | 2005-10-12 | 2010-08-11 | 日本メクトロン株式会社 | 薄板状フィルムの貼付装置および貼付方法 |
JP2008096530A (ja) | 2006-10-06 | 2008-04-24 | Hitachi High-Technologies Corp | 光学フィルム貼付け方法、光学フィルム貼付け装置、及び表示用パネルの製造方法 |
US20100109220A1 (en) * | 2007-04-19 | 2010-05-06 | Ulvac, Inc. | Substrate Holding Mechanism and Substrate Assembly Apparatus Including the Same |
JP5147425B2 (ja) * | 2007-08-14 | 2013-02-20 | 株式会社東京精密 | ウェーハ用テーブル、表面保護フィルム剥離装置および表面保護フィルム剥離方法 |
JP2010067782A (ja) * | 2008-09-10 | 2010-03-25 | Tokyo Seimitsu Co Ltd | 表面保護フィルム剥離装置 |
JP4883538B2 (ja) * | 2009-06-26 | 2012-02-22 | Jpテック株式会社 | 剥離装置 |
JP5572353B2 (ja) * | 2009-09-29 | 2014-08-13 | 日東電工株式会社 | 保護テープ剥離方法およびその装置 |
JP5375586B2 (ja) * | 2009-12-22 | 2013-12-25 | 株式会社スリーボンド | 剥離装置及び剥離方法 |
JP6047439B2 (ja) * | 2013-03-26 | 2016-12-21 | 株式会社Screenホールディングス | 剥離装置および剥離方法 |
KR20150035234A (ko) * | 2013-09-27 | 2015-04-06 | 엘아이지에이디피 주식회사 | 보호필름 박리장치 및 이를 이용하는 유기발광표시장치 제조방법 |
KR102064405B1 (ko) * | 2014-02-04 | 2020-01-10 | 삼성디스플레이 주식회사 | 기판 박리 장치 및 그것을 이용한 기판 박리 방법 |
-
2017
- 2017-03-23 CN CN201780031889.1A patent/CN109155274B/zh active Active
- 2017-03-23 KR KR1020187030318A patent/KR102106379B1/ko active IP Right Grant
- 2017-03-23 JP JP2018507402A patent/JP6542464B2/ja active Active
- 2017-03-23 WO PCT/JP2017/011674 patent/WO2017164294A1/ja active Application Filing
- 2017-03-23 US US16/087,086 patent/US20210197543A1/en not_active Abandoned
- 2017-03-23 TW TW106109732A patent/TWI659846B/zh active
- 2017-03-23 SG SG11201900544PA patent/SG11201900544PA/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR102106379B1 (ko) | 2020-05-04 |
CN109155274A (zh) | 2019-01-04 |
TW201739625A (zh) | 2017-11-16 |
CN109155274B (zh) | 2023-02-17 |
US20210197543A1 (en) | 2021-07-01 |
KR20180124962A (ko) | 2018-11-21 |
SG11201900544PA (en) | 2019-05-30 |
WO2017164294A1 (ja) | 2017-09-28 |
TWI659846B (zh) | 2019-05-21 |
JPWO2017164294A1 (ja) | 2019-01-17 |
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