JP6526408B2 - ケース、このケースを備える電子装置並びにこのケースの製造方法 - Google Patents
ケース、このケースを備える電子装置並びにこのケースの製造方法 Download PDFInfo
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- JP6526408B2 JP6526408B2 JP2014255953A JP2014255953A JP6526408B2 JP 6526408 B2 JP6526408 B2 JP 6526408B2 JP 2014255953 A JP2014255953 A JP 2014255953A JP 2014255953 A JP2014255953 A JP 2014255953A JP 6526408 B2 JP6526408 B2 JP 6526408B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
- G06F1/1698—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
- H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
- H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
- B29C2045/14327—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles anchoring by forcing the material to pass through a hole in the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/1486—Details, accessories and auxiliary operations
- B29C2045/14868—Pretreatment of the insert, e.g. etching, cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2075/00—Use of PU, i.e. polyureas or polyurethanes or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
- Y10T428/1355—Elemental metal containing [e.g., substrate, foil, film, coating, etc.]
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Casings For Electric Apparatus (AREA)
- Telephone Set Structure (AREA)
Description
10 本体部
30 ケース
31 基材
33 補強層
40 アンテナ
305 収容空間
306 内面
310 主体部
311 金属片
313 隔離層
Claims (11)
- 基材及び前記基材の内面に形成された補強層を備えるケースであって、
前記基材は、少なくとも1つの主体部と、複数の金属片と、複数の導電しない隔離層と、を含み、前記複数の金属片及び前記複数の導電しない隔離層は、交互に設けられ、相隣する2つの金属片は、当該2つの金属片の間に介在する前記隔離層によって互いに接合され、前記少なくとも1つの主体部は、前記隔離層を介して前記金属片と互いに接合され、
前記補強層は、前記ケースの内面において、前記複数の金属片、前記複数の導電しない隔離層、及び前記少なくとも1つの主体部を被覆して、前記複数の金属片、前記複数の導電しない隔離層、及び前記少なくとも1つの主体部を一体に連接することを特徴とするケース。 - 前記ケースの長さ方向に沿った各金属片の幅は、0.4mm〜1.0mmであることを特徴とする請求項1に記載のケース。
- 前記隔離層は、ポリウレタンUV硬化材料により製造され、前記補強層は、プラスチックにより製造されることを特徴とする請求項1に記載のケース。
- 金属材料からなる基材を提供する工程と、
前記基材において、前記基材を貫通する複数の間隙を設けて、前記基材を複数の金属片及び少なくとも1つの主体部にカットする工程と、
前記主体部と前記複数の金属片とを間隔をあけて設けて、前記主体部と前記主体部に隣接する金属片との間の間隙及び相隣する2つの金属片の間の間隙に、接着性材料を充填して導電しない隔離層を形成する工程と、
前記基材の内面に補強層を形成して、前記補強層により前記主体部、前記金属片、及び隔離層を被覆する工程と、
を備えることを特徴とするケースの製造方法。 - 前記ケースの長さ方向に沿った各隔離層の幅は、20μm〜60μmであることを特徴とする請求項4に記載のケースの製造方法。
- 前記補強層は、化学エッチング又は電気化学エッチングによって前記基材の内面に複数の微細孔を形成した後、射出成形法によって前記基材の内面に溶融樹脂を注入して、前記溶融樹脂を前記微細孔の内部に侵入させて、前記溶融樹脂を固化させることによって形成され、
前記微細孔の開口の直径は、15μm〜100μmであることを特徴とする請求項4に記載のケースの製造方法。 - 前記補強層は、前記基材の内面に熱硬化性接着剤を塗布して乾燥させて、接着剤層を形成した後に、射出成形法によって前記接着剤層の表面に樹脂層を接合することによって形成されることを特徴とする請求項4に記載のケースの製造方法。
- 複数の金属片を提供する工程と、
各金属片の対向する2つの側面に導電しない隔離層を形成して、前記隔離層を介して相隣する2つの金属片を連接固定する工程と、
少なくとも1つの主体部を提供して、前記主体部に開口を設ける工程と、
一体に連接固定された前記複数の金属片を前記開口内にセットして、前記複数の金属片、前記隔離層、及び前記少なくとも1つの主体部の内面に補強層を形成して、前記補強層によって前記複数の金属片、前記隔離層、及び前記少なくとも1つの主体部の内面を被覆する工程と、
を備えることを特徴とするケースの製造方法。 - 前記ケースの基材の表面には、化学エッチング又は電気化学エッチングによって複数の15μm〜100μmの微細孔が形成され、前記ケースの長さ方向に沿った各隔離層の幅は、0.01mm〜0.1mmであることを特徴とする請求項8に記載のケースの製造方法。
- 各金属片の側面には、複数の微細孔が形成され、前記補強層は、インサートモールド成型技術を利用して、溶融樹脂を前記基材の表面の前記微細孔及び前記金属片の側面の前記微細孔の内部に注入させることによって、前記基材の内面に形成され、
前記隔離層は、絶縁塗料を塗布することによって前記金属片の側面に形成されることを特徴とする請求項9に記載のケースの製造方法。 - 本体部と、ケースと、前記本体部の内部に設けられたアンテナと、を備える電子装置であって、
前記ケースは、請求項1〜3の何れか1項に記載のケースであり、前記ケースが前記本体部に装着された後、前記ケースの前記金属片及び前記隔離層により構成される部分は、前記アンテナに対応して位置することを特徴とする電子装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN201410065545.0A CN104168730B (zh) | 2014-02-26 | 2014-02-26 | 壳体、应用该壳体的电子装置及其制作方法 |
CN201410065545.0 | 2014-02-26 |
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JP2015162672A JP2015162672A (ja) | 2015-09-07 |
JP6526408B2 true JP6526408B2 (ja) | 2019-06-05 |
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US (3) | US20150241921A1 (ja) |
EP (1) | EP2913988B1 (ja) |
JP (1) | JP6526408B2 (ja) |
CN (1) | CN104168730B (ja) |
TW (1) | TWI565387B (ja) |
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2014
- 2014-02-26 CN CN201410065545.0A patent/CN104168730B/zh active Active
- 2014-03-04 TW TW103107137A patent/TWI565387B/zh not_active IP Right Cessation
- 2014-12-01 US US14/556,658 patent/US20150241921A1/en not_active Abandoned
- 2014-12-18 JP JP2014255953A patent/JP6526408B2/ja not_active Expired - Fee Related
- 2014-12-31 EP EP14200698.0A patent/EP2913988B1/en active Active
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CN104168730B (zh) | 2019-06-11 |
EP2913988B1 (en) | 2020-05-13 |
US20170197344A1 (en) | 2017-07-13 |
US20170199546A1 (en) | 2017-07-13 |
JP2015162672A (ja) | 2015-09-07 |
TWI565387B (zh) | 2017-01-01 |
EP2913988A1 (en) | 2015-09-02 |
TW201534194A (zh) | 2015-09-01 |
CN104168730A (zh) | 2014-11-26 |
US20150241921A1 (en) | 2015-08-27 |
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